WO2016146485A1 - Système modulaire - Google Patents

Système modulaire Download PDF

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Publication number
WO2016146485A1
WO2016146485A1 PCT/EP2016/055186 EP2016055186W WO2016146485A1 WO 2016146485 A1 WO2016146485 A1 WO 2016146485A1 EP 2016055186 W EP2016055186 W EP 2016055186W WO 2016146485 A1 WO2016146485 A1 WO 2016146485A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
modular system
heat
connection
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2016/055186
Other languages
German (de)
English (en)
Inventor
Fritz Frey
Michael STÄHLE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R Stahl Schaltgeraete GmbH
Original Assignee
R Stahl Schaltgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R Stahl Schaltgeraete GmbH filed Critical R Stahl Schaltgeraete GmbH
Priority to EP16709764.1A priority Critical patent/EP3271979B1/fr
Publication of WO2016146485A1 publication Critical patent/WO2016146485A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H05K7/1474—Mounting of modules, e.g. on a base or rail or wall
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H05K7/1468—Mechanical features of input/output (I/O) modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/015—Boards, panels, desks; Parts thereof or accessories therefor
    • H02B1/04—Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing
    • H02B1/056—Mounting on plugboards

Definitions

  • the invention relates to a modular system with at least one module.
  • the module comprises a Bauele ⁇ management support, such as a printed circuit board, and a plurality of arranged on the component carrier electrical and / or electronic components on.
  • a Bauele ⁇ management support such as a printed circuit board
  • One or more such modules are held by a module carrier and can be placed in a cabinet.
  • the electrical or electronic components can become warm during operation and have to release their heat into the environment. It is therefore necessary to cool the components accordingly. Depending therefore it may be necessary from the electrical power and the heat emitted to place in the cabinet active cooling elements such VENTILA ⁇ tors to ensure adequate air circulation. Furthermore, the hot air must be discharged from the interior of the housing to the outside or cooled.
  • a module carrier for one or more modules is known for example from DE 10 2012 016 997 AI.
  • the ladder ⁇ cards are held parallel to each other and perpendicular to a receiving surface of the module carrier.
  • openings are present, which serve on the one hand as a viewing window and on the other for air circulation and for cooling the circuit boards, whereby the air between two circuit boards can flow through the receiving surface.
  • DE 10 2012 210 677 A1 describes a power module cooling system.
  • a module carrier has a cooling plate on which modules to be cooled from opposite sides can be arranged.
  • the cooling plate has on each of the modules facing mounting sides an opening which is enclosed by a seal. When the modules are placed on the cooling plate, the gap between the modules and the cooling plate is closed by the seal.
  • the cooling plate is hollow and has on its side surfaces on air inlet or air outlet openings. Through these air inlet or air outlet openings, the cooling plate can be connected to an air circulation system. During operation, the modules are cooled by the air, which flows in the interior of the cooling plate in the region of the openings directly past the modules, thereby causing a convection cooling.
  • Such a cooling system is very complicated and expensive. It requires active elements for producing the shipszirku ⁇ lation within the cooling plate.
  • a modular system is to be created which enables simple cooling of the electrical and / or electronic components of a module.
  • the modular system has at least one module.
  • the module includes a component carrier, for example a printed circuit board, on which electrical and / or electronic components are arranged.
  • a module can also have a plurality of component carriers or a plurality of printed circuit boards.
  • the heat-conducting body has a
  • Plate part which extends parallel to the component carrier or between two component carriers.
  • the module has a mechanical connection device for connection to a module carrier.
  • a contact surface is provided which serves to produce a planteleitthetic with the module carrier.
  • the contact surface preferably extends in a plane.
  • the electrical couplers ⁇ averaging means may be connected to the component carrier, for example, with one or more conductive tracks or contacts.
  • the at least one module carrier of the modular system has a holding device for producing a mechanical connection with the respective associated connection device of a module.
  • a connector device is provided on each module carrier, which is adapted to produce a elekt ⁇ generic connection with the coupling means of an associated module.
  • a plurality of modules arranged on the module carrier can be electrically coupled to one another.
  • a counter-contact surface preferably extending in a plane is present. The plant ⁇ surface and the counter-contact surface abut each other when a connection is made between the holding device of the module carrier and the connecting device of the module.
  • the contact surface and the counter abutment surface are carried out before ⁇ preferably complementary to each other.
  • the heat by heat conduction is performed from ⁇ , so that means for generating a coolant flow through or on the modules or between two modules through are not necessary.
  • the resultant components to the heat will be dissipated via the thermal conductors and from there through the planar heat conducting contact between the contact surface and the counter bearing surface in the Modulträ ⁇ ger. It has been found that can be dispensed by such a design in a forced air or Gaszir ⁇ kulation with the aid of fans between the component carriers and printed circuit boards. Means that direct the air targeted to the modules or PCBs are not necessary and can be omitted.
  • This has the particular advantage that the component carrier or circuit boards can be arranged in any orientation in a cabinet or housing. So far, the printed circuit boards have usually been vertically aligned to allow air circulation in the cabinet between the circuit boards.
  • a component carrier of a module can be arranged on each side of the plate part.
