WO2009002019A2 - Appareil d'évaporation - Google Patents

Appareil d'évaporation Download PDF

Info

Publication number
WO2009002019A2
WO2009002019A2 PCT/KR2008/002919 KR2008002919W WO2009002019A2 WO 2009002019 A2 WO2009002019 A2 WO 2009002019A2 KR 2008002919 W KR2008002919 W KR 2008002919W WO 2009002019 A2 WO2009002019 A2 WO 2009002019A2
Authority
WO
WIPO (PCT)
Prior art keywords
moving plate
evaporation
driving motor
evaporation apparatus
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/002919
Other languages
English (en)
Other versions
WO2009002019A3 (fr
Inventor
Jin Haon Kwon
Kyo Jun Song
Sung Jae Cho
Ki Ju Park
Hyun Ki Lee
Jin Il Mok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Mecatec Co Ltd
Original Assignee
Doosan Mecatec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co Ltd filed Critical Doosan Mecatec Co Ltd
Priority to CN2008800220536A priority Critical patent/CN101743617B/zh
Priority to JP2010514600A priority patent/JP2010531391A/ja
Publication of WO2009002019A2 publication Critical patent/WO2009002019A2/fr
Publication of WO2009002019A3 publication Critical patent/WO2009002019A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating

Definitions

  • the present invention relates to an evaporation apparatus, and more particularly to an evaporation apparatus which can deposit evaporation materials on large-size substrates in uniform thickness while having a simplified structure.
  • Evaporation apparatus are generally used for depositing materials on substrates by heating and evaporating the materials filled into an evaporation source in a vacuum chamber exhausted and decompressed by a vacuum pump.
  • an evaporation apparatus capable of depositing evaporation materials on a substrate in a short time has been rising.
  • an evaporation apparatus which is provided with a large-size evaporation source having an elongated opening with a width equal to the width of a substrate and performs evaporation process while moving the substrate has been developed.
  • scaling-up is inevitable due to a space required for the movement of the substrate, and the uniformity of a deposited film is low since the temperature control of the large-size source is difficult.
  • an evaporation apparatus which is provided with one evaporation source capable of moving while evaporating a material onto a suspended substrate has been developed.
  • this evaporation apparatus requires a long process time and uses a moving part including a ball screw which generates many particles.
  • Research is also ongoing to develop an evaporation apparatus which is provided with a plurality of evaporation units each including one source and one moving part to evaporate a material onto a large-size substrate in a short time.
  • This apparatus becomes complex and expensive since it needs a plurality of moving parts to move a plurality of evaporation sources.
  • the present invention has been made to solve the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide an evaporation apparatus which can shorten the process time of evaporation and improve the thickness uniformity of an evaporation material deposited on a substrate.
  • Another object of the present invention is to provide an evaporation apparatus which can be simplified in structure and can minimize the generation of particles.
  • an evaporation apparatus which includes a moving plate disposed on a frame to be reciprocated; a plurality of evaporation sources for evaporating an evaporation material onto a substrate so as to deposit the evaporation material on the substrate, the plurality of evaporation sources being arranged in a direction intersecting a movement direction of the moving plate on the moving plate; and a driving unit for reciprocating the moving plate.
  • the evaporation apparatus includes a guide unit for guiding the reciprocating movement of the moving plate which includes a guide rail disposed in the frame; and a guide member secured to the moving plate and having a guide groove into which the guide rail is inserted.
  • the driving unit includes a driving motor; and a power transmission unit for transmitting a driving force of the driving motor to the moving plate so that the moving plate is moved.
  • the power transmission unit includes a drive pulley rotatably disposed in the frame and driven by the driving motor; an idler pulley rotatably disposed in the frame, the idler pulley being spaced apart from the drive pulley in the movement direction of the moving plate; a steel belt drivingly connecting the drive pulley and the idler pulley wherein the moving plate is secured to the steel belt; and a pair of bevel gears transmitting the driving force to the drive pulley, wherein the drive pulley, the idler pulley, and the steel belt are each plural in number being spaced apart from one another in the direction intersecting the movement direction of the moving plate.
