WO2008040255A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2008040255A1
WO2008040255A1 PCT/CN2007/070802 CN2007070802W WO2008040255A1 WO 2008040255 A1 WO2008040255 A1 WO 2008040255A1 CN 2007070802 W CN2007070802 W CN 2007070802W WO 2008040255 A1 WO2008040255 A1 WO 2008040255A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
metal ground
ground layer
chip
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2007/070802
Other languages
English (en)
French (fr)
Inventor
Nancheng Chen
Chunwei Chang
Chaowei Tseng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MediaTek Inc
Original Assignee
MediaTek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MediaTek Inc filed Critical MediaTek Inc
Priority to EP07816993A priority Critical patent/EP2073263A4/en
Priority to JP2009525904A priority patent/JP2010503189A/ja
Publication of WO2008040255A1 publication Critical patent/WO2008040255A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the present invention relates to an electronic device, and more particularly to an electronic device that can enhance the heat dissipation effect of the chip and enhance the electrostatic protection function and effect.
  • Background Art In general, as the efficiency and function of a chip (integrated circuit) are increased, the amount of heat radiated therefrom also increases. Therefore, it is critical to effectively remove or diffuse the heat generated by a chip (integrated circuit) in operation.
  • FIG. 1 is a prior art electronic device 1 mainly comprising a housing 11, a printed circuit board 12, a chip 13, a heat sink 14, and a fan 15.
  • the printed circuit board 12, the chip 13, the heat sink 14, and the fan 15 are disposed in the casing 11.
  • the chip 13 is disposed on the printed circuit board 12.
  • the chip 13 may be a chip with lead-frame package or a chip with ball grid array package.
  • the chip 13 is shown in FIG. 1 chip lead frame package exemplified, and having a plurality of pins (lead) 13 a, die (die) 13b and a plastic package 13c.
  • the die 13b is covered by the package plastic 13c, and the die 13b is connected to the pin 13a.
  • the pin 13a is electrically connected to the printed circuit board 12 by means of splicing.
  • the heat sink 14 is disposed on the chip 13, and the fan 15 is disposed on the heat sink 14.
  • the heat generated by the die 13b of the chip 13 during operation is conducted to the heat sink 14 through the package plastic 13c.
  • the heat in the fins 14 is diffused by the fan 15 to other places in the casing 11 or outside the casing 11.
  • the electronic device 1 shown in Fig. 1 has many disadvantages in terms of heat dissipation.
  • t represents the heat transfer rate
  • k is the heat transfer coefficient
  • A represents the thermal contact area (thermal contact Area)
  • ⁇ represents the temperature difference
  • L represents the conduction thickness.
  • the temperature difference ( ⁇ ) between the chip 13 and the heat sink 14 is generally not large, and the heat transfer coefficient (k) value of the package plastic 13c is small. Therefore, the heat generated when the die 13b operates is conducted to the heat sink 14 through the package plastic 13c.
  • the heat transfer rate (t:) will be low, which will result in poor heat dissipation of the chip 13.
  • the arrangement of the heat radiating fins 14 and the fan 15 not only increases the overall volume of the electronic device 1, but also increases the manufacturing cost of the electronic device 1. Further, in order to solve the electrostatic discharge problem in the electronic device 1, it usually takes a lot of time and cooperates with the development of the hardware test platform, which also increases the manufacturing cost of the electronic device 1.
  • the present invention provides an electronic device that can enhance the heat dissipation effect of a chip and enhance the electrostatic protection function and effect.
  • the present invention provides an electronic device including a housing, a printed circuit board, and a chip.
  • a printed circuit board disposed in the housing and having a first metal ground layer, a second metal ground layer, and a metal connection, wherein the first metal ground layer is disposed on the printed circuit board and grounded relative to the second metal
  • the layer is connected between the first metal ground layer and the second metal ground layer, and the second metal ground layer is connected to the casing;
  • the chip is electrically connected to the printed circuit board, and includes a die and a heat conducting portion, wherein The heat conducting portion is connected to the die and is connected to the first metal ground layer, wherein heat generated by the chip is conducted to the case through the heat conducting portion, the first metal ground layer, the metal connecting portion and the second metal ground layer.
  • the present invention further provides an electronic device comprising a housing, a printed circuit board, a chip, and a metal connecting member.
  • the printed circuit board is disposed in the housing, the printed circuit board includes a first metal ground layer and a second metal ground layer, wherein the first metal ground layer is opposite to the second metal ground layer; the chip is electrically connected to the printed circuit board, The chip includes a die and a heat conducting portion, wherein the heat conducting portion is connected And connecting the first metal ground layer to the die; the metal connecting member is disposed in the printed circuit board, and connects the first metal ground layer and the second metal ground layer to the casing, wherein the heat generated by the chip It is conducted to the casing through the heat conducting portion, the first metal ground layer, and the metal connecting member.
  • the invention further provides an electronic device comprising a housing, a printed circuit board, and a chip.
  • the printed circuit board is disposed in the casing, and the printed circuit board includes a metal ground layer connected to the casing; the chip is electrically connected to the printed circuit board, and the chip comprises a die and a heat conducting portion, wherein the heat conducting portion is connected to the die, And the heat conducting portion is connected to the metal ground layer, wherein the heat generated by the chip is conducted to the housing through the heat conducting portion and the metal ground layer.
  • the present invention further provides an electronic device comprising a housing, a printed circuit board, a chip, and a metal connecting member.
  • the printed circuit board is disposed in the casing, and the printed circuit board comprises a metal ground layer;
  • the chip is electrically connected to the printed circuit board, and the chip comprises a die and a heat conducting portion connected to the die, wherein the heat conducting portion is connected to the metal a grounding layer;
  • the metal connecting member is disposed in the printed circuit board, and connects the metal ground layer to the housing, wherein the heat generated by the chip is conducted to the housing through the heat conducting portion, the metal ground layer, and the metal connecting member.
  • the invention further provides an electronic device comprising a housing, a printed circuit board, and a chip.
  • the printed circuit board is disposed in the casing; the chip is electrically connected to the printed circuit board, and the chip comprises a die and a heat conducting portion connected between the die and the casing, wherein heat generated by the chip is transmitted to the shell through the heat conducting portion body.
  • FIG. 1 is a partial side elevational and cross-sectional view of a prior art electronic device.
  • FIG. 2 is a partial side elevational and cross-sectional view of the electronic device according to the first embodiment of the present invention.
  • 3 is a partial side elevational and cross-sectional view of an electronic device in accordance with a second embodiment of the present invention.
  • FIG. 4 is a partial side elevational and cross-sectional view of an electronic device according to a third embodiment of the present invention.
  • FIG. 5 is a partial side elevational and cross-sectional view of an electronic device according to a fourth embodiment of the present invention.
  • FIG. 6 is a partial side elevational and cross-sectional view of an electronic device according to a fifth embodiment of the present invention.
  • FIG. 7 is a partial side elevational and cross-sectional view of an electronic device according to a sixth embodiment of the present invention.
  • FIG. 8 is a partial side elevational and cross-sectional view of an electronic device according to a seventh embodiment of the present invention.
  • FIG. 9 is a partial side elevational and cross-sectional view of an electronic device according to an eighth embodiment of the present invention.
  • FIG. 2 is a schematic diagram of an electronic device 100 according to a first embodiment of the present invention.
  • the electronic device 100 includes a housing 110, a printed circuit board 120, a chip 130, and a conductive element 140.
  • the printed circuit board 120 is disposed in the housing 110, and the printed circuit board 120 has a first metal ground layer 121, a second metal ground layer 122, and a plurality of metal connections 123.
  • the first metal ground layer 121 is disposed on the printed circuit board 120, and the first metal ground layer 121 is opposite to the second metal ground layer 122.
  • a plurality of metal connecting portions 123 are respectively connected between the first metal ground layer 121 and the second metal ground layer 122.
  • the second metal ground layer 122 is coupled to the housing 110.
  • the housing 110 has a projection 111, and the second metal ground layer 122 is coupled to the projection 111 of the housing 110.
