WO1998049760A1 - Contact reduisant les contraintes sur les fils - Google Patents

Contact reduisant les contraintes sur les fils Download PDF

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Publication number
WO1998049760A1
WO1998049760A1 PCT/US1998/008928 US9808928W WO9849760A1 WO 1998049760 A1 WO1998049760 A1 WO 1998049760A1 US 9808928 W US9808928 W US 9808928W WO 9849760 A1 WO9849760 A1 WO 9849760A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
contact
groove
circuit board
contact member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1998/008928
Other languages
English (en)
Inventor
Joseph S. Cachina
James Michael Becker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ennovi Advanced Mobility Solutions NJ Inc
Original Assignee
North American Specialties Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North American Specialties Corp filed Critical North American Specialties Corp
Priority to AU71748/98A priority Critical patent/AU7174898A/en
Publication of WO1998049760A1 publication Critical patent/WO1998049760A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/027—Soldered or welded connections comprising means for positioning or holding the parts to be soldered or welded

Definitions

  • the present invention generally relates to the field of electrical contacts for wires and the like. More specifically, the present invention relates to an electrical contact for wires which reduces the stress placed on the wire during the wire soldering/connection operation, as well as in operation.
  • One approach to reducing the stress experienced by the wire during insertion and subsequent operation is to utilize connectors or contacts which are then soldered to corresponding pads on the circuit board to which the wires were originally to be connected. Although this approach may somewhat reduce the stress experienced by the wire during insertion and/or subsequent operation, it still does not entirely eliminate the stress. This is because the wire must still be stretched during the connection to the connector itself. Additionally, this approach introduces the cost and complexity of additional components (the connector or holder) without substantially eliminating the stress experienced by the wire.
  • the present invention is directed to an electrical contact for wires which reduces the stress placed on the wire during the wire soldering/connection operation, as well as in operation.
  • the wires of an electrical component are electrically connected to stress reducing contacts which are in turn mounted on a circuit board.
  • Each contact is generally in the shape of an angular, e.g., right angle, conductor which is provided with a generally circular groove running the length of the conductor.
  • the open portion of the generally circular groove is generally less than 180 degrees such that when the wire is inserted into the groove it cannot be easily removed.
  • the diameter of the groove is slightly less than the diameter of the wire, including insulation. This is to provide a friction fit between the wire and the groove once the wire is inserted into the groove.
  • the wire from the electrical component is held by the contact which is fixed to the circuit board.
  • the portion of the wire between the electrical component and the contact is maintained untensioned after the wire is inserted into the groove.
  • the wire portion held in the groove is then laser welded whereby the insulation is removed and a tin-lead plating on the contact is allowed to reflow in order to electrically and mechanically attach the wire to the contact.
  • the contact is also preferably provided with a pin, foot or other mechanism for mating with a corresponding contact pad or plated through hole on the circuit board.
  • the groove portion of the contact may be provided with cutout sections at one or both ends which act to more securely grip the wire.
  • Figure 1 is a perspective view of a contact according to the present invention.
  • Figure 2 is a cross sectional view of the contact of Figure 3 taken along the line 2-2;
  • Figure 3 is a plan view of the contact prior to bending into its final shape
  • Figure 4 is a plan view of the contact after bending into its final shape
  • Figure 5 is a perspective view of the contact with a wire inserted and soldered
  • Figure 6 is a cross sectional view of the contact of Figure 5 taken along line 6-6;
  • Figure 7 is a perspective view of an alternative embodiment of a contact according to the present invention with cutouts at the end of the groove;
  • Figure 8 is a perspective view of yet another alternative embodiment of a contact according to the present invention.
  • FIG. 1 therein is shown a detailed perspective view of a contact 8 according to the present invention.
  • the contact 8 is a generally angular contact having two orthogonal sides 10, 12 with a groove 14 in between the sides 10, 12 and located substantially along the bend in contact 8 which defines the sides 10, 12.
  • contact 8 is illustrated as having a 90 degree bend, it is of course understood that other angles of bend may be used in forming contact 8, in accordance with the particular application and requirement.
  • contact 8 will now be described with reference to Figures 3 and 4.
  • a blank of planar conductive material is stamped out to form the contact.
  • the contact is coated partially, or entirely, with tin material which is later reflowed in order to electrically and mechanically bond the wire 14 to the contact 8.
