WO2010077014A2 - Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board - Google Patents

Abstract

Disclosed are an aromatic polyester amide copolymer, a high molecular film, a prepreg, a prepreg laminate, a metal foil laminate, and a printed circuit board. The disclosed aromatic polyester amide copolymer comprises 20 to 25 mol % of an aromatic diol-derived recurrent unit (A) relative to the total recurrent unit, wherein said aromatic diol-derived recurrent unit (A) contains both a resorcinol-derived recurrent unit (RCN) and a recurrent unit (HQ) derived from at least one compound of biphenol and hydroquinone.

Description

Aromatic polyester amide copolymer, polymer film, prepreg, prepreg laminate, metal foil laminate and printed wiring board

Aromatic polyester amide copolymers, polymer films, prepregs, prepreg laminates, metal foil laminates, and printed wiring boards are disclosed. More specifically, 20-25 mol% of repeating units (A) derived from an aromatic diol with respect to all the repeating units, The repeating unit (A) derived from the said aromatic diol is a repeating unit (derived from resorcinol ( RCN), an aromatic polyester amide copolymer containing all of repeating units (HQ) derived from at least one compound of biphenol and hydroquinone, a polymer film employing the aromatic polyester amide copolymer, a prepreg and A prepreg laminate, a metal foil laminate and a printed wiring board employing the prepreg or the prepreg laminate are disclosed.

BACKGROUND ART With the recent miniaturization and multifunctionalization of electronic devices, the densification and miniaturization of printed wiring boards are progressing. Copper foil laminates are widely used as substrates for printed wiring boards of electronic devices due to their excellent stamping processability and drillability, and low cost.

The prepreg used in such a copper clad laminate for a printed wiring board must satisfy the following main characteristics to be suitable for the performance of the semiconductor and the manufacturing conditions of the semiconductor packaging process.

(1) Low thermal expansion rate that can correspond to metal thermal expansion rate

(2) Low dielectric constant and dielectric stability in high frequency region of 1GHz or more

(3) Heat resistance to reflow process of about 270 ° C

The prepreg is prepared by impregnating a resin derived from epoxy or bismaleimide triazine into a glass cloth, followed by drying and semi-curing. Next, copper foil is laminated on the prepreg, and the resin is cured to produce a copper foil laminated plate. Such a copper foil laminate is thinned and subjected to a high temperature process such as a reflow process at 270 ° C. There is a problem that the yield is reduced due to thermal deformation of the copper foil laminate in the form of a thin film. In addition, epoxy or bismaleimide triazine resin is required to be improved to low absorbency due to its high hygroscopicity. In particular, semiconductor packaging requiring high frequency and high speed processing due to poor dielectric properties in the high frequency region of 1 GHz or more. There is a problem that is difficult to apply to a printed wiring board for dragons. Therefore, a low dielectric prepreg that does not cause such a problem is desired.

There is also an example in which aromatic polyesters have recently been used for prepreg formation as an alternative to epoxy or bismaleimide triazine resins. Such prepregs are prepared by impregnating aromatic polyesters with organic or inorganic woven fabrics. In particular, an aromatic polyester prepreg may be produced using an aromatic polyester resin and an aromatic polyester woven fabric. Specifically, the aromatic polyester is dissolved in a solvent containing a halogen element such as chlorine to prepare a solution composition. The solution composition is impregnated with an aromatic polyester woven fabric and then dried to prepare an aromatic polyester prepreg. However, this method is difficult to completely remove the solvent containing a halogen element, and since the halogen element can corrode copper foil, the improvement by the use of a non-halogen solvent is calculated | required.

One embodiment of the present invention provides an aromatic polyester amide copolymer having low thermal expansion coefficient, low dielectric constant and low dielectric loss.

Another embodiment of the present invention provides a prepreg and a prepreg laminate employing the aromatic polyester amide copolymer.

Another embodiment of the present invention provides a metal foil laminate and a printed wiring board employing the prepreg or the prepreg laminate.

One aspect of the invention,

20-25 mol% of repeating units (A) derived from an aromatic diol with respect to all the repeating units, The repeating unit (A) derived from the said aromatic diol is a repeating unit (RCN) derived from resorcinol, and bi It includes both repeating units (HQ) derived from at least one compound of phenol and hydroquinone.

