WO2019010607A1 - Procédé de pelage et dispositif de pelage pour substrat flexible - Google Patents

Procédé de pelage et dispositif de pelage pour substrat flexible Download PDF

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Publication number
WO2019010607A1
WO2019010607A1 PCT/CN2017/092372 CN2017092372W WO2019010607A1 WO 2019010607 A1 WO2019010607 A1 WO 2019010607A1 CN 2017092372 W CN2017092372 W CN 2017092372W WO 2019010607 A1 WO2019010607 A1 WO 2019010607A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
glass substrate
section
intercepting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/092372
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English (en)
Chinese (zh)
Inventor
曹荣
刘志强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2017/092372 priority Critical patent/WO2019010607A1/fr
Priority to CN201780058750.6A priority patent/CN109791319B/zh
Publication of WO2019010607A1 publication Critical patent/WO2019010607A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a peeling method and a stripping device for a flexible substrate.
  • the manufacturing process of the flexible substrate in order to peel the flexible substrate from the glass substrate, it is usually required to irradiate the contact surface of the flexible substrate and the glass substrate by laser, thereby destroying the adsorption force of the contact surface, and then cutting the glass substrate and the flexible display by using a cutter.
  • the flexible substrate is further peeled off, and the peeling process and the peeling apparatus of the flexible substrate are complicated, and the manufacturing cost of the flexible substrate is high.
  • Embodiments of the present invention provide a peeling method and a peeling apparatus for a flexible substrate.
  • the peeling method of the flexible substrate according to the embodiment of the present invention is for peeling off the flexible substrate and the glass substrate, and the peeling method includes:
  • the clipped section and the flexible substrate are moved to separate the cut-out section from the glass substrate and peel off the flexible substrate from the glass substrate.
  • the stripping method further comprises: before the intercepting the predetermined size of the glass substrate as an intercepting segment:
  • the glass substrate and the flexible substrate are placed on a carrying platform, the flexible substrate being located between the glass substrate and the carrying platform.
  • the cutting the predetermined size of the glass substrate is a cutting section by applying pressure to a side of the glass substrate opposite to the flexible substrate to form a crack on the glass substrate.
  • the crack separates the glass substrate into the intercepting section and the retaining section.
  • the stripping method further comprises: after the intercepting the predetermined size of the glass substrate as an intercepting segment:
  • the glass substrate and the flexible substrate are moved to separate the flexible substrate from the carrier platform.
  • the glass substrate further includes a retention segment, the moving the glass substrate and the flexible substrate being achieved by moving the glass substrate and the flexible substrate after adsorbing the retention segment.
  • the stripping method further comprises:
  • the intercepting segment and the flexible substrate corresponding to the intercepting segment are cut.
  • the stripping device of the flexible substrate of the embodiment of the present invention is used for peeling off the flexible substrate and the glass substrate, and the stripping device comprises:
  • An intercepting device for intercepting the glass substrate of a predetermined size as an intercepting segment
  • a clamping device for clamping the intercepting section and the flexible substrate corresponding to the intercepting section, and moving the clipped section and the flexible substrate to be The intercepting section separates from the glass substrate and peels off the flexible substrate and the glass substrate.
  • the stripping apparatus further includes a carrying platform for carrying the glass substrate and the flexible substrate, the flexible substrate being located between the glass substrate and the carrying platform.
  • the intercepting device includes a cutter wheel for applying pressure on a side of the glass substrate opposite the flexible substrate to form a crack on the glass substrate, The crack separates the glass substrate into the intercepting section and the retaining section.
  • the stripping apparatus further includes a gripping device for gripping the glass substrate and moving the glass substrate and the flexible substrate such that the flexible substrate The carrier platform is separated.
  • the glass substrate further includes a retention section, the gripping device including an adsorption platform for generating a negative pressure and adsorbing the retention section to grasp the retention section.
  • the stripping apparatus further includes a carrier platform for carrying the separated section and the stripped flexible substrate, the stripping apparatus further comprising a cutting device, A cutting device is used to cut the intercepting segment and the flexible substrate corresponding to the intercepting segment.
  • the flexible substrate and the glass substrate are directly peeled off by sandwiching the cut-off section and the corresponding flexible substrate, and the peeling process and the peeling apparatus are relatively simple, and the manufacturing cost of the flexible substrate is low.
  • FIG. 1 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
  • FIG. 2 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
  • FIG. 3 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
  • FIG. 4 is a schematic flow chart of a peeling method according to an embodiment of the present invention.
  • FIG. 5 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
  • FIG. 6 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
  • FIG. 7 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
  • FIG. 8 is a schematic view showing a peeling scene of a flexible substrate according to an embodiment of the present invention.
  • Stripping device 10 cutting device 11, cutter wheel 111, clamping device 12, upper clamping plate 121, lower clamping plate 122, carrying platform 13, gripping device 14, adsorption platform 141, suction cup 1411, cutting device 15, flexible substrate 20, edge The region 21, the glass substrate 30, the intercepting section 31, and the retaining section 32.
  • the first feature "on” or “under” the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.
  • the peeling method of the flexible substrate 20 of the embodiment of the present invention is used for peeling off the flexible substrate 20 and the glass substrate 30 .
  • the peeling method includes the following steps:
  • the peeling apparatus 10 of the flexible substrate 20 of the embodiment of the present invention can be used to peel off the flexible substrate 20 and the glass substrate 30, and the peeling apparatus 10 includes the cutting device 11 and the holding device 12.
  • the intercepting device 11 can be used to implement step S1, and the clamping device 12 can be used to implement steps S3 and S5. That is, the intercepting device 11 can be used to intercept the glass substrate 30 of a predetermined size as the intercepting segment 31.
  • the clamping device 12 can be used to grip the intercepting section 31 and the flexible substrate 20 corresponding to the intercepting section 31, and to move the clamped section 31 and the flexible substrate 20 to separate the cutting section 31 from the glass substrate 30 and peel off the flexible substrate. 20 and glass substrate 30.
  • the peeling method and the peeling device 10 of the flexible substrate 20 according to the embodiment of the present invention directly peel the flexible substrate 20 from the glass substrate 30 by sandwiching the cut-off section 31 and the corresponding flexible substrate 20, and the peeling process and the peeling apparatus 10 are relatively simple and flexible.
  • the manufacturing cost of the substrate 20 is low.
  • the flexible substrate 20 may be an OLED screen.
  • a flexible substrate is required to be fabricated on the glass substrate 30, and a device layer, a protective layer, and the like are prepared on the flexible substrate to form the flexible substrate 20. Then, the flexible substrate 20 needs to be removed from the glass substrate. 30 peeled off.
  • the peeling method of the embodiment of the present invention does not need to first break the bonding force between the flexible substrate 20 and the glass substrate 30 by laser irradiation or the like, and does not need to be cut between the glass substrate 30 and the flexible substrate 20 by using a special cutter.
  • the peeling process of the flexible substrate 20 is relatively simple.
  • the stripping apparatus 10 does not need to be provided with a laser that emits laser light, and does not need to be equipped with a cutter that cuts between the glass substrate 30 and the flexible substrate 20, and the structure of the peeling device 10 It is simpler and saves the manufacturing cost of the flexible substrate 20.
  • the intercepting section 31 may be reserved when the flexible substrate 20 is attached to the glass substrate 30, and the intercepting section 31 may be reserved at the edge position of the glass substrate 30 so that the intercepting section 31 is intercepted and clamped.
  • the flexible substrate 20 includes an edge region 21 corresponding to the intercepting segment 31, and the edge region 21 is located at an edge position of the flexible substrate 20.
  • the edge region 21 facilitates the operation of the flexible substrate 20 by the stripping device 10, such as fixing, clamping, The operation of moving the flexible substrate 20 or the like prevents the remaining area of the flexible substrate 20 from being too much contact with the peeling device 10 during the production process to be damaged.
  • no device layer is prepared on the edge region 21, and the edge region 21 does not affect the use function of the flexible substrate 20.
  • the flexible substrate 20 can be edged before leaving the factory. 21 cut.
  • the thickness of the flexible substrate 20 is thin and soft, that is, the flexible substrate 20 is relatively weak and easily deformed and difficult to be clamped separately, and since the hardness of the cutting section 31 is relatively large and flat, the clamping device 12 is At the same time, the intercepting section 31 and the edge section 21 are relatively stable, so that the edge region 21 can pull the entire flexible substrate 20 away from the glass substrate 30 when the clamping device 12 is moved.
  • the stripping method further includes step S0 before step S1: placing the glass substrate 30 and the flexible substrate 20 on the carrying platform 13, the flexible substrate 20 being located on the glass substrate 30 and carrying Between platforms 13.
  • the stripping device 10 of the embodiment of the present invention further includes a carrying platform 13 for carrying the glass substrate 30 and the flexible substrate 20, and the flexible substrate 20 is located between the glass substrate 30 and the carrying platform 13.
  • the glass substrate 30 can be fixed on the carrying platform 13, for example, a fixing groove can be formed on the carrying platform 13, and the glass substrate 30 can be placed on the carrying platform 13, and the air in the fixing groove can be extracted. A negative pressure is formed in the fixing groove to adsorb the glass substrate 30.
  • the flexible substrate 20 is then prepared on the glass substrate 30.
  • the preparation of the flexible substrate 20 is completed, when the flexible substrate 20 and the glass substrate 30 need to be peeled off, the glass substrate 30 is flat from the carrier. After the stage 13 is removed, the glass substrate 30 and the flexible substrate 20 are turned over, and then the glass substrate 30 and the flexible substrate 20 are placed on the carrying platform 13. At this time, the flexible substrate 20 is brought into contact with the carrier platform 13, and the glass substrate 30 is placed above the flexible substrate 20, and the glass substrate 30 is easily taken out.
  • step S1 is performed by applying pressure to a side of the glass substrate 30 opposite to the flexible substrate 20 to form a crack on the glass substrate 30, and the crack separates the glass substrate 30.
  • the segment 31 and the reserved segment 32 are intercepted.
  • the intercepting device 11 further includes a cutter wheel 11 for applying pressure on a side of the glass substrate 30 opposite to the flexible substrate 20 to form a crack on the glass substrate 30, the crack will be glass
  • the substrate 30 is divided into a cut-out section 31 and a retaining section 32.
  • the cutter wheel 11 is a cutting tool, and the cutter wheel 11 can form a crack on the article to be cut, so that the object to be cut is separated along the crack.
  • the material of the cutter wheel 11 can be a hard material such as diamond, and the cutter wheel 11 can be It has a disc shape. It can be understood that the material of the glass substrate 30 may be glass, and the glass has greater brittleness. After a crack is cut on the surface of the glass substrate 30, the crack easily extends in the thickness direction of the glass substrate 30, that is, the glass substrate 30 is easily removed. Split along the crack. The crack divides the glass substrate 30 into the intercepting section 31 and the retaining section 32.
  • the area of the intercepting section 31 can be minimized and increased on the basis of ensuring the peeling effect.
