WO2010077014A3 - Copolymère amide polyester aromatique, film à poids moléculaire élevé, préimprégné, stratifié préimprégné, stratifié en feuille métallique, et carte de circuits imprimés - Google Patents
Copolymère amide polyester aromatique, film à poids moléculaire élevé, préimprégné, stratifié préimprégné, stratifié en feuille métallique, et carte de circuits imprimés Download PDFInfo
- Publication number
- WO2010077014A3 WO2010077014A3 PCT/KR2009/007763 KR2009007763W WO2010077014A3 WO 2010077014 A3 WO2010077014 A3 WO 2010077014A3 KR 2009007763 W KR2009007763 W KR 2009007763W WO 2010077014 A3 WO2010077014 A3 WO 2010077014A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- prepreg
- laminate
- aromatic polyester
- polyester amide
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyamides (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011543429A JP2012514066A (ja) | 2008-12-31 | 2009-12-24 | 芳香族ポリエステルアミド共重合体、高分子フィルム、プリプレグ、プリプレグ積層体、金属箔積層板及びプリント配線板 |
| CN2009801532722A CN102272200B (zh) | 2008-12-31 | 2009-12-24 | 芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2008-0138702 | 2008-12-31 | ||
| KR1020080138702A KR101595121B1 (ko) | 2008-12-31 | 2008-12-31 | 방향족 폴리에스테르 아미드 공중합체, 상기 방향족 폴리에스테르 아미드 공중합체를 채용한 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2010077014A2 WO2010077014A2 (fr) | 2010-07-08 |
| WO2010077014A3 true WO2010077014A3 (fr) | 2010-09-16 |
Family
ID=42310339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2009/007763 Ceased WO2010077014A2 (fr) | 2008-12-31 | 2009-12-24 | Copolymère amide polyester aromatique, film à poids moléculaire élevé, préimprégné, stratifié préimprégné, stratifié en feuille métallique, et carte de circuits imprimés |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2012514066A (fr) |
| KR (1) | KR101595121B1 (fr) |
| CN (1) | CN102272200B (fr) |
| TW (1) | TW201035168A (fr) |
| WO (1) | WO2010077014A2 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101798237B1 (ko) * | 2011-05-06 | 2017-11-15 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판 |
| CN108026268B (zh) * | 2015-09-09 | 2020-12-25 | 住友化学株式会社 | 芳香族聚酯、芳香族聚酯液状组合物、芳香族聚酯膜的制造方法及芳香族聚酯膜 |
| CN106633044A (zh) * | 2016-11-30 | 2017-05-10 | 彭州市运达知识产权服务有限公司 | 一种液晶聚芳酯及其制备方法 |
| KR102049024B1 (ko) | 2017-03-22 | 2019-11-26 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR920003419B1 (ko) * | 1986-10-17 | 1992-04-30 | 폴리플라스틱스 가부시끼가이샤 | 폴리에스테르 수지조성물 |
| JPH07126916A (ja) * | 1993-09-03 | 1995-05-16 | Polymer Processing Res Inst | サーモトロピック液晶ポリマーフィラメントの製法 |
| US20040061105A1 (en) * | 2002-09-30 | 2004-04-01 | St. Lawrence Michael R. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| JP2008291168A (ja) * | 2007-05-28 | 2008-12-04 | Sumitomo Chemical Co Ltd | 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6132884A (en) * | 2000-01-14 | 2000-10-17 | Ticona Llc | Process for producing amorphous anisotrophic melt-forming polymers having a high degree of stretchability and polymers produced by same |
-
2008
- 2008-12-31 KR KR1020080138702A patent/KR101595121B1/ko active Active
-
2009
- 2009-12-24 JP JP2011543429A patent/JP2012514066A/ja active Pending
- 2009-12-24 CN CN2009801532722A patent/CN102272200B/zh active Active
- 2009-12-24 WO PCT/KR2009/007763 patent/WO2010077014A2/fr not_active Ceased
- 2009-12-30 TW TW98145785A patent/TW201035168A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR920003419B1 (ko) * | 1986-10-17 | 1992-04-30 | 폴리플라스틱스 가부시끼가이샤 | 폴리에스테르 수지조성물 |
| JPH07126916A (ja) * | 1993-09-03 | 1995-05-16 | Polymer Processing Res Inst | サーモトロピック液晶ポリマーフィラメントの製法 |
| US20040061105A1 (en) * | 2002-09-30 | 2004-04-01 | St. Lawrence Michael R. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
| JP2008291168A (ja) * | 2007-05-28 | 2008-12-04 | Sumitomo Chemical Co Ltd | 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102272200B (zh) | 2013-11-27 |
| TW201035168A (en) | 2010-10-01 |
| WO2010077014A2 (fr) | 2010-07-08 |
| JP2012514066A (ja) | 2012-06-21 |
| KR101595121B1 (ko) | 2016-02-17 |
| CN102272200A (zh) | 2011-12-07 |
| KR20100080081A (ko) | 2010-07-08 |
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