  • the components that need to be cooled are on the same side of the component carrier and facing the plate member.
  • the facing away from the carrier top is Bauele ⁇ ment of each component to be cooled into contact with the plate member.
  • a a nickelleit ⁇ layer, a heat conducting foil or the like may be present. It is also possible to connect the component carriers with the components and the plate member by pouring. This may be necessary, for example, when using the modular system in a Zone 1 explosion-proof atmosphere.
  • the plate part may have elevations and / or depressions on one or both sides, which faces the components to be cooled, in order to compensate for different heights of the components.
  • the median plane through the plate part and the median plane through the compo ⁇ ment carrier may in this embodiment have a constant distance from each other, which may be predetermined for example by spacers.
  • the different heights of the components are compensated by elevations or depressions on the plate part, so that all the components to be cooled have a sufficiently good heat conducting contact with the plate part.
  • the heat-conducting body is designed as an integral body and has no seam or joint.
  • the heat-conducting body can be as aluminum die casting out ⁇ leads.
  • the heat-conducting body preferably has no chambers or cavities for fluid conduction in its interior.
  • the holding device has a holding part which defines a pivot axis.
  • the connecting device may have a connecting part, which is adapted to access the holding part on ⁇ and pivotal movement of the module to the
  • the connecting part may surround the holding part in the circumferential direction about the pivot axis at least in sections.
  • the pivoting movement can serve to connect the electrical coupling device of the module to the electrical connection device of the module carrier and in particular to insert one another.
  • the pivot axis is aligned parallel to the counter contact surface.
  • the pivot axis is aligned parallel to the counter contact surface.
  • Pivot axis a distance to the mating contact surface in egg ⁇ ner height direction, which is oriented at right angles to the pivot axis and the mating contact surface.
  • the direction in which the pivot axis extends may be referred to as the longitudinal direction.
  • the direction perpendicular to the elevation and perpendicular to the longitudinal direction may be referred to as the transverse direction.
  • a receiving ⁇ recess is provided on the connecting part, which is adapted to the holding ⁇ part, at least partially accommodate.
  • the receiving recess can for this purpose in the longitudinal direction parallel to the
  • the holding member can thus ent ⁇ long the pivot axis extend completely through therawausspa- tion.
  • the receiving recess for insertion of the holding part is open to one side.
  • the holding device of the module carrier has in a preferred embodiment at a distance from the holding part an attachment part.
  • the connecting device of the module may have a fastening ⁇ supply part at a distance from the connecting part.
  • the fastening part and the Anbrin ⁇ supply part are preferably adapted to kraftschlüs ⁇ sig and / or positively connected to each other and in particular to be releasably connected.
  • the attachment part to the attachment part can debolzen ⁇ or the like connected via a threaded.
  • a threaded connection and locking and / or clamping connections between the attachment part and the fastening part can be produced.
  • connection device is arranged between the holding part and the attachment part. Accordingly, the coupling device can be arranged between the connecting part and the fastening part. In this embodiment, a secure electrical contact between the module carrier and the module is achieved.
  • the crableit entrepreneurial has in one embodiment between the connecting part and the fastening part plate-shaped base part, which serves as varnishleitmaschine.
  • the base part is aligned in particular at right angles to the plate part.
  • the connecting device may have a positioning surface, which is arranged at a distance from the connecting part and which faces away from the connecting part.
  • the Hal ⁇ te beautiful may have a positioning counter-surface, which is arranged at a distance from the holding part and which faces the holding part. When the connection between the connecting device and the holding device is established, the positioning surface bears against the positioning counter-surface.
  • a contact between the positioning surface and the positio ⁇ nierumble Chemistry, in the preparation of the compound is achieved before the coupling means and the connecting device can make an electrical connection. This ensures that the contacts to be connected are correctly assigned when making a plug connection and that no accidental short circuits occur.
  • the positioning counter surface is inclined to the counter-contact surface and the positioning surface inclined to the contact surface aligned.
  • the positioning counter-surface can be arranged in a plane which runs parallel to the pivot axis ⁇ or to the longitudinal direction.
  • the holding device and / or the connecting device to a force generating device.
  • the force-generating device When the connection between the holding device and the connecting device is established, the force-generating device generates a pressing force between the contact surface and the counter-contact surface.
  • the power generating means may also generate a pressing force between the positioning surface and the Positionierneuvection when a connection is made between the Hal ⁇ te pleasing and the connection means.
  • the Krafterzeu ⁇ restriction device to an elastic or resilient force-generating element which is supported at Ver produced ⁇ connection between the holding means and the connecting means on the one hand on the holding part and the other part at the connecting part.
  • the force-producing member may, for example, arranged or on the connecting part is introduced ⁇ be and protrude with a portion in theracausspa- tion.
  • the Krafter Wegungs ⁇ element is designed as a resilient wire bending part.
  • the module carrier is designed as integral body without seam and joint.
  • the module carrier may be formed by an extruded profile.
  • the module body is preferential ⁇ , aluminum.
  • at least one cooling channel is present in the module carrier.
  • the cooling channel may for example be arranged adjacent to the counter-contact surface and parallel to it and preferably parallel to
  • the cooling channel may have a completely closed in the circumferential direction channel wall, which is not divided and therefore not slotted.
