WO2000007199A2 - Relais electromagnetique et son procede de production - Google Patents

Relais electromagnetique et son procede de production Download PDF

Info

Publication number
WO2000007199A2
WO2000007199A2 PCT/DE1999/002338 DE9902338W WO0007199A2 WO 2000007199 A2 WO2000007199 A2 WO 2000007199A2 DE 9902338 W DE9902338 W DE 9902338W WO 0007199 A2 WO0007199 A2 WO 0007199A2
Authority
WO
WIPO (PCT)
Prior art keywords
relay according
contact springs
circuit board
contacts
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1999/002338
Other languages
German (de)
English (en)
Other versions
WO2000007199A3 (fr
Inventor
Michael Dittmann
Jens Heinrich
Rainer Vogel
Titus Ziegler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Electromechanical Components GmbH and Co KG
Original Assignee
Siemens Electromechanical Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1999119425 external-priority patent/DE19919425C2/de
Application filed by Siemens Electromechanical Components GmbH and Co KG filed Critical Siemens Electromechanical Components GmbH and Co KG
Publication of WO2000007199A2 publication Critical patent/WO2000007199A2/fr
Publication of WO2000007199A3 publication Critical patent/WO2000007199A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
    • H01H1/40—Contact mounted so that its contact-making surface is flush with adjoining insulation
    • H01H1/403—Contacts forming part of a printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/16—Magnetic circuit arrangements
    • H01H50/18—Movable parts of magnetic circuits, e.g. armature
    • H01H50/24—Parts rotatable or rockable outside coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H01H50/548—Contact arrangements for miniaturised relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/32—Self-aligning contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H50/041—Details concerning assembly of relays
    • H01H50/043—Details particular to miniaturised relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/22—Polarised relays
    • H01H51/2272—Polarised relays comprising rockable armature, rocking movement around central axis parallel to the main plane of the armature
    • H01H51/2281—Contacts rigidly combined with armature

