WO2017131008A1 - Composition de résine polyamide résistante à la chaleur - Google Patents

Composition de résine polyamide résistante à la chaleur Download PDF

Info

Publication number
WO2017131008A1
WO2017131008A1 PCT/JP2017/002470 JP2017002470W WO2017131008A1 WO 2017131008 A1 WO2017131008 A1 WO 2017131008A1 JP 2017002470 W JP2017002470 W JP 2017002470W WO 2017131008 A1 WO2017131008 A1 WO 2017131008A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyamide resin
parts
mass
resin composition
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/002470
Other languages
English (en)
Japanese (ja)
Inventor
信宏 吉村
和樹 岩村
雄平 福本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP2017510684A priority Critical patent/JPWO2017131008A1/ja
Publication of WO2017131008A1 publication Critical patent/WO2017131008A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Definitions

  • the present invention relates to a polyamide resin composition, and more particularly to a polyamide resin composition having excellent heat aging resistance.
  • Polyamide resins have been widely used in various parts such as automobile parts, electrical and electronic parts, and industrial machine parts because they have excellent characteristics such as mechanical properties, chemical resistance and molding processability.
  • Polyamide resins are a class of resins that are relatively excellent in heat aging resistance, but deterioration due to the action of heat and light is inevitable.
  • As a method for improving heat aging resistance copper halide, potassium halide, oxazole compounds, etc. are heated.
  • a method of adding as a stabilizer has been known for a long time (for example, Patent Document 1).
  • polyamide resins are used for parts that are exposed to a high temperature environment of about 140 ° C. in the field of automobile parts, electrical and electronic parts.
  • the environmental temperature in the engine room has increased with the increase in engine output and the density of parts in recent years, and unprecedented heat aging resistance has been demanded. .
  • Patent Document 2 a method of blending fine elemental iron with polyamide
  • Patent Document 3 a method of blending finely dispersed metal powder with polyamide
  • Patent Document 4 a method of blending a heat stabilizer such as copper iodide and potassium iodide and a complex oxide such as iron trioxide (including iron (II) oxide)
  • Patent Document 5 a method of blending a heat stabilizer such as copper iodide and potassium iodide and a complex oxide such as iron trioxide (including iron (II) oxide)
  • Patent Document 2 and Patent Document 3 there is a risk of catching fire during the production of the composition, and the production is not easy.
  • the method of Patent Document 4 the effect is exhibited only with a very limited composition.
  • the method of Patent Document 5 is inferior in heat aging resistance and stability of mechanical strength, and there is room for improvement in the current situation.
  • An object of the present invention is to provide a polyamide resin composition that can exhibit stable heat aging resistance even under a high temperature environment of about 200 ° C., is excellent in mechanical strength, and is easy to manufacture.
  • the present invention is as follows. [1] 0.1 to 10 parts by mass of a metal salt of acetic acid with respect to 100 parts by mass of the polyamide resin, and the metal of the metal salt is an alkali metal, an alkaline earth metal, a group VB, a group VIB of the periodic table, A polyamide resin composition, wherein the polyamide resin composition is at least one selected from Group VIIB and Group VIIIB transition metals. [2] The polyamide resin composition according to [1], wherein the metal salt of acetic acid is at least one selected from lithium acetate, calcium acetate, sodium acetate, and iron acetate. [3] The polyamide resin composition according to [1] or [2], wherein a molded product obtained by injection molding of the polyamide resin composition has a tensile strength retention after heat treatment at 200 ° C. for 1000 hours of 80% or more. object.
  • the polyamide resin composition of the present invention is used for automobiles and electrical / electronic parts that require little deterioration in mechanical properties and high heat aging resistance even when exposed to a high temperature (200 ° C. or higher) environment for a long period of time.
  • a possible polyamide resin composition is used for automobiles and electrical / electronic parts that require little deterioration in mechanical properties and high heat aging resistance even when exposed to a high temperature (200 ° C. or higher) environment for a long period of time.
  • the polyamide resin in the present invention is not particularly limited.
  • a ring-opening polymerization product of cyclic lactam a polycondensation product of aminocarboxylic acid, a polycondensation product of dibasic acid and diamine, and a copolymer thereof.
  • polycaproamide polyamide 6
  • polyhexamethylene adipamide polyamide 66
  • polytetramethylene adipamide polyamide 46
  • polyhexamethylene sebacamide polyamide 610
  • Aliphatic polyamides such as polyhexamethylene dodecamide (polyamide 612), poly-lauryl lactam (polyamide 12), poly-11-aminoundecanoic acid (polyamide 11), poly (metaxylene adipamide) (polyamide MXD6)
