WO2020259032A1 - 光学模组及移动终端 - Google Patents

光学模组及移动终端 Download PDF

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Publication number
WO2020259032A1
WO2020259032A1 PCT/CN2020/085675 CN2020085675W WO2020259032A1 WO 2020259032 A1 WO2020259032 A1 WO 2020259032A1 CN 2020085675 W CN2020085675 W CN 2020085675W WO 2020259032 A1 WO2020259032 A1 WO 2020259032A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical module
wiring structure
photosensitive unit
collimator
mobile terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/085675
Other languages
English (en)
French (fr)
Chinese (zh)
Inventor
曾强
易永念
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to KR1020217038593A priority Critical patent/KR102770131B1/ko
Priority to JP2021570473A priority patent/JP7394150B2/ja
Priority to ES20832796T priority patent/ES2981501T3/es
Priority to EP20832796.5A priority patent/EP3992843B1/de
Publication of WO2020259032A1 publication Critical patent/WO2020259032A1/zh
Priority to US17/550,757 priority patent/US11881046B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/147—Details of sensors, e.g. sensor lenses
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/198—Contact-type image sensors [CIS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Definitions

  • the present disclosure relates to the field of communication technology, and in particular to an optical module and a mobile terminal.
  • Optical modules such as fingerprint modules are one of the core components of mobile terminals.
  • Optical modules such as fingerprint modules are one of the core components of mobile terminals.
  • the fingerprint module in the related technology usually includes a carrier substrate, a photosensitive unit, a wiring structure, and a collimator.
  • the photosensitive unit and the wiring structure are both arranged on the side of the carrier substrate facing the collimator.
  • the sensor is located between the display screen and the photosensitive unit.
  • One side of the above-mentioned collimator is bonded to the display screen by laminating glue, and the other side is bonded to the photosensitive unit, wiring structure and carrier substrate by laminating glue.
  • the thickness of the glue on both sides of the collimator is relatively large. This results in a larger thickness of the entire optical module, and the occupied space increases accordingly.
  • the present disclosure discloses an optical module and a mobile terminal to solve the problem of large space occupied by the optical module.
  • An optical module includes a collimator, a photosensitive unit, and a wiring structure.
  • the photosensitive unit is arranged on one side surface of the collimator, and the wiring structure is arranged on the photosensitive unit away from the collimator. One side surface of the device.
  • the wiring structure is attached to the photosensitive unit.
  • a circuit protection layer is further included, and the circuit protection layer is disposed on a side surface of the wiring structure away from the photosensitive unit.
  • it further includes a circuit board, the circuit board is connected to the wiring structure, and the circuit board and the circuit protection layer are located on the same side of the wiring structure.
  • a part of the wiring structure is attached to the circuit board, and another part of the wiring structure is attached to the circuit protection layer.
  • it further includes a filter layer, and the filter layer is disposed on a surface of the collimator facing away from the photosensitive unit.
  • it further includes a filter layer, and the filter layer is disposed between the collimator and the photosensitive unit.
  • At least one of the photosensitive unit and the wiring structure is a plating structure.
  • the optical module is a fingerprint module.
  • a mobile terminal includes a display screen and an optical module arranged on the display screen, the optical module being the optical module described in any one of the above.
  • the optical module is adhered to the display screen by laminating glue.
  • the photosensitive unit and the wiring structure are directly formed on one side surface of the collimator. Therefore, the photosensitive unit and the wiring structure do not need to be bonded to the collimator through glue, and do not need to be formed for molding.
  • the photosensitive unit and the wiring structure increase the carrier substrate, so that the thickness of the entire optical module is reduced accordingly, so the optical module occupies a smaller space.
  • the distance between the photosensitive unit and the wiring structure and the display screen of the mobile terminal is smaller, so the signal strength is higher, and the optical module The photosensitive efficiency is higher.
  • FIG. 1 is a schematic structural diagram of an optical module disclosed in an embodiment of the disclosure
  • FIG. 2 is a schematic diagram of a partial structure of a mobile terminal disclosed in an embodiment of the disclosure.
  • an embodiment of the present disclosure discloses an optical module, which may specifically be a fingerprint module, and the fingerprint module can be applied to a mobile terminal to identify the user's fingerprint information, thereby facilitating user judgment Whether the access is legal to ensure the security of the mobile terminal.
  • the optical module may be installed under the display screen 600 of the mobile terminal. Specifically, the display screen 600 has a fingerprint recognition area, and the optical module may be installed at the fingerprint recognition area.
  • the optical module may include a collimator 100, a photosensitive unit 200, a wiring structure 300, and a circuit board 400.
