WO2010077014A3 - Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board - Google Patents

Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board Download PDF

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Publication number
WO2010077014A3
WO2010077014A3 PCT/KR2009/007763 KR2009007763W WO2010077014A3 WO 2010077014 A3 WO2010077014 A3 WO 2010077014A3 KR 2009007763 W KR2009007763 W KR 2009007763W WO 2010077014 A3 WO2010077014 A3 WO 2010077014A3
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
laminate
aromatic polyester
polyester amide
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/007763
Other languages
French (fr)
Korean (ko)
Other versions
WO2010077014A2 (en
Inventor
구본혁
옥태준
박정원
오영택
크라브주그드미트리
김만종
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lotte Fine Chemical Co Ltd
Original Assignee
Samsung Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Fine Chemicals Co Ltd filed Critical Samsung Fine Chemicals Co Ltd
Priority to JP2011543429A priority Critical patent/JP2012514066A/en
Priority to CN2009801532722A priority patent/CN102272200B/en
Publication of WO2010077014A2 publication Critical patent/WO2010077014A2/en
Publication of WO2010077014A3 publication Critical patent/WO2010077014A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyamides (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed are an aromatic polyester amide copolymer, a high molecular film, a prepreg, a prepreg laminate, a metal foil laminate, and a printed circuit board. The disclosed aromatic polyester amide copolymer comprises 20 to 25 mol % of an aromatic diol-derived recurrent unit (A) relative to the total recurrent unit, wherein said aromatic diol-derived recurrent unit (A) contains both a resorcinol-derived recurrent unit (RCN) and a recurrent unit (HQ) derived from at least one compound of biphenol and hydroquinone.
PCT/KR2009/007763 2008-12-31 2009-12-24 Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board Ceased WO2010077014A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011543429A JP2012514066A (en) 2008-12-31 2009-12-24 Aromatic polyesteramide copolymer, polymer film, prepreg, prepreg laminate, metal foil laminate and printed wiring board
CN2009801532722A CN102272200B (en) 2008-12-31 2009-12-24 Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0138702 2008-12-31
KR1020080138702A KR101595121B1 (en) 2008-12-31 2008-12-31 An aromatic polyester amide copolymer, a prepreg and a prepreg laminate employing the aromatic polyester amide copolymer, and a metal-clad laminate employing the prepreg or prepreg laminate,

Publications (2)

Publication Number Publication Date
WO2010077014A2 WO2010077014A2 (en) 2010-07-08
WO2010077014A3 true WO2010077014A3 (en) 2010-09-16

Family

ID=42310339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007763 Ceased WO2010077014A2 (en) 2008-12-31 2009-12-24 Aromatic polyester amide copolymer, high molecular film, prepreg, prepreg laminate, metal foil laminate, and printed circuit board

Country Status (5)

Country Link
JP (1) JP2012514066A (en)
KR (1) KR101595121B1 (en)
CN (1) CN102272200B (en)
TW (1) TW201035168A (en)
WO (1) WO2010077014A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101798237B1 (en) * 2011-05-06 2017-11-15 심천 워트 어드밴스드 머티리얼즈 주식회사 Wholly aromatic polyester amide copolymer resin, polymer film having the copolymer resin, flexible metal clad laminate having the polymer film, and flexible printed circuit board having the metal clad laminate
CN108026268B (en) * 2015-09-09 2020-12-25 住友化学株式会社 Aromatic polyester, aromatic polyester liquid composition, method for producing aromatic polyester film, and aromatic polyester film
CN106633044A (en) * 2016-11-30 2017-05-10 彭州市运达知识产权服务有限公司 Liquid crystal polyarylester and preparation method thereof
KR102049024B1 (en) 2017-03-22 2019-11-26 주식회사 엘지화학 Resin composition for semiconductor package, prepreg and metal clad laminate using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920003419B1 (en) * 1986-10-17 1992-04-30 폴리플라스틱스 가부시끼가이샤 Polyester resin composition
JPH07126916A (en) * 1993-09-03 1995-05-16 Polymer Processing Res Inst Production of thermotropic liquid crystal polymer filament
US20040061105A1 (en) * 2002-09-30 2004-04-01 St. Lawrence Michael R. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP2008291168A (en) * 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd Method for producing liquid crystal polymer film and printed wiring board substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132884A (en) * 2000-01-14 2000-10-17 Ticona Llc Process for producing amorphous anisotrophic melt-forming polymers having a high degree of stretchability and polymers produced by same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920003419B1 (en) * 1986-10-17 1992-04-30 폴리플라스틱스 가부시끼가이샤 Polyester resin composition
JPH07126916A (en) * 1993-09-03 1995-05-16 Polymer Processing Res Inst Production of thermotropic liquid crystal polymer filament
US20040061105A1 (en) * 2002-09-30 2004-04-01 St. Lawrence Michael R. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP2008291168A (en) * 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd Method for producing liquid crystal polymer film and printed wiring board substrate

Also Published As

Publication number Publication date
CN102272200B (en) 2013-11-27
TW201035168A (en) 2010-10-01
WO2010077014A2 (en) 2010-07-08
JP2012514066A (en) 2012-06-21
KR101595121B1 (en) 2016-02-17
CN102272200A (en) 2011-12-07
KR20100080081A (en) 2010-07-08

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