  • the evaporation sources include a plurality of host evaporation sources arranged to be spaced apart from one another in the direction intersecting the movement direction of the moving plate, and guest evaporation sources having a number corresponding to the number of the host evaporation sources and each disposed to be apart in the movement direction of the moving plate from the corresponding the host evaporation source.
  • the drive pulley is coupled to the driving shaft of the driving motor so that the pair of bevel gears can be omitted.
  • an evaporation apparatus which includes a driving motor; a moving plate disposed on the frame to be reciprocated; at least one evaporation source disposed on the moving plate, the at least one evaporation source evaporating an evaporation material onto a substrate so as to deposit the evaporation material on the substrate; and a steel belt connected to the moving plate secured thereto, the steel belt reciprocating the moving plate when being driven by the driving motor.
  • FIG. 1 is a schematic perspective view of an evaporation apparatus according to an embodiment of the present invention
  • FIG. 2 is a side view of the evaporation apparatus shown in FIG. 1;
  • FIG. 3 is a sectional view of the evaporation apparatus shown in FIG. 1; and FIG. 4 is a perspective view of an evaporation apparatus according to another embodiment of the present invention.
  • an evaporation apparatus includes a frame 100, a moving plate 110 which is mounted to the frame 100 in such a manner that it is linearly reciporcatable on the frame 100, a plurality of evaporation sources 120 disposed on the moving plate 110, guide units 130 for guiding the linear movement of the moving plate 110, and a driving unit 140 for linearly reciprocating the moving plate 110.
  • the moving plate 110 is used for supporting and moving the plurality of evaporation sources 120 all together, and has a top surface on which the plurality of evaporation sources 120 are disposed and a bottom surface on which a pair of connecting members 112 for connecting the moving plate 110 to the driving unit 140 is disposed.
  • a pair of supporting members 114 is disposed on the bottom surface of the moving plate 110 for supporting the moving plate 110 on the guide units 130. While in this embodiment the moving plate 110 is illustrated to be of a rectangle plate, it can have various modified shapes and be formed of various materials as long as it can support the plurality of evaporation sources 120 and move with them.
  • the plurality of evaporation sources 120 are arranged on the top surface of the moving plate 110 in a direction perpendicular to a movement direction of the moving plate 110. It is preferred that the plurality of evaporation sources 120 are spaced at the same intervals so that the evaporation material can be deposited with a uniform thickness according to the position of the substrate. Meanwhile, in the case of evaporating organic EL materials, each of the plurality of evaporation sources 120 may include a host evaporation source 124 and a guest evaporation source 122 which are spaced apart from each other in the movement direction of the moving plate 110.
  • the host evaporation sources 124 are filled with a host material, and the guest evaporation sources 122 are filled with a guest material as a dopant, so that the host and guest materials can be deposited on a substrate at the same time.
  • These evaporation sources 120 may each have a known construction that is provided with a crucible filled with an evaporation material and an electrothermal wire disposed around the crucible to heat and evaporate the evaporation material. The detailed descriptions of the evaporation principle and construction of the evaporation source 120 will be omitted since the configuration of the evaporation source 120 is already well- known.
  • sensors including quartz vibrators may be disposed near the respective evaporation sources 120 for measuring evaporation of the evaporation sources 120.
  • a controller is operable to control evaporation rates of the respective evaporation sources 120 by adjusting the respective temperature thereof based on the measured evaporation of the respective evaporation sources 120.
  • the guide units 130 are used for guiding the linear reciprocating movement of the moving plate 110, and each includes a guide member 134 provided to each of the supporting members 114 and a guide rail 132 provided to the frame 100.
  • the guide member 134 has a guide groove 135 into which the guide rail 132 is inserted.
  • the driving unit 140 is used for moving the moving plate 110, and includes a driving motor 141 and a power transmission unit 142 for transmitting driving force of the driving motor 141 to moving plate 110.
  • the driving motor 141 is secured to the frame 100 and is rotatable forward and backward in response to supplied electric current directions, thereby allowing the moving plate 110 to be reciprocated.