The content of the repeating unit (RCN) and the content of the repeating unit (HQ) may satisfy the following conditions:

0 <n (RCN) / [n (RCN) + n (HQ)] <1.

Here, n (RCN) and n (HQ) are the moles of repeating unit (RCN) and repeating unit (HQ) included in the aromatic polyester amide copolymer, respectively.

The said aromatic polyester amide copolymer may further contain 2-25 mol% of repeating units (B) derived from aromatic hydroxy carboxylic acid with respect to all the repeating units.

The aromatic polyester amide copolymer is a repeating unit of 20 to 25 of at least one of a repeating unit (C) derived from an aromatic amine having a phenolic hydroxyl group with respect to all repeating units and a repeating unit (C ′) derived from an aromatic diamine. And may further comprise mole%.

The said aromatic polyester amide copolymer can further contain 35-48 mol% of repeating units (D) derived from aromatic dicarboxylic acid with respect to all the repeating units.

Another aspect of the invention,

It provides a polymer film comprising the aromatic polyester amide copolymer.

Another aspect of the invention,

It provides a prepreg comprising a substrate impregnated with the aromatic polyester amide copolymer.

Another aspect of the invention,

Provided is a prepreg laminate comprising two or more of the above prepregs.

Another aspect of the invention,

Provided is a metal foil laminate in which a metal thin film is formed on at least one surface of the prepreg or the prepreg laminate.

Another aspect of the invention,

The printed wiring board obtained by etching the metal thin film of the said metal foil laminated board is provided.

Another aspect of the invention,

It provides a printed wiring board formed by printing a metal circuit pattern on at least one surface of the polymer film.

According to one embodiment of the present invention, an aromatic polyester amide copolymer having low thermal expansion coefficient, low dielectric constant and low dielectric loss may be provided.

According to another embodiment of the present invention, a prepreg and a prepreg laminate having low thermal expansion coefficient, low dielectric constant and low dielectric loss may be provided by employing the aromatic polyester amide copolymer.

According to another embodiment of the present invention, a metal foil laminate and a printed wiring board employing the prepreg or the prepreg laminate may be provided.

Hereinafter, a prepreg including an aromatic polyester amide copolymer and a substrate impregnated with the copolymer according to an embodiment of the present invention will be described in detail.

The aromatic polyester amide copolymer according to the present embodiment contains 20 to 25 mol% of the repeating units (A) derived from the aromatic diol based on the total repeating units, and the repeating units (A) derived from the aromatic diol are It includes both a repeating unit (RCN) derived from knol and a repeating unit (HQ) derived from at least one compound of biphenol and hydroquinone. If the content of the repeating unit (A) is less than 20 mol%, the solubility in the solvent is lowered, which is undesirable.

In addition, the number of moles (n (RCN)) of the repeating unit (RCN) and the number of moles (n (HQ)) of the repeating unit (HQ) included in the aromatic polyester amide copolymer may satisfy the following conditions:

0 <n (RCN) / [n (RCN) + n (HQ)] <1.

In addition, the aromatic polyester amide copolymer may further include 2 to 25 mol% of the repeating unit (B) derived from the aromatic hydroxy carboxylic acid based on the total repeating units.

If the content of the repeating unit (B) is less than 2 mol%, the mechanical strength of the aromatic polyester amide copolymer is lowered, which is undesirable. If the content of the repeating unit (B) exceeds 25 mol%, the thermal properties of the aromatic polyester amide copolymer are lowered. Not.

The repeating unit (B) may include a repeating unit derived from at least one compound of para hydroxy benzoic acid and 2-hydroxy-6-naphthoic acid.

In addition, the aromatic polyester amide copolymer has a repeating unit of at least one of the repeating unit (C) derived from an aromatic amine having a phenolic hydroxyl group and the repeating unit (C ′) derived from an aromatic diamine with respect to all repeating units. It may further comprise -25 mol%.

In addition, if the total content of the repeating unit (C) and the repeating unit (C ') is less than 20 mol%, the solubility in the solvent is lowered, and if the total content exceeds 25 mol%, the melting temperature increases too much, which is not preferable. not.