  • a semicircular (180 degree) groove 14 is then formed in the middle region of the contact 8.
  • contact 8 is bent into its angular shape, as shown in Figure 4.
  • the groove 14 becomes more than 180 degrees, and in fact approaches 270 degrees if the bend in contact 8 is 90 degrees. This leaves only a quarter-circle (90 degree) opening in groove 14, which allows for secure retention of wire 4 which is inserted therein. It will be
  • the opening can be more or less than 90 degrees, depending on the particular application.
  • the diameter of groove 14 is slightly larger than the diameter of wire 4 including insulation. This allows for a snug friction fit or compression fit between the wire 4 and the groove 14, i.e. , when the wire 4 is inserted into the groove 14, the insulation on o the wire 4 is compressed.
  • Figure 2 illustrates the cross section of groove 14 according to one illustrative embodiment of the present invention. As shown in Figure 2, the ends 16 of groove 14 are preferably flared out, i.e. , larger in diameter to allow slight movement of the wire 4 at the ends in order to absorb any tension that may be present at the end of wire 4. Alternatively, the flared ends may be eliminated and the entire groove 14 may be formed with s a constant diameter.
  • the insulation on wire 4 is removed, for example, by laser welding which vaporizes the insulation.
  • the laser welding also serves to reflow the tin coating on the contact 8 to thereby electrically and mechanically bond the wire 4 to the contact 8.
  • Figure 6 illustrates in cross section the wire 4 and contact o 8 after the tin has reflowed.
  • the contact 8 is provided with a foot or pin or similar mechanism 18 for mounting onto a circuit board.
  • the foot 18 is provided as a flat foot as shown, whereas in the case of a through hole package, the foot 18 is actually provided in the form of a pin (not shown) for mating with a corresponding plated 5 through hole on the circuit board.
  • the foot is provided in the appropriate form for contacting the corresponding contact on the circuit board.
  • Figure 7 illustrates an alternative embodiment of the contact 8 according to the present invention.
  • the groove 14 includes open areas or cuts 20, 22 at either end. These cuts 20, 22 are used for pinching or retaining the wire at either end with o an increased amount of friction.
  • the wire 4 is bent downward into the cuts 20, 22 to provide added friction.
  • the added friction is due to the fact that as the wire is bent with respect to the plane of the groove, the actual cross section of the wire that is retained within the groove 14 is actually increased. As a result, more of the wire insulation is compressed, resulting in a more secure friction fit or compression hold between the wire 4 and the groove 14.
  • Figure 8 depicts another illustrative embodiment of the contact 8 according to the present invention.
  • the contact includes the two generally orthogonal sides 10 and 12, with the side 10 having a through hole 24 formed therein.
  • Hole 24 may optionally be used for mounting purposes.
  • the size of the hole 24 may be changed to alter the mass of the metal that forms the contact 8 to change the thermal properties of the contact in conjunction with the heat characteristics of the particular welding process used to reflow the tin coating. For example, if it is found that a chosen welding process results in too much heat being applied, the size of the hole may be made relatively small (or no hole may be formed at all) to provide a relatively large amount of metal to dissipate the heat being generated.
  • the size of the hole is preferably made relatively large such that there is less material to dissipate the heat being generated.
  • the hole may be formed in the side 12 rather than in the side 10, or a hole may be formed in both of the sides.
  • the hole may extend partially through the contact, rather than being a through hole, any may have any desired shape.
  • a recess (not shown) or other indentation may be formed to reduce the mass of the contact 8.
  • the term "hole” or "opening” is used to refer to any void that reduces the mass of the contact 8.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention porte sur un contact électrique réduisant les contraintes (8) sur les fils (4) de composants qui réduit les contraintes exercées sur le fil (4) pendant le processus de fixation par une liaison soudée au cours duquel le fil (4) est raccordé électriquement au contact (8). Chacun des contacts (8) a sensiblement une forme angulaire, par exemple à angle droit, présentant deux côtés (10, 12), et comporte une rainure circulaire (14) de la longueur du conducteur. La partie ouverte de la rainure (14) est de moins de 180° si bien que le fil une fois inséré dans la rainure (14) est difficile à déplacer. De plus, le diamètre de la rainure est légèrement inférieur à celui du fil, isolant compris, ce qui produit un ajustement serré entre le fil et la rainure. La partie du fil maintenue dans la rainure est ensuite soudée au laser pour solidariser électriquement et mécaniquement le fil au contact. Le contact est également muni d'une broche ou d'un sabot (18) ou d'autres mécanismes d'adaptation à des plots de contacts ou à des traversées (24) plaquées appariés sur le CI.
PCT/US1998/008928 1997-05-01 1998-04-30 Contact reduisant les contraintes sur les fils Ceased WO1998049760A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU71748/98A AU7174898A (en) 1997-05-01 1998-04-30 Reduced tension wire contact