  • each of the metal connecting portions 123 may be a through hole whose inner wall is plated with a metal material.
  • printed circuit board 120 can be a multilayer printed circuit board.
  • the chip 130 is electrically connected to the printed circuit board 120, and the chip 130 has a die 131, a heat conducting portion 132, and a package plastic 133.
  • the heat conducting portion 132 is connected to the die 131
  • the heat conducting portion 132 is connected to the first metal ground layer 121 of the printed circuit board 120 .
  • the package plastic 133 covers the die 131.
  • the first metal ground layer 121 is usually coated with a solder mask S 0 in order to enable the heat conducting portion 132 of the chip 130 to be connected to the first metal ground layer 121.
  • the first metal ground layer 121 retains the top barrier layer opening 121a.
  • the heat conducting portion 132 is connected to the first metal ground layer 121 through the top barrier layer opening 121a.
  • the conductive element 140 is coupled between the protrusion 111 of the housing 110 and the second metal ground layer 122 of the printed circuit board 120. Similarly, a second barrier layer S is also applied over the second metal ground plane 122. Similarly, a bottom barrier layer opening 122a is retained on the second metal ground plane 122. Conductive element 140 is coupled to second metal ground layer 122 through bottom barrier layer opening 122a. Additionally, conductive element 140 can include an electrical conductor and/or a thermal conductor. For example, conductive element 140 can comprise a conductive paste, a conductive patch, or a thermal pad.
  • the chip 130 may be a lead frame package chip or a ball grid array package chip.
  • the chip 130 is a lead frame package type chip, for example, when the chip 130 is a low profile plastic quad flat package (LQFP) type chip, the heat conduction portion 132 is connected to the crystal.
  • the exposed die pad is made of a metal such as aluminum.
  • the chip 130 is a ball grid array package chip, for example, when the chip 130 is a flip chip ball grid array (FCBGA package) chip, the heat conducting portion 132 is connected to the crystal.
  • the particles 131 are composed of a plurality of thermal ground balls.
  • the heat generated by the die 130 is sequentially conducted to the housing 110 through the heat conducting portion 132, the first metal ground layer 121, the metal connecting portion 123, the second metal ground layer 122, and the conductive member 140. And then transmitted from the housing 110 to the outside of the electronic device 100.
  • the heat generated by the operation of the die 131 is mainly conducted to the housing 110 through the heat conducting portion 132, the first metal ground layer 121, the metal connecting portion 123, the second metal ground layer 122, and the conductive member 140. It is not conducted by the package plastic 133 that coats the die 131, so the heat transfer coefficient (k) value is greatly increased. Further, the temperature difference ( ⁇ ) between the die 131 and the case 110 is larger than the temperature difference between the die 131 and the package plastic 133. Therefore, heat is transferred from the die 131 to
  • the heat transfer rate (t) in the housing 110 may increase, thereby enhancing the grain 131 (or chip 130) heat radiation.
  • the electronic device 100 no longer requires the configuration of the heat sink and the fan. Therefore, its overall volume and manufacturing cost can be greatly reduced.
  • the first metal ground layer 121 is connected to the second metal ground layer 122 with the shortest conductive path (metal connection portion 123), and the second metal ground layer 122 is connected to the housing 110, therefore, printing
  • the static electricity in the circuit board 120 can be easily conducted to the housing 110, which can effectively enhance the ESD protection effect in the electronic device 100. Therefore, the extra time and the cost of the test equipment required to solve the electrostatic discharge problem can be eliminated, and the manufacturing cost of the electronic device 100 can be drastically reduced.
  • the electronic device 100 can also selectively omit the conductive element 140.
  • the protrusion 111 of the case 110 can be directly connected to the second metal ground layer 122 through the bottom barrier layer opening 122a to achieve the same function and effect.
  • FIG. 3 is a schematic diagram of an electronic device 100' according to a second embodiment of the present invention.
  • the difference between the electronic device 100' and the electronic device 100 of the first embodiment is that the protruding portion 111 of the first embodiment is replaced by the conductive seat 150 of the present embodiment.
  • the conductive mount 150 is coupled between the second metal ground plane 122 of the printed circuit board 120 and the housing 110, and the conductive mount 150 can be an electrical conductor and/or a thermal conductor.
  • the conductive seat 150 includes an electrical conductor (e.g., metal), the heat dissipation effect of the die 131 (or the chip 130) can be greatly enhanced, and the electrostatic protection effect in the electronic device 100' can be effectively improved.
  • the conductive seat 150 includes a heat conductor (e.g., an insulating thermal pad), the heat dissipation effect of the die 131 (or the chip 130) can be greatly enhanced.
  • electronic device 100' can also selectively omit conductive element 140.
  • the conductive seat 150 can be directly connected to the second metal ground layer 122 through the bottom barrier layer opening 122a to achieve the same function and effect.
  • FIG. 4 is a schematic diagram of an electronic device 300 according to a third embodiment of the present invention.
  • the electronic device 300 includes a housing 310, a printed circuit board 320, a chip 330, and a plurality of metal connecting members 340.
  • the printed circuit board 320 is disposed in the housing 310, and the printed circuit board 320 includes a first metal ground layer 321, a second metal ground layer 322, and a plurality of metal connections 323.
  • the first metal ground layer 321 is opposite to the second metal ground layer 322, and the plurality of metal connecting portions 323 are respectively connected between the first metal ground layer 321 and the second metal ground layer 322.
  • each of the metal connecting portions 323 may be a through hole whose inner wall is plated with a metal material.
  • printed circuit board 320 can be a multilayer printed circuit board.
  • the chip 330 is electrically connected to the printed circuit board 320, and the chip 330 includes a die 331, a heat conducting portion 332, and a package plastic 333.
  • the heat conducting portion 332 is connected to the die 331, and is connected to the first metal ground layer 321 of the printed circuit board 320.
  • the package plastic 333 is coated with the die 331.
  • the first metal ground layer 321 is usually coated with a barrier layer S.
  • a barrier layer opening 321a is provided on the first metal ground layer 321 .
  • the heat conducting portion 332 is connected to the first metal ground layer 321 through the barrier layer opening 321a.
  • the metal connecting member 340 is disposed in the printed circuit board 320, and the metal connecting member 340 is used to connect the first metal ground layer 321 and the second metal ground layer 322 to the housing 310.
  • the metal connecting member 340 may adopt a bolt structure, which may be used to connect the first metal ground layer 321 and the second metal ground layer 322 to the housing 310, and may also be printed with the printed circuit board 320 and the housing 310. Fixed together.
  • chip 330 can be a lead frame packaged chip or a ball grid array packaged chip.
  • the heat conducting portion 332 may be an exposed die connected to the die 331. Pad.
  • the exposed die pad may be made of a metal such as aluminum.
  • the chip 330 is a ball grid array package chip, for example, when the chip 330 is a FCBGA package type chip, the heat conduction portion 332 may be thermally conductively connected to the die 331. Ball joints.
  • the heat generated by the chip 331 is conducted to the housing 310 through the heat conducting portion 332, the first metal ground layer 321, the metal connecting portion 323, the second metal ground layer 322, and the metal connecting member 340, and then The housing 310 is further transferred to the outside of the electronic device 300.
  • the heat generated when the die 331 operates is conducted to the housing 310 through the heat conducting portion 332, the first metal ground layer 321, the metal connecting portion 323, the second metal ground layer 322, and the metal connecting member 340 instead of passing through The package plastic 333 is conducted, so the heat transfer coefficient (k) value is greatly increased.
  • the temperature difference ( ⁇ ) between the die 331 and the housing 310 is greater than the temperature difference between the die 331 and the package plastic 333. Therefore, the heat generated by the die 331 is transferred from the die 331
  • the rate of thermal conduction ( ) leading to the housing 310 can be high, which can enhance the thermal diffusion or heat dissipation of the die 331 (or chip 330). Similarly, since the electronic device 300 does not require the arrangement of the heat sink and the fan, the overall volume and manufacturing cost can be greatly reduced.