The repeating unit (C) includes a repeating unit derived from one or more compounds selected from the group consisting of 3-aminophenol, 4-aminophenol, and 2-amino-6-naphthol, and the repeating unit (C ' ) May include repeating units derived from one or more compounds selected from the group consisting of 1,4-phenylene diamine, 1,3-phenylene diamine, and 2,6-naphthalene diamine.

In addition, the aromatic polyester amide copolymer may further include 35 to 48 mol% of the repeating unit (D) derived from the aromatic dicarboxylic acid with respect to all the repeating units.

When the content of the repeating unit (D) is less than 35 mol%, the solubility is lowered, which is not preferable. When the content of the repeating unit (D) is more than 48 mol%, the heat resistance, low heat window, and low dielectric properties are not preferable.

The repeating unit (D) may include a repeating unit derived from one or more compounds selected from the group consisting of isophthalic acid, naphthalene dicarboxylic acid and terephthalic acid.

Specifically, each repeating unit included in the aromatic polyester amide copolymer may be represented by any one of the following formulas:

(1) Repeating unit (A) derived from aromatic diol:

 <Formula 1>

<Formula 2>

<Formula 3>

<Formula 4>

(2) Repeating unit (B) derived from aromatic hydroxy carboxylic acid:

<Formula 5>

<Formula 6>

<Formula 7>

<Formula 8>

<Formula 9>

 (3) Repeating unit (C) derived from aromatic amine having phenolic hydroxyl group:

<Formula 10>

<Formula 11>

<Formula 12>

(4) repeating unit (C ′) derived from aromatic diamine:

<Formula 13>

<Formula 14>

<Formula 15>

(5) Repeating unit (D) derived from aromatic dicarboxylic acid:

<Formula 16>

<Formula 17>

<Formula 18>

<Formula 19>

<Formula 20>

<Formula 21>

<Formula 22>

<Formula 23>

In the above formula,

R ₁ and R ₂ are the same as or different from each other, and each represents a halogen atom, a carboxyl group, an amino group, a nitro group, a cyano group, a substituted or unsubstituted C ₁ -C ₂₀ alkyl group, a substituted or unsubstituted C ₁ -C ₂₀ alkoxy group , Substituted or unsubstituted C ₂ -C ₂₀ alkenyl group, substituted or unsubstituted C ₂ -C ₂₀ alkynyl group, substituted or unsubstituted C ₁ -C ₂₀ heteroalkyl group, substituted or unsubstituted C ₆ -C ₃₀ An aryl group, a substituted or unsubstituted C ₇ -C ₃₀ arylalkyl group, a substituted or unsubstituted C ₅ -C ₃₀ heteroaryl group, or a substituted or unsubstituted C ₃ -C ₃₀ heteroarylalkyl group. In the present specification, the term 'substituted' means that hydrogen is substituted with a halogen group, a hydroxy group, an alkyl group, an alkoxy group, an amine group or two or more thereof.

Such aromatic polyester amide copolymers include (1) aromatic diols comprising resorcinol and hydroquinone and / or biphenols, or derivatives for ester formation thereof; (2) aromatic hydroxy carboxylic acids or derivatives for ester formation thereof; (3) at least one member selected from the group consisting of an aromatic amine having a phenolic hydroxyl group, or a derivative for forming an amide thereof, and an aromatic diamine or a derivative for forming an amide; And (4) polymerizing an aromatic dicarboxylic acid or a derivative for forming an ester thereof.

The derivative for forming esters of the aromatic diol may be one in which the hydroxyl groups react with carboxylic acids to form ester bonds.

In addition, the derivative for forming esters of the aromatic hydroxycarboxylic acid or aromatic dicarboxylic acid may be a derivative having high reactivity such as an acid chloride or an acid anhydride, or forming an ester bond with alcohols, ethylene glycol, or the like.

In addition, the derivative for forming an amide of the aromatic amine or aromatic diamine may be one in which the amine group forms an amide bond with carboxylic acids.

The aromatic polyester amide copolymer prepared as described above may be dissolved in a solvent, preferably a thermotropic liquid crystalline polyester amide copolymer capable of forming a melt exhibiting optical anisotropy at 400 ° C. or lower. . Specifically, the aromatic polyester amide copolymer may have a melting temperature of 250 ° C. to 400 ° C. and a number average molecular weight of 1,000 to 20,000.