  • Poly (hexamethylene terephthalamide) polyamide 6T
  • poly (f Aliphatic-aromatic polyamides such as samethylene isophthalamide) (polyamide 6I), poly (nonamethylene terephthalamide) (polyamide 9T), poly (tetramethylene isophthalamide) (polyamide 4I), and copolymers and mixtures thereof Can be mentioned.
  • Particularly suitable polyamides for the present invention include polyamide 6, polyamide 66, polyamide 6/66 copolymer, polyamide 66 / 6T copolymer, polyamide 6T / 12 copolymer, polyamide 6T / 11 copolymer, polyamide 6T / 6I copolymer, polyamide 6T / 6I / 12 copolymer, polyamide 6T / 610 copolymer, and polyamide 6T / 6I / 6 copolymer.
  • the molecular weight of such a polyamide resin is not particularly limited, but a polyamide resin having a relative viscosity of 1.7 to 4.5 measured at 25 ° C. in 98% (98% by mass) sulfuric acid at a concentration of 1% by mass is used. It is preferable.
  • the relative viscosity of the polyamide resin is more preferably 2.0 to 4.0, still more preferably 2.0 to 3.5.
  • the metal of the metal salt of acetic acid in the present invention is at least one selected from alkali metals, alkaline earth metals, transition metals of Group VB, VIB, VIIB, and VIIIB of the periodic table.
  • alkali metal include lithium, sodium, and potassium.
  • alkaline earth metal include magnesium and calcium.
  • transition metals of Group VB, VIB, VIIB, and VIIIB of the periodic table include vanadium, chromium, manganese, and iron.
  • Specific compounds include lithium acetate, calcium acetate, sodium acetate, iron acetate and the like.
  • the iron acetate is preferably iron (II) acetate.
  • the metal is preferably at least one selected from alkali metals and alkaline earth metals, and more preferably alkali metals.
  • at least one selected from lithium acetate, calcium acetate, and sodium acetate is preferable, and at least one selected from lithium acetate and sodium acetate is more preferable.
  • the content of the metal salt of acetic acid is 0.1 to 10 parts by mass, preferably 0.1 to 5 parts by mass, and more preferably 0.5 to 3 parts by mass with respect to 100 parts by mass of the polyamide resin. Part. If the amount is less than 0.1 parts by mass, there is almost no effect of developing heat aging resistance, and if it exceeds 10 parts by mass, the effect of developing heat aging property will not increase any further. If the metal salt of acetic acid is 10 parts by mass or less, unlike metal particles or metal oxide particles, there is little adverse effect on mechanical properties, and in particular, glass fiber breakage can be suppressed even in glass fiber reinforced compositions. Therefore, the mechanical properties are hardly deteriorated.
  • the metal salt of acetic acid has an oxygen scavenging effect near the surface layer of the polyamide resin, and the oxidative deterioration of the polyamide resin. It is thought that it is because it can suppress.
  • a known heat stabilizer can also be used in combination with the resin composition of the present invention.
  • Examples of the copper compound that can be used in the present invention include copper acetate, copper iodide, copper bromide, copper chloride, copper fluoride, copper laurate, and copper stearate. These copper compounds may be used alone or in combination. Copper acetate, copper iodide, copper bromide and copper chloride are preferred, and cupric bromide is particularly preferably used.
  • the addition amount of the copper compound is preferably 0.0001 to 1 part by mass as copper in the copper compound with respect to 100 parts by mass of the polyamide resin.
  • a more preferable addition amount is 0.0005 to 1 part by mass, a further preferable addition amount is 0.0005 to 0.03 part by mass, and a particularly preferable addition amount is 0.0005 to 0.02 part by mass. is there.
  • a copper compound when adding a copper compound, it is preferable to use an alkali metal halide compound such as potassium iodide or potassium bromide in combination. By using together, precipitation of copper can be prevented.
  • a method for adding the copper compound it may be added at any stage of the production of the polyamide resin, and the addition method is not limited. For example, a method of adding to a raw material salt aqueous solution of polyamide, a method of injecting and adding to a molten polyamide in the middle of melt polymerization, and after blending a granulated polyamide pellet and the copper compound powder or masterbatch after polymerization Any of a method of melt kneading using an extruder, a molding machine or the like may be used.
  • an auxiliary stabilizer such as a hindered phenol antioxidant, a phosphorus antioxidant, a sulfur antioxidant, an amine antioxidant, or a light stabilizer is added. Can do.
  • hindered phenol antioxidant can be used alone or in combination.
  • phenols having two or more functional groups are preferable, and triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate] (IRGANOX245)
  • IRGANOX245 triethylene glycol-bis [3- (3-tert-butyl-5-methyl-4-hydroxyphenyl) propionate]