  • the first metal ground layer 321 is connected to the second metal ground layer 322 with the shortest conduction path (the metal connection member 340 and the metal connection portion 323), and the second metal ground layer 322 is also the shortest conduction path (metal The connecting member 340) is connected to the housing 310, so that static electricity in the printed circuit board 320 can be easily conducted to the housing 310, which can effectively enhance the ESD protection effect in the electronic device 300. Therefore, the extra time and the cost of the test equipment required for solving the electrostatic discharge problem can be eliminated, and the manufacturing cost of the electronic device 100 can be drastically reduced.
  • the printed circuit board 320 can selectively omit the metal connection portion 323.
  • the heat generated by the die 331 can be conducted to the housing 310 through the heat conducting portion 332, the first metal ground layer 321 and the metal connecting member 340, and then transferred from the housing 310 to the outside of the electronic device 300. Therefore, the heat diffusion or heat dissipation effect of the die 331 (or the chip 330) and the electrostatic protection effect in the electronic device 300 can still be effectively improved.
  • FIG. 5 is a schematic diagram of an electronic device 400 according to a fourth embodiment of the present invention.
  • the electronic device 400 includes a housing 410, a printed circuit board 420, a chip 430, and a conductive element 440.
  • the printed circuit board 420 is disposed in the housing 410, and the printed circuit board 420 includes a metal ground layer 421.
  • Metal ground layer 421 is coupled to housing 410.
  • the housing 410 has a projection 411, and the metal ground layer 421 is coupled to the projection 411 of the housing 410.
  • printed circuit board 420 can be a multilayer printed circuit board.
  • the chip 430 is electrically connected to the printed circuit board 420, and the chip 430 includes a die 431, a heat conducting portion 432, and a package plastic 433.
  • the heat conducting portion 432 is connected to the die 431 and is connected to the metal ground layer 421 of the printed circuit board 420.
  • the package plastic 433 covers the die 431.
  • the metal ground layer 421 is usually coated with a barrier layer S.
  • the metal ground layer 421 has a top barrier layer opening 421a. The heat conducting portion 432 is connected to the metal ground layer 421 through the top barrier layer opening 421a.
  • the conductive element 440 is coupled between the protrusion 411 of the housing 410 and the metal ground plane 421 of the printed circuit board 420.
  • the bottom barrier layer opening 421b is further included on the metal ground layer 421.
  • Conductive element 440 is coupled to metal ground plane 421 through bottom barrier layer opening 421b.
  • conductive element 440 can include an electrical conductor and/or a thermal conductor.
  • conductive element 440 can be a conductive paste, a conductive patch, or a thermal pad.
  • chip 430 can be a lead frame packaged chip or a ball grid array packaged chip.
  • the chip 430 is a lead frame package type chip, for example, when the chip 430 is a thin plastic square planar package (LQFP) type chip
  • the heat conduction portion 432 is an exposed die pad connected to the die 431.
  • the exposed die pad may be made of a metal such as aluminum.
  • the chip 430 is a ball grid array package chip, for example, when the chip 430 is a flip chip matrix package (FCBGA package)
  • FCBGA package flip chip matrix package
  • the heat conducting portion 432 is composed of a plurality of thermally conductive ball joints connected to the die 431.
  • the heat generated by the die 430 is sequentially conducted to the housing 410 through the heat conducting portion 432, the metal ground layer 421, and the conductive member 440, and then transferred from the housing 410 to the outside of the electronic device 400. .
  • the heat transfer coefficient (k) value of the present embodiment is greatly improved as compared with the existing package structure.
  • the temperature difference ( ⁇ ) between the die 431 and the housing 410 is greater than the temperature difference between the die 431 and the package plastic 433. Therefore, heat generated by the crystal grains 431 is conducted from the crystal grains 431 to the shell
  • the heat transfer rate (t) in the body 410 is faster than that of the conventional device, so that the heat dissipation effect of the die 431 (or the chip 430) can be improved.
  • the electronic device 400 can be configured without a heat sink and a fan, the overall volume and manufacturing cost can be greatly reduced.
  • the metal ground layer 421 is connected to the housing 410 by the shortest conduction path Ci, the static electricity in the printed circuit board 420 can be easily conducted to the housing 410, which can effectively improve the electronic device 400. ESD protection effect. Therefore, the extra time and the cost of the test equipment required for solving the electrostatic discharge problem can be eliminated, and the manufacturing cost of the electronic device 100 can be drastically reduced.
  • electronic device 400 can also selectively omit conductive element 440.
  • the protrusion 411 of the body 410 can be directly connected to the metal ground layer 421 through the bottom barrier layer opening 421b to achieve the same function and effect.
  • FIG. 6 is a schematic diagram of an electronic device 400' according to a fifth embodiment of the present invention.
  • the difference between the electronic device 400' and the electronic device 400 of the fourth embodiment is that the protruding portion 411 of the fourth embodiment is replaced by the conductive seat 450 of the present embodiment.
  • the conductive seat 450 is connected to the print
  • the metal ground layer 421 of the circuit board 420 is brushed between the housing 410 and the conductive base 450 may include electrical conductors and/or thermal conductors.
  • the heat dissipation effect of the die 431 (or the chip 430) can be greatly enhanced, and the electrostatic protection effect in the electronic device 400' can be effectively improved.
  • the conductive seat 450 includes a heat conductor (e.g., an insulating thermal pad), the heat dissipation effect of the die 431 (or the chip 430) can be greatly enhanced.
  • electronic device 400' can also selectively omit conductive element 440.
  • the conductive seat 450 can be directly connected to the metal ground plane 421 through the bottom barrier layer opening 421b to achieve the same function and effect.
  • FIG. 7 is a schematic diagram of an electronic device 600 according to a sixth embodiment of the present invention.
  • the electronic device 600 includes a housing 610, a printed circuit board 620, a chip 630, and a plurality of metal connecting members 640.
  • Printed circuit board 620 is disposed in housing 610, and printed circuit board 620 includes a metal ground plane 621. Additionally, printed circuit board 620 can be a multilayer printed circuit board.
  • the chip 630 is electrically connected to the printed circuit board 620, and the chip 630 includes a die 631, a heat conducting portion 632, and a package plastic 633.
  • the heat conducting portion 632 is connected to the die 631, and the heat conducting portion 632 is connected to the metal ground layer 621 of the printed circuit board 620.
  • the package plastic 633 is coated with a die 631.
  • a barrier layer S is usually applied to the metal ground layer 621.
  • the metal ground layer 621 retains the barrier layer opening 621a.
  • the heat conducting portion 632 is connected to the metal ground layer 621 through the barrier layer opening 621a.
  • the metal connecting member 640 is disposed in the printed circuit board 620, and the metal connecting member 640 is used to connect the metal ground layer 621 to the housing 610.
  • the metal connecting member 640 may have a bolt structure that can be used to connect the metal ground layer 621 to the housing 610.
  • the printed circuit board 620 can also be secured to the housing 610.
  • chip 630 can be a lead frame packaged chip or a ball grid array packaged chip.
  • the chip 630 is a lead frame package type chip, for example, when the chip 630 is a thin plastic square planar package (LQFP) type chip, the heat conduction portion 632 is an exposed die pad connected to the die 631.
  • the exposed die pad may be made of a metal such as aluminum.
  • the chip 630 is a ball grid array package chip, for example, when the chip 630 is a FCBGA package chip
  • the heat conducting portion 632 can be connected to the plurality of heat conducting balls connected to the die 631. The combination of contacts.
  • the heat generated by the die 630 is conducted to the case 610 through the heat conductive portion 632, the metal ground layer 621, and the metal connecting member 640, and then transferred from the case 610 to the outside of the electronic device 600.
  • the heat transfer coefficient (k) value Will be greatly improved.
  • the temperature difference ( ⁇ ) between the die 631 and the housing 610 is greater than the temperature difference between the die 631 and the package plastic 633. Therefore, the heat from
  • the rate of thermal conduction (t) that the die 631 conducts into the housing 610 increases, which enhances the heat dissipation of the die 631 (or chip 630).