Definitions

  • the invention relates to an electromagnetic relay with a magnet system comprising a coil, a core, an armature and movable contacts arranged on the armature and with a contact system comprising a base element having fixed contacts and connection elements arranged on the base element for the fixed contacts and the sink.
  • the fixed contacts are usually welded onto stamped tapes and tapes overmolded with thermoplastic plastic.
  • the connection elements are formed from these punched strips by bending, sealed with potting compound, cut to length and angled as an SMD connection.
  • the conventional relays have the disadvantage that punching metal strips causes high tool costs.
  • the subsequent bending operation results in a large spread in the position of the fixed contacts with respect to the movable contacts, which results in a high probability of failure and consequently also leads to a high scrap in production.
  • the thermoplastic used for the encapsulation has insufficient thermal stability against the temperatures that occur during reflow soldering.
  • the curved and cut to length SMD connection pins have a wide spread with regard to the coplanarity and the fidelity " , which results in a high rejection during manufacture, soldering errors during soldering and a reduction in the lifespan of the soldering point geometric design of the contact systems, a change of the design is only possible with increased effort.
  • the aim of the present invention is therefore to provide a relay that can be implemented without complex punching and bending operations that are critical with regard to the geometric dimensions.
  • the invention consists in an electromagnetic relay with a magnet system comprising a coil, a core, an armature and movable contacts arranged on the armature and with a contact system comprising a base element having fixed contacts and connection elements for the fixed contacts arranged on the base element and the coil, the fixed contacts being arranged on contact springs which are fixed to the base element with a fixed end and which have a free end.
  • the function of the relay no longer depends on the position in which the fixed contacts are located, since distance tolerances to the armature are compensated for by the spring action become.
  • a fixed, plated-through circuit board with conductor tracks is used as the base element, the fixed ends of the contact springs being connected to the conductor tracks.
  • This embodiment has the advantage that when the relay base is soldered onto a further printed circuit board, no thermal mismatch can occur between the base element and the printed circuit board.
  • the conductor tracks forming the supply line to the fixed contacts can also be designed in a particularly simple and flexible manner on a printed circuit board.
  • An insulating layer is preferably arranged between the movable contacts and the armature. With the movable contacts insulated from one another as a result, they can be designed particularly easily as bridge contacts, the movable contacts forming contact bridges which each cover two fixed contacts.
  • the advantage of the bridge contacts is, on the one hand, that the power supply to the movable contacts can be dispensed with.
  • the air gap between the fixed contacts and the movable contacts when the contacts are open becomes twice as effective as an electrical series connection of resistors, which increases the dielectric strength of the contacts against overvoltages. When applying high-frequency signals to the fixed contacts, this also results in higher crosstalk attenuation than with only one air gap.
  • the base element has additional connection elements for the movable contacts, which are connected to conductor tracks arranged on the insulating layer.
  • the conductor tracks on the insulating layer are contacted with the corresponding connection elements by means of spring elements or via a flexible printed circuit board.
  • This embodiment halves the number of required contact springs per contact compared to the bridge contacts, which can be used to increase the number of contacts with the same volume of the relay.
  • the spring elements used for contacting the conductor tracks on the insulating layer are preferably arranged on arms of the insulating layer which project transversely outward in the region of the armature rotation axis. The arms also act as a torsion spring and act as an anchor spring.
  • the relay structure according to the invention is used to manufacture high-frequency relays, it is particularly advantageous to have a conductor track on the relay base as a microstrip line to train.
  • the microstrip line allows the wave resistance to be adapted particularly easily in the case of high-frequency signals, so that the electrical shielding required by the conventional high-frequency relays by means of a coaxial line can be dispensed with.
  • the main disadvantage of these known coaxial lines is that they take up a lot of space.
  • the contact springs of the relay according to the invention can preferably be formed by electrodeposition of a layer of metal or a metal alloy and subsequent partial undercutting of the layer.
  • the contact springs bulge upwards due to internal stresses in the deposited material with their free, under-etched ends in the direction of the armature.
  • the spring characteristics can be set to a desired level by simply varying the deposited material or the deposited layer thickness.
  • contact springs Another possibility of producing the contact springs is their formation from strip material, which is bent by plastic deformation.
  • the tape material can also be attached to the relay base with spacer elements without plastically deforming the spring.
  • Undeformed contact springs can also be arranged with their free end over a pit arranged in the relay base. The advantage here is that it is possible to dispense with deforming the contact spring.
  • connection elements for the fixed contacts, the coil and possibly the movable contacts are formed as solder balls in connection with the plated-through holes of the printed circuit board, which are arranged on the side of the relay base facing away from the armature.
  • solder balls can be manufactured very simply with a fixedly defined diameter, and in connection with the flat circuit board there is almost no scatter in the coplanarity of the relay connections.
  • the circuit board forming the base element is preferably made of thermosetting plastic. This has the advantage that it is stable against the temperatures that occur during reflow soldering.
  • the fixed contacts are double contacts. These double contacts guarantee a safe contact even if the armature axis of rotation is slightly tilted and if there are any particles in a contact.
  • the double contacts can be realized particularly easily by means of contact springs which are slotted in the longitudinal direction at their free ends.
  • a plated-through circuit board as a base element for the relay enables the arrangement of further contact and magnet systems on this circuit board.
  • several relays in a customer-specific matrix form can be accommodated in a common housing to save space.
  • the circuit board forming the base element of the relay is additionally used as a wiring support for components which are usually used in external circuitry, such as electronic fuses, diodes, capacitors, resistors or drivers.
  • components which are usually used in external circuitry, such as electronic fuses, diodes, capacitors, resistors or drivers.