  • the at least one cooling channel has a non-circular contour, and preferably an elliptical Kon ⁇ structure.
  • the channel height in the vertical direction is some way legally smaller than the channel width in the transverse direction ⁇ ⁇ tung before.
  • a heat pipe or a heat pipe may be inserted.
  • the heat pipe has an outer diameter in an undeformed initial state that is greater than the channel height and smaller than the channel width.
  • the inserted in the cooling duct part of the heat pipe deforms and is at least at two diametrically opposed ⁇ places in the region of the lower channel height on the channel wall.
  • a press fit is preferably avoided and in the direction of the channel width there is a gap between the heat pipe and the channel wall. In this way, a heat pipe can be frictionally held in the cooling channel without producing a press fit.
  • the module carrier has, in particular on its Ge ⁇ genstromisation opposite side of at least one Mounting surface, with which it rests in the assembled state on ei ⁇ ner housing wall or mounting plate in the interior of a Ge ⁇ housing. As a result, a heat-conducting connection to the housing wall or the mounting plate is made. Before ⁇ preferably the at least one cooling channel between the at least one mounting face and the counter contact surface is located.
  • the modular system is intended to be arranged in a housing interior of a housing.
  • the housing interior is hermetically sealed against the environment.
  • the housing may potentially explosive ⁇ protects be performed, for example, in the ignition protection ⁇ art "flameproof enclosure".
  • the module carrier is arranged on a housing wall or a mounting plate in the housing interior.
  • the housing inner wall or the mounting plate can be used to generate a convection flow in the Ge ⁇ reheatieriraum.
  • FIG. 1 shows an exemplary embodiment of a modular Sys tems ⁇ with a module carrier and a module in a perspective view during the preparation of the compound
  • FIG. 2 shows the modular system of FIG. during the preparation of the compound
  • FIG. 3 is a side view of the modular system according to FIGS. 1 and 2 when the connection between the module and the module carrier has been completely established;
  • FIG. 4 shows an exemplary embodiment of a heat conduction body of a module in a perspective view
  • FIG. 5 shows the heat-conducting body from FIG. 4 in a front view of a connecting part
  • Figure 6 is a partial perspective view of a Mo ⁇ duls in view of the electrical coupling means and a base portion of the heat conducting from the figures 4 and 5,
  • Figure 7 is a partial schematic representation of a Plat ⁇ tenteils of the heat conducting from the Figures 4 to 6 and an electric and / or electronic components on ⁇ facing the component carrier,
  • FIG. 8 shows a partial view of the module carrier and the module in a side view during the production of the connection
  • FIG. 9 shows a schematic perspective view of a force-generating element of the exemplary embodiment of the modular system or of the heat-conducting body according to FIGS. 1 to 7, FIG .
  • Figure 10 is a schematic diagram of the shape of a cooling channel in the module carrier and the deformation of a heat pipe when plugged into the cooling channel,
  • FIG. 11 shows a schematic basic illustration of a housing with a plurality of modular systems arranged in the housing interior
  • FIG. 12 is a schematic representation of the housing in a sectional view along the section line XII-XII in Figure 11.
  • FIGS. 1 to 3 illustrate an exemplary embodiment of a modular system 20.
  • To the modular system 20 includes at least one module 21 and a module ⁇ carrier 22, which serves for mechanically holding and electrically connecting the at least one module 21.
  • the module 21 has at least one component carrier 23 on which electrical and / or electronic components 24 are angeord ⁇ net.
  • the component carrier 23 and the components 24 are illustrated in FIGS. 6 and 7, respectively.
  • the component ⁇ carrier 23 may be designed as a printed circuit board. On the component carrier 23 conductor tracks for contacting the components 24 may be present.
  • Each module 21 includes a heat-conducting body 25, which is shown separately in FIGS. 4 and 5.
  • the heat ⁇ conductive body 25 has a base portion 26 and a plate member 27.
  • the plate member 27 is on one side with the base part
  • the components to be cooled 24 are arranged on the side of the Bauele ⁇ ment carrier 23, which faces the plate member 27. With their upper side facing the plate part 27, the components 24 rest on the plate part 27.
  • Optio ⁇ nal may be between the top of the components to be cooled 24 and the plate member 27, a heat conducting layer 28, in ⁇ example, a heat conducting pad or a heat conducting be ⁇ arranged.
  • spacer elements 29 are arranged on the plate member 27 spacer elements 29 arranged.
  • the spacer elements 29 give the distance between the component carrier 23 and the plate member 27 before. This distance is adapted to the height of the components 24 to be cooled.
  • a spacer element 29 may basically have any shape.
  • Example ⁇ adhesive are here 29 illustrates ⁇ so as cylindrical or hollow cylindrical Abstandshalteelemen ⁇ te 29 a web-shaped spacer element.
  • the hollow cylindrical Abstandshal ⁇ te pension 29 can be designed with an internal thread, so that these spacer members 29 may be used on the heat conducting plate 25 and the part 27 also for loading ⁇ consolidate the component carrier 23rd
  • FIG. 7 schematically illustrates that the component carrier 23 is fastened at several points with screws 30 to the spacer elements 29 designed as female threaded bushes.