The aromatic polyester amide copolymer as described above may be prepared through a general method for producing an aromatic polyester, for example, aromatic diols corresponding to the repeating unit (RCN) and the repeating unit (HQ), respectively, the repeating Excess fatty acid anhydride of the aromatic hydroxy carboxylic acid corresponding to the unit (B), the phenolic hydroxyl group or the amine group of the aromatic amine and / or the aromatic diamine corresponding to the repeating unit (C) and / or the repeating unit (C '). And acylating to obtain an acyl compound, and a method of melt polymerization by transesterification of the obtained acyl compound and the aromatic dicarboxylic acid.

In the acylation reaction, the amount of fatty acid anhydride added may be 1.0 to 1.2 times the equivalent, for example, 1.04 to 1.07 times the equivalent of the total equivalent of the phenolic hydroxyl group and the amine group. When the addition amount of the fatty acid anhydride is large, the coloring of the aromatic polyester amide copolymer tends to be remarkable, and when the amount is small, the raw material monomer or the like tends to increase in the polymer or the amount of phenol gas generated increases. It is preferable to make such an acylation reaction react at 130-170 degreeC for 30 minutes-8 hours, and it is more preferable to make it react at 140-160 degreeC for 2 to 4 hours.

Fatty acid anhydrides used in the acylation reaction include acetic anhydride, propionic anhydride, isobutyric anhydride, gil acetic anhydride, pivalic anhydride, butyric anhydride, and the like, and are not particularly limited thereto. Moreover, these two or more types can be mixed and used. It is preferable to use acetic anhydride in economics and handleability.

The transesterification and amide exchange reactions are preferably performed at a temperature increase rate of 0.1 to 2 ° C./min at 130 to 400 ° C., and more preferably at a temperature increase rate of 0.3 to 1 ° C./min at 140 to 350 ° C. .

By-product fatty acids and unreacted anhydrides may be discharged out of the reaction system by evaporation or distillation in order to shift the equilibrium in the transesterification reaction and the amide exchange reaction of the fatty acid ester and the carboxylic acid obtained by acylation.

The acylation reaction, transesterification reaction and amide exchange reaction can be carried out in the presence of a catalyst. The catalyst is conventionally known as a catalyst for polyester, magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, potassium acetate, antimony trioxide, N, N-dimethylaminopyridine, N-methyl Midazoles and the like. The catalyst is usually introduced simultaneously with the monomer upon the addition of the monomer, and acylation and transesterification reactions occur in the presence of the catalyst.

Although polycondensation by the said transesterification reaction and an amide exchange reaction is normally performed by melt polymerization, melt polymerization and solid state polymerization can be used together.

The polymerizer used for the melt polymerization is not particularly limited, and may be a reactor equipped with a stirring apparatus generally used for high viscosity reactions. At this time, the same reactor may be used as the reactor of the acylation process and the polymerizer of the melt polymerization process or different reactors may be used for each process.

The solid phase polymerization may be performed by pulverizing the prepolymer discharged from the melt polymerization process into a flake or powder phase and then proceeding with the polymerization. Such solid phase polymerization can be carried out by, for example, heat treatment in a solid state for 1 to 30 hours at 200 to 350 ° C. in an inert atmosphere such as nitrogen. Further, the solid phase polymerization may be carried out under stirring or may be carried out in an unstirred state. Moreover, the reactor equipped with the suitable stirring apparatus can also be used together with a melt polymerization tank and a solid state polymerization tank.

The aromatic polyester amide copolymer prepared as described above may have a thermal expansion rate of 3 ppm / K or less.

The obtained aromatic polyester amide copolymer may be pelletized by a known method and then molded or fiberized according to a known method. In addition, such an aromatic polyester amide copolymer may be dissolved in a solvent and then applied to a metal thin film, then dried and heat treated to form a polymer film, and may also be used in the manufacture of a woven or nonwoven fabric.

The prepreg according to this embodiment comprises a substrate impregnated with the aromatic polyester amide copolymer.