  • the photosensitive unit 200 is disposed on one side surface of the collimator 100, and the wiring structure 300 is disposed on the photosensitive unit 200. A side surface facing away from the collimator 100.
  • the photosensitive unit 200 can be directly molded on one side surface of the collimator 100, or can be molded on one side surface of the collimator 100 through other structures.
  • the number of photosensitive units 200 may be set to be multiple, and each photosensitive unit 200 may be arranged at intervals between the collimator 100 and the wiring structure 300.
  • the specific number and size of the photosensitive unit 200 can be designed according to the specific structure of the optical module, which is not limited herein.
  • the circuit board 400 is electrically connected to the wiring structure 300, and can be electrically connected to the photosensitive unit 200 through the wiring structure 300 to transmit signals.
  • the circuit board 400 can be connected to the main board of the mobile terminal.
  • the collimator 100 is provided with a plurality of light passing holes 110, and the axis of the light passing holes 110 may be perpendicular to the photosensitive unit 200.
  • the photosensitive unit 200 can sense light, and can convert light signals into electrical signals.
  • the optical module as the fingerprint module as an example, when the user puts the finger in the fingerprint recognition area of the mobile terminal, the light emitted by the light source of the mobile terminal is reflected by the user's fingerprint, and the reflected light carries the user's fingerprint information and is reflected
  • the light passing through the collimator 100 only the light whose angle is substantially perpendicular to the photosensitive unit 200 (that is, the light with good verticality) can pass through the collimator 100 through the light-passing hole 110.
  • the light passing through the collimator 100 can be irradiated on the photosensitive unit 200, the photosensitive unit 200 senses the light signal, and then converts the light signal representing fingerprint information into an electrical signal, which can be transmitted to the main board of the mobile terminal through the circuit board 400
  • the main board can determine whether the fingerprint information obtained is consistent with the fingerprint information stored in advance, so as to determine whether the user's access operation is legal.
  • the photosensitive unit 200 and the wiring structure 300 are directly formed on one side surface of the collimator 100, so the photosensitive unit 200 and the wiring structure 300 do not need to be laminated
  • the glue is bonded to the collimator 100, and there is no need to add a carrier substrate for molding the photosensitive unit 200 and the wiring structure 300, so that the thickness of the entire optical module is reduced, and therefore the optical module occupies a smaller space.
  • the thickness of the adhesive between the photosensitive unit 200, the wiring structure 300, and the collimator 100 in the related art is approximately 0.03 mm to 0.1 mm, and the thickness of the carrier substrate in the related art is approximately It is 0.1mm, so the thickness of the optical module can be reduced by 0.13mm ⁇ 0.2mm.
  • the distance between the photosensitive unit 200 and the wiring structure 300 and the display screen 600 of the mobile terminal is smaller, so the signal strength Higher, the photosensitive efficiency of the optical module is higher, and the user experience is improved accordingly.
  • the optical module may further include a wiring protection layer 500 disposed on a surface of the wiring structure 300 away from the photosensitive unit 200 to cover at least a part of the wiring structure 300 so that the wiring structure 300 The wire structure 300 is not easily damaged.
  • the wiring structure 300 needs to be connected to the photosensitive unit 200, the circuit board 400, and the circuit protection layer 500. If the circuit board 400 is connected to the side of the wiring structure 300 facing the photosensitive unit 200, then the wiring structure 300 The part for connecting with the photosensitive unit 200 will become smaller, resulting in the limitation of the number and size of the photosensitive unit 200. To solve this problem, the circuit board 400 can be connected to the side surface of the wiring structure 300 away from the photosensitive unit 200 so that the circuit board 400 and the circuit protection layer 500 are located on the same side of the wiring structure 300.
  • connection between the wiring structure 300 and the photosensitive unit 200 is not restricted, and the connection between the circuit board 400 and the wiring structure 300 is not restricted, and the connection area between the circuit board 400 and the wiring structure 300 can even be appropriately increased. , Making the connection between the two more reliable.
  • the circuit protection layer 500 and the circuit board 400 are connected on the same side of the wiring structure 300.
  • the connection area between the circuit board 400 and the wiring structure 300 will affect the reliability of the connection between the two, and the circuit protection layer 500 covers the area of the wiring structure 300 Affect the protection effect of the wiring structure 300.
  • the side of the wiring structure 300 facing away from the photosensitive unit 200 includes a first part and a second part, and the first part and the second part together form the wiring structure 300, wherein the circuit The board 400 is connected to the first part, and the circuit protection layer 500 covers the second part.
