WO2016117719A1 - Film de protection contre les ondes électromagnétiques et son procédé de fabrication - Google Patents

Film de protection contre les ondes électromagnétiques et son procédé de fabrication Download PDF

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Publication number
WO2016117719A1
WO2016117719A1 PCT/KR2015/000589 KR2015000589W WO2016117719A1 WO 2016117719 A1 WO2016117719 A1 WO 2016117719A1 KR 2015000589 W KR2015000589 W KR 2015000589W WO 2016117719 A1 WO2016117719 A1 WO 2016117719A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic wave
insulating layer
conductive
shielding film
wave shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/000589
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English (en)
Inventor
Yoon Hyun Kim
Seung Jin Yang
Kyu Jae Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANG SUNG Co Ltd
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CHANG SUNG Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANG SUNG Co Ltd filed Critical CHANG SUNG Co Ltd
Priority to PCT/KR2015/000589 priority Critical patent/WO2016117719A1/fr
Priority to KR1020157004462A priority patent/KR101690166B1/ko
Publication of WO2016117719A1 publication Critical patent/WO2016117719A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes

Definitions

  • the present invention relates to an electromagnetic wave shielding film and a manufacturing method thereof, and more particularly, to an electromagnetic wave shielding film and a manufacturing method of the electromagnetic wave shielding film having shielding efficiency equivalent to that of the existing product and reduced in manufacturing cost.
  • PCB printed circuit board
  • a thin metal film having an excellent conductivity is attached to the printed circuit board or a conductive paste is coated on the printed circuit board.
  • a conductive adhesive film-type product in which the conductive paste is made in a film form and heated and attached to the printed circuit board has been applied.
  • a reinforcement-shielding film including a conductive adhesive layer and, if necessary, a shielding layer formed of a thin metal film layer on one surface of a cover film and an adhesive layer and a releasable reinforcement film laminated in sequence on the other surface (refer to Patent Literature 1).
  • Patent Literature 2 a shielding film including a shielding layer having a conductive adhesive layer and/or a thin metal film and a base film formed of an aromatic polyimide resin
  • Patent Literature 3 a shielding adhesive film in which a cover film is formed by coating a resin on one surface of a separate film and a shielding layer including a thin metal film layer and an adhesive layer is provided on a surface of the cover film.
  • an electromagnetic wave shielding film developed recently uses silver-coated copper having a high thermal conductivity to increase the shielding efficiency, but has a drawback in that expensive silver is used, resulting in an increase in shielding film manufacturing cost.
  • the present invention provides an electromagnetic wave shielding film and a manufacturing method of the electromagnetic wave shielding film having shielding efficiency equivalent to that of the existing shielding film using silver-coated copper.
  • the present invention provides an electromagnetic wave shielding film and a manufacturing method of the electromagnetic wave shielding film having shielding efficiency equivalent to that of the existing product and reduced in manufacturing cost.
  • the binder resin of the insulating layer may further include a polyurethane resin.
  • the polyurethane resin may be added in an amount of 5 to 15 wt% with respect to 100 wt% of the insulating layer.
  • the curing agent of the conductive shielding layer may further include a urea resin as a curing accelerator.
  • the curing accelerator may be added in an amount of 1.5 to 2.5 wt% with respect to 100 wt% of the conductive shielding layer.
  • a releasable protective film laminated on a lower surface of the conductive layer, an upper surface of the insulating layer, or the lower surface of the conductive layer and the upper surface of the insulating layer may be further included.
  • a manufacturing method of an electromagnetic wave shielding film includes: a step of forming an insulating layer in a semi-cured state by mixing and dispersing one or more resins selected from an epoxy resin and a polyurethane resin, a curing agent, a filler, and a solvent; and a step of forming a conductive shielding layer by mixing and dispersing an epoxy resin and copper as a conductive filler and including a curing agent and a solvent, which do not react with the copper, as a step of coating and heat-treating the conductive shielding layer on the insulating layer.
  • the insulating layer may be formed by including 7 to 18 wt% of a binder resin containing an epoxy resin, 4.5 to 8.5 wt% of a filler, 7 to 12 wt% of a curing agent, 65 to 70 wt% of a solvent, and other additives.
  • the conductive shielding layer may include 15 to 20 wt% of a binder resin which is the same as the binder resin of the insulating layer, 30 to 40 wt% of copper as a conductive filler, 1.5 to 2.5 wt% of a curing agent, and 35 to 45 wt% of a solvent.
  • a step of coating and heat-treating a composition of the insulating layer on a first protective film and a step of laminating a second protective film on a composition of the conductive shielding layer may be further included.
  • oxidation of copper can be minimized by using a solvent, a binder, and additives which do not react with the copper in a copper ink composition, and, thus, the shielding efficiency equivalent to that of the existing product using silver-coated copper can be achieved and the manufacturing cost can be remarkably reduced.