  • the blending amount (content) is preferably 0.05 to 3 parts by mass, more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the polyamide resin. 2 parts by mass. If it is less than 0.05 part by mass, the effect of preventing thermal discoloration is insufficient, while if it exceeds 3 parts by mass, the effect may reach saturation or blooming on the surface of the molded product may occur.
  • the phosphorus antioxidant is at least one selected from inorganic and organic phosphorus antioxidants.
  • inorganic phosphorus antioxidants include hypophosphites such as sodium hypophosphite and phosphites.
  • organic phosphorus antioxidant commercially available organic phosphorus antioxidants such as phosphites can be used, but organic phosphorus-containing compounds that do not generate phosphoric acid by thermal decomposition are preferable. As such organic phosphorus-containing compounds, known compounds can be used.
  • the blending amount (content) is preferably 0.05 to 3 parts by weight, more preferably 0.1 to 2 parts by weight with respect to 100 parts by weight of the polyamide resin. Part. If the amount is less than 0.05 parts by mass, the effect of preventing thermal discoloration is insufficient. On the other hand, if the amount exceeds 3 parts by mass, flashing may occur in the molded product. In the present invention, it is preferable to use inorganic and organic phosphorus antioxidants in combination because the amount of the antioxidant can be reduced.
  • amine-based antioxidant that can be used in the present invention
  • known compounds can be used.
  • Secondary arylamines can also be mentioned as amine-based antioxidants.
  • secondary arylamine is meant an amine compound containing two carbon radicals chemically bonded to a nitrogen atom, wherein at least one, preferably both carbon radicals are aromatic.
  • the blending amount (content) is preferably 0.05 to 3 parts by mass, more preferably 0.1 to 2 parts by mass with respect to 100 parts by mass of the polyamide resin. Part. If it is less than 0.05 part by mass, the effect of preventing thermal discoloration is insufficient, while if it exceeds 3 parts by mass, the effect may reach saturation or blooming on the surface of the molded product may occur.
  • sulfur-based antioxidant that can be used in the present invention, known compounds can be used.
  • the blending amount (content) is preferably 0.05 to 3 parts by weight, more preferably 0.1 to 2 parts by weight with respect to 100 parts by weight of the polyamide resin. Part. If it is less than 0.05 part by mass, the effect of preventing thermal discoloration is insufficient, while if it exceeds 3 parts by mass, the effect may reach saturation or blooming on the surface of the molded product may occur.
  • the light stabilizer that can be used in the present invention is preferably one or more hindered amine type light stabilizers (HALS).
  • HALS is a compound derived from a substituted piperidine compound, in particular a compound derived from an alkyl-substituted piperidinyl or piperazinone compound, and an alkoxy-substituted piperidinyl compound.
  • a known compound can be used.
  • a mixture of secondary arylamine and HALS can be used.
  • Preferred embodiments comprise at least two co-stabilizers, at least one selected from secondary arylamines and at least one selected from the group of HALS.
  • the total blending amount is preferably 0.5 to 10 parts by mass, more preferably 0.5 to 3 parts per 100 parts by mass of the polyamide resin. Part by mass. If the amount is less than 0.5 parts by mass, the effect of improving the heat aging resistance is insufficient. On the other hand, if the amount exceeds 10 parts by mass, the effect may be saturated or blooming may occur on the surface of the molded product.
  • the strength, rigidity, heat resistance and the like can be significantly improved by adding a filler.
  • a filler include glass fiber, carbon fiber, metal fiber, aramid fiber, asbestos, potassium titanate whisker, wollastonite, glass flake, glass beads, talc, mica, clay, calcium carbonate, barium sulfate, oxidation Examples thereof include titanium and aluminum oxide. Among them, chopped strand type glass fibers are preferably used.
  • the blending amount (content) is preferably 5 to 140 parts by weight, particularly preferably 5 to 100 parts by weight with respect to 100 parts by weight of the thermoplastic resin.
  • ultraviolet absorbers for example, resorcinol, salicylate, benzotriazole, benzophenone, etc.
  • lubricants and mold release agents for example, nucleating agents, plasticizers, and the like within a range not impairing the object of the present invention.
  • One or more conventional additives such as an antistatic agent and a colorant containing a dye / pigment can be added up to about 5 parts by mass with respect to 100 parts by mass of the polyamide resin.
  • the polyamide resin composition of the present invention can contain each of the components described above, but in the composition excluding the filler, 90% by mass or more in total of the polyamide resin and the metal salt of acetic acid. It is preferable to occupy 95% by mass or more.
  • the method for incorporating the metal salt of acetic acid and other additives in the present invention into the polyamide resin is not particularly limited, and may be performed by any method. For example, after all the components are premixed, the method is kneaded in an extruder or kneader, or the other components are kneaded and blended with pellets obtained by kneading any number of components in advance in an extruder or kneader. Is mentioned.