  • the plate part 27 may for example have at least one elevation 31 in order to compensate for such a height difference.
  • wells could be provided in the plate member 27, wherein such wells can be used only if the thickness of the plate member 27 is ⁇ reaching from large to the plate member 27 is not too much weaknesses.
  • Another way of compensating the differences in height is to mount the components 24 on the component carrier 23 by means of sockets or the like, so that the tops of the components 24 to be cooled lie in a common plane.
  • a module 21 may include a plurality of component carriers 23 and
  • the at least one component carrier 23 with the construction ⁇ elements 24 can be integrated with the plate member 27 in a common potting.
  • the potting material is chosen so that a sufficiently low thermal resistance ensured and a good saucoshiza ⁇ tion between the components 24 and the plate member 27 is made. This encapsulation can be provided in particular if the modular system 20 is provided, for example, in an explosion-proof housing for use in a potentially explosive area.
  • a connecting device 34 is provided, which is adapted to the mechanical connection of the module 21 to the module carrier 22.
  • the connecting device 34 has a connecting part 35 and a fastening part 36.
  • the connecting part 35 and the fastening part 36 are in the direction of extension of the base part 26 of the heat-conducting body 25 arranged at a distance from each other and are in ⁇ game according to opposite ends of the base member 26th
  • the connecting part 35 has a receiving recess 37.
  • the receiving recess 37 is completely open to the side facing away from the base part 26 and from the fastening part 36 through an insertion opening 38.
  • a guide opening 38 a part of the module carrier can be inserted into the receiving recess 37 22nd In a direction which is oriented, for example, at right angles to the plate part 27, the receiving recess 37 passes through the heat-conducting body 25 or its base part 26 completely.
  • a part inserted into the receiving recess 37 can therefore protrude from the receiving recess 37 transversely to the plate part 27 on both sides.
  • a positioning projection 39 is present within the receiving recess 37.
  • the positioning projection 39 widens in the embodiment of an outer En ⁇ de 39a to an inner end 39i towards and can have an approximately triangular contour.
  • the positioning projection 39 is illustrated in dashed lines in Figure 1 in a position ⁇ light, in which it cooperates with a positioning recess 40 on the module carrier 22.
  • a contact surface 45 is present on the module carrier 22 facing or associated underside.
  • the system 45 extends in the execution ⁇ for example in a plane which is perpendicular to the Clearre- ckungsebene of the plate member 27th
  • the Anla ⁇ ge materials 45 is disposed on a front portion 46 of the Ba ⁇ sisteils 26.
  • a rear portion 47 connects, which at its End has the fastening part 36.
  • the thickness of the prede ⁇ ren portion 46 perpendicular to the bearing surface is greater than that of the adjacent rear portion 47, so that in the transition region between the two portions 46, 47 is formed with a positioning surface 48 is a paragraph.
  • the positioning surface 48 extends in a plane, an obtuse angle with the plane in which the surface 45 extends NORflä ⁇ (Fi gures ⁇ 4 and 8).
  • the obtuse angle is preferably greater than 100 ° and is preferably in the range between 100 ° and 110 °.
  • the front portion 46 forms a base part projection 49, which belongs to the connecting part 35.
  • the connecting part 35 On the base part projection 49 ent ⁇ opposite side of the receiving recess 37, the connecting part 35 has a connecting projection 50 which is connected via an intermediate piece 51 with the front portion 46 of the base part 26.
  • the positioning projection 39 is arranged on the connecting projection 50 and / or on the intermediate piece 51.
  • the intermediate piece 51 extends approximately at right angles away from the front portion.
  • the module 21 also includes an electrical coupler ⁇ averaging means 55, which is schematically illustrated in FIG. 6
  • To the coupling device 55 in the embodiment includes at least one plug contact 56, which is formed in the present case by edge regions of the component carrier 23, wherein contact pads 57 in the form of conductor ends for electrical contacting are present at these edge regions.
  • the coupling device 55 could also be plug sockets and / or designed differently Have plug.
  • the coupling device 55 is designed exclusively with plug contacts 56 in the form of plugs for receiving in an associated plug contact socket.
  • the coupling means 55 and the plug contacts is provided in the base part 26 and ⁇ game in accordance with the rear portion 47 has an opening 58th
  • the opening 58 is executed in the embodiment as a slot, parallel or along the center plane, the plug contacts 56 of the Kopplungseinrich ⁇ device 55 extend.
  • the module 21 may also include a plurality of groups of plug contacts 56, which are each associated with at least one component carrier 23.
  • a plurality of apertures 58 could also be present in the base part 26 in order to make the several groups of plug contacts 56 accessible, preferably at least one opening 58 in the base part 26 on each side of the plate part 27.
  • the fastening part 36 has at least one and example ⁇ according to two or more elevations 61.
  • the projections 61 are arranged in the embodiment in a direction perpendicular to the extension direction of the plate member 27 at a distance from each other along a line.
  • the fastening part 36 also has a through hole 62 through which a fastening screw 63 can reach through.
  • the fastening screw 63 serves for the positive or non-positive fastening of the fastening at the module carrier 22.