  • the area of the segment 32 is largely retained, and the retention segment 32 is easily recycled after the flexible substrate 20 is peeled off from the glass substrate 30.
  • the retention segment 32 can be used as the glass substrate 30 for manufacturing another flexible substrate 20.
  • step S1 the intercepting segment 31 may not be completely separated from the retaining segment 32, for example, only a crack is formed between the intercepting segment 31 and the retaining segment 32, so as to separate the two by external force in the subsequent process.
  • the intercepting segment 31 and the retaining segment 32 can be completely separated, which is not limited herein.
  • the stripping method further includes step S2 after step S1 : moving the glass substrate 30 and the flexible substrate 20 to separate the flexible substrate 20 from the carrying platform 13 .
  • the stripping device 10 further includes a gripping device 14 that can be used to implement step S2. That is, the gripping device 14 is used to grasp the glass substrate 30 and move the glass substrate 30 and the flexible substrate 20 to separate the flexible substrate 20 from the carrying platform 13.
  • the flexible substrate 20 Since the flexible substrate 20 is relatively weak, the flexible substrate 20 is easily damaged by contact with the carrying platform 13 for a long time. Therefore, after the intercepting of the cutting section 31 is completed, the flexible substrate 20 needs to be separated from the carrying platform 13 to avoid the flexible substrate 20 being subjected to. damage. Moreover, since the glass substrate 30 is less susceptible to damage than the flexible substrate 20, the gripping device 14 is preferably used to grasp the glass substrate 30 to drive the flexible substrate 20 away from the carrier platform 13.
  • the glass substrate 30 and the flexible substrate 20 can be moved upward to separate the flexible substrate 20 from the carrying platform 13 to avoid friction between the flexible substrate 20 and the carrying platform 13 and damage the flexible substrate 20 during the moving process.
  • sufficient operating space can be reserved for the subsequent clamping, moving intercepting section 31 and edge zone 31.
  • the glass substrate 30 further includes a retention section 32.
  • the moving glass substrate 30 and the flexible substrate 20 are realized by moving the glass substrate 30 and the flexible substrate 20 after adsorbing the retention section 32.
  • the gripping device 14 includes an adsorption platform 141 for generating a negative pressure and adsorbing the retention section 32 to grasp the retention section 32.
  • the adsorption platform 141 includes a plurality of suction cups 1411, each of which is in communication with a vacuum pump. Opening the vacuum pump can evacuate the air in the suction cup 1411 to form a negative pressure in the suction cup 1411, and the adsorption platform 141 is close to the glass substrate 30 until the retention section 32 is adsorbed on the suction cup 1411, and then the adsorption platform 141 is moved to move the glass substrate 30 and the flexibility. Substrate 20.
  • the suction force of the suction cup 1411 can be adjusted by adjusting the power of the vacuum pump.
  • the retention section 32 can be placed on the carrier platform 13, and then the vacuum pump can be closed and the suction cup 1411 communicated with the atmosphere. After the adsorption force of the retaining section 32 disappears, the adsorption stage 141 is removed.
  • the adsorption platform 141 Since the adsorption platform 141 passes the adsorption retention section 32 to fix the glass substrate 30, the adsorption platform 141 does not affect the operation of the subsequent stripping device 10 on the intercepting section 31.
  • the clamping device 12 can be a movable robot.
  • the clamping device 12 includes an upper clamping plate 121 and a lower clamping plate 122.
  • the clamping device 12 is first moved, so that the cutting section 31 and The edge region 21 is located between the upper and lower plates 121 and 122.
  • the upper plate 121 or the lower plate 122 is moved again, or the upper plate 121 and the lower plate 122 are simultaneously moved, so that the upper plate 121 comes into contact with the intercepting section 31, and the lower plate 122 contacts the flexible substrate 20 and clamps the cutting section 31 and the edge section 21.
  • the overall rotation of the clamping device 12 can be controlled to completely separate the intercepting section 31 from the retaining section 32. Specifically, since the glass substrate 30 has formed a crack in the step S1, when the cutting section 31 is held and the intercepting section 31 is broken by an external force, the crack extends in the thickness direction of the glass substrate 30 and the glass substrate 30 is completely divided into the intercepting section. 31 and retain segment 32.
  • the clamping device 12 can be controlled to move to disengage the flexible substrate 20 from the retention section 32.
  • the position of the flexible substrate 20 to be peeled off from the glass substrate 30 is D
  • the length of the flexible substrate 20 that has been peeled off is L
  • the tangent of the arc of the holding device 12 along the circle D and with the radius of L can be controlled.
  • the flexible substrate 20 After clamping the intercepting section 31 and the edge zone 21, and during the movement of the intercepting section 31 and the edge zone 21, the flexible substrate 20 is never in contact with the carrying platform 13, reducing the flexible substrate 20 and the carrying platform 13 during the peeling process.
  • the interaction force reduces the likelihood of the flexible substrate 20 being damaged by the carrier platform 13.
  • the peeling method further comprises the steps of:
  • the stripping apparatus 10 further includes a carrier platform 13 for carrying the separated cut-out section 31 and the stripped flexible substrate 20, the stripping apparatus 10 further comprising a cutting device 15.
  • the clamping device 12 and the cutting device 15 can be used to implement steps S6 and S7. That is, the gripping device 12 can be used to place the separated cut-out section 31 and the peeled flexible substrate 20 on the carrier platform 13.
  • the cutting device 15 can be used to cut off the cut-out section 31 and the flexible substrate 20 corresponding to the cut-out section 31.
  • the edge region 21 is directly cut away together with the intercepting segment 31, eliminating the need to separate the edge region 21 from the intercepting segment 31, simplifying the peeling process of the flexible substrate 20, and the edge region 21 does not affect the subsequent manufacture and use of the flexible substrate 20.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • a plurality means at least two, for example two, three, unless specifically defined otherwise.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

