WO2003012175A3 - Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials - Google Patents

Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials Download PDF

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Publication number
WO2003012175A3
WO2003012175A3 PCT/EP2002/006824 EP0206824W WO03012175A3 WO 2003012175 A3 WO2003012175 A3 WO 2003012175A3 EP 0206824 W EP0206824 W EP 0206824W WO 03012175 A3 WO03012175 A3 WO 03012175A3
Authority
WO
WIPO (PCT)
Prior art keywords
strip
paint
support material
shaped
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2002/006824
Other languages
English (en)
French (fr)
Other versions
WO2003012175A2 (de
Inventor
Michail Kotsias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IMO INGO MUELLER EK
Imo Ingo Mueller E K
Original Assignee
IMO INGO MUELLER EK
Imo Ingo Mueller E K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IMO INGO MUELLER EK, Imo Ingo Mueller E K filed Critical IMO INGO MUELLER EK
Priority to US10/484,205 priority Critical patent/US6972082B2/en
Priority to AT02754718T priority patent/ATE291110T1/de
Priority to HK05102087.5A priority patent/HK1069607B/xx
Priority to DE50202493T priority patent/DE50202493D1/de
Priority to JP2003517344A priority patent/JP2004536971A/ja
Priority to EP02754718A priority patent/EP1409772B2/de
Publication of WO2003012175A2 publication Critical patent/WO2003012175A2/de
Publication of WO2003012175A3 publication Critical patent/WO2003012175A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

Es wird ein Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials (10) im kontinuierlichen Durchlauf vorgeschlagen, insbesondere eines Trägermaterialbands mit vorgestanzten Kontaktelementen, wobei a) das Trägermaterial (10) in einer elektrophoretischen Lackbeschichtungseinrichtung (14) mit einem elektrophoretischen Lack selektiv mit wenigstens einem Lackstreifen beschichtet wird, b) der wenigstens eine Lackstreifen an denjenigen Stellen mittels eines Lasers (40) entlackt wird, die galvanisiert werden sollen, c) in einem Galvanisierungsprozess eine Metallschicht auf die entlackten Stellen im wenigstens einen Lackstreifen mittels selektiver Galvanisierung aufgebracht wird, und der wenigstens eine Lackstreifen anschließend entfernt wird.
PCT/EP2002/006824 2001-07-20 2002-06-20 Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials Ceased WO2003012175A2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US10/484,205 US6972082B2 (en) 2001-07-20 2002-06-20 Method for the selectively electroplating a strip-shaped, metal support material
AT02754718T ATE291110T1 (de) 2001-07-20 2002-06-20 Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials
HK05102087.5A HK1069607B (en) 2001-07-20 2002-06-20 Method for selectively electroplating a strip-shaped, metal support material
DE50202493T DE50202493D1 (de) 2001-07-20 2002-06-20 Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials
JP2003517344A JP2004536971A (ja) 2001-07-20 2002-06-20 ストリップ形状の金属製支持材料に対する選択的電気めっき方法
EP02754718A EP1409772B2 (de) 2001-07-20 2002-06-20 Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10135349.9 2001-07-20
DE10135349A DE10135349A1 (de) 2001-07-20 2001-07-20 Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials

Publications (2)

Publication Number Publication Date
WO2003012175A2 WO2003012175A2 (de) 2003-02-13
WO2003012175A3 true WO2003012175A3 (de) 2003-10-30

Family

ID=7692468

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/006824 Ceased WO2003012175A2 (de) 2001-07-20 2002-06-20 Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials

Country Status (7)

Country Link
US (1) US6972082B2 (de)
EP (1) EP1409772B2 (de)
JP (1) JP2004536971A (de)
CN (1) CN1250777C (de)
AT (1) ATE291110T1 (de)
DE (2) DE10135349A1 (de)
WO (1) WO2003012175A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4660231B2 (ja) * 2005-03-10 2011-03-30 株式会社シミズ 表面処理方法およびそれを用いる電子部品の製造方法
SG191114A1 (en) * 2010-12-23 2013-07-31 Framatome Connectors Int Plating method and apparatus, and strip obtained by this method
CN102888632B (zh) * 2012-09-14 2014-12-03 艾蒂盟斯（苏州）压铸电子技术有限公司 一种选择性电镀的防护工装和方法
CN103173839B (zh) * 2013-03-22 2015-11-18 湖南永盛新材料股份有限公司 一种金属带材单面连续电泳沉积的方法及装置
CN105239118B (zh) * 2014-06-17 2017-10-31 于长弘 电镀治具
CN107059078B (zh) * 2017-04-21 2020-02-18 东莞领益精密制造科技有限公司 一种金属零件局部精密镀锡加工工艺
JP7221003B2 (ja) * 2017-08-31 2023-02-13 Ｄｏｗａメタルテック株式会社 部分めっき方法
CN110923783B (zh) * 2019-11-20 2021-05-25 娄底市安地亚斯电子陶瓷有限公司 一种轮毂型电镀超薄金刚石切割片的制作方法
FR3117131B1 (fr) * 2020-12-03 2022-12-09 Safran Electronics & Defense Procede de protection d’une piece en alliage a base d’aluminium
CN112934582B (zh) * 2021-02-08 2022-04-26 浙江东尼电子股份有限公司 一种毛毡涂漆装置及漆包线
CN113089063A (zh) * 2021-04-14 2021-07-09 王曼曼 连续电镀装置及连续电镀方法
CN116180175A (zh) * 2023-01-06 2023-05-30 长春捷翼汽车科技股份有限公司 一种插拔件端子的孔内局部电镀工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035918A (en) * 1989-04-26 1991-07-30 Amp Incorporated Non-flammable and strippable plating resist and method of using same
WO2000052231A1 (en) * 1999-02-27 2000-09-08 Aem-Tech Engineers Pte Ltd. Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) * 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432855A (en) † 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
DD246575A1 (de) † 1986-03-14 1987-06-10 Seghers A Mikroelektronik Veb Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern
US4877644A (en) † 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation
NL9300174A (nl) † 1993-01-28 1994-08-16 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035918A (en) * 1989-04-26 1991-07-30 Amp Incorporated Non-flammable and strippable plating resist and method of using same
WO2000052231A1 (en) * 1999-02-27 2000-09-08 Aem-Tech Engineers Pte Ltd. Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) * 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten

Also Published As

Publication number Publication date
DE10135349A1 (de) 2003-02-06
JP2004536971A (ja) 2004-12-09
CN1533449A (zh) 2004-09-29
EP1409772B1 (de) 2005-03-16
EP1409772A2 (de) 2004-04-21
US20040206629A1 (en) 2004-10-21
US6972082B2 (en) 2005-12-06
HK1069607A1 (en) 2005-05-27
WO2003012175A2 (de) 2003-02-13
DE50202493D1 (de) 2005-04-21
ATE291110T1 (de) 2005-04-15
CN1250777C (zh) 2006-04-12
EP1409772B2 (de) 2008-08-13

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