The prepreg impregnates a composition solution in which the aromatic polyester amide polymer is dissolved in a solvent into an organic or inorganic fabric and / or non-fabric substrate, or the solution of the composition is fabric and / or It can be produced by molding by applying to a nonwoven substrate and then removing the solvent. In this case, as a molding method usable, a solution impregnation method or a varnish impregnation method may be mentioned.

The solvent for dissolving the aromatic polyester amide copolymer may be used in an amount of 100 to 100,000 parts by weight based on 100 parts by weight of the aromatic polyester amide polymer, and when the content of the solvent is less than 100 parts by weight, the solution viscosity increases to process When it has a problem at the time and exceeds 100,000 weight part, since the quantity of aromatic polyester amide copolymer is small and there exists a tendency for productivity to fall, it is unpreferable.

It is preferable that a non-halogen solvent is used as a solvent which melt | dissolves the said aromatic polyester amide copolymer. However, the present invention is not limited thereto, and in addition, polar aprotic compounds, halogenated phenols, o-dichlorobenzene, chloroform, methylene chloride, tetrachloroethane and the like may be used alone or in combination of two or more thereof. In particular, since the aromatic polyester amide copolymer is well dissolved in a non-halogen solvent and does not have to use a solvent containing a halogen element, the metal foil of the metal foil laminate or printed wiring board containing the same uses a solvent containing a halogen element. It is possible to prevent problems such as corrosion due to.

As the substrate, woven and / or nonwoven fabrics such as aromatic polyester fibers, glass fibers, carbon fibers, paper, or mixtures thereof may be used.

When using the impregnation method in the said prepreg manufacturing process, as for the time to impregnate the said base material with the composition solution which melt | dissolved the aromatic polyester amide copolymer in the solvent, 0.001 minute-1 hour are preferable normally. If the impregnation time is less than 0.001 minutes, the aromatic polyester amide copolymer may not be uniformly impregnated, and if it exceeds 1 hour, productivity may be reduced.

The temperature at which the base material is impregnated with the composition solution in which the aromatic polyester amide copolymer is dissolved in a solvent can be in the range of 20 to 190 ° C, and is preferably performed at room temperature.

In addition, it is preferable that the amount of the aromatic polyester amide copolymer impregnated per unit area of the substrate is in the range of 0.1 to 1,000 g / m ² . When the said impregnation amount is less than 0.1 g / m <^2> , productivity falls and it is unpreferable, and when it exceeds 1,000 g / m < ² >, it is not suitable for miniaturization of a printed wiring board.

In the composition solution in which the aromatic polyester amide copolymer is dissolved in a solvent, an inorganic filler such as silica, aluminum hydroxide, calcium carbonate, hardened epoxy, crosslinked acryl, etc., in order to adjust the dielectric constant and thermal expansion rate within a range that does not impair the object of the invention. Organic fillers may be added. In particular, you may add the inorganic filler of high dielectric constant. As such an inorganic filler, a titanate such as barium titanate or strontium titanate, a part of titanium or barium of barium titanate, or the like may be used. It is preferable that content of such an inorganic filler or an organic filler is the ratio of 0.0001-100 weight part with respect to 100 weight part of aromatic polyester amide copolymers. If the amount of the inorganic filler or the organic filler is less than 0.0001 parts by weight, it is difficult to sufficiently increase the dielectric constant of the prepreg or lower the thermal expansion coefficient, and if it exceeds 100 parts by weight, the effect of the aromatic polyester amide copolymer as a binder becomes less. Tend to be.

The prepreg according to the present embodiment uses an aromatic polyester amide copolymer having low hygroscopicity and low dielectric properties, and an organic or inorganic woven fabric and / or nonwoven fabric having excellent mechanical strength, and thus has excellent dimensional stability, low thermal deformation, and rigidity, thereby making a via hole drill. It is advantageous for processing and lamination processing.

In the impregnation method for producing the prepreg, the composition solution in which the aromatic polyester amide copolymer is dissolved in a solvent is impregnated into the substrate, or after applying the composition solution to the substrate, the solvent is removed. Although a method is not specifically limited, It is preferable by solvent evaporation. For example, evaporation by methods, such as a heating, reduced pressure, and ventilation, is mentioned. Among them, solvent heating evaporation is preferred from the viewpoint of applicability to existing prepreg manufacturing processes, production efficiency, and handling, and more preferably evaporation by ventilation heating.

