WO2019138564A1 - Dissipateur thermique - Google Patents

Dissipateur thermique Download PDF

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Publication number
WO2019138564A1
WO2019138564A1 PCT/JP2018/000746 JP2018000746W WO2019138564A1 WO 2019138564 A1 WO2019138564 A1 WO 2019138564A1 JP 2018000746 W JP2018000746 W JP 2018000746W WO 2019138564 A1 WO2019138564 A1 WO 2019138564A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
heat dissipating
fin
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/000746
Other languages
English (en)
Japanese (ja)
Inventor
平田　幹人
哲 石坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to KR1020207019646A priority Critical patent/KR102434571B1/ko
Priority to CN201880076912.3A priority patent/CN111567155B/zh
Priority to JP2019564257A priority patent/JP7004746B2/ja
Priority to PCT/JP2018/000746 priority patent/WO2019138564A1/fr
Priority to TW107114247A priority patent/TWI664896B/zh
Publication of WO2019138564A1 publication Critical patent/WO2019138564A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Definitions

  • the present invention relates to a heat sink, and more particularly to a heat sink provided with heat dissipating fins.
  • the heat sink has come to behave as a radiation source of electromagnetic noise. That is, noise is superimposed on the heat sink by conducting the noise of the printed circuit board to the heat sink, or, for example, by coupling the component or wiring on the printed circuit board with the heat sink, the heat sink acts as an antenna, and the noise is secondary.
  • the radiation may cause a system malfunction.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide a heat sink capable of achieving design freedom and reducing electromagnetic noise.
  • the portion of one of the plurality of radiation fins and the portion of the other radiation fin are electrically connected by the conductive member It is done.
  • the impedance on the open end side of the plurality of heat radiation fins can be reduced, and the electromagnetic noise can be returned to any of the signal ground potential, the frame ground potential and the ground of the printed circuit board.
  • the degree of freedom in design can be achieved and the strength of the electromagnetic noise can be reduced without being restricted by the wavelength of the electromagnetic wave and without being restricted by the material of the radiation fin.
  • FIG. 16 is an enlarged perspective view showing another example of the connection member in the embodiment. It is a perspective view which shows an example of the state in which the heat sink which concerns on Embodiment 5 of this invention was mounted in the printed circuit board.
  • Embodiment 1 The heat sink according to the first embodiment will be described.
  • the heat sink 1 is mounted on, for example, a printed circuit board 51.
  • An electronic component 53 is mounted on the printed circuit board 51.
  • the heat sink 1 is disposed in contact with the electronic component 53.
  • the heat generated from the electronic component 53 such as a large scale integrated circuit is dissipated through the heat sink 1.
  • the structure of the heat sink 1 will be described in detail.
  • the heat sink 1 includes a base portion 3, a gap securing member 5, a plurality of heat radiation fins 7, and an upper sheet metal 9 as a conductive member.
  • the base portion 3 is flat and has a constant thickness.
  • the gap securing member 5 secures a space between the base portion 3 and the printed circuit board 51 such that the base portion 3 contacts or approaches the electronic component 53.
  • base member 3 and printed circuit board 51 can be electrically connected by separately providing a conductive member such as a screw, an on-board contact or a gasket. It may be connected to
  • Each of the plurality of heat dissipating fins 7 has a width W in the X direction, and has a length H extending in the Z direction.
  • Each of the plurality of heat dissipating fins 7 has a first end 7 a and a second end 7 b opposite to each other across the length H.
  • the plurality of radiation fins 7 are disposed in the base portion 3 at an interval from each other in the Y direction.
  • the first end 7 a of the radiation fin 7 is fixed to the base 3.
  • the second end 7 b side of the radiation fin 7 is an open end side.
  • the plurality of heat dissipating fins 7 are formed of the same metal material, which has high thermal conductivity and high conductivity. Moreover, as for several radiation fin 7, it is desirable to form from the same size. The same size is not intended to be completely the same, but includes a manufacturing error.
  • the heat dissipating fins 7 are preferably made of, for example, aluminum, an aluminum alloy, copper or the like.
  • the impedance at the open end side of the plurality of heat radiation fins 7 can be reduced. Furthermore, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground through the base portion 3 and the gap securing member 5.
  • the open end sides of the plurality of heat radiation fins 7 are locked to each other by the projections 13 with a relatively narrow width. For this reason, the impedance at the open end side of the radiation fin 7 can be reduced. Further, as described in the first embodiment, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground through the base portion 3 and the gap securing member 5.
  • a pair of side surface metal plates 19 is disposed as a conductive member.
  • Each of the plurality of radiation fins 7 has a third end 7 c and a fourth end 7 d opposite to each other across the width W.
  • One side surface metal plate 19 of the pair of side surface metal plates 19 is disposed at a portion of the third end 7 c of each of the plurality of heat radiation fins 7 located on the open end side.
  • the other side surface metal plate 19 is disposed at a portion of the fourth end 7 d of each of the plurality of heat radiation fins 7 located on the open end side.
  • the side surface metal plate 19 is an alternative to the upper surface metal plates 9 and 11, etc., it is desirable that the upper portion of each of the third end 7c and the fourth end 7d of the radiation fin 7 be a position to arrange the side surface .
  • the plate-like member is mainly described as an example of the conductive member, but it is not limited to the plate-like member as long as a plurality of heat radiation fins can be electrically connected.
  • it may be in the form of a tape having conductivity.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dissipateur thermique (1) comprenant une section de base (3), des éléments de fixation d'espace (5), des ailettes de rayonnement thermique (7) et des pièces métalliques de plaque supérieure (9). Chacune des ailettes de rayonnement thermique (7) présente une largeur (W) dans une direction X et une longueur (H) dans une direction Z. Chacune des ailettes de rayonnement thermique (7) présente une première partie de bord (7a) et une seconde partie de bord (7b) opposées l'une à l'autre sur la longueur (H). Dans l'ailette de rayonnement thermique (7), la première partie de bord (7a) est fixée à la section de base (3) et la seconde partie de bord (7b) sert de côté de bord ouvert. Dans un mode qui relie la seconde partie de bord (7b) de l'une des ailettes de rayonnement thermique (7) à la seconde partie de bord (7b) d'une autre ailette de rayonnement thermique (7), chacune des pièces métalliques de plaque supérieure (9) est raccordée aux secondes parties de bord (7b) des ailettes de rayonnement thermique (7). Les pièces métalliques de plaque supérieure (9) s'étendent dans la direction Y.
PCT/JP2018/000746 2018-01-15 2018-01-15 Dissipateur thermique Ceased WO2019138564A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020207019646A KR102434571B1 (ko) 2018-01-15 2018-01-15 히트 싱크
CN201880076912.3A CN111567155B (zh) 2018-01-15 2018-01-15 散热器
JP2019564257A JP7004746B2 (ja) 2018-01-15 2018-01-15 ヒートシンク
PCT/JP2018/000746 WO2019138564A1 (fr) 2018-01-15 2018-01-15 Dissipateur thermique
TW107114247A TWI664896B (zh) 2018-01-15 2018-04-26 散熱器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/000746 WO2019138564A1 (fr) 2018-01-15 2018-01-15 Dissipateur thermique