  • the tensile strength retention after heat treatment at 200 ° C. for 1000 hours of a molded product obtained by injection molding of the polyamide resin composition of the present invention can be 80% or more.
  • the molded product is a test piece molded in accordance with the description in the following example section, and the heat treatment is a process performed in the procedure described in the following example section.
  • the tensile strength retention is the retention of the tensile strength after the heat treatment relative to the tensile strength of the test piece before the heat treatment.
  • the tensile strength retention is more preferably 85% or more.
  • the polyamide resin composition of the present invention can be formed into a molded body by a so-called hollow method represented by injection molding, extrusion molding, thermoforming, compression molding, blow molding, die slide molding or the like.
  • these molded products can be formed into molded products by secondary processing, for example, welding methods including vibration welding, hot plate welding, ultrasonic welding, and the like.
  • it is an injection-molded or blow-molded body, and a molded body by secondary processing thereof.
  • Examples of uses of the molded article of the polyamide resin composition of the present invention include, in the automobile and vehicle fields, for example, a cylinder head cover, an engine cover, an intercooler housing, a valve, an end cap, a caster, a trolley part, etc.
  • intake pipes air ducts
  • intake system parts such as intake manifolds, connectors, gears, fan wheels, coolant storage containers, housings or housing parts for heat exchangers, radiators, thermostats, coolants and water pumps, Heater, fastening element, oil pan, exhaust system such as muffler and catalytic converter housing, timing chain belt front cover, gear box, bearing, gasoline cap, seat parts, headrest, door handle, wire Such as over parts, and the like.
  • circuit board components housings, films, conductors, switches, terminal strips, relays, resistors, capacitors, coils, lamps, diodes, LEDs, transistors, connectors, controllers, memories, bolts, coil bobbins , Plugs, plug parts, mechatronic parts, cooking equipment, washing machine, refrigerator, air conditioner and other home appliance parts, sensors and the like.
  • Heat aging test The test piece was heat-treated in a recirculation air oven (manufactured by Nagano Kagaku Kikai Co., Ltd., hot air circulation dryer NH-401S) according to the procedure detailed in ISO2578. The specimens were removed from the oven at 200 ° C. environment for a predetermined test time (500 hours, 1000 hours), cooled to room temperature and sealed in an aluminum lined bag until ready for testing. Subsequently, the tensile strength and the tensile elongation at break were measured according to ISO527-1,2. The average value obtained from three test pieces was adopted.
  • the retention rate of tensile strength and tensile elongation at break is the retention rate after heat treatment for 500 hours and 1000 hours when the initial value without heat treatment is 100%.
  • Examples 1 to 7, Comparative Examples 1 to 7 The resin compositions described as Examples and Comparative Examples were prepared by blending the above raw materials at the ratios (mass ratios) shown in Table 1 using a twin-screw extruder (STS35 manufactured by Coperion Co., Ltd.), and melt-kneading them. To obtain pellets (diameter: about 2.5 mm ⁇ length: about 2.5 mm). The obtained pellets were used after drying at 100 ° C. for 4 hours or more in a hot air circulation dryer. The evaluation results are shown in Table 1.
  • Examples 1 to 7 have high initial tensile strength (before heat treatment) and tensile elongation at break, and the tensile strength retention after heat treatment at 200 ° C. for 500 hours and 1000 hours is a high value of 80% or more.
  • the tensile rupture elongation retention rate is as high as 70% or more.
  • Comparative Example 6 is a case where only a phenolic antioxidant and cupric bromide were added, but the tensile strength retention rate and tensile fracture elongation retention rate after 1000 hours at 200 ° C. ⁇ 500 hours were greatly reduced. is doing.
  • Comparative Example 1 is a case where the amount of metal acetate added is small, but the tensile strength retention rate and tensile fracture elongation retention rate after 200 ° C. ⁇ 500 hours and 1000 hours are significantly reduced.
  • Comparative Examples 2, 3, 4, 5, and 7 are cases where iron oxide (II), iron oxide (III), iron chloride (II), phthalocyanine iron (II), and aluminum acetate were added, respectively. ⁇ The tensile strength retention and tensile rupture elongation retention after 500 hours and 1000 hours are significantly reduced.
  • the polyamide resin composition obtained according to the present invention has an environment at 200 ° C. because the heat aging resistance in a high temperature environment of about 200 ° C. can be easily and stably improved. It can be used for parts of automobiles and electrical / electronic products that may be exposed to

