WO2009050130A3 - Chipkühlvorrichtung mit keilelement - Google Patents

Chipkühlvorrichtung mit keilelement Download PDF

Info

Publication number
WO2009050130A3
WO2009050130A3 PCT/EP2008/063683 EP2008063683W WO2009050130A3 WO 2009050130 A3 WO2009050130 A3 WO 2009050130A3 EP 2008063683 W EP2008063683 W EP 2008063683W WO 2009050130 A3 WO2009050130 A3 WO 2009050130A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
wedge
gap
chip
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/063683
Other languages
English (en)
French (fr)
Other versions
WO2009050130A2 (de
Inventor
Phillip Hortmann
Klaus Weinmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abaco Systems Inc
Intelligent Platforms LLC
Original Assignee
GE Fanuc Embedded Systems Inc
GE Fanuc Intelligent Platforms Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Fanuc Embedded Systems Inc, GE Fanuc Intelligent Platforms Inc filed Critical GE Fanuc Embedded Systems Inc
Priority to US12/682,302 priority Critical patent/US8662155B2/en
Publication of WO2009050130A2 publication Critical patent/WO2009050130A2/de
Publication of WO2009050130A3 publication Critical patent/WO2009050130A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die vorliegende Erfindung schafft eine Kühlvorrichtung die den Wärmeübergang zwischen einem Chip (2) mit einem HaIbleitsubstrat (3) und einem Kühlkörper (7) verbessert. Der Zwischenraum zwischen einer zu kühlenden Oberfläche (11) des Chips (2) und einer Oberfläche (12) des Kühlkörpers (7), dessen Breite von Fertigungstoleranzen der Elemente und Lötverbindungen abhängt, wird durch eine schräge untere Oberfläche (12) des Kühlkörpers keilförmig ausgestaltet, um einen keilförmigen Zwischenraum zu schaffen. Ein Keilelement (17) mit dem gleichen Keilwinkel wie der keilförmige Zwischenraum wird genau so weit in diesen hinein geschoben, dass es sowohl an der zu kühlenden Chipoberfläche (11) als auch an der Kühlkörperoberfläche (12) flächig anliegt. Dadurch können Maßabweichungen ausgeglichen, der Einbau von Gap Fillern vermieden und die Wärmeübertragung von der Wärmequelle auf den Kühlkörper verbessert werden.
PCT/EP2008/063683 2007-10-11 2008-10-10 Chipkühlvorrichtung mit keilelement Ceased WO2009050130A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/682,302 US8662155B2 (en) 2007-10-11 2008-10-10 Chip cooling device having wedge element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007049035.8 2007-10-11
DE102007049035A DE102007049035B4 (de) 2007-10-11 2007-10-11 Chipkühlvorrichtung mit Keilelement

Publications (2)

Publication Number Publication Date
WO2009050130A2 WO2009050130A2 (de) 2009-04-23
WO2009050130A3 true WO2009050130A3 (de) 2009-07-02

Family

ID=40122515

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/063683 Ceased WO2009050130A2 (de) 2007-10-11 2008-10-10 Chipkühlvorrichtung mit keilelement

Country Status (3)

Country Link
US (1) US8662155B2 (de)
DE (1) DE102007049035B4 (de)
WO (1) WO2009050130A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103370996B (zh) 2011-02-04 2016-09-28 索尤若驱动有限及两合公司 电气设备
FR2988186B1 (fr) * 2012-03-15 2014-03-28 Ecrin Systems Calculateur et radiateur pour ce calculateur
DE102013214899B4 (de) 2013-07-30 2023-11-16 Valeo Eautomotive Germany Gmbh Leistungselektronikanordnung
DE102014004798B4 (de) * 2014-04-03 2017-08-10 Sew-Eurodrive Gmbh & Co Kg Elektrisches Gerät
AT517079B1 (de) * 2015-06-24 2016-11-15 Ift Gmbh Verfahren zum Betreiben eines Verbrennungsmotors
DE102018117695B3 (de) * 2018-07-23 2019-09-26 Sick Ag Verfahren zum Montieren eines elektrischen Bauteils auf einem Sockelteil
AU2020276612B2 (en) 2019-05-16 2026-01-29 Hubbell Lighting, Inc. Edge lit luminaire
DE102023103837B4 (de) * 2023-02-16 2026-02-26 Cariad Se Elektroschaltkastensystem, Einschubleiste und Kraftfahrzeug

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0288183A2 (de) * 1987-04-08 1988-10-26 Hitachi, Ltd. Kühlungsgerät und eine dieses Gerät verwendende Halbleitervorrichtung
EP0354722A2 (de) * 1988-08-08 1990-02-14 Hitachi, Ltd. Wärmetransportsystem, insbesondere zum Kühlen von Halbleiteranordnungen
US5028989A (en) * 1989-06-03 1991-07-02 Hitachi, Ltd. Semiconductor cooling module
WO1999016128A1 (fr) * 1997-09-19 1999-04-01 Hitachi, Ltd. Module a semiconducteur
US20050047092A1 (en) * 2003-08-25 2005-03-03 Whit Joseph M. Method of assembly of a wedge thermal interface to allow expansion after assembly

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4462462A (en) * 1981-11-17 1984-07-31 International Business Machines Corporation Thermal conduction piston for semiconductor packages
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
GB8607526D0 (en) * 1986-03-26 1986-04-30 Artus R G C Cooled component assembly
DE8711779U1 (de) * 1987-08-31 1988-01-07 Siemens AG, 1000 Berlin und 8000 München Wärmeleiter für Bauelemente der elektrischen Nachrichtentechnik
US5028969A (en) 1988-09-13 1991-07-02 Nec Corporation Semiconductor device for a space modulation matrix and method for driving a space modulation matrix
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
JPH10107189A (ja) * 1996-09-25 1998-04-24 Sony Corp 放熱装置
JP2000091485A (ja) * 1998-07-14 2000-03-31 Denso Corp 半導体装置
US6304449B1 (en) * 1999-07-06 2001-10-16 Chaojiong Zhang Heat sink mounting for power semiconductors
DE60209423T2 (de) * 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Mikrochip-Kühlung auf Leiterplatte

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0288183A2 (de) * 1987-04-08 1988-10-26 Hitachi, Ltd. Kühlungsgerät und eine dieses Gerät verwendende Halbleitervorrichtung
EP0354722A2 (de) * 1988-08-08 1990-02-14 Hitachi, Ltd. Wärmetransportsystem, insbesondere zum Kühlen von Halbleiteranordnungen
US5028989A (en) * 1989-06-03 1991-07-02 Hitachi, Ltd. Semiconductor cooling module
WO1999016128A1 (fr) * 1997-09-19 1999-04-01 Hitachi, Ltd. Module a semiconducteur
US20050047092A1 (en) * 2003-08-25 2005-03-03 Whit Joseph M. Method of assembly of a wedge thermal interface to allow expansion after assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"SPHERICAL COOLING DEVICE", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 34, no. 2, 1 July 1991 (1991-07-01), pages 1 - 03, XP000210548, ISSN: 0018-8689 *

Also Published As

Publication number Publication date
US8662155B2 (en) 2014-03-04
US20120000636A1 (en) 2012-01-05
DE102007049035A1 (de) 2009-04-23
WO2009050130A2 (de) 2009-04-23
DE102007049035B4 (de) 2011-01-13

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