Publications (1)

Publication Number Publication Date
WO2019138564A1 true WO2019138564A1 (fr) 2019-07-18

Family

ID=67218536

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/000746 Ceased WO2019138564A1 (fr) 2018-01-15 2018-01-15 Dissipateur thermique

Country Status (5)

Country Link
JP (1) JP7004746B2 (fr)
KR (1) KR102434571B1 (fr)
CN (1) CN111567155B (fr)
TW (1) TWI664896B (fr)
WO (1) WO2019138564A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205171A1 (fr) * 2024-03-27 2025-10-02 株式会社デンソー Dispositif électronique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101550U (fr) * 1989-01-26 1990-08-13
JPH02132993U (fr) * 1989-04-07 1990-11-05
JPH09139592A (ja) * 1995-11-15 1997-05-27 Nec Corp 電子装置の放熱構造
JP2003249611A (ja) * 2002-02-26 2003-09-05 Fujikura Ltd フィン付きヒートシンク
JP2004111727A (ja) * 2002-09-19 2004-04-08 Teac Corp ヒートシンク
JP2012227297A (ja) * 2011-04-18 2012-11-15 Sony Computer Entertainment Inc ヒートシンク及びヒートシンクを備える電子機器

Family Cites Families (14)

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JPH09116061A (ja) * 1995-10-13 1997-05-02 Mitsubishi Materials Corp 電子部品用冷却装置
JP2000305273A (ja) 1998-11-19 2000-11-02 Applied Materials Inc 遠紫外線ドライフォトリソグラフィー
JP3008942B1 (ja) 1998-11-20 2000-02-14 日本電気株式会社 電子装置の放熱構造
US7408778B2 (en) * 2006-09-11 2008-08-05 International Business Machines Corporation Heat sinks for dissipating a thermal load
JP2007281504A (ja) * 2007-06-04 2007-10-25 Fujikura Ltd ヒートシンクおよびフィンモジュール
CN101325862A (zh) * 2008-08-01 2008-12-17 北京星网锐捷网络技术有限公司 一种机箱、散热装置以及散热装置安装方法
KR101729254B1 (ko) * 2009-08-07 2017-04-24 가부시키가이샤 유에이씨제이 히트 싱크
US8765287B2 (en) * 2011-08-09 2014-07-01 Samsung Sdi Co., Ltd. Battery module
JP6168152B2 (ja) * 2013-09-05 2017-07-26 富士電機株式会社 電力用半導体モジュール
TWM504269U (zh) * 2014-11-19 2015-07-01 技嘉科技股份有限公司 板件固定結構
JP6582717B2 (ja) * 2015-08-18 2019-10-02 富士電機株式会社 電子電気機器
JP2017084883A (ja) * 2015-10-23 2017-05-18 スタンレー電気株式会社 グラファイトを用いたヒートシンク、および、発光装置
JP6274709B2 (ja) * 2016-01-21 2018-02-07 株式会社Uacj 熱交換器用ヒートシンク及び該ヒートシンクを備えた熱交換器
TWM547822U (zh) * 2017-05-17 2017-08-21 至良科技股份有限公司 散熱器固定結構及電連接器殼座組合

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101550U (fr) * 1989-01-26 1990-08-13
JPH02132993U (fr) * 1989-04-07 1990-11-05
JPH09139592A (ja) * 1995-11-15 1997-05-27 Nec Corp 電子装置の放熱構造
JP2003249611A (ja) * 2002-02-26 2003-09-05 Fujikura Ltd フィン付きヒートシンク
JP2004111727A (ja) * 2002-09-19 2004-04-08 Teac Corp ヒートシンク
JP2012227297A (ja) * 2011-04-18 2012-11-15 Sony Computer Entertainment Inc ヒートシンク及びヒートシンクを備える電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205171A1 (fr) * 2024-03-27 2025-10-02 株式会社デンソー Dispositif électronique

Also Published As

Publication number Publication date
TWI664896B (zh) 2019-07-01
KR20200095542A (ko) 2020-08-10
CN111567155B (zh) 2022-11-08
TW201933977A (zh) 2019-08-16
JPWO2019138564A1 (ja) 2020-11-26
JP7004746B2 (ja) 2022-01-21
CN111567155A (zh) 2020-08-21
KR102434571B1 (ko) 2022-08-19

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