WO2010143379A1 - Procédé de production d'une structure de montage de composant électronique et structure de montage de composant électronique - Google Patents

Procédé de production d'une structure de montage de composant électronique et structure de montage de composant électronique Download PDF

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Publication number
WO2010143379A1
WO2010143379A1 PCT/JP2010/003707 JP2010003707W WO2010143379A1 WO 2010143379 A1 WO2010143379 A1 WO 2010143379A1 JP 2010003707 W JP2010003707 W JP 2010003707W WO 2010143379 A1 WO2010143379 A1 WO 2010143379A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
circuit board
mounting structure
curable resin
foaming agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/003707
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English (en)
Japanese (ja)
Inventor
小和田弘枝
山口敦史
松野行壮
辻村英之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2011518276A priority Critical patent/JP5523454B2/ja
Priority to CN201080025456.3A priority patent/CN102460667B/zh
Publication of WO2010143379A1 publication Critical patent/WO2010143379A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to an electronic component mounting structure manufacturing method and an electronic component mounting structure. Specifically, the present invention relates to a method for manufacturing an electronic component mounting structure capable of controlling the thickness of a cured resin that protects an electronic component mounted on a circuit board surface.
  • a resin is formed in the gap formed between the circuit board surface and the electronic component.
  • An underfill method for filling a cured product is also known.
  • Patent Document 1 discloses a sealing resin composition containing a curable resin and a foaming agent.
  • the encapsulating resin composition disclosed in Patent Document 1 is an underfill resin composition that allows an electronic component mounted on a circuit board surface to be easily removed and repaired (repaired).
  • the sealing resin composition is underfilled and cured at the solder joint between the circuit board and the electronic component flip-chip connected to the surface thereof.
  • a foaming agent is foamed by heating to the temperature at which the foaming agent in resin cured material foams. The strength of the cured resin is reduced by foaming of the foaming agent, and the mounted electronic component can be easily removed by melting the solder.
  • an electronic component mounted on a circuit board accommodated in a portable electronic device may be disconnected or damaged by an impact or the like.
  • a protective coating made of a cured resin is formed for the purpose of reinforcement on parts that are relatively susceptible to damage such as joints between the circuit board surface and electronic components. The method of doing is also known.
  • an electronic component mounting structure 50 obtained by mounting an electronic component 52 including an IC (Integrated Circuit) package 60 and lead terminals 61 on a circuit board 13 as shown in FIG. 3 will be described.
  • the electronic component 52 is inserted into the through hole H1 formed in the circuit board 13 from the front surface of the circuit board 13 and then soldered to the circuit (not shown) formed on the back surface of the circuit board 13 using the solder 55. It is implemented by attaching. And the resin cured material 53 which is a protective film is formed in the surface of the solder
  • a cured resin 53 having a uniform thickness and an appropriately thick thickness can be formed due to the influence of the interfacial tension or the like.
  • the film thickness of the cured resin 53 in such a region tends to be thin.
  • the insulation characteristics and the like due to the cured resin 53 are reduced in the thin portion of the cured resin 53.
  • current may leak from the thin portion. Such current leakage is particularly likely to occur in a high temperature and high humidity environment.
  • the present invention relates to an electronic component mounting structure capable of easily controlling the thickness of a protective coating when an electronic component mounted on a circuit board surface is coated with a curable resin composition containing a foaming agent. It aims at providing the manufacturing method of.
  • One aspect of the present invention is to mount an electronic component on a circuit board by soldering a terminal connected to the electronic component to an electrode formed on the surface of the circuit board, and a circuit formed by soldering.
  • An electronic component mounting structure manufacturing method comprising: a curing step of forming a resin cured product by curing at a temperature; and a foaming step of foaming a foaming agent by heating at least a part of the resin cured product.
  • Another aspect of the present invention is an electronic component mounting structure including a circuit board and at least one electronic component mounted by soldering on an electrode formed on the surface of the circuit board.
  • the portion is covered with a resin cured product, and the resin cured product is a cured product of a curable resin composition containing a foaming agent and a curable resin, and at least a part of the foaming agent of the resin cured product is foamed.