  • the attachment hole 62 is preferably arranged between the elevations 61.
  • the heat-conducting body 25 is embodied in the exemplary embodiment as an integral component and is preferably made of aluminum or an aluminum alloy. He has no seam or joint. It is free of fluid channels provided for guiding ei ⁇ nes cooling fluid. Although the heat conduction body 25 may have recesses, holes or openings, which are not provided for fluid conduction of a cooling fluid, but can serve to reduce the weight of the heat conducting body 25 and thus the materi ⁇ al host in its manufacture. Preferably, the heat-conducting body 25 is designed as a cast aluminum body.
  • the module carrier 22 has a module body 66, which preferably consists of aluminum or an aluminum alloy.
  • the module body 66 is integrally formed without seam and joint and formed for example by a strand ⁇ pressprofilianu.
  • a Coordina ⁇ tensystem which is stationary with respect to the module body 66th
  • the coordinate system has a height direction H, at right angles thereto a transverse direction Q and at right angles to the height direction H and to the transverse direction Q a longitudinal direction L.
  • the module body 66 has a holding device 67, which is set up to produce the mechanical connection with the at least one module 21 and cooperates therewith with the connecting device 34.
  • the holding device 67 is, for example under an integral part of the module body 66.
  • the holding part 68 and the attachment member 69 are arranged in Qu ⁇ rearing Q distance from one another.
  • Example ⁇ according to are of the holding part 68 and the attachment ⁇ part 69 at opposite end portions of the module body 66th
  • the module body 66 has a counter abutment surface 70 which extends in a plane.
  • the counter-contact surface 70 extends in a plane which is spanned by the transverse direction Q and the longitudinal direction L.
  • front end of the module body 66 adjacent to the counter-contact surface 70 has a web 71 which is disposed adjacent to the counter-contact surface 70 and extending in height ⁇ direction H.
  • a crosspiece 72 projects from the web 71 and has at least one extension component in the transverse direction Q.
  • the transverse web 72 starting from the web 71, extends obliquely in the transverse direction Q and at the same time inclined in the vertical direction H.
  • a thickened end piece 73 is formed on the transverse web 72.
  • the end piece 73 forms a pivot axis S.
  • it has at least one outer surface area, which is located on a cylinder jacket surface about the pivot axis S.
  • This curved Au ⁇ z romance Scheme of the end piece 73 is not completely closed in the circumferential direction about the pivot axis S, special ends at the transition point to the transverse web 72.
  • the pivot axis S extends in the longitudinal direction L.
  • the Posi ⁇ tionieraussparung 40 is present ( Figure 1).
  • the positioning recess 40 forms a recess which extends in the transverse web 72 and / or in the end piece 73 through the holding part 68.
  • the positioning recess 40 is open at the top, away from the counter abutment surface 70 and in the transverse direction Q on the side 71 of the end piece 73 facing away from the web 71.
  • the positioning recess 40 expands from a front end 40v to a rear end 40h.
  • the positioning recess 40 has a triangular-shaped contour in et wa. According to the example, the front end 40v is located in the transverse web 72, while the rear end 40h is arranged in the end piece 73.
  • the module body 66 has a positioning counter surface 77.
  • the Positionier ought Chemistry 77 borders, for example according to the Ge ⁇ genstrom Chemistry 70th
  • the positioning counter surface 77 has an extension component in the longitudinal direction L. Opposite the height direction H and the transverse direction Q, the positioning counter surface 77 is inclined. Their normal vector points towards the holding part 68, for example according to the web 71 or the end piece 73.
  • the angle which the positioning counter surface 77 encloses with the counter-contact surface 70 corresponds to the obtuse angle (FIG. 1).
  • the positioning counter surface 77 is arranged at,sbei ⁇ game on a first longitudinal ridge 78.
  • the first Longitudinal ridge 78 extends in the longitudinal direction L and protrudes in the height direction H from the plane in which the counter-bearing surface 70 extends.
  • a second longitudinal web 79 which extends parallel to the first longitudinal web 78 in the longitudinal direction L, belongs to the mounting part 69. Between the two longitudinal webs 78, 79, an electrical connection device 80 of the Modulträ ⁇ gers 22 is arranged. The electrical connection device 80 is configured to produce an electrical connection with the coupling device 55 of the module 21 when the mechanical connection between the connection device 34 and the holding device 67 is established.
  • the Anschlußusseinrich ⁇ device 80 correspondingly complementary to the electrical contacts of the coupling device 55 formed electrical mating contacts.
  • each plug contact 56 of the coupling means 55 of a module 21 is a entspre ⁇ sponding associated plug contact socket 81 ( Figures 1, 2 and 8).
  • the plug contact sleeves 81 are disposed on a connection plate 82 which leads out ⁇ such as a printed circuit board can be.
  • the connection plate 82 is held between the two longitudinal webs 78, 79. For this purpose, corresponding grooves are introduced into the longitudinal webs 78, 79, in which engage the longitudinal edges of the connecting plate 82.
  • connection plate 82 electrical connec ⁇ tions, such as interconnects, may be present. Characterized electrical connectors of the plug contact socket 81 can be electrically connected to each other ⁇ .