  • connectors can also be arranged on the circuit board.
  • Figure 1 shows a relay according to the invention in a schematic longitudinal section.
  • Figure 2 shows a first embodiment of the armature with the insulating layer in a schematic plan view of the contact side.
  • Figure 3 shows a first embodiment of the relay base with contact springs arranged thereon in a schematic plan view.
  • Figure 4 shows a second embodiment of the anchor with the insulating layer in a schematic plan view of the
  • FIG. 5 shows a second embodiment of the relay base with contact springs arranged thereon in a schematic plan view.
  • Figure 6 shows an embodiment of the armature with the insulating layer for use in RF relays in a schematic plan view of the contact side.
  • Figure 7 shows a first embodiment of the relay base with contact springs arranged thereon for use in RF relays in a schematic plan view.
  • Figure 8 shows a second embodiment of the relay base with contact springs arranged thereon for use in RF relays in a schematic plan view.
  • FIG. 9 shows an arrangement of several relays on a printed circuit board with components additionally arranged on the printed circuit board in a schematic longitudinal section.
  • Figure 10 shows the relay base with an electrodeposited contact spring before undercutting in a schematic longitudinal section 1 shows an electromagnetic relay with coil 1, coil body 23, core 2, first pole piece 2a, second pole piece 2b, a three-pole permanent magnet 3, and an armature 4.
  • the armature 4 is fastened to the three-pole permanent magnet 3 with the aid of a bearing spring 17 .
  • the intermediate piece 16 guarantees a minimum distance of the armature 4 from the three-pole permanent magnet 3 and at the same time bridges the air gap between the two.
  • the entire magnet system is surrounded by a relay jacket 13 with a collar 14. With the collar 14, the relay sheath 13 is fastened on the plated-through circuit board 10.
  • the plated-through circuit board 10 forms the base element of the relay and carries the connection elements 15 of the relay for the underside
  • the connecting elements are designed as solder balls 15.
  • the fixed contacts 12 are arranged on contact springs 9 on the inside of the printed circuit board 10.
  • the plated-through holes 15 a shown in FIG. 1 contact the fixed contacts 12 with the corresponding solder balls 15.
  • FIG. 2 shows the insulating layer 6 with the armature 4 underneath and with the movable contacts 5, as can be designed for the execution of bridge contacts.
  • the corresponding design of the plated-through circuit board 10 is shown in FIG. 3.
  • Two fixed contacts 12 are provided on the printed circuit board 10 for each movable contact 5.
  • the fixed contacts are arranged on contact springs 9.
  • These contact springs 9 have a free end on which the fixed contacts 12 are arranged and a fixed end with which they are fastened on conductor tracks 9a running on the printed circuit board 10.
  • the conductor tracks 9a are connected to the solder balls in an electrically conductive manner via plated-through holes 15a (FIG. 1).
  • the contact springs 9 are slotted at their free ends in order to ensure reliable contacting.
  • FIG. 1 shows the insulating layer 6 with the armature 4 underneath and with the movable contacts 5, as can be designed for the execution of bridge contacts.
  • the corresponding design of the plated-through circuit board 10 is shown in FIG. 3. 3.
  • FIG. 4 shows a further embodiment of an elastic insulating layer 6 with an anchor 4 underneath.
  • the movable contacts 5 are connected to conductor tracks 7 arranged on the insulating layer 6.
  • the conductor tracks 7 are contacted with spring elements 8, which produce the electrical connection to the associated connection elements.
  • the spring elements 8 are arranged in the region of the armature axis of rotation on arms 11 of the insulating layer 6 which project transversely outwards. These arms 11 in turn are supported on supports 11a fastened on the base element, so that a rocking movement of the armature about an axis running longitudinally to the spring elements 8 is possible.
  • FIG. 5 shows a printed circuit board 10 with conductor tracks 9a and supports 11a arranged thereon.
  • the contact springs 9 with the fixed contacts 12 are arranged on the conductor tracks 9a.
  • the fixed contacts 12 are connected via the contact springs 9 and
  • connection elements only one fixed contact 12 on the printed circuit board 10 is required for each movable contact 5.
  • Figure 6 shows a further embodiment of the insulating layer
  • FIG. 6 includes the embodiments of the plated-through circuit board 10 shown in FIG. 7 and in FIG. 8.
  • FIG. 7 shows a circuit board 10 as a base element with fixed contacts 12 arranged thereon.
  • the fixed contacts 12 are arranged on contact springs 9.
  • the high-frequency signal lines to the fixed contacts 12 are realized by conductor tracks 18 arranged on the printed circuit board 10.
  • the one to lead Ground line necessary for high-frequency signals is designed as a microstrip line 19, which is separated from the conductor tracks 18 by an insulating layer. This creates a ground line with an adapted characteristic impedance.
  • the microstrip line 19 can be arranged on the side of the printed circuit board facing away from the fixed contacts 12 or in an intermediate plane of the printed circuit board.
  • Coil contact elements 20 for connecting the coil are also arranged on the printed circuit board 10.
  • Figure 8 shows a plated-through circuit board 10 for use in an RF relay.
  • Fixed contacts 12 are arranged on the printed circuit board 10.
  • the fixed contacts 12 are arranged on contact springs 9.
  • the high-frequency signals are supplied to the fixed contacts via conductor tracks 18a arranged on the printed circuit board.
  • the ground line 18 necessary for the routing of RF signals is located on the same level as the signal lines and forms a coplanar waveguide with them.
  • Coil contact elements 20 are also arranged on the printed circuit board 10.
  • FIG. 9 shows a multi-relay arrangement with additional components 21 arranged on the printed circuit board 10 and a plug connector 22 arranged on the printed circuit board 10.
  • Contact systems with contact springs 9 belonging to several relays are arranged on the printed circuit board 10.
  • the magnetic systems of the relays with their relay casings 13 are mounted on the printed circuit board 10 via these contact systems.
  • FIG. 10 shows the printed circuit board 10 with the copper layer 24 electrodeposited thereon.
  • This copper layer 24 has a thickness of 35 ⁇ m, for example.
  • the layer forming the contact spring 9 is electrodeposited on the copper layer 24.
  • This layer consists, for example, of a nickel / iron alloy with a thickness of 50 ⁇ m.
  • Conductivity is a precious metal coating 25 on the contact spring 9, for example by sputtering or by means of electroplating, upset.
  • This noble metal coating 25 typically has a thickness of 1 to 2 ⁇ m and consists, for example, of gold or silver.
  • the solid contact 12 is finally deposited on the noble metal coating 25.
  • the fixed contact 12 is preferably made of gold.
  • the nickel / iron layer 9 can be applied with high mechanical tension, so that a contact spring 9 bent away from the printed circuit board 10 can be produced by partially etching away the copper layer 24.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Contacts (AREA)
  • Electromagnets (AREA)

