WO2009002019A3 - Appareil d'évaporation - Google Patents

Appareil d'évaporation Download PDF

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Publication number
WO2009002019A3
WO2009002019A3 PCT/KR2008/002919 KR2008002919W WO2009002019A3 WO 2009002019 A3 WO2009002019 A3 WO 2009002019A3 KR 2008002919 W KR2008002919 W KR 2008002919W WO 2009002019 A3 WO2009002019 A3 WO 2009002019A3
Authority
WO
WIPO (PCT)
Prior art keywords
evaporation
moving plate
substrate
evaporation apparatus
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/002919
Other languages
English (en)
Other versions
WO2009002019A2 (fr
Inventor
Jin Haon Kwon
Kyo Jun Song
Sung Jae Cho
Ki Ju Park
Hyun Ki Lee
Jin Il Mok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Mecatec Co Ltd
Original Assignee
Doosan Mecatec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co Ltd filed Critical Doosan Mecatec Co Ltd
Priority to CN2008800220536A priority Critical patent/CN101743617B/zh
Priority to JP2010514600A priority patent/JP2010531391A/ja
Publication of WO2009002019A2 publication Critical patent/WO2009002019A2/fr
Publication of WO2009002019A3 publication Critical patent/WO2009002019A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Transmission Devices (AREA)

Abstract

La présente invention concerne un appareil d'évaporation qui comprend une plaque mobile placée sur le cadre afin d'effectuer un mouvement de va et vient, une pluralité de sources d'évaporation servant à l'évaporation d'une matière évaporable, sur un substrat, de manière à ce que la matière évaporable se dépose sur le substrat, ladite pluralité de sources d'évaporation étant disposée dans une direction qui croise, sur la plaque, la direction de déplacement de la plaque mobile et une unité de commande qui anime d'un mouvement de va et vient la plaque mobile. L'appareil d'évaporation peut avoir une structure simplifiée et peut déposer la matière évaporable à une épaisseur uniforme sur le substrat en un temps court.
PCT/KR2008/002919 2007-06-27 2008-05-26 Appareil d'évaporation Ceased WO2009002019A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800220536A CN101743617B (zh) 2007-06-27 2008-05-26 蒸发装置
JP2010514600A JP2010531391A (ja) 2007-06-27 2008-05-26 蒸着装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0063711 2007-06-27
KR1020070063711A KR100977971B1 (ko) 2007-06-27 2007-06-27 증착 장치

Publications (2)

Publication Number Publication Date
WO2009002019A2 WO2009002019A2 (fr) 2008-12-31
WO2009002019A3 true WO2009002019A3 (fr) 2009-02-19

Family

ID=40186136

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/002919 Ceased WO2009002019A2 (fr) 2007-06-27 2008-05-26 Appareil d'évaporation

Country Status (5)

Country Link
JP (1) JP2010531391A (fr)
KR (1) KR100977971B1 (fr)
CN (1) CN101743617B (fr)
TW (1) TWI443208B (fr)
WO (1) WO2009002019A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101876058B (zh) * 2010-03-23 2012-07-11 东莞宏威数码机械有限公司 真空蒸镀装置
CN103540898B (zh) 2013-10-30 2015-07-01 京东方科技集团股份有限公司 一种真空蒸镀装置
KR101609185B1 (ko) * 2013-12-13 2016-04-05 주식회사 선익시스템 증발원 이송유닛, 증착 장치 및 증착 방법
CN105695939B (zh) * 2016-04-26 2018-09-14 京东方科技集团股份有限公司 线性蒸发源、蒸镀装置及方法
CN111041441B (zh) * 2019-12-28 2021-04-13 中国科学院长春光学精密机械与物理研究所 一种均匀镀膜方法、镀膜设备及计算机可读存储介质
CN116200709A (zh) * 2022-12-30 2023-06-02 浙江昌丽木作家居有限公司 一种木材表面包覆铝合金装饰膜的设备及其工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004035964A (ja) * 2002-07-04 2004-02-05 Tokki Corp 蒸着装置
JP2004353030A (ja) * 2003-05-28 2004-12-16 Tokki Corp 蒸着装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742582B2 (ja) * 1993-01-26 1995-05-10 クリーンサアフェイス技術株式会社 スパッター装置
JPH0659464U (ja) * 1993-01-29 1994-08-19 日新電機株式会社 成膜装置
TW490714B (en) * 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
JP3877613B2 (ja) * 2002-03-05 2007-02-07 三洋電機株式会社 有機エレクトロルミネッセンス表示装置の製造方法
US20030221620A1 (en) * 2002-06-03 2003-12-04 Semiconductor Energy Laboratory Co., Ltd. Vapor deposition device
US20040040504A1 (en) * 2002-08-01 2004-03-04 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP4251857B2 (ja) * 2002-11-27 2009-04-08 株式会社アルバック 真空成膜装置及び真空成膜方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004035964A (ja) * 2002-07-04 2004-02-05 Tokki Corp 蒸着装置
JP2004353030A (ja) * 2003-05-28 2004-12-16 Tokki Corp 蒸着装置

Also Published As

Publication number Publication date
JP2010531391A (ja) 2010-09-24
KR100977971B1 (ko) 2010-08-24
CN101743617A (zh) 2010-06-16
TW200916595A (en) 2009-04-16
CN101743617B (zh) 2012-05-23
TWI443208B (zh) 2014-07-01
KR20080114299A (ko) 2008-12-31
WO2009002019A2 (fr) 2008-12-31

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