WO2004106944A3 - 電子部品試験装置 - Google Patents

電子部品試験装置 Download PDF

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Publication number
WO2004106944A3
WO2004106944A3 PCT/JP2004/007362 JP2004007362W WO2004106944A3 WO 2004106944 A3 WO2004106944 A3 WO 2004106944A3 JP 2004007362 W JP2004007362 W JP 2004007362W WO 2004106944 A3 WO2004106944 A3 WO 2004106944A3
Authority
WO
WIPO (PCT)
Prior art keywords
test
holding
electronic part
section
test device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/007362
Other languages
English (en)
French (fr)
Other versions
WO2004106944A1 (ja
WO2004106944A2 (ja
Inventor
Kazuyuki Yamashita
Akihiko Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2005506501A priority Critical patent/JP4331165B2/ja
Priority to US10/558,833 priority patent/US20060290369A1/en
Priority to KR1020057021931A priority patent/KR100751842B1/ko
Priority to CNB2004800128438A priority patent/CN100498361C/zh
Publication of WO2004106944A1 publication Critical patent/WO2004106944A1/ja
Publication of WO2004106944A2 publication Critical patent/WO2004106944A2/ja
Publication of WO2004106944A3 publication Critical patent/WO2004106944A3/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

ＩＣチップ（ＩＣ）の入出力端子（ＨＢ）をテストヘッド（１５０）のコンタクト部（１５１）へ押し付けてテストを行う電子部品試験装置であって、ＩＣチップ（ＩＣ）の入出力端子（ＨＢ）が導出していない背面を、当該背面より大きく、実質的に平滑な保持面（１１４）に保持する保持部（１１３）をテストプレート本体部（１１１）に揺動可能に保持したテストプレート（１１０）を備え、テスト時に、保持部（１１３）の側面（１１３ｂ）が、コンタクト部（１５１）の周囲に設けられたガイド面（１５３）に案内されながら、保持部（１１３）に保持された状態のＩＣチップ（ＩＣ）が、コンタクト部のコンタクトピンに押し付けられる。
PCT/JP2004/007362 2003-05-30 2004-05-28 電子部品試験装置 Ceased WO2004106944A2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005506501A JP4331165B2 (ja) 2003-05-30 2004-05-28 電子部品試験装置
US10/558,833 US20060290369A1 (en) 2003-05-30 2004-05-28 Electronic part test device
KR1020057021931A KR100751842B1 (ko) 2003-05-30 2004-05-28 전자부품 시험장치
CNB2004800128438A CN100498361C (zh) 2003-05-30 2004-05-28 电子部件试验装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2003/006834 WO2004106953A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置
JPPCT/JP03/06834 2003-05-30

Publications (3)

Publication Number Publication Date
WO2004106944A1 WO2004106944A1 (ja) 2004-12-09
WO2004106944A2 WO2004106944A2 (ja) 2004-12-09
WO2004106944A3 true WO2004106944A3 (ja) 2005-02-17

Family

ID=33485799

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2003/006834 Ceased WO2004106953A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置
PCT/JP2004/007362 Ceased WO2004106944A2 (ja) 2003-05-30 2004-05-28 電子部品試験装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/006834 Ceased WO2004106953A1 (ja) 2003-05-30 2003-05-30 電子部品試験装置

Country Status (7)

Country Link
US (1) US20060290369A1 (ja)
JP (1) JP4331165B2 (ja)
KR (1) KR100751842B1 (ja)
CN (1) CN100498361C (ja)
AU (1) AU2003241973A1 (ja)
TW (1) TW200506394A (ja)
WO (2) WO2004106953A1 (ja)