Abstract

L'invention concerne un relais électromagnétique comprenant une bobine (1), un noyau (2), un induit (4), des contacts mobiles (5) disposés sur l'induit, un élément socle (10) et des contacts fixes (12) disposés sur l'élément socle. Les contacts fixes (12) sont disposés sur des ressorts de contact (9) qui sont fixés à l'élément socle (10) par une extrémité fixe et qui présentent une extrémité libre. L'invention concerne également le procédé de production de ce relais.
PCT/DE1999/002338 1998-07-30 1999-07-29 Relais electromagnetique et son procede de production Ceased WO2000007199A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19834460 1998-07-30
DE19834460.0 1998-07-30
DE19919425.4 1999-04-28
DE1999119425 DE19919425C2 (de) 1999-04-28 1999-04-28 Elektromagnetisches Relais

Publications (2)

Publication Number Publication Date
WO2000007199A2 true WO2000007199A2 (fr) 2000-02-10
WO2000007199A3 WO2000007199A3 (fr) 2000-08-31

Family

ID=26047806

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/002338 Ceased WO2000007199A2 (fr) 1998-07-30 1999-07-29 Relais electromagnetique et son procede de production

Country Status (1)

Country Link
WO (1) WO2000007199A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150042423A1 (en) * 2012-03-30 2015-02-12 Phoenix Contact Gmbh & Co. Kg Relay Having Two Switches That Can Be Actuated In Opposite Directions
US20150048909A1 (en) * 2012-03-30 2015-02-19 Phoenix Contact Gmbh & Co. Kg Polarized Electromagnetic Relay and Method for Production Thereof
CN112103138A (zh) * 2020-09-14 2020-12-18 苏州磁明科技有限公司 一种具有柔性印刷线路触点带的射频开关及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE24209E (en) * 1952-07-19 1956-09-04 bernstein
US2852639A (en) * 1954-11-08 1958-09-16 Leach Corp Relay
FR1136502A (fr) * 1955-11-15 1957-05-15 Cie I B M France Perfectionnements aux relais
US4668928A (en) * 1986-06-23 1987-05-26 Tektronix, Inc. Bi-stable switch with pivoted armature
AT404768B (de) * 1993-07-02 1999-02-25 Schrack Components Ag Relais
JPH07211212A (ja) * 1994-01-26 1995-08-11 Matsushita Electric Works Ltd リレー
DE4445129C2 (de) * 1994-12-17 2000-10-26 Hella Kg Hueck & Co Elektrisches Gerät für Kraftfahrzeuge
JPH08255544A (ja) * 1995-03-20 1996-10-01 Nec Corp リードレス表面実装用リレー
DE19719355C1 (de) * 1997-05-07 1998-11-05 Siemens Ag Polarisiertes elektromagnetisches Relais