  • Another aspect of the present invention is an electronic component mounting structure including a circuit board and at least one electronic component mounted on the first surface of the circuit board.
  • the electronic component includes an electronic component body and an electronic component.
  • the resin cured product is a cured product of a curable resin composition containing a foaming agent and a curable resin, and at least a part of the foaming agent of the resin cured product is foamed. It is.
  • the present invention it is possible to easily control the film thickness of the cured resin that covers the joint portion of the electronic component mounted on the circuit board.
  • the liquid curable resin composition is a curable resin composition that is liquid at room temperature and contains a curable resin and a foaming agent.
  • the curable resin composition which is liquid at normal temperature is a composition containing a foaming agent as a main component of a solvent-free liquid resin or a resin varnish obtained by dissolving a solid resin at normal temperature in a solvent. It is.
  • Specific examples of the curable resin include a thermosetting resin, a photocurable resin, and an electron beam curable resin.
  • a curable resin As such a curable resin, a conventionally known curable resin is used, and specifically, formed from a resin component such as a silicone resin, polyurethane, acrylic resin, polyolefin, epoxy resin, or the like. .
  • a thermosetting silicone resin, a thermosetting polyolefin, and the like are particularly preferable from the viewpoint that the foaming state can be easily controlled in the foaming process described later.
  • thermosetting resin a resin that can be cured at a temperature lower than the gas generation temperature of the foaming agent, which will be described later, is preferable because it can suppress foaming during thermosetting.
  • a resin that can be cured at a temperature that is 10 ° C. or more lower than the gas generation temperature of the foaming agent, and further 20 ° C. or more is preferable.
  • it is preferably a low temperature curable thermosetting resin that is cured at a low temperature such as room temperature to 100 ° C., and further room temperature to 80 ° C. In such a case, the thermosetting resin can be cured while being suppressed from foaming by heating to a curing temperature lower than the gas generation temperature of the foaming agent.
  • the thermosetting resin to be used has elasticity even after curing.
  • the glass transition point (Tg) of the cured resin is lower than the foaming temperature.
  • the cured resin preferably has a Tg of 100 ° C. or lower.
  • an organic decomposable foaming agent capable of generating gas by heating to a predetermined temperature and foaming the resin cured product.
  • a foaming agent include, for example, azodicarbonamide (gas generation temperature: about 208 ° C., the same applies hereinafter), N, N′-dinitrosopentamethylenetetramine (about 205 ° C.), 4,4′- Oxybis (benzenesulfonylhydrazide) (about 159 ° C.), sodium bicarbonate (about 150 ° C.), barium azodicarboxylate (about 245 ° C.), acetone-paratoluenesulfonyl hydrazone (about 135 ° C.), paratoluenesulfonyl semicarbazide (about 220 ° C.) ° C), and mixtures thereof.
  • the gas generation temperature of the foaming agent can be measured using, for example, a differential scanning calorimeter (DSC). Specifically, a predetermined amount of foaming agent is weighed as a sample, and the thermal behavior of the foaming agent when the weighed foaming agent is heated at a predetermined temperature increase rate is measured by DSC. Usually, an endothermic peak is observed in the curve indicating the relationship between the endothermic amount and the temperature. Here, the temperature at which the endothermic amount is maximum is the gas generation temperature.
  • DSC differential scanning calorimeter
  • Such an organic decomposable foaming agent generates foaming gas, specifically, for example, nitrogen gas (N 2 ), carbon dioxide gas (CO 2 ), etc. by decomposing at a predetermined temperature.
  • the gas generation temperature is not particularly limited, but is preferably a temperature that does not exceed the melting point of the solder used for mounting the electronic component, and specifically, for example, 110 to 210 ° C., more preferably 120 to 180 ° C. It is preferable that it is the range of these.
  • the content of the foaming agent in the liquid curable resin composition is 0.05 to 45% by mass, more preferably 1 to 40% by mass, particularly 5%, based on the total amount of the liquid thermosetting resin and the foaming agent. It is preferably ⁇ 25 mass.