In the solvent removal process, the heating temperature is pre-dried for 1 minute to 2 hours in the range of 20 to 190 ℃ with respect to the composition solution of the aromatic polyester amide copolymer obtained in the production method of the present invention, 190 to 350 ℃ It is preferable to carry out the heat treatment from 1 minute to 10 hours at.

The prepreg according to the present embodiment thus obtained preferably has a thickness of about 5 to 200 μm, preferably about 30 to 150 μm. In addition, the prepreg has a thermal expansion coefficient of 10 ppm / K or less in one direction, a dielectric constant of 3.5 or less, and a dielectric loss of 0.01 or less. Here, the dielectric loss means an energy loss lost by heat in the dielectric when an alternating electric field is applied to the dielectric. When the thermal expansion rate exceeds 10 ppm / K, peeling of the prepreg occurs, which is not preferable. In addition, if the dielectric constant exceeds 3.5 or the dielectric loss exceeds 0.01, the dielectric constant is unsuitable as an insulating substrate in the high frequency region.

A prepreg laminated body can be manufactured by laminating | stacking a predetermined number of said prepregs, and heating and pressurizing it.

Moreover, a metal foil laminated board can be manufactured by arrange | positioning metal thin films, such as copper foil, silver foil, and aluminum foil, on one surface or both surfaces of the said prepreg or the said prepreg laminated body, and heating and pressurizing in the same manner to the above.

In the said metal foil laminated board, although the thickness of each prepreg or a prepreg laminated body, and a metal thin film is not specifically limited, It is preferable that it is 0.1-300 micrometers. If the thickness of the prepreg or the prepreg laminate is less than 0.1 μm, cracks are easily generated during the winding process, and if it exceeds 300 μm, the number of layers of the multilayer stack having a limited thickness is not preferable. When the thickness of the metal thin film is less than 0.1 μm, cracks are easily generated when the metal thin film is laminated.

The heating and pressurization process applied in the production of the metal foil laminate is preferably performed at a temperature of 150 to 180 ° C. and a pressure of 9 to 20 MPa, but the prepreg characteristics, the reactivity of the aromatic polyester amide copolymer composition, the ability of the press machine, Since it can determine suitably in consideration of the thickness of a metal foil laminated board, etc., it is not specifically limited.

In addition, the metal foil laminate according to the present embodiment may further include an adhesive layer interposed therebetween to increase the bonding strength between the prepreg laminate and the metal thin film. As the adhesive layer, a thermoplastic resin composition or a thermosetting resin composition may be used. In addition, the adhesive layer preferably has a thickness of 0.1 ~ 100㎛. If the thickness is less than 0.1 mu m, the adhesive strength is low, which is not preferable. If the thickness exceeds 100 mu m, the thickness becomes too thick, which is not preferable.

Moreover, a printed wiring board can be manufactured by etching the metal thin film of the said metal foil laminated board, and forming a circuit. In addition, a printed wiring board may be manufactured by printing a metal circuit pattern on at least one surface of the polymer film. Moreover, a through hole etc. can also be formed in the said printed wiring board as needed. In the multilayer printed wiring board of the present embodiment, a predetermined number of sheets of the prepreg are placed between components of an inner layer base material, a metal thin film, or the like according to the thickness of an insulating layer, for example, and molded by heating and pressing. Can be. Heating and pressurization conditions at this time can be suitably determined similarly to the conditions at the time of manufacture of the said metal foil laminated board. Moreover, as said inner base material, the prepreg laminated body, metal foil laminated board, printed wiring board, etc. which are used for an electrical insulation material can be mentioned, You can use these together two or more types.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.

Example 1

138.1 g (1.0 mol) of para hydroxy benzoic acid, 245.54 g (2.3 mol) of 4-aminophenol, 185.8 g (1.7 mol) of hydroquinone in a reactor equipped with a stirring device, a torque meter, a nitrogen gas introduction tube, a thermometer, and a reflux condenser. , 61.9 g (0.6 mole) of resorcinol, 747.6 g (4.5 mole) of isophthalic acid, and 1,123 g (11 mole) of acetic anhydride were added thereto.