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4526597P 1997-05-01 1997-05-01
US60/045,265 1997-05-01

Publications (1)

Publication Number Publication Date
WO1998049760A1 true WO1998049760A1 (fr) 1998-11-05

Family

ID=21936903

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/008928 Ceased WO1998049760A1 (fr) 1997-05-01 1998-04-30 Contact reduisant les contraintes sur les fils

Country Status (2)

Country Link
AU (1) AU7174898A (fr)
WO (1) WO1998049760A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093950A1 (fr) * 2005-02-28 2006-09-08 Molex Incorporated Terminaux anticapillarite a pas fins et connecteurs comprenant ces terminaux
EP2750251A4 (fr) * 2011-09-12 2015-03-18 Fuji Electric Wire Ind Co Ltd Structure de connexion pour fil électrique
JP2015115240A (ja) * 2013-12-12 2015-06-22 住友電装株式会社 端子および該端子の電線接続方法
EP3092685A4 (fr) * 2014-01-07 2017-12-06 MiniPumps, LLC Rondelles de soudage pour soudage par microfil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3027004A (en) * 1957-08-13 1962-03-27 Ind Electronic Hardware Corp Pin-receiving contacts for printed circuit board
US3144505A (en) * 1961-08-24 1964-08-11 Robertson Co H H Non-metallic electrical duct with embedded ground wire
US5344338A (en) * 1992-03-04 1994-09-06 Molex Incorporated Strain relief structure for connecting flat flexible cable to a circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3027004A (en) * 1957-08-13 1962-03-27 Ind Electronic Hardware Corp Pin-receiving contacts for printed circuit board
US3144505A (en) * 1961-08-24 1964-08-11 Robertson Co H H Non-metallic electrical duct with embedded ground wire
US5344338A (en) * 1992-03-04 1994-09-06 Molex Incorporated Strain relief structure for connecting flat flexible cable to a circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006093950A1 (fr) * 2005-02-28 2006-09-08 Molex Incorporated Terminaux anticapillarite a pas fins et connecteurs comprenant ces terminaux
US7318730B2 (en) 2005-02-28 2008-01-15 Molex Incorporated Fine-pitch anti-wicking terminals and connectors using same
EP2750251A4 (fr) * 2011-09-12 2015-03-18 Fuji Electric Wire Ind Co Ltd Structure de connexion pour fil électrique
JP2015115240A (ja) * 2013-12-12 2015-06-22 住友電装株式会社 端子および該端子の電線接続方法
EP3092685A4 (fr) * 2014-01-07 2017-12-06 MiniPumps, LLC Rondelles de soudage pour soudage par microfil

Also Published As

Publication number Publication date
AU7174898A (en) 1998-11-24

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