  • the electronic device 600 does not require the arrangement of the heat sink and the fan, the overall volume and manufacturing cost can be greatly reduced.
  • the metal ground layer 621 is connected to the housing 610 with the shortest conductive path (metal connecting member 640), static electricity on the printed circuit board 620 can be easily conducted to the housing 610, which can effectively enhance the inside of the electronic device 600. ESD protection effect. Therefore, the extra time and the cost of the test equipment required for solving the electrostatic discharge problem can be eliminated, and the manufacturing cost of the electronic device 100 can be drastically reduced.
  • FIG. 8 is a schematic diagram of an electronic device 700 according to a seventh embodiment of the present invention.
  • the electronic device 700 includes a housing 710, a printed circuit board 720, a chip 730, and a conductive element 740.
  • the housing 710 has a protrusion 711 in which the printed circuit board 720 is disposed.
  • printed circuit board 720 can be a multilayer printed circuit board.
  • the chip 730 is electrically connected to the printed circuit board 720, and the chip 730 includes a die 731, a heat conducting portion 732, and a package plastic 733.
  • the heat transfer portion 732 is connected between the die 731 and the protruding portion 711 of the housing 710.
  • the package plastic 733 is coated with a die 731.
  • the chip 730 is a lead frame package type chip
  • the heat conducting portion 732 is a reverse exposed die pad connected to the die 731.
  • the reverse-exposed die pad can be made of metal such as aluminum.
  • conductive member 740 is coupled between the projection 711 of the housing 710 and the thermally conductive portion 732. Additionally, conductive element 740 can include an electrical conductor and/or a thermal conductor. For example, conductive element 740 can include a conductive paste, a conductive patch, or a thermal pad.
  • the heat generated by the die 730 is conducted to the housing 710 through the heat conducting portion 732 and the conducting member 740, and then transferred from the housing 710 to the outside of the electronic device 700.
  • the heat transfer coefficient (k) value is greatly increased.
  • the temperature difference ( ⁇ ) between the die 731 and the casing 710 also increases. Therefore,
  • the heat transfer rate (t) conducted by the heat generated by the die 731 from the die 731 to the housing 710 is increased to enhance the heat dissipation effect of the die 731 (or the chip 730).
  • the electronic device 700 of the present embodiment can also eliminate the need for the arrangement of the heat sink and the fan, so that the overall volume and manufacturing cost can be greatly reduced.
  • the conductive element 740 includes a conductive material such as a conductive paste or a conductive paste
  • static electricity in the printed circuit board 720 can be easily conducted to the housing 710, which can effectively improve the ESD protection effect in the electronic device 700. . Therefore, the extra time and the cost of the test equipment required for solving the electrostatic discharge problem can be eliminated, and the manufacturing cost of the electronic device 100 can be greatly reduced.
  • electronic device 700 can also selectively omit conductive element 740. In other words, the protrusion 711 of the housing 710 can be directly connected to the heat conducting portion 732 to achieve the same function and effect.
  • FIG. 9 is a schematic diagram of an electronic device 700' according to an eighth embodiment of the present invention.
  • the difference between the electronic device 700' and the electronic device 700 of the seventh embodiment is that the protruding portion 711 of the seventh embodiment is replaced by the conductive seat 750 of the present embodiment.
  • the conductive seat 750 is coupled between the heat conducting portion 732 and the housing 710, and the conductive seat 750 can include an electrical conductor and/or a thermal conductor.