  • the connection plate 82 can - if necessary - also carry additional electrical and / or electronic components.
  • An electrical connection between a plurality of modules 21, which are arranged on the module carrier 22, can be produced via the connection device 80.
  • the connection device 80 can provide a bus connection for the modules 21.
  • Adjacent to the second longitudinal web 79 is in the Anbrin ⁇ supply part 69 in the height direction H upwardly open
  • the longitudinal groove 83 has in each case a corrugated surface on the opposite groove flanks. These corrugations are configured to work with the external thread of the fastening screw 63 of the module 21 together so that the external thread of its mountings ⁇ setscrew 63 can positively and / or frictionally engage in the fluting of the groove flanks in order to establish a connection.
  • the longitudinal groove 83 has at the top, following the longitudinal edges between the opposite groove flanks a mouth portion 84.
  • the mouth portion 84 tapers in the height direction H from the top into the longitudinal groove 83 inside.
  • Its cross-sectional contour is adapted to the cross-sectional contour of the elevations 61.
  • the two in the transverse direction Q opposite side surfaces of each survey 61 are made in connection between the module 21 and the module carrier 22 on the groove sides of the
  • the modular system 20 also includes a Krafterzeu ⁇ restriction device 87th
  • the force-generating device 87 is set up in the case of mechanical Bonding between the connecting device 34 and the holding device 67 a pressing force between the Scriptflä ⁇ surface 45 and the counter-contact surface 70 and the execution ⁇ example also a pressing force between the positioning ⁇ nier Structure 48 and the positioning counter surface 77 erzeu ⁇ conditions.
  • the force generating device 87 a Force generating element 88 and, for example, by a force generating element 88 is formed.
  • the Krafterzeu ⁇ restriction member 88 has elastic or resilient properties inherent ⁇ and is elastically deformed when the connection of a module 21 with the module carrier 22 and clamped. The deformation or stress generates a force which acts at least in the height direction H and, according to the example, in the transverse direction Q.
  • the force-generating element 88 is embodied, for example, as a bent wire part (FIG. 9). It has two mutually parallel first leg 89. Each of the first legs 89 is adjoined by a second leg 90, which runs essentially at a right angle to the associated first leg 89.
  • the two second legs 90 are connected to each other via an intermediate piece 91, as it bridges the distance between the two second legs 90 in the longitudinal direction L or in a direction perpendicular to the extension plane of the plate member 27.
  • the Zvi ⁇ rule piece 91 may extend straight and perpendicular to the first legs 89 and second legs 90th
  • the intermediate piece 91 is angled at one point and preferably centrally between the two second legs 90 and has a V-shaped course.
  • the intermediate piece 91 has the smallest height distance to the plane in which the first two legs 89 extend.
  • opposite ends of the first leg 89 each have an end portion 93 is present.
  • the two Endab ⁇ sections 93 extend to their respective free end toward and are arranged, for example according to of a common ⁇ men line.
  • the force generating element 88 is arranged in theticiansbei ⁇ game on the connecting part 35.
  • the first two legs 89 extending on opposite sides of the connecting part 35 in each case of a supporting recess 94.
  • the supporting recess 94 has a below the jeweili ⁇ gen first leg 89 arranged support surface 95 (see in particular detail A in Figure 8).
  • the support surface 95 ver ⁇ runs not completely parallel to the first leg 89, but supports the first leg 89 following the end portion 93 in a support portion 96 from.
  • the intermediate piece 91 can deform elastically.
  • the angled point 92 is located for this purpose in the connecting part 35, while the transition regions between the second legs 90 and the intermediate piece 91 when connected the module 21 with the module carrier 22 on the holding member 68 can support from ⁇ .
  • At least the intermediate piece 91 partially protrudes out of the support recess 94 in the undeformed state of the force-generating element 88 and can project at least partially into the receiving recess 37.
  • the connection between a module 21 and the module carrier 22 is made as follows:
  • the module 21 is attached to the connecting part 35 on the holding part 68, so that the end piece 73 passes through the insertion opening 38 in the receiving recess 37 and abuts there on the connecting part 35.
  • the Posi ⁇ tioniervorsprung 39 engages in the associated Positionierausspa ⁇ tion 40th This ensures that the module 21 is positioned exactly in the longitudinal direction ⁇ of the module carrier 22.
  • the expanding Positionieraussparung 40 and the expanding positioning projection 39 facilitate the attachment of the connecting part 35 on the holding part 68th
  • FIGS. 1 and 2 This plugged position is illustrated in FIGS. 1 and 2.
  • the base part 26 of the are also arranged in this position a distance from the connection device 80 so that no electrical Ver ⁇ connection between the module 21 and the module carrier 22 is made.
  • the module 20 can now be pivoted about the pivot axis S ge ⁇ .
  • the force-generating element 88 is supported thereby between the holding part 68 and the connecting part 35 and is elastically deformed.
  • the base part projection 49 is arranged between the plane in which the counter abutment surface 70 extends and the holding part 68 and the end piece 73 and is ⁇ by the tension of the Krafterzeu ⁇ supply element 88 in the height direction H down to the module body 66 pushed.