After sufficiently replacing the inside of the reactor with nitrogen gas, the temperature was raised to 150 ° C. over 30 minutes under a nitrogen gas stream and refluxed for 3 hours while maintaining the temperature.

Thereafter, the distilled acetic acid and unreacted acetic anhydride were distilled off, and the temperature was raised to 320 ° C. for 180 minutes, and the contents were discharged considering the end of the reaction as the time when the torque was increased. After cooling the obtained solid content to room temperature, it grind | pulverized with the fine grinding machine, and solid-phase polymerization was performed, hold | maintaining at 260 degreeC for 5 hours in nitrogen atmosphere, and the aromatic polyester amide copolymer powder was obtained.

400 g of the aromatic polyester amide copolymer powder thus obtained was added to 600 g of N-methylpyrrolidinone (NMP), followed by stirring at room temperature for 4 hours to obtain a composition solution of the aromatic polyester amide copolymer.

This composition solution was impregnated with a glass cloth (IPC 1078) at room temperature and passed between double rollers to remove excess composition solution and to have a constant thickness. Thereafter, the contents were placed in a high temperature hot air dryer to remove the solvent at 120 ° C., and then heat-treated at 300 ° C. for 60 minutes to obtain a prepreg in which the aromatic polyester amide copolymer was impregnated into a glass cloth.

Comparative Example 1

An aromatic polyester amide copolymer was prepared in the same manner as in Example 1, except that 253.23 g (2.3 mol) of resorcinol was used without using any hydroquinone as the aromatic diol. In addition, an aromatic polyester amide copolymer composition solution and a prepreg were prepared in the same manner as in Example 1.

Comparative Example 2

An aromatic polyester amide copolymer was prepared in the same manner as in Example 1, except that only 253.23 g (2.3 mol) of hydroquinone was used without using any resorcinol as the aromatic diol. In addition, an aromatic polyester amide copolymer composition solution and prepreg were prepared in the same manner as in Example 1.

Comparative Example 3

Parahydroxy benzoic acid 138.1 g (1.0 mole), 4-aminophenol 109.1 g (1.0 mole), hydroquinone 289.6 g (2.63 mole), resorcinol 95.8 g (0.87 mole), isophthalic acid 747.6 g (4.5 mole) and An aromatic polyester amide copolymer was prepared in the same manner as in Example 1, except that 1,123 g (11 mol) of acetic anhydride was used. In addition, an aromatic polyester amide copolymer composition solution and a prepreg were prepared in the same manner as in Example 1.

The resin powder dropout and electrical property evaluation of the prepreg prepared in Example 1 were performed as follows in comparison with Comparative Examples 1 to 3.

First, the prepreg obtained in Example 1 and the prepregs prepared in Comparative Examples 1 to 3 were soaked three times for 10 seconds each in a soldering bath having a soldering temperature of 290 ° C., and the surface state was observed. The prepreg prepared in Example 1 did not cause deformation or blister, but it was confirmed that the prepreg prepared in Comparative Examples 1 to 3 fell off part of the surface and deformation of the prepreg itself.

The dielectric constants and dielectric losses of the prepregs obtained in Example 1 and the prepregs prepared in Comparative Examples 1 to 3 were measured using an impedance analyzer. As a result, the dielectric constants of the prepregs obtained in Example 1 were The dielectric loss was 3.05 (1 GHz), which was low in the high frequency region. However, the prepreg obtained in Comparative Example 1 had a dielectric constant of 3.4 (1 GHz), a dielectric loss of 0.007, a prepreg obtained in Comparative Example 2 of 3.6 (1 GHz), a dielectric loss of 0.008, and a prepreg obtained in Comparative Example 3. The dielectric constant was 3.4 (1 GHz) and the dielectric loss was 0.007, which is higher than that of Example 1.

In addition, the prepreg obtained in Example 1 was measured for each of the prepregs obtained in Example 1 and the prepregs prepared in Comparative Examples 1 to 3 using TMA (TMA, Q400). The coefficient of thermal expansion of was found to be 9.2ppm / K in the temperature range of 50 ~ 120 ℃. However, the thermal expansion rate of the prepreg obtained in Comparative Example 1 is 14.5 ppm / K, the thermal expansion rate of the prepreg obtained in Comparative Example 2 is 11.5 ppm / K, and the thermal expansion rate of the prepreg obtained in Comparative Example 3 is 12.4 ppm / K. As a result, it showed a higher value (> 10ppm / K) than in the case of Example 1.