  • copper (Cu) is solely applied as a filler and unreactive solvent, binder resin and curing agent are applied in order to minimize ionization of the copper, and, thus, a resistance change ratio can be minimized without elution of copper ions.
  • Fig. 1 is a cross-sectional view showing a configuration of an electromagnetic wave shielding film according to an exemplary embodiment of the present invention.
  • Fig. 2 is a graph showing an electrical resistance according to an exemplary embodiment of the present invention.
  • Fig. 3 is a graph showing electromagnetic wave shielding efficiency according to Embodiment of the present invention and Comparative Examples.
  • Figure 1 shows a cross-sectional configuration of an electromagnetic wave shielding film according to an exemplary embodiment of the present invention.
  • an electromagnetic wave shielding film includes an insulating film 10 and a conductive shielding layer 20 laminated on one surface thereof.
  • the electromagnetic wave shielding film according to the present invention may have a three-layered structure in which the conductive shielding layer 20, the insulating film 10, and a first protective film 30 are laminated in sequence.
  • the electromagnetic wave shielding film may have a three-layered structure in which a second protective film 40, the conductive shielding layer 20, and the insulating film 10 are laminated in sequence.
  • the electromagnetic wave shielding film may have a four-layered structure in which the first protective film 30 is formed on the insulating film 10 and the second protective film 40 is formed under the conductive shielding layer 20.
  • Each protective film is a releasable film and can be separated and removed before and after the electromagnetic wave shielding film is attached to an electronic component.
  • the insulating layer may include a binder resin, a curing agent, a filler, and a solvent.
  • a method of forming the insulating layer will be described in detail with reference to a manufacturing method of the electromagnetic wave shielding film to be described below.
  • the binder resin is a reaction product obtained from a reaction between one or more resins selected from an epoxy resin (bisphenol A-type) and a polyurethane resin and an epoxy group-containing curing agent.
  • the epoxy resin has an excellent thermal resistance, which may cause improvement in lead-free solder reflow property.
  • a curing agent reactive thereto is also used.
  • the curing agent may be any one of isocyanate or polyamide or a combination thereof.
  • the curing agent may be added in an amount of 7 to 12 wt% based on 100 wt% of the insulating layer. If the amount of the curing agent is less than the set range, an unreacted resin exists when the binder resin is cured, and, thus, a dried shielding film may be tacky. If the amount of the curing agent is more than the set range, the curing agent remains as unreacted reactant when the binder resin is cured, and, thus, the strength of the insulating layer may be decreased.
  • the polyurethane resin can improve flexibility of the electromagnetic wave shielding film, and when applied to a multi-layer FPCB, the polyurethane resin has a high elasticity and thus can alleviate tearing of the insulating layer.
  • the amount of the binder resin is less than the set range, flexibility of the shielding film may be decreased and cracks may occur on a surface of the manufactured shielding film. If the amount of the binder resin is more than the set range, a dry thickness after printing may be increased and the shielding film may be tacky.
  • the filler may be contained in an amount of 4.5 to 8.5 wt% based on 100 wt% of the insulating layer.
  • the filler may be any one of carbon black and aluminum oxide (Al 2 O 3 ) or a combination thereof.
  • the carbon black and the aluminum oxide (Al 2 O 3 ) may be input in an amount identical with or similar to each other. If the amount of the filler is less than the set range, an insulating resistance required for the insulating layer may have a resistance value lower than 10 10 to 10 12 and thus cannot satisfy the function as an insulator. If the amount of the filler is more than the set range, a thickness of the insulating layer may increase during microgravure printing, and, thus, the whole thickness of the shielding film may be increased more than necessary.
  • Ethyl acetate may be applied as the solvent and may be added in an amount of 65 to 70 wt% based on 100 wt% of the insulating layer. If the amount of the solvent is less than the set range, viscosity may be increased, and, thus, it is difficult to match a thickness to a set thickness during printing. If the amount of the solvent is more than the set range, the amounts of the filler, the resin, and the curing agent are decreased, and, thus, a thickness after drying may be decreased and it becomes difficult to achieve a set thickness of the manufactured shielding film.
  • the conductive shielding layer includes a binder resin, a curing agent, a conductive filler, and a solvent.
  • a method of forming the conductive shielding layer will be described in detail with reference to the manufacturing method of the electromagnetic wave shielding film to be described below, similarly to the insulating layer.
  • the same resin as that of the insulating layer may be applied as the binder resin.
  • the binder resin for the insulating layer and the conductive shielding layer.
  • an epoxy resin is applied as the binder resin of the conductive shielding layer and contained in an amount of 15 to 20 wt% based on 100 wt% of the conductive shielding layer. If the amount of the binder resin is less than the set range, the amount of the resin may be decreased as compared with the copper filler, and, thus, binding of the copper filler cannot be achieved and a product may be scratched by a hand or other devices during handling. If the amount of the binder resin is more than the set range, the amount of the resin may be increased as compared with the copper filler, and, thus, a surface resistance may be increased and shielding efficiency may be decreased accordingly.