  • the heat conducting body 25 and the module body 66 are dimensioned such that the positioning arrives during the pivoting movement 48 in contact with the Positionieradel ⁇ surface 77 before an electrical connection Zvi ⁇ rule of the coupling device 55 and the connection device is manufactured 80th This ensures that the electrical contacts of the coupling device 55 relative to the electrical contacts of the connection device 80 in the transverse direction Q of the module carrier 20 are accurately positioned. Thus, short circuits or unwanted electrical connections can be avoided.
  • the positio ⁇ nier Vietnamese toys the heat-conducting body 25 is urged toward the holding part 68 toward ⁇ .
  • the force generating element ⁇ supports 88 from the holding part 68th This can be done, for example, by virtue of the fact that the force-generating element 88 projects forward beyond the base-part projection 49 and is supported on the transverse web 72 and / or on the web 71 of the holding part 68.
  • 88 produce a pressing force between the positioning surface 48 and the Po ⁇ sitionierneuvection 77, the force-generating element. Accordingly, in the transverse direction Q ⁇ a precise relative positioning of the module 21 is achieved relative to the module carrier 22nd
  • the electrical connection between the coupling device 55 and the connection device 80 is made in a continued pivotal movement.
  • the plug-in contacts 56 inserted into the plug-in sockets 81.
  • the abutment surface 45 bears against the abutment surface 70 (FIG. 3).
  • the power generating element 88 generates at heights ⁇ direction H a pressing force between the contact surface 45 and the counter-bearing surface 70.
  • a form fit, at least in the transverse direction Q, is achieved in that the elevations 61 in the Mündungsab ⁇ section 84 to the groove flanks of the longitudinal groove 83 abut.
  • connection is released in reverse order. order of connection. Reference may therefore be made to the above explanation.
  • At least one cooling channel In the module body 66, at least one cooling channel
  • the cooling channel 100 has a channel wall
  • the channel wall 101 is completely closed in the circumferential direction and at no point divided into two relatively movable sections.
  • the cooling channel 100 in the longitudinal direction L extends in the module body 100 adjacent to the anvil surface 70th
  • the cross section of the cooling channel 100 is out of round ⁇ leads and has beispielshold an elliptical shape.
  • the cooling channel 100 has a channel height z, the amount of which is smaller than the channel width x in each case measured at the point with maximum dimension (FIG. 8).
  • the channel height z and the channel width x are, for example, measured along the Halbach ⁇ sen the elliptical contour of the cooling channel 100.
  • the smaller semiaxis of the ellipse extends in ⁇ game according to height direction H and the larger half-axis of the ellipse in the transverse direction Q.
  • the heat pipe 102 has an outer diameter D ( Figure 10).
  • the outer diameter D of the heat pipe is greater than the channel height z and smaller than the channel width x.
  • Eindrü ⁇ CKEN of the heat pipe 102 the pressed-in into the cooling channel 100 and the inserted portion from being deformed and also receives an elliptical in about contour.
  • the channel width x of the cooling channel 100 is chosen so large that no
  • the modular system 20 is suitable for mounting in a housing and, for example, in a potentially explosive ⁇ protected housing 105, the highly schematic drawings in ⁇ 11 and 12 is illustrated.
  • the explosion proof housing 105 enclosing a housing interior space 106 in particular ⁇ sondere hermetically gas-tight.
  • the explosion-proof housing 105 can be designed, for example, in the "flameproof enclosure" type of protection. In this embodiment, gas exchange between the housing interior 106 and the potentially explosive atmosphere in the environment can not take place, and adequate cooling must therefore be provided without the requirements to violate the explosion protection.
  • a mounting plate 107 is arranged, which extends example ⁇ wise in the vertical direction.
  • the module carriers 22 each have one or more mounting surfaces 108 with which they can be attached to the mounting plate 107.
  • the mounting surfaces 108 are present on the module body 66 and extend in a common plane.
  • the at least one mounting surface 108 faces away from the counter-abutment surface 70 and is preferably aligned parallel thereto.
  • at least one mounting surface is provided, which is arranged adjacent to the counter-contact surface 70.
  • the ⁇ we tendonss a cooling channel 100 may preferably be angeord ⁇ net between ei ⁇ ner mounting surface 108 and the counter bearing surface 70th
  • a heat may be conductive layer arranged on ⁇ , for example, unevenness sauglei ⁇ Chen and a good heat conductive contact equipzustel ⁇ len.
  • the mounting plate 107 extends in Vertikalrich ⁇ tion possible through the entire housing from the housing bottom 109 to the housing cover 110.
  • the height of the mounting plate 107 preferably corresponds to at least 70% or 80% or 90% of the distance between the housing bottom 109 and the housing cover 110th
  • the mounting plate 107 may be attached directly to a housing wall, such as the rear wall 111 of the housing. However, this is often not useful or not possible to simplify the assembly. Nevertheless, in order to ensure a good heat-conducting contact between the mounting plate 107 and the corresponding housing wall, for example, the Ge ⁇ housing rear wall 111, according to the example extending in the vertical direction mounting plate holder 112 are provided, which serve as a heat-conducting elements and sozusa ⁇ gene as a thermal bridge. Thereby can be guided over the mounting plate holder 112 in the housing rear wall 111 of the Modulträ ⁇ ger 22 and the module body 66 introduced into the mounting plate 107 heat.