  • the conductive seat 750 when the conductive seat 750 includes an electrical conductor (for example, metal), the heat dissipation effect of the die 731 (or the chip 730) can be greatly improved, and the electrostatic protection effect in the electronic device 700' can be effectively improved.
  • the conductive seat 750 when the conductive seat 750 includes a heat conductor (e.g., an insulating heat conductive pad), the heat dissipation effect of the die 731 (or the chip 730) can be greatly enhanced.
  • electronic device 700' can selectively omit conductive element 740.
  • the transfer block 750 can be directly connected to the heat transfer portion 732 to achieve the same function and effect.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
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Description

电子装置 技术领域
本发明是关于一种电子装置， 特别是关于一种可增进芯片的散热效果 及增进静电防护功能及效果的电子装置。 背景技术 一般来说， 随着芯片 (集成电路)效率及功能的提升，其散发的热量也会 随之增加。因此，有效地移除或扩散运作中的芯片 (集成电路)所产生的热量 是非常关键的。
请参考图 1， 图 1是一种现有技术的电子装置 1， 主要包括壳体 11、 印刷电路板 12、 芯片 13、 散热片 (heat sink)14及风扇 15。 印刷电路板 12、 芯片 13、 散热片 14及风扇 15设置于壳体 11中。 芯片 13设置于印刷电路 板 12上， 芯片 13可以是导线架封装式芯片 (chip with lead-frame package) 或球栅阵列封装芯片 (chip with ball grid array package)。 在这里， 图 1所示 的芯片 13是以导线架封装式芯片来举例说明， 且具有多个管脚 (lead)13a、 晶粒 (die)13b及封装塑料 13c。 晶粒 13b是由封装塑料 13c所包覆， 且晶粒 13b连接于管脚 13a。管脚 13a是通过悍接的方式电性连接于印刷电路板 12。 散热片 14设置于芯片 13上， 风扇 15设置于散热片 14上。
芯片 13的晶粒 13b在运作时所产生的热量会通过封装塑料 13c传导至 散热片 14。 散热片 14中的热量通过风扇 15扩散至壳体 11 内的其它地方 或壳体 11之外。
但是， 如图 1所示的电子装置 1会具有很多散热方面的缺点。 首先，
Q _ kx AxAT
根据热传导公式： 7 = ^^， 其中， Q表示传导热量， t表示传导时间， Q 一
t表示热传导速率、 k为热传导系数、 A表示热接触面积 (thermal contact area), ΔΤ表示温差、 以及 L表示传导厚度。 一般来说， 芯片 13与散热片 14之间的温差 (ΔΤ)通常都不大，并且封装塑料 13c的热传导系数 (k)值很小。 因此， 晶粒 13b运作时所产生的热量通过封装塑料 13c传导至散热片 14中
Q
的热传导速率（ t：)会很低， 因此会使得芯片 13的散热效果不佳。 另外， 散 热片 14及风扇 15的配置不仅会增加电子装置 1的整体体积， 还会增加电 子装置 1的制造成本。 此外， 为了解决电子装置 1内的静电放电问题， 通 常必须花费较多的时间并配合开发硬件测试平台来解决， 而这也会增加电 子装置 1的制造成本。
当芯片 13为球栅阵列封装芯片时， 电子装置 1仍会具有上述缺点。 发明内容 本发明提供了一种可增进芯片的散热效果及增进静电防护功能及效果 的电子装置。
本发明提供了一种电子装置， 包括壳体， 印刷电路板， 以及芯片。 印 刷电路板， 设置于壳体中， 并且具有第一金属接地层、 第二金属接地层、 以及金属连接部， 其中， 第一金属接地层设置于印刷电路板上， 并且相对 于第二金属接地层， 金属连接部连接于第一金属接地层与第二金属接地层 之间， 以及第二金属接地层连接于壳体； 芯片电性连接于印刷电路板， 并 且包括晶粒及导热部， 其中， 导热部连接于晶粒， 并且悍接于第一金属接 地层， 其中， 芯片所产生的热量通过导热部、 第一金属接地层、 金属连接 部以及第二金属接地层传导至壳体。
本发明另提供了一种电子装置， 包括壳体， 印刷电路板， 芯片， 以及 金属连接构件。 印刷电路板， 设置于壳体中， 印刷电路板包括第一金属接 地层以及第二金属接地层， 其中， 第一金属接地层相对于第二金属接地层; 芯片电性连接于印刷电路板， 芯片包括晶粒及导热部， 其中， 导热部连接 于晶粒且悍接于第一金属接地层； 金属连接构件， 穿设于印刷电路板中， 并且将第一金属接地层与第二金属接地层连接至壳体， 其中， 芯片所产生 的热量是通过导热部、 第一金属接地层及金属连接构件传导至壳体。
本发明另提供了一种电子装置， 包括壳体， 印刷电路板， 以及芯片。 印刷电路板， 设置于壳体中， 并且印刷电路板包括连接于壳体的金属接地 层； 芯片电性连接于印刷电路板， 芯片包含晶粒及导热部， 其中， 导热部 连接于晶粒， 且导热部悍接于金属接地层， 其中， 芯片所产生的热量通过 导热部及金属接地层传导至壳体。
本发明另提供了一种电子装置， 包括壳体， 印刷电路板， 芯片， 以及 金属连接构件。 印刷电路板， 设置于壳体中， 且印刷电路板包括金属接地 层； 芯片电性连接于印刷电路板， 且芯片包含晶粒及连接于晶粒的导热部， 其中， 导热部悍接于金属接地层； 金属连接构件穿设于印刷电路板之中， 并且将金属接地层连接至壳体， 其中， 芯片所产生的热量是通过导热部、 金属接地层以及金属连接构件传导至壳体。
本发明另提供了一种电子装置， 包括壳体， 印刷电路板， 以及芯片。 印刷电路板， 设置于壳体中； 芯片电性连接于印刷电路板， 芯片包括晶粒 及连接于晶粒与壳体之间的导热部， 其中， 芯片所产生的热量通过导热部 传导至壳体。
本发明提供的电子装置， 通过导热部或通过导热部配合其它元件， 将 芯片所产生的热量及印刷电路板所产生的静电传导至壳体， 可增进芯片的 热扩散效果及增进静电防护功能及效果， 并且电子装置可以不需散热片及 风扇， 大幅降低了电子装置的整体体积及制造成本。 附图说明 图 1为一种现有技术的电子装置的部分侧视及剖面示意图。
图 2为本发明第一实施例的电子装置的部分侧视及剖面示意图。 图 3为本发明第二实施例的电子装置的部分侧视及剖面示意图。
图 4为本发明第三实施例的电子装置的部分侧视及剖面示意图。
图 5为本发明第四实施例的电子装置的部分侧视及剖面示意图。
图 6为本发明第五实施例的电子装置的部分侧视及剖面示意图。
图 7为本发明第六实施例的电子装置的部分侧视及剖面示意图。
图 8为本发明第七实施例的电子装置的部分侧视及剖面示意图。
图 9为本发明第八实施例的电子装置的部分侧视及剖面示意图。 具体实施方式 以下将配合图式说明本发明的较佳实施例。
第一实施例
请参考图 2， 图 2为本发明第一实施例的电子装置 100的示意图。 电 子装置 100包括壳体 110、 印刷电路板 120、 芯片 130及传导元件 140。
印刷电路板 120设置于壳体 110中， 且印刷电路板 120具有第一金属 接地层 121、第二金属接地层 122及多个金属连接部 123。第一金属接地层 121设置于印刷电路板 120上， 并且第一金属接地层 121与第二金属接地 层 122相对。 多个金属连接部 123分别连接于第一金属接地层 121与第二 金属接地层 122之间。 第二金属接地层 122连接于壳体 110。 在本实施例 中，壳体 110具有突出部 111，第二金属接地层 122连接于壳体 110的突出 部 111。另外，每一个金属连接部 123可以是一个内壁镀有金属材料的通孔。 另外， 印刷电路板 120可以是多层印刷电路板。
芯片 130电性连接于印刷电路板 120， 并且芯片 130具有晶粒 131、导 热部 132及封装塑料 133。导热部 132连接于晶粒 131， 并且导热部 132悍 接于印刷电路板 120的第一金属接地层 121。封装塑料 133包覆着晶粒 131。 更详细来说， 在第一金属接地层 121 上通常会涂覆有一层阻悍层 (solder mask)S0 为了使芯片 130的导热部 132能悍接于第一金属接地层 121， 在 第一金属接地层 121保留顶部阻悍层开口 121a。 导热部 132通过顶部阻悍 层开口 121a悍接于第一金属接地层 121。