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention fournit une composition de résine polyamide qui permet de développer une résistance au vieillissement à la chaleur stable y compris dans un environnement à haute température de 200°, qui présente une excellente résistance mécanique, et dont la fabrication est facile. Cette composition de résine polyamide est caractéristique en ce qu'elle comprend 0,1 à 10 parties en masse d'un sel métallique d'un acide acétique pour 100 parties en masse d'une résine polyamide. Le métal dudit sel métallique consiste en au moins un élément choisi parmi un métal alcalin, un métal alcalino-terreux, et les métaux de transition des groupes VB, VIB, VIIB et VIIIB du tableau périodique.
PCT/JP2017/002470 2016-01-29 2017-01-25 Composition de résine polyamide résistante à la chaleur Ceased WO2017131008A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017510684A JPWO2017131008A1 (ja) 2016-01-29 2017-01-25 耐熱性ポリアミド樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-015382 2016-01-29
JP2016015382 2016-01-29

Publications (1)

Publication Number Publication Date
WO2017131008A1 true WO2017131008A1 (fr) 2017-08-03

Family

ID=59398739

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/002470 Ceased WO2017131008A1 (fr) 2016-01-29 2017-01-25 Composition de résine polyamide résistante à la chaleur

Country Status (2)

Country Link
JP (1) JPWO2017131008A1 (fr)
WO (1) WO2017131008A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114031793A (zh) * 2021-10-27 2022-02-11 上海金发科技发展有限公司 一种聚酰胺组合物及其制备方法和应用

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434361A (en) * 1977-08-03 1979-03-13 Allied Chem Highly impact resistant nylon molding composition
JPS5922923A (ja) * 1982-07-06 1984-02-06 バスフ　アクチェン　ゲゼルシャフト 収縮の少ないポリアミド成形品の製法
JPS5991147A (ja) * 1982-11-16 1984-05-25 Teijin Ltd ポリエステル組成物
JP2001200123A (ja) * 2000-01-20 2001-07-24 Nippon Synthetic Chem Ind Co Ltd:The 樹脂組成物ペレットおよび成形物
WO2007139200A1 (fr) * 2006-05-31 2007-12-06 Mitsubishi Gas Chemical Company, Inc. Formule de résine polyamide
WO2011145497A1 (fr) * 2010-05-17 2011-11-24 三菱瓦斯化学株式会社 Composition de résine de polyamide
WO2011145498A1 (fr) * 2010-05-17 2011-11-24 三菱瓦斯化学株式会社 Composition de résine polyamide
WO2012090797A1 (fr) * 2010-12-27 2012-07-05 三菱瓦斯化学株式会社 Composition de polyamide
WO2012115171A1 (fr) * 2011-02-24 2012-08-30 三菱瓦斯化学株式会社 Mélange-maître et procédé de préparation d'une composition de résine de polyamide à l'aide du mélange-maître
JP2012224844A (ja) * 2011-04-04 2012-11-15 Nippon Synthetic Chem Ind Co Ltd:The 樹脂組成物およびそれを用いた多層構造体
WO2014034624A1 (fr) * 2012-08-31 2014-03-06 三菱瓦斯化学株式会社 Composition de résine de polyamide et son procédé de fabrication