  • the power transmission unit 142 includes a pair of bevel gears 143 and 144 connected to a drive shaft 141a of the driving motor 141 and having shafts crossing each other, drive pulleys 145 connected to the bevel gears 143 and 144, idler pulleys 146 drivingly connected to the respective drive pulleys 145 by steel belts 147, and the steel belts 147 transmitting driving force of the drive pulleys 145 to the idler pulleys 146.
  • the bevel gears 143 and 144 include the first bevel gear 143 connected to the drive shaft 141a of the driving motor 141 and the second bevel gear 144 having a shaft perpendicular to a shaft of first bevel gear 143.
  • the first bevel gear 143 and second bevel gear 144 are used to convert a rotation direction of the driving force since the drive shaft 141a of the driving motor 141 is perpendicular to a shaft of the drive pulleys 145.
  • the first bevel gear 143 and second bevel gear 144 can be omitted according to the location and position of the driving motor 141.
  • the drive pulleys 145 include a pair of pulleys disposed at the opposite sides with respect to the driving motor 141. More specifically, the pair of drive pulleys 145 is rotatably mounted to supporting ribs 104 of the frame 100, respectively, and the drive pulleys 145 share a shaft 144a with the second bevel gear 144. Thus, the rotatory power of the second bevel gear 144 is transferred through the shaft 144a to the drive pulleys 145.
  • the idler pulleys 146 are driven by the drive pulleys 145 and disposed a distance apart from the drive pulleys 145 in the movement direction of the moving plate 110.
  • the idler pulleys 146 are a pair of pulleys corresponding to the pair of drive pulleys 145 and rotatably mounted to supporting ribs of the frame 100.
  • the steel belts 147 are a pair of steel belts, each of which is connected with the corresponding drive pulley 145 and idler pulley 146 so as to rotate.
  • the moving plate 110 is secured at a point of each of the steel belts 147.
  • the connecting members 112 attached to the moving plate 110 are fixed to the respective steel belts 147.
  • the moving plate 110 is linearly moved along the guide rails 132 when the steel belts 147 rotate. Since the steel belts 147 are employed as the power transmission members for moving the moving plate 110 as mentioned above, particles, which would be generated at a much higher rate in other power transmission members with greater friction, such as ball screws, can be minimized.
  • a housing may be disposed to cover the steel belts 147, the drive pulleys 145, and the idler pulleys 146. In this case, the fraction defective of the substrates generated by the particles can be more reduced since the power transmission unit 142 is sealed with respect to the substrates.
  • a substrate is mounted to face the evaporation sources 120, and electric power is applied to the evaporation sources 120 to evaporate the evaporation material.
  • the driving motor 141 is actuated to move the moving plate 110 along the guide rails 132. More specifically, when the driving motor 141 is actuated, the pair of drive pulleys 145 is rotated through the first bevel gear 143 and second bevel gear 144 and the steel belts 147, which are coupled to the respective drive pulleys 145 by a frictional force, rotate. The moving plate 110 fixed at a point of the respective steel belts 147 is then moved.
  • FIG. 4 is a schematic perspective view of an evaporation apparatus according to another embodiment of the present invention.
  • a power transmission unit 242 according to another embodiment of the present invention includes a driving motor 241, of which a drive shaft 241a is directly connected with a drive pulley 245.
  • the drive pulley 245 is then connected with an idler pulleys 246 by a steel belt 247.
  • the steel belt 247, the drive pulley 245, and the idler pulleys 246 are positioned in the middle of the width of a moving plate 210. This is to more effectively transmit the driving force in a movement direction of the moving plate 210. Except this, a structure for connecting the moving plate 210 with the steel belt 247 and a structure for guiding the movement of the moving plate 210 are the same as those of the above embodiment.
  • the structure of the evaporation apparatus can be more simplified by directly connecting the drive pulley 245 to the drive shaft 241a of the driving motor 241.
  • the structure of the evaporation apparatus can be simplified, the deposition time can be reduced, and the temperature control of each of the evaporation sources can be easily performed and thus the uniform thickness of the deposited films can be obtained.
  • the structures of the moving parts of the evaporation apparatus can be more simplified, and the particles from the moving parts can be minimized.
  • the driving shaft of the driving motor is directly connected with the drive pulley, thereby allowing the structure of the driving unit to be more simplified.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Transmission Devices (AREA)