La présente invention concerne un procédé de pelage et un dispositif de pelage (10) pour un substrat flexible (20). Le procédé de pelage permet de peler le substrat flexible (20) et un substrat de verre (30). Ce procédé de pelage consiste : (S1) à couper une taille prédéfinie du substrat de verre (30) pour servir de section de coupure (31) ; (S3) à serrer la section de coupure (31) et ledit substrat flexible (20) correspondant à la section de coupure (31) ; et (S5) à déplacer cette section de coupure (31) serrée et le substrat flexible (20), de façon à ce que la section de coupure (31) soit séparée du substrat de verre (30), et que le substrat flexible (20) et le substrat de verre (30) soient pelés.
PCT/CN2017/092372 2017-07-10 2017-07-10 Procédé de pelage et dispositif de pelage pour substrat flexible Ceased WO2019010607A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2017/092372 WO2019010607A1 (fr) 2017-07-10 2017-07-10 Procédé de pelage et dispositif de pelage pour substrat flexible
CN201780058750.6A CN109791319B (zh) 2017-07-10 2017-07-10 柔性基板的剥离方法和剥离设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/092372 WO2019010607A1 (fr) 2017-07-10 2017-07-10 Procédé de pelage et dispositif de pelage pour substrat flexible

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WO2019010607A1 true WO2019010607A1 (fr) 2019-01-17

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CN (1) CN109791319B (fr)
WO (1) WO2019010607A1 (fr)

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CN112340522A (zh) * 2019-08-09 2021-02-09 格力电器（石家庄）有限公司 海绵贴装装置、生产线
WO2022178677A1 (fr) * 2021-02-23 2022-09-01 京东方科技集团股份有限公司 Système de pelage et procédé de pelage pour module d'empreinte digitale flexible

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112340522A (zh) * 2019-08-09 2021-02-09 格力电器（石家庄）有限公司 海绵贴装装置、生产线
WO2022178677A1 (fr) * 2021-02-23 2022-09-01 京东方科技集团股份有限公司 Système de pelage et procédé de pelage pour module d'empreinte digitale flexible

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CN109791319B (zh) 2022-05-17

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