  • the amount of the conductive filler is 30 to 40 wt% based on 100 wt% of the shielding layer.
  • the conductive filler has excellent electrical conductivity and adhesion with respect to a substrate. That is, if the amount of the conductive filler is less than the set range, the manufactured shielding film may have an insufficient density, and, thus, a surface resistance may be increased and shielding efficiency may be decreased accordingly. If the amount of the conductive filler is more than the set range, the shielding film may have an increased density but viscosity may be increased, and, thus, a thickness may be increased during printing and product manufacturing cost may be increased.
  • copper may be applied solely, and one or more selected from dendrite, flake, and spherical metal particles may be used.
  • solvents having an ester group (-COOR) solvents having a hydroxyl group (-OH)
  • the solvents having an ester group (-COOR) may include ethyl acetate, butyl carbitol acetate, dibasic ester, methyl dimethoxyacetate, methyl isobutyrate, dimethyl methylmalonate, methyl trans-4-oxo-2-pentenoate, and ethylene glycol diacetate;
  • the solvents having a hydroxyl group (-OH) may include butyl carbitol, butyl cellosolve, and benzyl alcohol;
  • the solvents having an ester group (-COOR) and a hydroxyl group (-OH) may include texanol(ester-alcohol);
  • the solvent may be contained in amount of 40 to 50 wt% based on 100 wt% of the conductive shielding layer. If the amount of the solvent is less than the set range, viscosity may be increased, and, thus, it is difficult to match a thickness to a set thickness during printing. If the amount of the solvent is more than the set range, the amounts of the filler, the resin, and the curing agent are decreased, and, thus, a thickness after drying may be decreased and it becomes difficult to achieve a set thickness of the manufactured shielding film.
  • dicyandiamide which does not react with copper may be applied as the curing agent, and a curing accelerator formed of a urea resin may be further included.
  • the curing agent and the curing accelerator are individually added in an amount of 1.5 to 2.5 wt% based on 100 wt% of the conductive shielding layer. If the amount of the curing agent is less than the set range, an unreacted resin exists, and, thus, a dried shielding film may be tacky. If the amount of the curing agent is more than the set range, the curing agent remains as unreacted reactant when the resin is cured, and, thus, the strength may be decreased.
  • the first protective film and the second protective film prevent the electromagnetic wave shielding film from being contaminated with foreign substances from the external environment before being used by a user and protect a surface of the electromagnetic wave shielding film during a hot pressing process.
  • a substrate film which is formed of polyethylene, polypropylene, or polyethylene terephthalate and of which a surface is treated with a silicon-based, fluorine-based, or long-chain alkyl acrylate-based release agent may be used in order to make it easier to separate the first protective film and the second protective film from the electromagnetic wave shielding film.
  • the present invention in terms of adhesion between the interfaces and film modification caused by heat, it is desirable to use the same binder resin for the insulating layer and the conductive shielding layer.
  • a manufacturing method of the electromagnetic wave shielding film according to the present invention is as follows.
  • a first protective film having a release force of 200 gf/in is prepared.
  • an insulating layer coating solution is prepared by mixing and dissolving an insulating layer composition including one or more selected from one or more resins selected from an epoxy resin and a polyurethane resin, an epoxy group-containing curing agent, and a filler, and the insulating layer coating solution is coated and heat-treated on the first protective film so as to form an insulating layer.
  • the insulating layer coating solution may include one or more selected from a coloring and a curing catalyst.
  • the insulating layer coating solution is coated on the first protective film using a microgravure coater, and the heat treatment of the insulating layer coating solution is carried out at 100 to 180°C. During the heat treatment , the insulating layer composition is cured. Herein, preferably, the insulating layer may be formed in a semi-cured state.
  • a conductive shielding layer composition including a binder resin formed of an epoxy resin, an epoxy group-containing curing agent, and a conductive filler is coated on the insulating layer using a slot die and then heat-treated thereon so as to form a conductive shielding layer.
  • the heat treatment of a coating solution for the conductive shielding layer is carried out at 100 to 180°C. During the heat treatment, the conductive shielding layer composition is cured.
  • the curing reaction in the insulating layer and the conductive shielding layer may include a semi-curing reaction of the reactants. If the semi-curing reaction is carried out during the heat treatment as such, an additional curing reaction is carried out in a subsequent process (for example, a laminating process, a pressing process such as hot pressing), and, thus, a fully cured reaction product may be obtained.
  • a solvent may be added.
  • ethyl acetate, toluene, methyl isobutyrate, dimethyl methylmalonate, dibasic ester, etc. may be used as the solvent.
  • the second protective film is laminated on one surface of the conductive shielding layer, and, thus, a shielding film is completely manufactured.
