WO1998024124A1 - Support pour circuit integre - Google Patents

Support pour circuit integre Download PDF

Info

Publication number
WO1998024124A1
WO1998024124A1 PCT/DE1997/002757 DE9702757W WO9824124A1 WO 1998024124 A1 WO1998024124 A1 WO 1998024124A1 DE 9702757 W DE9702757 W DE 9702757W WO 9824124 A1 WO9824124 A1 WO 9824124A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
circuit board
integrated circuit
frame
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1997/002757
Other languages
German (de)
English (en)
Inventor
Klaus Klein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO1998024124A1 publication Critical patent/WO1998024124A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Definitions

  • the invention relates to a base for an integrated circuit according to the preamble of claim 1.
  • connection elements of the integrated circuit are optionally connected directly to connection elements of the printed circuit board by soldering, or the integrated circuit is detachably inserted into a base which is itself soldered to the printed circuit board and the electrical connections between connection elements of the integrated circuit and connecting elements of the circuit board.
  • Such a base is known from DE-GM 87 16 007, which, in addition to cooling on the top of the integrated circuit, is equipped with a heat sink which is snapped into a carrier frame.
  • a shield housing which can be used to accommodate various circuits can.
  • the housing is essentially cuboid and has an open side which, when mounted on a circuit board, is closed by it.
  • the shielding housing is fastened to the printed circuit board by inserting four mounting legs formed on the lower edge of the shielding housing into mounting openings in the printed circuit board and bending or soldering them. Circuits housed in the shield housing are soldered directly to the circuit board.
  • This shielding housing additionally complicates an already difficult replacement of inserted components in a disadvantageous manner.
  • Another disadvantage is that the encapsulation of the components has a negative effect on the heat dissipation, which must be ensured in particular in the case of complex integrated circuits.
  • the invention has for its object to provide a base for an integrated circuit which enables improved cooling of the integrated circuit with a low overall height above the circuit board.
  • the invention has the advantage that the surface area active during cooling is increased without having to change the overall height of a heat sink above the printed circuit board accordingly.
  • Both heat sinks can be designed as shielded housings.
  • the base can be easily replaced despite good electromagnetic shielding.
  • the integrated circuit is accessible after opening the housing cover and can be removed from the base insert - possibly with the aid of a simple removal tool. To easily open the lid, it can be attached using screws, clips or a snap connection, for example.
  • the electrical connection technology of the base insert can be carried out as with conventional connection forms and is not subject to any additional restrictions.
  • connection elements can be implemented using push-through technology and on the circuit board side, the connection elements can be designed as BGA (ball grid array) or SGA (stud grid array).
  • the base frame which is attached to the circuit board.
  • SMD Surface Mounted Device
  • the base frame which is attached to the circuit board. This prevents pulling forces occurring when the integrated circuit is removed from acting on the electrical contact points of the base insert and damaging them. Even when installing the base insert using the press-in technique, the press-in pins should not be subjected to excessive pulling force.
  • An incline on the inside of the base frame makes it easy to access the integrated circuit for a lifting tool. If, for example, a screwdriver is used as the removal tool, the base frame advantageously serves as a counter bearing with good leverage which is close to the component.
  • the design of the base frame is designed so that a special removal tool, which can also be used to press the component, can be used.
  • a base frame composed of several parts can be used to advantageously different frame types a modular principle. This does not have a negative effect on the shielding properties of the housing with regard to electromagnetic or electrostatic influences if the parts overlap at the joints.
  • For good thermal contact between the cover and the integrated circuit it lies on the top of the integrated circuit in a form-fitting manner, possibly thermally coupled by means of a thermal paste. It is also advantageous to use a thermal paste between the cover and the frame.
  • a recess in the base plate can advantageously ensure that connecting elements protruding through the printed circuit board are not short-circuited.
  • a base plate can also serve as a counter bearing when installing a base insert with press-in contacts.