  • the content ratio of the foaming agent in the liquid curable resin composition is too high, the content ratio of the curable resin is relatively decreased, and thus the properties such as adhesion of the obtained resin cured product tend to be decreased. There is.
  • the content of the foaming agent in the liquid curable resin composition is too low, the resin cured product tends not to be sufficiently thick due to foaming.
  • the liquid curable resin composition may contain an additive as necessary.
  • additives include, for example, curing catalysts, foam stabilizers, emulsifiers, flame retardants (phosphorus compounds, halogen compounds, etc.), antioxidants, anti-aging agents, ultraviolet absorbers, plasticizers, fillers (talc) Clay, calcium carbonate, silica powder, alumina, carbon black, titanium oxide, iron oxide, etc.), dyes, pigments and the like. You may use an additive individually by 1 type or in combination of 2 or more types.
  • the liquid curable resin composition can be prepared by uniformly mixing a liquid curable resin and a foaming agent and defoaming.
  • the liquid curable resin composition may contain a diluent in order to adjust its viscosity.
  • a diluent is used, the content of the diluent is preferably 40 to 90% by mass, more preferably 50 to 80% by mass, from the viewpoints of handleability, coating properties, leveling properties, and the like.
  • the solution viscosity of the liquid curable resin composition is preferably 1000 to 100 mPa ⁇ sec, more preferably 400 to 200 mPa ⁇ sec.
  • the overcoat material and the underfill material can be applied in a single process.
  • the material can be applied simultaneously.
  • the solution viscosity is a value measured by a method based on the drop time of the viscosity cup.
  • the manufacturing method of the electronic component mounting structure according to the present embodiment includes a mounting step of mounting the electronic component on the circuit board by soldering a terminal connected to the electronic component to an electrode formed on the surface of the circuit board.
  • the mounting process for mounting electronic components on the surface of the circuit board includes electronic components 2a, 1a, 1b, 1c at predetermined positions on the surface of the circuit board 3, which are mounting areas. This is a process of mounting by soldering and joining the terminals 2b and 2c.
  • the electronic component 2a is an IC package, and the electrode 7 formed on the surface thereof is connected to the electrode 1a formed on the surface of the circuit board by wire bonding with a wire W.
  • the electronic component 2b is an IC package, and an unillustrated electrode formed on the back surface is connected to the electrode 1b formed on the surface of the circuit board by flip-chip mounting with solder bumps s1.
  • the electronic component 2c is a connector, and a plurality of lead terminals L for mounting through holes are inserted into through holes H2 formed on the circuit board, and each lead terminal L is soldered to the electrode 1c formed on the back surface thereof. They are connected by mounting through holes.
  • circuit boards include various printed boards including rigid boards and flexible boards.
  • a rigid substrate uses a known circuit forming method such as a photoresist method on the surface of a substrate obtained by laminating a plurality of prepregs impregnated with a curable resin such as an epoxy resin on a fiber base material and heating and pressing.
  • a printed wiring board on which a circuit made of copper foil or the like is formed.
  • the flexible substrate is formed by forming a circuit on the surface of a heat-resistant resin film such as a polyimide film.
  • Specific examples of electronic components that can be used in the method for manufacturing an electronic component mounting structure according to this embodiment include various IC packages, various resistors, various light emitting diodes, various capacitors, various connectors, and the like.
  • the number of electronic components mounted on the circuit board surface may be one or more. Usually, a plurality of packages are mounted depending on the application.
  • the method for mounting electronic components on the circuit board surface is not particularly limited, and a known surface mounting method or through-hole mounting method can be used. Specific examples include the following. Examples thereof include wire bonding connection in which a plurality of electrodes 7 formed on the surface of the electronic component 2a and an electrode 1a formed on the surface of the circuit board 3 are connected by thin wires such as gold wires. Also, a plurality of protruding solder bumps s1 formed on electrodes (not shown) formed on the surface of the electronic component 2b are placed on the electrodes 1b formed on the surface of the circuit board 3 so as to correspond to the solder bumps s1, The flip chip mounting which joins by passing through a reflow furnace is mentioned.