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434361A (en) * 1977-08-03 1979-03-13 Allied Chem Highly impact resistant nylon molding composition
JPS5922923A (ja) * 1982-07-06 1984-02-06 バスフ　アクチェン　ゲゼルシャフト 収縮の少ないポリアミド成形品の製法
JPS5991147A (ja) * 1982-11-16 1984-05-25 Teijin Ltd ポリエステル組成物
JP2001200123A (ja) * 2000-01-20 2001-07-24 Nippon Synthetic Chem Ind Co Ltd:The 樹脂組成物ペレットおよび成形物
WO2007139200A1 (fr) * 2006-05-31 2007-12-06 Mitsubishi Gas Chemical Company, Inc. Formule de résine polyamide
WO2011145497A1 (fr) * 2010-05-17 2011-11-24 三菱瓦斯化学株式会社 Composition de résine de polyamide
WO2011145498A1 (fr) * 2010-05-17 2011-11-24 三菱瓦斯化学株式会社 Composition de résine polyamide
WO2012090797A1 (fr) * 2010-12-27 2012-07-05 三菱瓦斯化学株式会社 Composition de polyamide
WO2012115171A1 (fr) * 2011-02-24 2012-08-30 三菱瓦斯化学株式会社 Mélange-maître et procédé de préparation d'une composition de résine de polyamide à l'aide du mélange-maître
JP2012224844A (ja) * 2011-04-04 2012-11-15 Nippon Synthetic Chem Ind Co Ltd:The 樹脂組成物およびそれを用いた多層構造体
WO2014034624A1 (fr) * 2012-08-31 2014-03-06 三菱瓦斯化学株式会社 Composition de résine de polyamide et son procédé de fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114031793A (zh) * 2021-10-27 2022-02-11 上海金发科技发展有限公司 一种聚酰胺组合物及其制备方法和应用
CN114031793B (zh) * 2021-10-27 2024-04-30 上海金发科技发展有限公司 一种聚酰胺组合物及其制备方法和应用

Also Published As

Publication number Publication date
JPWO2017131008A1 (ja) 2018-11-15

Similar Documents

Publication Publication Date Title
JP7092026B2 (ja) ポリアミド樹脂組成物
TWI631179B (zh) 聚醯胺樹脂組成物及聚醯胺樹脂之耐熱老化性改善方法
JP6841038B2 (ja) 耐熱老化性ポリアミド樹脂組成物、及びポリアミド樹脂の耐熱老化性向上方法
JP6424649B2 (ja) ガスバリア性成形体
JP6672736B2 (ja) 耐熱老化性ポリアミド樹脂組成物及びその製造方法
JP7567353B2 (ja) ポリアミド樹脂組成物
WO2017131008A1 (fr) Composition de résine polyamide résistante à la chaleur
JP6802527B2 (ja) 高溶融粘度ポリアミド樹脂組成物
JP6915323B2 (ja) ポリアミド樹脂組成物、及びそれからなるウェルド部を有する成形品
JP6575199B2 (ja) 耐熱老化性ポリアミド樹脂組成物
JP6586807B2 (ja) 耐熱老化性ポリアミド樹脂組成物
JP6926554B2 (ja) ポリアミド樹脂組成物、及びそれからなるウェルド部を有する成形品
WO2016017472A1 (fr) Composition de résine polyamide
JP2018188560A (ja) ガラス繊維強化ポリアミド樹脂組成物
JP6064509B2 (ja) ポリアミド樹脂組成物
WO2017130931A1 (fr) Composition de résine de polyamide résistante au vieillissement thermique
JPH02228358A (ja) ポリアミド樹脂組成物

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2017510684

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17744238

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17744238

Country of ref document: EP

Kind code of ref document: A1