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WO2004106954A1 (ja) * 2003-05-30 2004-12-09 Advantest Corporation 電子部品試験装置
JP5243037B2 (ja) * 2006-10-27 2013-07-24 株式会社アドバンテスト 電子部品試験装置
CN101342532B (zh) * 2007-07-13 2013-05-01 鸿劲科技股份有限公司 记忆体ic检测分类机
DE112009000200B4 (de) 2008-02-15 2013-05-16 Multitest Elektronische Systeme Gmbh Betätigungsvorrichtungen für eine Vorrichtung und ein Verfahren zum Ausrichten und Halten einer Mehrzahl singulierter Halbleiterbauelemente in Aufnahmetaschen eines Klemmträgers
EP2302399B1 (en) 2009-08-18 2012-10-10 Multitest elektronische Systeme GmbH System for post-processing of electronic components
MY151553A (en) 2009-08-18 2014-06-13 Multitest Elektronische Syst Two abutting sections of an align fixture together floatingly engaging an electronic component
MY160276A (en) 2009-08-18 2017-02-28 Multitest Elektronische Systeme Gmbh An elastic unit as a separate elastic member to be mounted at an elastic unit receiving section of an align fixture
MY152834A (en) 2009-08-18 2014-11-28 Multitest Elektronische Syst An elastic unit for clamping an electronic component and extending below an electronic component receiving volume of an align fixture
US20110046228A1 (en) * 2009-08-20 2011-02-24 Mutual Pharmaceutical Company, Inc. Methods for administration of colchicine with grapefruit juice
JP2011086880A (ja) * 2009-10-19 2011-04-28 Advantest Corp 電子部品実装装置および電子部品の実装方法
KR20110093456A (ko) * 2010-02-12 2011-08-18 삼성전자주식회사 반도체 패키지의 인서트 수납장치
KR20110099556A (ko) * 2010-03-02 2011-09-08 삼성전자주식회사 반도체 패키지 테스트장치
JP5423627B2 (ja) * 2010-09-14 2014-02-19 富士通セミコンダクター株式会社 半導体装置の試験装置及び試験方法
JP2013053991A (ja) * 2011-09-06 2013-03-21 Seiko Epson Corp ハンドラー及び部品検査装置
KR101183690B1 (ko) * 2011-11-28 2012-09-17 (주)이엔씨테크 제습기능을 갖춘 낸드 플래시 메모리용 핫/콜드 테스트 장비
US20130335110A1 (en) * 2012-06-15 2013-12-19 Polyvalor, Limited Partnership Planar circuit test fixture
DE102013113580B4 (de) 2013-12-05 2018-03-08 Multitest Elektronische Systeme Gmbh Verfahren zum Positionieren eines Trägers mit einer Vielzahl elektronischer Bauteile in einer Einrichtung zum Prüfen der elektronischen Bauteile
US9588142B2 (en) 2014-10-24 2017-03-07 Advantest Corporation Electronic device handling apparatus and electronic device testing apparatus
CN105005160B (zh) * 2015-07-29 2018-03-06 句容骏成电子有限公司 一种lcd管脚检测装置
KR102391516B1 (ko) * 2015-10-08 2022-04-27 삼성전자주식회사 반도체 테스트 장치
CN106180004B (zh) * 2016-08-08 2022-10-28 深圳市华力宇电子科技有限公司 指纹分选机的控制系统及控制方法
EP3580658A4 (en) * 2017-02-10 2020-12-30 Optofidelity OY PROCESS, ALL-IN-ONE TESTER AND COMPUTER PROGRAM PRODUCT
CA3084671A1 (en) * 2017-12-19 2019-06-27 Boston Semi Equipment, Llc Kit-less pick and place handler
TWI677685B (zh) * 2018-10-08 2019-11-21 鴻勁精密股份有限公司 電子元件測試設備
KR102760368B1 (ko) * 2018-12-11 2025-02-03 (주)테크윙 전자부품 테스트용 핸들러
WO2020124979A1 (en) * 2018-12-21 2020-06-25 Huawei Technologies Co., Ltd. A portable, integrated antenna test bed with built-in turntable
WO2020153742A1 (ko) * 2019-01-24 2020-07-30 주식회사 고영테크놀러지 검사 장치용 이송 기구, 검사 장치, 및 이를 이용하는 대상물 검사 방법
US11282730B2 (en) * 2019-08-02 2022-03-22 Rohinni, LLC Bridge apparatus for semiconductor die transfer
CN111346838A (zh) * 2020-03-12 2020-06-30 苏州艾方芯动自动化设备有限公司 利用金属载盘进行芯片自动化测试分类的方法及系统
DE102020117586B4 (de) * 2020-07-03 2022-03-24 Deutronic Elektronik Gmbh Vorrichtung zum Prüfen von Bauteilen elektrischer Maschinen, insbesondere Statoren und Rotoren
TWI766650B (zh) * 2021-04-19 2022-06-01 力成科技股份有限公司 半導體元件的測試頭組件
US11693026B2 (en) * 2021-10-22 2023-07-04 Advantest Corporation Test carrier
TWI907189B (zh) * 2024-12-02 2025-12-01 鴻勁精密股份有限公司 校正裝置、校正方法及其應用的作業機

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JPH1022365A (ja) * 1996-07-04 1998-01-23 Mitsubishi Electric Corp 位置決め装置
JP2002257900A (ja) * 2001-02-28 2002-09-11 Advantest Corp 試験用電子部品搬送媒体、電子部品試験装置および試験方法

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JPH06309436A (ja) * 1993-04-23 1994-11-04 Ando Electric Co Ltd Ｑｆｐ型ｉｃ用ｉｃソケットの位置検出方法
JPH09211067A (ja) * 1996-01-29 1997-08-15 Toshiba Corp 半導体装置の試験装置
JPH1022365A (ja) * 1996-07-04 1998-01-23 Mitsubishi Electric Corp 位置決め装置
JP2002257900A (ja) * 2001-02-28 2002-09-11 Advantest Corp 試験用電子部品搬送媒体、電子部品試験装置および試験方法

Also Published As

Publication number Publication date
US20060290369A1 (en) 2006-12-28
TW200506394A (en) 2005-02-16
AU2003241973A1 (en) 2005-01-21
TWI335992B (ja) 2011-01-11
KR100751842B1 (ko) 2007-08-24
JPWO2004106944A1 (ja) 2006-07-20
JP4331165B2 (ja) 2009-09-16
KR20060009362A (ko) 2006-01-31
CN1788206A (zh) 2006-06-14
WO2004106953A1 (ja) 2004-12-09
CN100498361C (zh) 2009-06-10
WO2004106944A2 (ja) 2004-12-09

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