  • the lead terminals L of the electronic component 2c having a plurality of lead terminals L for mounting through holes are inserted into the through holes H2 formed on the circuit board, and each lead terminal L is soldered to the electrode 1c formed on the back surface thereof. Through-hole mounting to be attached.
  • the coating process is performed to form a resin joint that protects the solder joint formed by soldering the circuit board 3 and the electronic components 2a, 2b, and 2c. It is the process of apply
  • the liquid curable resin composition 4 is cured.
  • a cured resin for protecting the electronic components 2a, 2b, 2c from the external environment can be formed at the same time.
  • the flip-chip-mounted electronic component 2b is further filled with the liquid curable resin composition 4 in the gap v between the electronic component 2b and the circuit board 3 in this step, so that an underfill material for flip-chip connection is used. Is also supplied. Thereby, the overcoat material and the underfill material are simultaneously applied to the electronic component 2b in one process.
  • the application method of the liquid curable resin composition is not particularly limited, and specific examples include an application method using a dispenser (discharge device).
  • the liquid curable resin composition 4 is applied to the solder joint portion on the back surface of the circuit board 3 to thereby prevent the through hole.
  • a film made of a cured resin can also be formed at the joint between the electronic component 2c and the electrode 1c by mounting.
  • the coating amount of the liquid curable resin composition is not particularly limited. Specifically, for example, it is preferably 10 to 80 ⁇ m, more preferably 20 to 50 ⁇ m. When applied to such a thickness, in the foaming process after curing, the flat part is 20 to 160 ⁇ m, further 40 to 100 ⁇ m, the edge part of the electronic component or the tip part of the lead terminal is 10 to 40 ⁇ m, and A film of a cured resin film having a thickness as large as 20 to 30 ⁇ m can be obtained.
  • each of the solder joints of the electronic components 2a, 2b, 2c mounted on the surface of the circuit board 3, the outer surfaces of the electronic components 2a, 2b, 2c, and the surface of the circuit board 3 is provided.
  • the cured resin 5 is formed by curing the liquid curable resin composition 4 covering the periphery of the electronic component mounting region at a temperature at which the foaming agent does not foam.
  • the curing is performed at a temperature not higher than the gas generation temperature at which the foaming agent does not foam. Moreover, when the liquid curable resin composition 4 contains a photocurable resin, a sufficient amount of light for photocuring is irradiated. Furthermore, when the liquid curable resin composition 4 contains an electron beam curable resin, an electron beam sufficient for electron beam curing is irradiated. By such a method, the applied liquid curable resin composition 4 is cured, and a cured resin product 5 is formed.
  • the region of the resin cured product 5 formed in the curing step is heated by heating the region surrounded by the broken line B, which is the portion where the film thickness is desired to be increased.
  • the foaming agent contained in the product 5 foams to form pores 6, and the cured resin product 5 forms a foamed structure.
  • the electronic component mounting structure 10 is formed.
  • the film thickness of the cured resin 5 is increased by the pressure of the gas when forming the pores 6. In this way, when only the portion of the resin cured product 5 to be thickened is selectively heated, a thick coating such as a portion to be reinforced, specifically, a corner portion of an electronic component or a tip portion of a lead terminal.
  • a thick protective film can be easily formed even on a portion where it is difficult to form. This allows thicker film to be applied in a single step without applying thickening by coating in a separate process on the part that you want to reinforce, or where you want to form a thick-film protective coating such as the tip of a lead terminal.
  • the part can be formed.
  • the effect of the manufacturing method of this embodiment will be described more specifically. 2
  • the electronic component mounting structure 20 obtained by mounting the electronic component 52 including the IC package 60 and the lead terminal 61 on the circuit board 13 as shown in FIG. 2 is taken as an example. This will be described in detail in comparison with the component mounting structure 50.
  • the thickness of the cured resin 12 that is a protective coating is greater than the thickness of the cured resin 53 that is the protective coating of the conventional electronic component mounting structure 50 shown in FIG. 3. It is the same except that.