  • the insulating layer may be formed by coating the insulating layer composition on the first protective film
  • the conductive shielding layer may be formed by coating the conductive shielding layer composition on the second protective film, and the respective methods are not particularly limited. Then, the insulating layer and the conductive shielding layer are laminated, and the laminating process may be completed by arranging the insulating layer and the conductive shielding layer to face each other and pressing them at 60 to 120°C.
  • the second protective film is removed and the conductive shielding layer is temporarily bonded to be adjacent to the electronic component and then bonded through a pressing process such as hot pressing. Thereafter, the first protective film is removed.
  • the electromagnetic wave shielding film of the present invention manufactured by the above-described manufacturing method can be reliably applied to one or both surfaces of an FPCB required to have a high adhesion with an electronic component and a high flexibility and can also effectively diminish various electromagnetic waves generated in a printed circuit board.
  • the shielding film since copper is used solely as the conductive filler, the shielding film has shielding efficiency almost equivalent to that of the existing shielding film using silver-coated copper as a conductive filler and can be remarkably reduced in manufacturing cost.
  • An insulating layer coating solution was prepared by mixing and dissolving 3.5 wt% of bisphenol A-type epoxy resin (Kukdo YD-128), 10 wt% of a polyurethane resin, 5 wt% of isocyanate, 5 wt% of polyamide, 3 wt% of carbon black, 5 wt% of aluminum oxide, and 68.5 wt% of ethyl acetate.
  • An insulating layer in a semi-cured state was formed to a thickness of 5 mm by coating the insulating layer coating solution on one surface of a first protective film (release force of 200 gf/in) using a microgravure coater and drying the insulating layer coating solution at a temperature of 150°C for 5 minutes.
  • a curable conductive adhesive composition was obtained by dispersing and mixing 17.7 wt% of bisphenol A-type epoxy resin (Kukdo YD-128), 35 wt% of copper, 1.8 wt% of dicyandiamide, 1.8 wt% of a urea resin, 11.7 wt% of ethyl acetate, 27 wt% of toluene, and 5 wt% of dibasic ester.
  • a conductive shielding layer was formed to a thickness of 13 mm by coating the curable conductive adhesive composition on the insulating layer using a slot die coater and drying the curable conductive adhesive composition at a temperature of 150°C for 5 minutes.
  • An electromagnetic wave shielding film was manufactured with the same compositions and the same process conditions as Embodiment except that an imidazole resin reactive to copper was used as a curing accelerator.
  • An electromagnetic wave shielding film was manufactured with the same compositions and the same process conditions as Embodiment except that silver-coated copper powder was used as a filler in a composition for a shielding layer.
  • the semi-cured electromagnetic wave shielding film stored at room temperature and at a humidity of 50% after being manufactured was overlapped with and temporarily bonded to a 250 mm long PI (polyimide, Kapton) film and then cured at a temperature of 160°C under a pressure of 30 kgf for 60 minutes by way of hot pressing so as to prepare a specimen for measuring electrical conductivity. Then, a surface resistance value and shielding efficiency were measured.
  • PI polyimide, Kapton
  • the shielding film of Embodiment has a surface resistance value almost equivalent to 189.6 of Comparative Example 2 and considerably lower than 506.7 of Comparative Example 1.
  • a reference sample and a load sample were cut in an appropriate size and requested to be measured by an electromagnetic wave shielding measurement institution (Korea Testing Laboratory).
  • the shielding efficiency average in the range of 30 MHz to 1.5 GHz was measured.
  • the electromagnetic wave shielding film according to Embodiment employs Cu only as the conductive filler and uses the binder resin, the solvent and the curing agent which do not react with Cu, and, thus, ink does not discolor and the electromagnetic wave shielding film has the shielding efficiency almost equivalent to Comparative Example 2 using expensive silver-coated copper as the filler. Therefore, reduction in manufacturing cost can be induced.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un film de protection contre les ondes électromagnétiques. Ledit film de protection contre les ondes électromagnétiques comprend : une couche isolante comprenant un liant résineux contenant une résine époxy, une charge, un durcisseur, un solvant et d'autres additifs ; une couche de protection conductrice comprenant un liant résineux, qui est le même que le liant résineux de la couche isolante, du cuivre en tant que charge conductrice, un durcisseur et un solvant, le solvant étant choisi dans au moins un groupe comprenant des solvants contenant un groupe ester (-COOR), des solvants contenant un groupe hydroxyle (-OH), des solvants contenant un groupe ester (-COOR) et un groupe hydroxyle (-OH), des solvants contenant un groupe cétone (C=O) et des solvants contenant un groupe alkyle (-R), seul ou en combinaison d'au moins deux de ceux-ci.
PCT/KR2015/000589 2015-01-20 2015-01-20 Film de protection contre les ondes électromagnétiques et son procédé de fabrication Ceased WO2016117719A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/KR2015/000589 WO2016117719A1 (fr) 2015-01-20 2015-01-20 Film de protection contre les ondes électromagnétiques et son procédé de fabrication
KR1020157004462A KR101690166B1 (ko) 2015-01-20 2015-01-20 전자파 차폐 필름 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2015/000589 WO2016117719A1 (fr) 2015-01-20 2015-01-20 Film de protection contre les ondes électromagnétiques et son procédé de fabrication