Abstract

La présente invention concerne un appareil d'évaporation qui comprend une plaque mobile placée sur le cadre afin d'effectuer un mouvement de va et vient, une pluralité de sources d'évaporation servant à l'évaporation d'une matière évaporable, sur un substrat, de manière à ce que la matière évaporable se dépose sur le substrat, ladite pluralité de sources d'évaporation étant disposée dans une direction qui croise, sur la plaque, la direction de déplacement de la plaque mobile et une unité de commande qui anime d'un mouvement de va et vient la plaque mobile. L'appareil d'évaporation peut avoir une structure simplifiée et peut déposer la matière évaporable à une épaisseur uniforme sur le substrat en un temps court.
PCT/KR2008/002919 2007-06-27 2008-05-26 Appareil d'évaporation Ceased WO2009002019A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800220536A CN101743617B (zh) 2007-06-27 2008-05-26 蒸发装置
JP2010514600A JP2010531391A (ja) 2007-06-27 2008-05-26 蒸着装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0063711 2007-06-27
KR1020070063711A KR100977971B1 (ko) 2007-06-27 2007-06-27 증착 장치

Publications (2)

Publication Number Publication Date
WO2009002019A2 true WO2009002019A2 (fr) 2008-12-31
WO2009002019A3 WO2009002019A3 (fr) 2009-02-19

Family

ID=40186136

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/002919 Ceased WO2009002019A2 (fr) 2007-06-27 2008-05-26 Appareil d'évaporation

Country Status (5)

Country Link
JP (1) JP2010531391A (fr)
KR (1) KR100977971B1 (fr)
CN (1) CN101743617B (fr)
TW (1) TWI443208B (fr)
WO (1) WO2009002019A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101876058B (zh) * 2010-03-23 2012-07-11 东莞宏威数码机械有限公司 真空蒸镀装置
CN103540898B (zh) 2013-10-30 2015-07-01 京东方科技集团股份有限公司 一种真空蒸镀装置
KR101609185B1 (ko) * 2013-12-13 2016-04-05 주식회사 선익시스템 증발원 이송유닛, 증착 장치 및 증착 방법
CN105695939B (zh) * 2016-04-26 2018-09-14 京东方科技集团股份有限公司 线性蒸发源、蒸镀装置及方法
CN111041441B (zh) * 2019-12-28 2021-04-13 中国科学院长春光学精密机械与物理研究所 一种均匀镀膜方法、镀膜设备及计算机可读存储介质
CN116200709A (zh) * 2022-12-30 2023-06-02 浙江昌丽木作家居有限公司 一种木材表面包覆铝合金装饰膜的设备及其工艺

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Publication number Priority date Publication date Assignee Title
JPH0742582B2 (ja) * 1993-01-26 1995-05-10 クリーンサアフェイス技術株式会社 スパッター装置
JPH0659464U (ja) * 1993-01-29 1994-08-19 日新電機株式会社 成膜装置
TW490714B (en) * 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
JP3877613B2 (ja) * 2002-03-05 2007-02-07 三洋電機株式会社 有機エレクトロルミネッセンス表示装置の製造方法
US20030221620A1 (en) * 2002-06-03 2003-12-04 Semiconductor Energy Laboratory Co., Ltd. Vapor deposition device
JP4286496B2 (ja) * 2002-07-04 2009-07-01 株式会社半導体エネルギー研究所 蒸着装置及び薄膜作製方法
US20040040504A1 (en) * 2002-08-01 2004-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4251857B2 (ja) * 2002-11-27 2009-04-08 株式会社アルバック 真空成膜装置及び真空成膜方法
JP4015064B2 (ja) * 2003-05-28 2007-11-28 トッキ株式会社 蒸着装置

Also Published As

Publication number Publication date
JP2010531391A (ja) 2010-09-24
KR100977971B1 (ko) 2010-08-24
CN101743617A (zh) 2010-06-16
TW200916595A (en) 2009-04-16
CN101743617B (zh) 2012-05-23
TWI443208B (zh) 2014-07-01
KR20080114299A (ko) 2008-12-31
WO2009002019A3 (fr) 2009-02-19

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