On the other hand, as described above, according to the conventional manufacturing method for manufacturing the prepreg laminate, the metal foil laminate and the printed wiring board using the prepreg, the prepreg laminate, the metal foil laminate using the prepreg prepared in the above embodiment And printed wiring boards.

Although the present invention has been described with reference to the embodiments, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (21)

20-25 mol% of repeating units (A) derived from an aromatic diol with respect to all the repeating units, The repeating unit (A) derived from the said aromatic diol is a repeating unit (RCN) derived from resorcinol, and bi An aromatic polyester amide copolymer comprising both repeating units (HQ) derived from at least one compound of phenol and hydroquinone. The method of claim 1, The content of the repeating unit (RCN) and the content of the repeating unit (HQ) is an aromatic polyester amide copolymer satisfying the following conditions: 0 <n (RCN) / [n (RCN) + n (HQ)] <1. Here, n (RCN) and n (HQ) are the moles of repeating unit (RCN) and repeating unit (HQ) included in the aromatic polyester amide copolymer, respectively. The method of claim 1, An aromatic polyester amide copolymer further containing 2-25 mol% of repeating units (B) derived from aromatic hydroxy carboxylic acid with respect to all the repeating units. The method of claim 3, The repeating unit (B) is an aromatic polyester amide copolymer derived from at least one compound of para hydroxy benzoic acid and 2-hydroxy-6-naphthoic acid. The method of claim 1, An aromatic poly further including 20-25 mol% of at least 1 repeating unit of the repeating unit (C) derived from the aromatic amine which has a phenolic hydroxyl group, and the repeating unit (C ') derived from aromatic diamine with respect to all the repeating units. Ester amide copolymers. The method of claim 5, The repeating unit (C) is derived from at least one compound selected from the group consisting of 3-aminophenol, 4-aminophenol, and 2-amino-6-naphthol, and the repeating unit (C ′) is 1,4 An aromatic polyester amide copolymer derived from at least one compound selected from the group consisting of -phenylene diamine, 1,3-phenylene diamine, and 2,6-naphthalene diamine. The method of claim 1, An aromatic polyester amide copolymer further containing 35-48 mol% of repeating units (D) derived from aromatic dicarboxylic acid with respect to all the repeating units. The method of claim 7, wherein The repeating unit (D) is an aromatic polyester amide copolymer derived from at least one compound selected from the group consisting of isophthalic acid, naphthalene dicarboxylic acid and terephthalic acid. The method of claim 1, An aromatic polyester amide copolymer having a number average molecular weight of 1,000 to 20,000 and a melting temperature of 250 to 400 ° C. A polymer film comprising the aromatic polyester amide copolymer according to any one of claims 1 to 9. A prepreg comprising a substrate impregnated with the aromatic polyester amide copolymer according to any one of claims 1 to 9. The method of claim 11, The prepreg in which the aromatic polyester amide copolymer is impregnated per unit area of the substrate ranges from 0.1 to 1,000 g / m ² . The method of claim 11, Prepreg wherein said substrate comprises at least one selected from the group consisting of aromatic polyester fibers, glass fibers, carbon fibers and paper. The method of claim 11, A prepreg further comprising an organic or inorganic filler added to the substrate in a ratio of 0.0001 to 100 parts by weight based on 100 parts by weight of the aromatic polyester amide copolymer. The method of claim 11, Prepreg with a thermal expansion coefficient of 10 ppm / K or less in one direction. The method of claim 11, Prepreg with dielectric constant of 3.5 or less and dielectric loss of 0.01 or less. A prepreg laminate comprising two or more prepregs according to claim 11. A prepreg according to claim 11; And A metal foil laminate comprising at least one metal thin film disposed on at least one surface of the prepreg. The method of claim 18, The said prepreg is a metal foil laminated board which is a prepreg laminated body of at least 2 sheets. The printed wiring board obtained by etching the metal thin film of the metal foil laminated board of Claim 18. A printed wiring board formed by printing a metal circuit pattern on at least one surface of the polymer film according to claim 10.