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150042423A1 (en) * 2012-03-30 2015-02-12 Phoenix Contact Gmbh & Co. Kg Relay Having Two Switches That Can Be Actuated In Opposite Directions
US20150048909A1 (en) * 2012-03-30 2015-02-19 Phoenix Contact Gmbh & Co. Kg Polarized Electromagnetic Relay and Method for Production Thereof
US9275815B2 (en) * 2012-03-30 2016-03-01 Phoenix Contact Gmbh & Co. Kg Relay having two switches that can be actuated in opposite directions
US9368304B2 (en) * 2012-03-30 2016-06-14 Phoenix Contact Gmbh & Co. Kg Polarized electromagnetic relay and method for production thereof
CN112103138A (zh) * 2020-09-14 2020-12-18 苏州磁明科技有限公司 一种具有柔性印刷线路触点带的射频开关及其制造方法

Also Published As

Publication number Publication date
WO2000007199A3 (fr) 2000-08-31

Similar Documents

Publication Publication Date Title
EP0004899B1 (fr) Procédé pour établir des connexions électriquement conductrices et sans oscillations entre des circuits imprimés sur la surface arrière d'une plaque à circuits et des ressorts de contact des réglettes à ressorts de contact, aussi bien que réglette à ressorts de contact appropriée
DE3544838C2 (fr)
DE4217205C2 (de) Steckverbinder
EP1216419B1 (fr) Pointe de mesure pour mesure de hautes fréquences
DE69011223T2 (de) Verbinderanordnung mit einem beweglichen Wagen.
EP2338207B1 (fr) Antenne pour balise rfid
EP0374648B1 (fr) Dispositif de connexion d'un câble électrique
EP3138161B1 (fr) Élément de contact pour connexion électrique et feuillard de cuivre servant à fabriquer une pluralité d'éléments de contact
DE102009058825A1 (de) Kontaktvorrichtung zum Befestigen an einer Leiterplatte, Verfahren zum Befestigen einer Kontaktvorrichtung an einer Leiterplatte und Leiterplatte
DE1949966A1 (de) UEber Nocken betaetigbarer Schalter mit beweglichen und festen Kontakten,insbesondere fuer gedruckte Leiterplatten
EP1714533B1 (fr) Composant electrique comprenant une fiche de contact electroconductrice et destine a etre enfonce dans un orifice d'une carte de circuits imprimes
EP1128476B2 (fr) Procédé de fabrication d'un connecteur
DE102019208778B4 (de) Substratanordnung
WO2000007199A2 (fr) Relais electromagnetique et son procede de production
EP0811995A1 (fr) Enroulement magnétique et procédé de sa fabrication
DE102004001899A1 (de) Sperrkreisanordnung
WO1982003723A1 (fr) Contact electrique, notamment pour circuits imprimes de petits appareils electriques
EP0148328A2 (fr) Interrupteur électrique avec des contacts fixes formés par des parties de pistes conductrices
EP2237378A1 (fr) Dispositif de contact
DE19919425C2 (de) Elektromagnetisches Relais
EP0144413A1 (fr) Carte imprimee pour le montage en surface de circuits integres miniature et procede de fabrication de telles cartes imprimees
DE3249831C2 (fr)
WO2000007200A2 (fr) Relais electromagnetique
DE4136031C1 (en) Double plug contact for car electric installation - consists of 2 terminal contact fins integral with strip conductor web
DE102012223077A1 (de) Kontaktanordnung für einen mehrlagigen Schaltungsträger

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

122 Ep: pct application non-entry in european phase
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)

Free format text: (EXCEPT US)