  • the thickness of the cured resin 12 formed in the region of the tip portion of the lead terminal 61 and the edge portion of the electronic component 52 is increased by foaming the cured resin 12. .
  • the thickness of the region that tends to preferentially become thin due to the influence of the interfacial tension of the liquid curable resin composition after application is increased.
  • the film thickness of the resin cured product 12 can be controlled by heating the portion where the film thickness is desired to be increased after curing.
  • a heater having a relatively small heating element is brought close to the upper portion of the predetermined portion to directly heat the predetermined portion, or air heated by the heater is sprayed onto the predetermined portion.
  • the method of heating is used.
  • the heating temperature in the foaming step is equal to or higher than the gas generation temperature of the foaming agent and does not exceed the melting point of the solder used for joining the electronic component and the circuit board. Specifically, for example, it is preferably in the range of 110 to 210 ° C., more preferably 120 to 180 ° C.
  • the heating time is appropriately adjusted depending on the target foaming ratio, and is preferably in the range of, for example, 1 to 10 minutes, and more preferably 3 to 7 minutes. Note that the foaming state can be controlled by changing the heating temperature and the heating time. And the higher the expansion ratio, the thicker the resin cured product.
  • the resin cured product after foaming is 20 to 100 ⁇ m at the flat part, and further 20 to 95 ⁇ m at the flat part, depending on the film thickness of the resin cured product before foaming. Is preferably 20 to 40 ⁇ m, more preferably 20 to 35 ⁇ m.
  • the change in the apparent volume before and after the foaming process of the resin cured product of the foamed part is that the apparent volume after the foaming process is about 2 to 8 times, further about 3 to 5 times the apparent volume before the foaming process. preferable.
  • the circuit board on which the cured resin is formed may be placed in a heating furnace or the like set at a predetermined temperature for a predetermined time. In such a case, the film thickness of the entire formed resin cured product is increased by the foaming process.
  • thermosetting resin a solvent-free liquid silicone resin (trade name: SE-9187L manufactured by Toray Dow Corning Co., Ltd., hereinafter also referred to as Resin A), or a diluent (dedicated thinner 904 ( Solid polyolefin (trade name: Humiseal 1B51NS manufactured by Chase Inc., hereinafter also referred to as resin B) dissolved in (trade name)) was used.
  • the blending ratio of the solid polyolefin and the diluent was 1: 1 (weight ratio).
  • a solution of resin A or resin B and a foaming agent (4,4′-oxybis (benzenesulfonylhydrazide; gas generation temperature of about 170 ° C.)) are mixed at a ratio shown in Table 1 and subjected to defoaming treatment.
  • a liquid curable resin composition was prepared, and the content ratio of the foaming agent in Table 1 is the weight ratio of the foaming agent to the total amount of the curable resin (in terms of solid content) and the foaming agent.
  • An IC package having a length of 10 mm, a width of 10 mm, and a height of 5 mm provided with a metal lead terminal portion was mounted on an FR-4 type circuit board using a mounter, and mounted using a reflow furnace having a maximum temperature of 240 ° C. Note that solder of Sn-3Ag-0.5Cu (melting point: 217-219 ° C.) was used for bonding.
  • a liquid curable resin composition was applied using a dispenser around the outer surface of the IC package, the joint, and the area where the IC package was mounted on the surface of the circuit board so as to embed the IC package mounted on the circuit board.
  • resin A was used as the curable resin
  • cured material was formed by heating the circuit board with which the liquid curable resin composition was apply
  • the foaming agent in the cured resin was foamed by heating the circuit board on which the cured resin was formed in a heating furnace set at 170 ° C. for 5 minutes. In this manner, the electronic component mounting structures A to H in which the IC package was mounted on the main surface of the circuit board and the IC package was covered with the foamed cured product were obtained.
  • the obtained electronic component mounting structures A to H were evaluated by the following methods. [Change in film thickness] In manufacturing the electronic component mounting structures A to H, the film thickness before and after the foaming process was measured. The film thickness of the cured product was measured at two locations, a flat portion of the circuit board and an edge portion of the IC package.