传导元件 140连接于壳体 110的突出部 111与印刷电路板 120的第二 金属接地层 122之间。 相似地， 在第二金属接地层 122上也通常会涂覆有 一层阻悍层 S。同样地，在第二金属接地层 122上保留底部阻悍层开口 122a。 传导元件 140通过底部阻悍层开口 122a连接于第二金属接地层 122。此外， 传导元件 140可以包括电导体及 /或热导体。 举例来说， 传导元件 140可以 包括导电胶、 导电贴布或导热垫。
此外， 芯片 130可以是导线架封装式芯片或球栅阵列封装芯片。 更详 细来说， 当芯片 130为导线架封装式芯片时， 例如， 当芯片 130为薄型塑 料四方平面封装 (low profile plastic quad flat package, LQFP)式芯片时，其导 热部 132即为连接于晶粒 131的外露式晶粒垫 (exposed die pad)。 在此， 外 露式晶粒垫是由铝等金属所制成。 另一方面， 当芯片 130为球栅阵列封装 芯片时， 例如， 当芯片 130 为覆晶球栅矩阵封装 (flip chip ball grid array package, FCBGA package)式芯片时， 其导热部 132由连接于晶粒 131的多 个导热球接点 (thermal ground balls)组成。
当芯片 130的晶粒 131运作时，其所产生的热量会依序通过导热部 132、 第一金属接地层 121、 金属连接部 123、 第二金属接地层 122及传导元件 140传导至壳体 110， 然后再由壳体 110传送至电子装置 100外。
如上所述， 由于晶粒 131运作时所产生的热量主要是通过导热部 132、 第一金属接地层 121、 金属连接部 123、 第二金属接地层 122及传导元件 140传导至壳体 110， 而不是通过包覆晶粒 131的封装塑料 133来传导， 因 此热传导系数 (k)值会大幅提升。此外，晶粒 131与壳体 110之间的温差 (ΔΤ) 大于晶粒 131与封装塑料 133之间的温差。 因此， 热量从晶粒 131传导至
Q
壳体 110中的热传导速率（ t )会增加， 因而可增进晶粒 131(或芯片 130)的 散热效果。 另外， 电子装置 100不再需要散热片及风扇的配置。 因此其整 体体积及制造成本可大幅降低。
更详细来说， 由于第一金属接地层 121是以最短的传导路径 (金属连接 部 123)连接于第二金属接地层 122， 而第二金属接地层 122又连接于壳体 110, 因此， 印刷电路板 120中的静电可以轻易地被传导至壳体 110， 可有 效提升电子装置 100内的静电防护 (ESD protection)效果。 因此， 用于解决 静电放电问题所需花费的额外的时间及测试设备成本都可省却， 可大幅降 低电子装置 100的制造成本。
此外， 电子装置 100还可选择性地省略传导元件 140。 换句话说， 壳 体 110的突出部 111可通过底部阻悍层开口 122a直接连接于第二金属接地 层 122， 以达到相同的功能及效果。
第二实施例
在本实施例中， 与第一实施例相同的元件均以相同的符号标示。
请参考图 3， 图 3为本发明第二实施例的电子装置 100'的示意图。 电 子装置 100'与第一实施例的电子装置 100 的差别为第一实施例的突出部 111由本实施例的传导座 150来代替。更详细来说，传导座 150连接于印刷 电路板 120的第二金属接地层 122与壳体 110之间， 且传导座 150可为电 导体及 /或热导体。
当传导座 150包括电导体 (例如， 金属)时， 晶粒 131(或芯片 130)的散 热效果可以大幅增进， 同时电子装置 100'内的静电防护效果也可以被有效 提升。 另一方面， 当传导座 150包括热导体 (例如， 绝缘导热垫)时， 晶粒 131(或芯片 130)的散热效果可以大幅增进。
同样地， 电子装置 100'也可选择性地省略传导元件 140。 换句话说， 传导座 150可通过底部阻悍层开口 122a直接连接于第二金属接地层 122， 以达到相同的功能及效果。
本实施例的其它元件构造、 特征或运作方式均与第一实施例相同， 因 此， 为了使本案的说明书内容能更清楚， 在这里省略其重复的说明。
第三实施例
请参考图 4， 图 4为本发明第三实施例的电子装置 300的示意图。 电 子装置 300包括壳体 310、 印刷电路板 320、芯片 330及多个金属连接构件 340。
印刷电路板 320设置于壳体 310中， 且印刷电路板 320包括第一金属 接地层 321、第二金属接地层 322及多个金属连接部 323。第一金属接地层 321与第二金属接地层 322相对， 多个金属连接部 323分别连接于第一金 属接地层 321与第二金属接地层 322之间。 在本实施例中， 每一个金属连 接部 323均可以是一个内壁镀有金属材料的通孔。 另外， 印刷电路板 320 可以为多层印刷电路板。
芯片 330电性连接于印刷电路板 320， 且芯片 330包括晶粒 331、导热 部 332、 以及封装塑料 333。 导热部 332连接于晶粒 331， 且悍接于印刷电 路板 320的第一金属接地层 321。封装塑料 333包覆着晶粒 331。更详细来 说， 在第一金属接地层 321 上通常涂覆有一层阻悍层 S。 为了使芯片 330 的导热部 332能悍接于第一金属接地层 321， 因此在第一金属接地层 321 上具有阻悍层开口 321a。导热部 332通过阻悍层开口 321a悍接于第一金属 接地层 321。
金属连接构件 340穿设于印刷电路板 320中， 并且金属连接构件 340 是用来将第一金属接地层 321与第二金属接地层 322连接至壳体 310。 更 详细来说， 金属连接构件 340可以采用螺栓结构， 其除了可用来将第一金 属接地层 321与第二金属接地层 322连接至壳体 310外， 还可将印刷电路 板 320与壳体 310固定在一起。
同样地， 芯片 330可以是导线架封装式芯片或球栅阵列封装芯片。 当 芯片 330为导线架封装式芯片时， 例如， 当芯片 330为薄型塑料四方平面 封装 (LQFP)式芯片时， 其导热部 332可以是连接于晶粒 331的外露式晶粒 垫。 在此， 外露式晶粒垫可以由铝等金属制成。 另一方面， 当芯片 330为 球栅阵列封装芯片时， 例如， 当芯片 330 为覆晶球栅矩阵封装 (FCBGA package)式芯片时，其导热部 332可以由连接于晶粒 331的多个导热球接点 组成。
当芯片 330的晶粒 331运作时， 其产生的热量会通过导热部 332、 第 一金属接地层 321、金属连接部 323、第二金属接地层 322及金属连接构件 340传导至壳体 310， 然后再由壳体 310传递至电子装置 300外。
因此， 由于晶粒 331运作时所产生的热量是通过导热部 332、 第一金 属接地层 321、 金属连接部 323、 第二金属接地层 322及金属连接构件 340 传导至壳体 310， 而不是通过封装塑料 333所传导， 因此热传导系数 (k)值 会大幅提升。 此外， 晶粒 331与壳体 310之间的温差 (ΔΤ)大于晶粒 331与 封装塑料 333之间的温差。 因此， 由晶粒 331所产生的热量从晶粒 331传
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导至壳体 310中的热传导速率（ )会很高， 可增进晶粒 331(或芯片 330)的 热扩散或散热效果。 同样地， 由于电子装置 300可以不需要散热片及风扇 的配置， 其整体体积及制造成本可大幅降低。
此外， 由于第一金属接地层 321 是以最短的传导路径 (金属连接构件 340与金属连接部 323)连接于第二金属接地层 322， 以及第二金属接地层 322也是以最短的传导路径 (金属连接构件 340)连接于壳体 310， 因此印刷 电路板 320中的静电可以轻易地被传导至壳体 310， 可有效提升电子装置 300内的静电防护 (ESD protection)效果。因此，用于解决静电放电问题所需 花费的额外的时间及测试设备成本都可省却， 可大幅降低电子装置 100的 制造成本。
此外， 印刷电路板 320可选择性地省略金属连接部 323。 在这种情况 下， 晶粒 331产生的热量可通过导热部 332、 第一金属接地层 321及金属 连接构件 340传导至壳体 310， 然后再由壳体 310传递至电子装置 300外。 因此， 晶粒 331(或芯片 330)的热扩散或散热效果以及电子装置 300内的静 电防护效果仍可被有效提升。
第四实施例
请参考图 5， 图 5为本发明第四实施例的电子装置 400的示意图。 电 子装置 400包括壳体 410、 印刷电路板 420、 芯片 430、 以及传导元件 440。
印刷电路板 420设置于壳体 410中， 并且印刷电路板 420包括金属接 地层 421。 金属接地层 421连接于壳体 410。在本实施例中， 壳体 410具有 突出部 411， 且金属接地层 421连接于壳体 410的突出部 411。 另外， 印刷 电路板 420可以为多层印刷电路板。