  • the base plate is advantageously flat, that is to say without a recess, for better cooling and as a counter bearing.
  • An SMD connection technology on the circuit board side also has the advantage that even integrated circuits with PGA or SPGA connection forms, which are actually designed for push-through installation, can be fitted to a circuit board in pure SMD (Surface Mounted Device) technology without that the SMD principle must be broken.
  • integrated circuits for push-through installation can also be equipped with circuit board technologies that do not permit through-plating as connection elements. This is the case, for example, for printed circuit boards with multiple surface wiring, in which different vias for connecting cables whose layers the number of signal layers is drastically reduced.
  • SMD technology eliminates the process steps that would be required in a mixed technique for assembling and soldering components in push-through assembly. In other words, an assembly no longer has to be guided to a manual assembly station and a wave bath in the manufacturing process. The manufacturing effort is thus significantly reduced.
  • FIG. 1 shows a base in an exploded view
  • FIG. 2 shows a sectional view through a base
  • FIG. 3 shows a base insert with non-positive clamping of a contact element in a sectional view
  • FIG. 4 shows a base insert with positive locking
  • FIG. 5 shows a base insert with positive and positive locking one Contact element
  • Figure 6 shows a base insert with connection elements for press-in technology
  • Figure 7 shows a base insert for push-through installation in soldering technology
  • Figure 8 shows a base insert in SGA version.
  • a base for an integrated circuit 1 essentially consists of a cover 2, here a frame composed of four parts 3, 4, 5 and 6, a base insert 7 and a base 8.
  • the cover 2 is used as a cooling body executed and provided with cooling fins on its top, so that it can be optimally aligned according to the air flow in the device in which a printed circuit board 9 equipped with the components shown is to be used.
  • the cover is fastened to the base frame with four screws 10 ... 13 arranged in the area of its corners.
  • parts 3 ... 6 of the base frame have openings with screws corresponding to the screws 10 ... 13, of which in Figure 2 only the openings 14, 15 and 16 are visible.
  • the parts 3 ... 6 each have a collar 17, 18, 19 or 20, which projects somewhat beyond the cover 2 at the associated edge sections.
  • the base frame can also be designed as a one-piece frame with fewer fastening points on the printed circuit board.
  • the cover 2 lies flat on the top of the integrated circuit 1.
  • the top of the integrated circuit 1 can be assembled with a thermal paste or a similar agent, for. B. thermal foil.
  • two recesses are made in each of parts 3 ...
  • FIG. 6 which serve as a depot for thermal paste. Of these, only the recesses 21 ... 27 are visible in FIG. 1. Parts 3 ... 6 of the base frame are provided with overlaps at the joints, so that no electromagnetic or electrostatic interference can penetrate the shielding housing through these joints.
  • the base frame is fastened with eight screws that go through openings in the ladder plate guided and screwed into corresponding holes with an internal thread in the bottom 8. In Figure 1, only the screws 28 ... 31, the openings 32, 33 and 34 and holes 35 ... 40 are shown.
  • the bottom 8 is also designed as a heat sink and provided with cooling fins. On its upper side it has a recess 41 into which possibly protruding connection elements of the base insert 7 can protrude on the underside of the printed circuit board 9 without touching the bottom 8.
  • the bottom 8 can also be used as a support or counter bearing if a base insert 7 with press-in pins is used or with contact elements which are jammed in their guides by pressing the base insert 7 against the printed circuit board 9. If the heat coupling between the floor 8 and the base frame via the eight fastening screws and the contact points on the printed circuit board 9 is not yet sufficient, more on the top of the edges of the base 8 and on the underside of the parts 3 ... 6 of the base frame Figure 1 not shown recesses can be made as a deposit for thermal paste. Since heat sinks are provided on both sides of the printed circuit board 9, the overall height of the base is distributed over both sides of the printed circuit board 9.
  • oblique recesses 42, 43, 44 and 45 are present on the parts 3 ... 6 of the base frame, in which a removal tool, for example a screwdriver blade, can be inserted such that it engages behind the underside of the integrated circuit 1.
  • parts 3 ... 6 may serve as counter bearings to create a leverage effect.
  • Figures 3, 4 and 5 illustrate different variants for clamping a contact element in the base insert after pressing on a printed circuit board 55.