  • a cross-cut tape peeling test was performed on the cured products formed on the electronic component mounting structures A to H. Specifically, a film made of a resin cured product on a flat portion of a circuit board was cut out on a grid having 100 grids of 1 mm ⁇ 1 mm square using a cutter knife and a cutter guide. Then, after the cellophane tape was strongly pressure-bonded to the area cut out in the grid of the coating, the number of peeling of the grid when the tape edge was rapidly peeled off at an angle of 45 ° was counted.
  • the foaming agent is foamed to form a film before the foaming step.
  • the film thickness after the foaming process increased more than the thickness.
  • the film thickness of the cured product at the edge portion is 20 ⁇ m or more by foaming the foaming agent in the cured product. It was a thick one. Therefore, the insulating property of the edge portion was particularly excellent.
  • the film thickness of the edge portion did not increase.
  • Example 7 and Example 8 using the liquid resin composition whose foaming agent content rate is 50 mass% since the increase rate of the film thickness of an edge part is high, the insulation of the edge part was excellent. However, since the content of the foaming agent was too high, the adhesion was slightly lowered.
  • the thickness can be easily controlled in the case of forming a protective film that protects the joint between the circuit board and the electronic component.
  • a protective film having a high protective property can be formed by an easy process. Therefore, it is useful for protecting an electronic component mounting structure obtained by mounting electronic components such as an IC package, a resistor, a light emitting diode, a capacitor, and a connector on the circuit board.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

La présente invention a trait à un procédé de production d'une structure de montage de composant électronique pourvu d'une étape de montage consistant à monter un composant électronique sur une carte de circuit imprimé en soudant les bornes connectées au composant électronique aux électrodes formées sur une surface de la carte de circuit imprimé, d'une étape de revêtement consistant à appliquer un revêtement de composition de résine durcissable à l'état liquide de manière à recouvrir la partie soudée sur la surface de la carte de circuit imprimé formée par brasage, laquelle composition de résine durcissable à l'état liquide inclut une résine durcissable et un agent moussant, d'une étape de durcissement consistant à former une résine durcie en durcissant la composition de résine durcissable à l'état liquide à une température inférieure à la température à laquelle l'agent moussant mousse, et d'une étape de moussage qui permet à un agent moussant de mousser en chauffant au moins une partie de la résine durcie.
PCT/JP2010/003707 2009-06-08 2010-06-03 Procédé de production d'une structure de montage de composant électronique et structure de montage de composant électronique Ceased WO2010143379A1 (fr)

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JP2013039653A (ja) * 2011-08-19 2013-02-28 Hitachi Koki Co Ltd 電動工具及び電動工具の製造方法
JP2014127647A (ja) * 2012-12-27 2014-07-07 Mitsubishi Electric Corp 電力変換装置及び冷蔵庫
KR101461041B1 (ko) * 2012-11-30 2014-11-13 유니콘 주식회사 방열효율을 높인 엘이디 전원공급장치
KR20150057886A (ko) * 2013-11-20 2015-05-28 삼성에스디아이 주식회사 전자 소자 보호용 통합 실리콘, 이를 이용한 회로 모듈 및 이의 제조 방법

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CN103390693B (zh) * 2013-07-29 2016-04-27 宁晋阳光新能源有限公司 太阳能电池切片用主辊的重复利用方法
CN110799321B (zh) * 2017-06-26 2022-06-17 麦克赛尔株式会社 电路部件的制造方法和电路部件

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JP2013039653A (ja) * 2011-08-19 2013-02-28 Hitachi Koki Co Ltd 電動工具及び電動工具の製造方法
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KR101461041B1 (ko) * 2012-11-30 2014-11-13 유니콘 주식회사 방열효율을 높인 엘이디 전원공급장치
JP2014127647A (ja) * 2012-12-27 2014-07-07 Mitsubishi Electric Corp 電力変換装置及び冷蔵庫
KR20150057886A (ko) * 2013-11-20 2015-05-28 삼성에스디아이 주식회사 전자 소자 보호용 통합 실리콘, 이를 이용한 회로 모듈 및 이의 제조 방법
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