  • the explosion proof housing 105 is beispielsge ⁇ Gurss adapted mounted to a wall 113 to the ⁇ .
  • the wall 113 is on an oil rig or on board a ship, especially on deck.
  • mounting struts 114 are provided to attach the housing 105 to the wall 113 .
  • the mounting struts 114 are formed in the embodiment by tubes and, for example, rectangular tubes. They are open at their two ends in the vertical direction. The vertical orientation allows air circulation through the tubular mounting struts 114.
  • the mounting struts 114 are attached at the location on the outside of the housing 105, in which ⁇ nen the mounting plate holder 112 are located. As a result, an improved heat conduction connection from the mounting plate holder 112 through the housing wall or the housing rear wall 111 into the mounting strut 114 is achieved.
  • a convection flow K of the air or the gas in the housing 105 is achieved in the housing interior 106.
  • the assembly ⁇ plate 107 is made of good heat conductive material, for example ⁇ aluminum. It heats up very uniformly during operation of the electrical and / or electronic components. Characterized in that it occupies a large area in the housing interior 106 and extends as completely as possible in the vertical direction through the housing interior 106, a circulation by convection and thus the convection K is set in motion without active cooling elements and in particular without a fan.
  • the air is heated and rises nearby on the mounting plate. In the area of the housing cover 110, it is urged away from the mounting plate 107 and can cool down and sinks accordingly.
  • the mounting plate 107 and the mounting plate holder 112 lead by heat conduction sufficient heat from the housing interior 106 to the outside.
  • a convection flow may also form outside the housing 105.
  • a temperature difference of a few degrees Celsius, in particular less than 5 ° C and in aforementionedsbei ⁇ game sets about 3 ° C.
  • comparable housings without the use of the mounting plate and the heat dissipation by heat conduction temperature differences have set in the vertical direction of about 15 ° C.
  • the mounting plate has a thickness of at least 2 mm or 3 mm.
  • the invention relates to a modular system 20, and a 20 ge ⁇ One suitable for the reception of such a modular system explosion proof housing 105.
  • the modular System 20 has at least one module 21 with electrical and / or electronic components 24.
  • the at least one module 21 can be arranged on a module carrier 22.
  • Each module 21 contains one and in particular a single heat-conducting body 25.
  • the heat-conducting body 25 has a base part 26 and a plate part 27 projecting transversely away from the base part 26.
  • the components to be cooled 24 are at the plate member 27 to produce a bathleitthetic.
  • a contact surface 45 is formed ⁇ , which is assigned to the module carrier 22.
  • the abutment surface 45 abuts against an associated ⁇ counter-bearing surface 70 of the module carrier 22.
  • the heat of the components 24 can be derived via the heat-conducting body 25 in the module carrier 22.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un système (20) modulaire ainsi qu'un boîtier (105) adapté pour recevoir un système (20) modulaire de ce type. Le système (20) modulaire comporte au moins un module équipé de composants (24) électriques et/ou électroniques. Le ou les modules (21) peuvent être disposés sur un support de module (22). Chaque module (21) contient un corps thermoconducteur (25), en particulier un unique corps thermoconducteur. Le corps thermoconducteur (25) comporte une partie de base (26) et une partie de plaque (27) s'éloignant en dépassant de manière transversale de la partie de base (26). Les composants (24) à refroidir se trouvent sur la partie de plaque (27) en établissant une liaison thermoconductrice. Une surface d'appui (45) est réalisée sur la partie de base (26) et est associée au support de module (22). Lors de l'établissement d'une liaison mécanique entre le module (21) et le support de module (22), la surface d'appui (45) se trouve sur une contre-surface d'appui (70) associée du support de module (22). La chaleur des composants (24) peut être déviée, par conduction thermique, dans le support de module (22) en passant par le corps thermoconducteur (25).
PCT/EP2016/055186 2015-03-18 2016-03-10 Système modulaire Ceased WO2016146485A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16709764.1A EP3271979B1 (fr) 2015-03-18 2016-03-10 Système modulaire

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015104044.1A DE102015104044A1 (de) 2015-03-18 2015-03-18 Modulares System
DE102015104044.1 2015-03-18

Publications (1)

Publication Number Publication Date
WO2016146485A1 true WO2016146485A1 (fr) 2016-09-22

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EP (1) EP3271979B1 (fr)
DE (1) DE102015104044A1 (fr)
WO (1) WO2016146485A1 (fr)

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US10631426B1 (en) 2018-09-28 2020-04-21 Rockwell Automation Technologies, Inc. Electronics module mounting system
CN113178136B (zh) * 2021-02-09 2023-04-21 河南宏昌科技有限公司 一种带有散热承托结构的led显示屏
DE102021120493A1 (de) * 2021-08-06 2023-02-09 Phoenix Contact Gmbh & Co. Kg Elektronikgehäuse zur Montage an einer Tragschiene sowie ein System

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DE102015104044A1 (de) 2016-09-22
EP3271979A1 (fr) 2018-01-24
EP3271979B1 (fr) 2020-05-06

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