  • Contact elements 56, 57 and 58 are each provided with a contact spring 59 for contacting the connection element of an integrated circuit to be used.
  • a plastic body 60, 61 or 62 the contact elements 56, 57 and 58 are inserted from above and secured in their end position against falling out by a latching connection.
  • the plastic bodies 60, 61 and 62 are each pressed onto the printed circuit board 55 and fastened there with a frame 63 which can be fastened directly on the printed circuit board.
  • Dimensions A, B, C and D are shown in FIG. 3 to explain the tolerance compensation.
  • the contact elements 56, 57 and 58 can be displaced in their guides in all three variants of a clamping in order to be able to compensate for height tolerances of the connection elements on the printed circuit board 55.
  • Dimension B determines the path by which the contact elements 56, 57 and 58 are displaced from their end position in the plastic body 60, 61 and 62 when the base inserts are pressed against the printed circuit board 55 in order to produce a clamping effect in the guide.
  • a web 48 is attached to the frame 63, the underside of which rests on the upper side of an edge of the plastic bodies 60, 61 and 62 of the base inserts.
  • roof-shaped extensions 49 are provided on the top of the edge of the plastic bodies 60, 61 and 62.
  • the height D of the extensions is reduced by the dimension C for tolerance compensation by a deformation of the extensions.
  • non-positive clamping of the contact element 56 in the plastic body 60 is achieved by pressing a circumferential collar 64 of the contact element 56 into a conical bevel 65 of the plastic body 60 and holding it there by mutual clamping.
  • a positive clamping results in the variant according to FIG. 4, in which an initially hollow-conical collar 66 attaches to the shaft of the contact element 57.
  • the contact element 58 is provided with a circumferential, deformable pointed collar 68, which presses into the plastic part 62 and brings about a positive and non-positive clamping.
  • an integrated circuit 1 is pulled out, which can be designed as a PGA or SPGA component, no forces act on the solder joints on the printed circuit board 55.
  • a base insert for assembly using press-in technology has press-in pins 51 with spring elements in their shaft region which press against the inside of the hole when pressed into a continuously metallized hole in a printed circuit board.
  • a solder connection is not necessary for this.
  • connecting pins 52 projecting through the metallized openings of the printed circuit board are electrically connected to conductor tracks of the printed circuit board by soldering.
  • Connection elements 53 of the base insert shown in FIG. 8 are also soldered to connection surfaces of the printed circuit board, which, however, are only located on the surface of the printed circuit board here.
  • connection elements 53 in the insertion direction of the centering te 54 be floating.
  • the connection elements and the base insert it can be pressed onto the printed circuit board by the base frame or another tool after the soldering process.
  • the connection elements can also be non-positively attached in their end position in the base insert. Afterwards, pulling forces no longer act on the solder connections.
  • the shielding housing of the base and possibly a ground position in the printed circuit board form an "island" which is hermetically sealed with respect to electromagnetic and electrostatic influences, which can either be permanently integrated into a ground concept or inductively or capacitively coupled in a changed shape with an enlarged interior of the base or in the free space 55 within the base insert 7 further components critical with respect to electromagnetic shielding, e.g. B. integrate crystals, VCO or clock circuits in the shield housing. This is particularly favorable in the case of components which are functionally assigned to the integrated circuit.
  • base inserts can be used which are designed as ZIF (zero insertion force) or LIF (low insertion force) version on the integrated circuit side.
  • the base can be used for the replacement of only the base insert 7 for integrated circuits of different housing designs and different electrical connection elements.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un support pour circuit intégré présentant, sur la partie supérieure du circuit intégré (1), un premier puits de chaleur (2...6) muni de nervures de refroidissement et qui, en vue d'obtenir une meilleure dissipation de chaleur, est complété par un deuxième puits de chaleur (8) sur le côté opposé de la plaquette de circuit imprimé (9). L'invention est utilisée pour des supports destinés à des composants mutipolaires.
PCT/DE1997/002757 1996-11-26 1997-11-25 Support pour circuit integre Ceased WO1998024124A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29620595.8 1996-11-26
DE29620595U DE29620595U1 (de) 1996-11-26 1996-11-26 Sockel für eine integrierte Schaltung