  • a part of the wiring structure 300 is attached to the circuit board 400, and another part of the wiring structure 300 is attached to the line protection layer 500, so that the surface of the line protection layer 500 can be utilized to the maximum, thereby ensuring the line protection layer
  • the reliability of the connection between 500 and the wiring structure 300 can cover the rest of the wiring structure 300, thereby improving the protection effect.
  • the optical module may further include a filter layer (not shown in the figure), and the filter layer may be disposed on a surface of the collimator 100 facing away from the photosensitive unit 200.
  • the time-sensitive unit 200 can be directly molded on the surface of the collimator 100 facing away from the filter layer.
  • the filter layer may be disposed between the collimator 100 and the photosensitive unit 200. That is, the filter layer can be molded on one side surface of the collimator 100, and the photosensitive unit 200 can be molded on the side surface of the filter layer away from the collimator 100, so that the photosensitive unit 200 can be placed on the collimator through the filter layer. Straightener 100 on.
  • At least one of the photosensitive unit 200 and the wiring structure 300 is a plating structure. That is, the photosensitive unit 200 and the wiring structure 300 can be formed by a coating process. After adopting this processing technology, the thickness of the photosensitive unit 200 and the wiring structure 300 can be controlled to about 3um, so that the thickness of the optical module is further reduced.
  • the embodiments of the present disclosure also disclose a method for preparing an optical module, which is used to prepare the optical module described in any of the above embodiments, and the preparation method specifically includes:
  • the photosensitive unit 200 and the wiring structure 300 are prepared on one side surface of the collimator 100 such that the wiring structure 300 is located on the side of the photosensitive unit 200 away from the collimator 100.
  • the photosensitive unit 200 and the wiring structure 300 can be directly formed on the collimator 100, or other structures can be formed on the collimator 100 first (for example, as described in the previous embodiment). Filter layer), and then the photosensitive unit 200 and the wiring structure 300 are formed.
  • the molding sequence of the photosensitive unit 200 and the wiring structure 300 can be flexibly designed. For example, the photosensitive unit 200 may be molded first, and then the wiring structure 300 may be molded, or the photosensitive unit 200 and wiring structure 300 may be molded at the same time.
  • an embodiment of the present disclosure also discloses a mobile terminal.
  • the mobile terminal may include a display screen 600 and an optical module disposed under the display screen 600,
  • the optical module may be the optical module described in any of the above embodiments.
  • the thickness of the optical module becomes smaller, the thickness of the mobile terminal can be reduced accordingly, and other parts in the mobile terminal can be arranged more conveniently.
  • the photosensitive efficiency is higher.
  • the optical module can be bonded to the display screen 600 through the glue 700.
  • the bonding glue 700 can ensure the bonding strength of the optical module and the display screen 600 on the one hand, and can allow light to pass through on the other hand.
  • the mobile terminal disclosed in the embodiments of the present disclosure may be a smart phone, a tablet computer, an e-book reader or a wearable device.
  • the mobile terminal may also be other devices, which is not limited in the embodiments of the present disclosure.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Vascular Medicine (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Optical Filters (AREA)
  • Image Input (AREA)
  • Optical Communication System (AREA)
PCT/CN2020/085675 2019-06-28 2020-04-20 光学模组及移动终端 Ceased WO2020259032A1 (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020217038593A KR102770131B1 (ko) 2019-06-28 2020-04-20 광학 모듈 및 이동 단말
JP2021570473A JP7394150B2 (ja) 2019-06-28 2020-04-20 光学モジュール及び移動端末
ES20832796T ES2981501T3 (es) 2019-06-28 2020-04-20 Módulo óptico y terminal móvil
EP20832796.5A EP3992843B1 (de) 2019-06-28 2020-04-20 Optisches modul und mobiles endgerät
US17/550,757 US11881046B2 (en) 2019-06-28 2021-12-14 Optical module and mobile terminal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910579374.6 2019-06-28
CN201910579374.6A CN110321832B (zh) 2019-06-28 2019-06-28 光学模组及移动终端

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/550,757 Continuation US11881046B2 (en) 2019-06-28 2021-12-14 Optical module and mobile terminal

Publications (1)

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WO2020259032A1 true WO2020259032A1 (zh) 2020-12-30

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US (1) US11881046B2 (de)
EP (1) EP3992843B1 (de)
JP (1) JP7394150B2 (de)
KR (1) KR102770131B1 (de)
CN (1) CN110321832B (de)
ES (1) ES2981501T3 (de)
WO (1) WO2020259032A1 (de)

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Publication number Publication date
EP3992843A1 (de) 2022-05-04
JP7394150B2 (ja) 2023-12-07
EP3992843B1 (de) 2024-05-29
KR20220004700A (ko) 2022-01-11
CN110321832B (zh) 2021-05-18
US11881046B2 (en) 2024-01-23
KR102770131B1 (ko) 2025-02-20
JP2022534582A (ja) 2022-08-02
ES2981501T3 (es) 2024-10-09
CN110321832A (zh) 2019-10-11
US20220101647A1 (en) 2022-03-31
EP3992843A4 (de) 2022-08-17

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