芯片 430电性连接于印刷电路板 420， 且芯片 430包括晶粒 431、导热 部 432及封装塑料 433。导热部 432连接于晶粒 431， 且悍接于印刷电路板 420的金属接地层 421。 封装塑料 433包覆着晶粒 431。
更详细来说， 在金属接地层 421上通常会涂覆有一层阻悍层 S。 为了 使芯片 430的导热部 432能悍接于金属接地层 421， 因此金属接地层 421 具有顶部阻悍层开口 421a。导热部 432通过顶部阻悍层开口 421a悍接于金 属接地层 421。
传导元件 440连接于壳体 410的突出部 411与印刷电路板 420的金属 接地层 421之间。 更详细来说， 在金属接地层 421上进一步包括底部阻悍 层开口 421b。 传导元件 440通过底部阻悍层开口 421b连接于金属接地层 421。 此外， 传导元件 440可以包括电导体及 /或热导体。 举例来说， 传导 元件 440可以是导电胶、 导电贴布或导热垫。
同样地， 芯片 430可以是导线架封装式芯片或球栅阵列封装芯片。 当 芯片 430为导线架封装式芯片时， 例如， 当芯片 430为薄型塑料四方平面 封装 (LQFP)式芯片时，其导热部 432即为连接于晶粒 431的外露式晶粒垫。 在此， 外露式晶粒垫可以由铝等金属所制成。 另一方面， 当芯片 430为球 栅阵列封装芯片时，例如，当芯片 430为覆晶球栅矩阵封装 (FCBGA package) 式芯片时， 其导热部 432是由连接于晶粒 431的多个导热球接点组成。 当芯片 430的晶粒 431运作时，其所产生的热量会依序通过导热部 432、 金属接地层 421、 以及传导元件 440传导至壳体 410， 然后再由壳体 410传 递至电子装置 400外。
因此， 由于晶粒 431运作时所产生的热量是通过导热部 432、 金属接 地层 421、 以及传导元件 440传导至壳体 410， 而不是通过封装塑料 433所 传导。 因此， 与现有的封装结构相比较， 本实施例的热传导系数 (k)值会大 幅提升。 此外， 晶粒 431与壳体 410之间的温差 (ΔΤ)大于晶粒 431与封装 塑料 433之间的温差。 因此， 由晶粒 431产生的热量从晶粒 431传导至壳
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体 410中的热传导速率（ t )会比传统的装置快， 因而可以增进晶粒 431(或 芯片 430)的散热效果。 同样地， 由于电子装置 400可以不需要散热片及风 扇的配置， 其整体体积及制造成本可大幅降低。
此外， 由于金属接地层 421是以最短的传导路径 Ci专导元件 440)连接于 壳体 410， 因此印刷电路板 420中的静电可以轻易地被传导至壳体 410， 可 有效提升电子装置 400内的静电防护 (ESD protection)效果。 因此， 用于解 决静电放电问题所需花费的额外的时间及测试设备成本都可省却， 可大幅 降低电子装置 100的制造成本。
此外， 电子装置 400还可选择性地省略传导元件 440。 换句话说， 壳 体 410的突出部 411可直接通过底部阻悍层开口 421b连接于金属接地层 421， 以达到相同的功能及效果。
第五实施例
在本实施例中， 与第四实施例相同的元件均以相同的标号来标示。 请参考图 6， 图 6为本发明第五实施例的电子装置 400'的示意图。 电 子装置 400'与第四实施例的电子装置 400 的差别为第四实施例的突出部 411 由本实施例的传导座 450来代替。 更详细来说， 传导座 450连接于印 刷电路板 420的金属接地层 421与壳体 410之间， 且传导座 450可以包含 电导体及 /或热导体。
当传导座 450包括电导体 (例如， 金属)时， 晶粒 431(或芯片 430)的散 热效果可以被大幅增进， 同时电子装置 400'内的静电防护效果也可以被有 效提升。 另一方面， 当传导座 450包括热导体 (例如， 绝缘导热垫)时， 晶粒 431(或芯片 430)的散热效果可以被大幅增进。
同样地， 电子装置 400'也可选择性地省略传导元件 440。 换句话说， 传导座 450可通过底部阻悍层开口 421b直接连接于金属接地层 421， 以达 到相同的功能及效果。
本实施例的其它元件构造、 特征或运作方式均与第四实施例相同， 因 此， 为了使本案的说明书内容能更清楚， 在这里省略其重复的说明。
第六实施例
请参考图 7， 图 7为本发明第六实施例的电子装置 600的示意图。 电 子装置 600包括壳体 610、 印刷电路板 620、芯片 630及多个金属连接构件 640。
印刷电路板 620设置于壳体 610中， 且印刷电路板 620包括金属接地 层 621。 另外， 印刷电路板 620可以是多层印刷电路板。
芯片 630电性连接于印刷电路板 620， 且芯片 630包括晶粒 631、导热 部 632及封装塑料 633。导热部 632连接于晶粒 631， 且导热部 632悍接于 印刷电路板 620的金属接地层 621。封装塑料 633包覆着晶粒 631。更详细 来说， 在金属接地层 621上通常会涂覆一层阻悍层 S。 为了使芯片 630的 导热部 632能悍接于金属接地层 621， 因此金属接地层 621保留了阻悍层 开口 621a。 导热部 632通过阻悍层开口 621a悍接于金属接地层 621。
金属连接构件 640穿设于印刷电路板 620中， 且金属连接构件 640是 用来将金属接地层 621 连接至壳体 610。 更详细来说， 金属连接构件 640 可以采用螺栓结构， 其除了可用来将金属接地层 621连接至壳体 610外， 还可将印刷电路板 620与壳体 610固定在一起。
同样地， 芯片 630可以是导线架封装式芯片或球栅阵列封装芯片。 当 芯片 630为导线架封装式芯片时， 例如， 当芯片 630为薄型塑料四方平面 封装 (LQFP)式芯片时，其导热部 632即为连接于晶粒 631的外露式晶粒垫。 在此， 外露式晶粒垫可以由铝等金属制成。 另一方面， 当芯片 630为球栅 阵列封装芯片时， 例如， 当芯片 630为覆晶球栅矩阵封装 (FCBGA package) 式芯片时， 其导热部 632可由连接于晶粒 631的多个导热球接点所组成。
当芯片 630的晶粒 631运作时， 其所产生的热量会通过导热部 632、 金属接地层 621及金属连接构件 640传导至壳体 610， 然后再由壳体 610 传递至电子装置 600外。
因此， 由于晶粒 631运作时所产生的热量是通过导热部 632、 金属接 地层 621、 以及金属连接构件 640传导至壳体 610， 而不是通过封装塑料 633来传导， 因此热传导系数 (k)值会大幅提升。此外， 晶粒 631与壳体 610 之间的温差 (ΔΤ)大于晶粒 631与封装塑料 633之间的温差。 因此， 热量从
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晶粒 631传导至壳体 610中的热传导速率（ t )会增大， 可增进晶粒 631(或 芯片 630)的散热效果。 同样地， 由于电子装置 600可以不需要散热片及风 扇的配置， 因此其整体体积及制造成本可大幅降低。
此外， 由于金属接地层 621 是以最短的传导路径 (金属连接构件 640) 连接至壳体 610， 因此印刷电路板 620上的静电可以轻易地被传导至壳体 610， 可有效提升电子装置 600内的静电防护 (ESD protection)效果。 因此， 用于解决静电放电问题所需花费的额外的时间及测试设备成本都可省却， 可大幅降低电子装置 100的制造成本。
第七实施例
请参考图 8， 图 8为本发明第七实施例的电子装置 700的示意图。 电 子装置 700包括壳体 710、 印刷电路板 720、 芯片 730及传导元件 740。 壳体 710具有突出部 711， 印刷电路板 720设置于壳体 710中。 另外， 印刷电路板 720可以是多层印刷电路板。
芯片 730电性连接于印刷电路板 720， 且芯片 730包括晶粒 731、导热 部 732、 以及封装塑料 733。导热部 732连接于晶粒 731与壳体 710的突出 部 711之间。 封装塑料 733包覆着晶粒 731。 更详细来说， 在本实施例中， 芯片 730是导线架封装式芯片， 导热部 732为连接于晶粒 731的反向外露 式晶粒垫 (reverse exposed die pad)。 在这里， 反向外露式晶粒垫可以由铝等 金属制成。
传导元件 740连接于壳体 710的突出部 711与导热部 732之间。此外， 传导元件 740可以包括电导体及 /或热导体。 举例来说， 传导元件 740可以 包括导电胶、 导电贴布或导热垫。
当芯片 730的晶粒 731运作时， 其产生的热量会通过导热部 732及传 导元件 740传导至壳体 710， 然后再由壳体 710传递至电子装置 700外。
由于晶粒 731运作时所产生的热量是通过导热部 732及传导元件 740 传导至壳体 710， 而不是通过封装塑料 733来传导， 因此热传导系数 (k)值 会大幅提升。 此外， 晶粒 731与壳体 710之间的温差 (ΔΤ)也会增大。 因此，