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WO2016117719A1 true WO2016117719A1 (fr) 2016-07-28

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Cited By (2)

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CN107513351A (zh) * 2017-10-11 2017-12-26 广东正业科技股份有限公司 一种电磁屏蔽膜及其制备方法
CN110839339A (zh) * 2019-11-26 2020-02-25 苏州城邦达益材料科技有限公司 一种可弯折使用的电磁屏蔽膜及其制备方法

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JP2001007587A (ja) * 1999-06-21 2001-01-12 Toyo Chem Co Ltd 電磁波遮蔽吸収シート
KR101081524B1 (ko) * 2004-04-07 2011-11-08 나노캠텍주식회사 도전성 필름 및 시트, 및 이의 제조 방법
KR20060018545A (ko) * 2004-08-25 2006-03-02 유트로닉스 주식회사 전자기파 차폐된 연성인쇄회로기판
US20110186324A1 (en) * 2008-09-04 2011-08-04 Eun-Kwang Hur Electromagnetic interference suppressing hybrid sheet
KR101361529B1 (ko) * 2012-01-12 2014-02-25 한화엘앤씨 주식회사 전자기파 차폐 필름 및 그 제작방법과 전자기파 차폐 필름이 부착된 인쇄회로기판 및 그 제작방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107513351A (zh) * 2017-10-11 2017-12-26 广东正业科技股份有限公司 一种电磁屏蔽膜及其制备方法
CN110839339A (zh) * 2019-11-26 2020-02-25 苏州城邦达益材料科技有限公司 一种可弯折使用的电磁屏蔽膜及其制备方法

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KR20160100815A (ko) 2016-08-24
KR101690166B1 (ko) 2016-12-27

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