Publications (1)

Publication Number Publication Date
WO1998024124A1 true WO1998024124A1 (fr) 1998-06-04

Family

ID=8032496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/002757 Ceased WO1998024124A1 (fr) 1996-11-26 1997-11-25 Support pour circuit integre

Country Status (2)

Country Link
DE (1) DE29620595U1 (fr)
WO (1) WO1998024124A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10297047B4 (de) * 2001-07-17 2009-07-23 Qimonda Ag Lötfreie Leiterplatten-Baugruppe

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0245179A2 (fr) * 1986-05-07 1987-11-11 Digital Equipment Corporation Système de montage amovible pour semi-conducteurs sur un substrat conducteur
EP0320660A2 (fr) * 1987-12-17 1989-06-21 International Business Machines Corporation Empaquetage pour circuit intégré
JPH04237152A (ja) * 1991-01-22 1992-08-25 Japan Aviation Electron Ind Ltd ソケット
EP0505859A1 (fr) * 1991-03-25 1992-09-30 International Business Machines Corporation Paquet électronique pour utilisations à haute densité
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure

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DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
DE3439556A1 (de) * 1984-08-07 1986-02-20 Aavid Engineering Inc., Laconia, N.H. Eine waermesenke bildende abdeckung fuer einen ein elektronisches chip aufnehmenden traeger
US4699593A (en) * 1986-01-14 1987-10-13 Amp Incorporated Connector having contact modules for a substrate such as an IC chip carrier
DE3629567A1 (de) * 1986-08-30 1988-03-03 Bbc Brown Boveri & Cie Halbleiterblock
US4906194A (en) * 1989-04-13 1990-03-06 Amp Incorporated High density connector for an IC chip carrier
US4969828A (en) * 1989-05-17 1990-11-13 Amp Incorporated Electrical socket for TAB IC's
US5058265A (en) * 1990-05-10 1991-10-22 Rockwell International Corporation Method for packaging a board of electronic components
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
JPH06164265A (ja) * 1992-11-16 1994-06-10 Toshiba Corp マイクロ波増幅器
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
DE4310446C1 (de) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Schaltungsanordnung
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0245179A2 (fr) * 1986-05-07 1987-11-11 Digital Equipment Corporation Système de montage amovible pour semi-conducteurs sur un substrat conducteur
EP0320660A2 (fr) * 1987-12-17 1989-06-21 International Business Machines Corporation Empaquetage pour circuit intégré
JPH04237152A (ja) * 1991-01-22 1992-08-25 Japan Aviation Electron Ind Ltd ソケット
EP0505859A1 (fr) * 1991-03-25 1992-09-30 International Business Machines Corporation Paquet électronique pour utilisations à haute densité
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure

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* Cited by examiner, † Cited by third party
Title
"Double-Sided Thermal Conduction Module Cooling", IBM TECHNICAL DISCLOSURE BULLETIN., vol. 28, no. 3, August 1985 (1985-08-01), NEW YORK US, pages 1094, XP002061693 *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 003 (E - 1301) 6 January 1993 (1993-01-06) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10297047B4 (de) * 2001-07-17 2009-07-23 Qimonda Ag Lötfreie Leiterplatten-Baugruppe

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