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由晶粒 731所产生的热量从晶粒 731传导至壳体 710中的热传导速率（ t ) 会增大，可增进晶粒 731(或芯片 730)的散热效果。本实施例的电子装置 700 也可以不需要散热片及风扇的配置， 因此， 其整体体积及制造成本可大幅 降低。
另外， 当传导元件 740包括导电胶或导电贴布等导电材料时， 印刷电 路板 720中的静电可以轻易地被传导至壳体 710，可有效提升电子装置 700 内的静电防护 (ESD protection)效果。 因此， 用于解决静电放电问题所需花 费的额外的时间及测试设备成本都可省却， 可大幅降低电子装置 100的制 造成本。 此外， 电子装置 700还可选择性地省略传导元件 740。 换句话说， 壳 体 710的突出部 711可直接连接于导热部 732， 以达到相同的功能及效果。
第八实施例
在本实施例中， 与第七实施例相同的元件均以相同的标号来标示。 请参考图 9， 图 9为本发明第八实施例的电子装置 700'的示意图。 电 子装置 700'与第七实施例的电子装置 700 的差别为第七实施例的突出部 711 由本实施例的传导座 750来代替。 更详细来说， 传导座 750连接于导 热部 732与壳体 710之间， 且传导座 750可以包括电导体及 /或热导体。
更详细来说， 当传导座 750包括电导体 (例如， 金属)时， 晶粒 731(或 芯片 730)的散热效果可以被大幅增进， 同时电子装置 700'内的静电防护效 果也可以被有效提升。 另一方面， 当传导座 750包括热导体 (例如， 绝缘导 热垫)时， 晶粒 731(或芯片 730)的散热效果可以被大幅增进。
同样地， 电子装置 700'可选择性地省略传导元件 740。 换句话说， 传 导座 750可直接连接于导热部 732， 以达到相同的功能及效果。
本实施例的其它元件构造、 特征或运作方式均与第七实施例相同， 因 此， 为了使本案的说明书内容能更清楚， 在这里省略重复的说明。
虽然本发明已以较佳实施例揭露如上， 然其并非用以限定本发明， 任 何所属技术领域中的技术人员， 在不脱离本发明的范围内， 可以做一些改 动， 因此本发明的保护范围应与权利要求所界定的范围为准。

Claims

权 利 要 求 书
1.一种电子装置， 其特征在于， 该电子装置包括：
壳体；
印刷电路板， 设置于该壳体中， 并且该印刷电路板具有第一金属接地 层、 第二金属接地层以及金属连接部， 其中， 该第一金属接地层相对于该 第二金属接地层， 该金属连接部连接于该第一金属接地层与该第二金属接 地层之间， 该第二金属接地层连接于该壳体； 以及
芯片， 电性连接于该印刷电路板， 该芯片包括晶粒及导热部， 其中， 该导热部连接于该晶粒， 并且该导热部悍接于该第一金属接地层，
其中， 该芯片所产生的热量通过该导热部、 该第一金属接地层、 该金 属连接部以及该第二金属接地层传导至该壳体。
2.如权利要求 1 所述的电子装置， 其特征在于， 该电子装置还包括传 导元件， 连接于该壳体与该第二金属接地层之间。
3.如权利要求 2所述的电子装置， 其特征在于， 该传导元件包括导电 胶、 导电贴布、 或导热垫。
4.如权利要求 2所述的电子装置， 其特征在于， 该第二金属接地层包 括底部阻悍层开口， 以及该传导元件是通过该底部阻悍层开口连接于该第 二金属接地层。
5.如权利要求 1 所述的电子装置， 其特征在于， 该第一金属接地层包 括顶部阻悍层开口； 该导热部通过该顶部阻悍层开口悍接于该第一金属接 地层。
6.如权利要求 1 所述的电子装置， 其特征在于， 该金属连接部包括通 孔， 该通孔的内壁镀有金属材料。
7.如权利要求 1 所述的电子装置， 其特征在于， 该壳体具有突出部， 该第二金属接地层连接于该突出部。
8.如权利要求 1 所述的电子装置， 其特征在于， 该电子装置还包括传 导座， 该传导座连接于该第二金属接地层与该壳体之间。
9.如权利要求 1 所述的电子装置， 其特征在于， 该芯片包括导线架封 装式芯片， 以及该导热部包括外露式晶粒垫。
10.如权利要求 1所述的电子装置， 其特征在于， 该芯片包括球栅阵列 封装芯片， 以及该导热部包括导热球接点。
11.一种电子装置， 其特征在于， 该电子装置包括：
壳体；
印刷电路板， 设置于该壳体中， 该印刷电路板包括第一金属接地层以 及第二金属接地层， 其中， 该第一金属接地层相对于该第二金属接地层； 芯片， 电性连接于该印刷电路板， 该芯片包括晶粒及导热部， 其中， 该导热部连接于该晶粒且悍接于该第一金属接地层； 以及
金属连接构件， 穿设于该印刷电路板中， 并且将该第一金属接地层与 该第二金属接地层连接至该壳体，
其中， 该芯片所产生的热量通过该导热部、 该第一金属接地层及该金 属连接构件传导至该壳体。
12.如权利要求 11 所述的电子装置， 其特征在于， 该第一金属接地层 具有阻悍层开口， 该导热部通过该阻悍层开口悍接于该第一金属接地层。
13.如权利要求 11 所述的电子装置， 其特征在于， 该印刷电路板进一 步包括金属连接部， 该金属连接部连接于该第一金属接地层与该第二金属 接地层之间， 以及该芯片所产生的热量是通过该导热部、 该第一金属接地 层、该金属连接部、该第二金属接地层以及该金属连接构件传导至该壳体。
14.如权利要求 13 所述的电子装置， 其特征在于， 该金属连接部包括 通孔， 该通孔的内壁镀有金属材料。
15.如权利要求 11 所述的电子装置， 其特征在于， 该芯片包括导线架 封装式芯片， 以及该导热部包括外露式晶粒垫。
16.如权利要求 11 所述的电子装置， 其特征在于， 该芯片包括球栅阵 列封装芯片， 以及该导热部包括导热球接点。
17.—种电子装置， 其特征在于， 该电子装置包括：
壳体；
印刷电路板， 设置于该壳体中， 并且该印刷电路板包括连接于该壳体 的金属接地层； 以及
芯片， 电性连接于该印刷电路板， 该芯片包含晶粒及导热部， 其中， 该导热部连接于该晶粒， 且该导热部悍接于该金属接地层，
其中， 该芯片所产生的热量是通过该导热部及该金属接地层传导至该 壳体。
18.如权利要求 17所述的电子装置， 其特征在于， 该电子装置进一步 包括传导元件， 该传导元件连接于该壳体与该金属接地层之间。
19.如权利要求 18所述的电子装置， 其特征在于， 该传导元件包括导 电胶、 导电贴布、 或导热垫。
20.如权利要求 18所述的电子装置， 其特征在于， 该金属接地层具有 底部阻悍层开口， 以及该传导元件通过该底部阻悍层开口连接于该金属接 地层。
21.如权利要求 17所述的电子装置， 其特征在于， 该金属接地层包括 顶部阻悍层开口； 该导热部通过该顶部阻悍层开口悍接于该金属接地层。
22.如权利要求 17所述的电子装置， 其特征在于， 该壳体具有突出部， 该金属接地层连接于该突出部。
23.如权利要求 17所述的电子装置， 其特征在于， 该电子装置进一步 包括传导座， 该传导座连接于该金属接地层与该壳体之间。
24.如权利要求 17所述的电子装置， 其特征在于， 该芯片包括导线架 封装式芯片， 以及该导热部包括外露式晶粒垫。
25.如权利要求 17所述的电子装置， 其特征在于， 该芯片包括球栅阵 列封装芯片， 以及该导热部包括导热球接点。
26.—种电子装置， 其特征在于， 该电子装置包括：
壳体；
印刷电路板， 设置于该壳体中， 且该印刷电路板包括金属接地层； 芯片， 电性连接于该印刷电路板， 且该芯片包含晶粒及连接于该晶粒 的导热部， 其中， 该导热部悍接于该金属接地层； 以及
金属连接构件， 穿设于该印刷电路板中， 并且将该金属接地层连接至 该壳体，
其中， 该芯片所产生的热量是通过该导热部、 该金属接地层以及该金 属连接构件传导至该壳体。
27.如权利要求 26所述的电子装置， 其特征在于， 该金属接地层包括 阻悍层开口； 该导热部通过该阻悍层开口悍接于该金属接地层。
28.如权利要求 26所述的电子装置， 其特征在于， 该芯片包括导线架 封装式芯片； 以及该导热部包括外露式晶粒垫。
29.如权利要求 26所述的电子装置， 其特征在于， 该芯片包括球栅阵 列封装芯片； 以及该导热部包括导热球接点。
30.—种电子装置， 其特征在于， 该电子装置包括：
壳体；
印刷电路板， 设置于该壳体中； 以及
芯片， 电性连接于该印刷电路板， 该芯片包括晶粒及连接于该晶粒与 该壳体之间的导热部，
其中， 该芯片所产生的热量通过该导热部传导至该壳体。
31.如权利要求 30所述的电子装置， 其特征在于， 进一步包括传导元 件， 该传导元件连接于该壳体与该导热部之间。
32.如权利要求 31 所述的电子装置， 其特征在于， 该传导元件包括导 电胶、 导电贴布或导热垫。
33.如权利要求 30所述的电子装置， 其特征在于， 该壳体包括突出部， 该导热部连接于该突出部。
34.如权利要求 30所述的电子装置， 其特征在于， 该电子装置还包括 传导座， 该传导座连接于该导热部与该壳体之间。
35.如权利要求 30所述的电子装置， 其特征在于， 该芯片包括导线架 封装式芯片， 该导热部包括反向外露式晶粒垫。
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