WO2026037601A1 - Dispositif optoélectronique et procédé de fonctionnement de dispositif optoélectronique - Google Patents

Dispositif optoélectronique et procédé de fonctionnement de dispositif optoélectronique

Info

Publication number
WO2026037601A1
WO2026037601A1 PCT/EP2025/071065 EP2025071065W WO2026037601A1 WO 2026037601 A1 WO2026037601 A1 WO 2026037601A1 EP 2025071065 W EP2025071065 W EP 2025071065W WO 2026037601 A1 WO2026037601 A1 WO 2026037601A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor chip
electronic semiconductor
optoelectronic
component structure
optoelectronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/071065
Other languages
German (de)
English (en)
Inventor
Zeljko Pajkic
Markus Leitl
Christian Betthausen
Harald Hopperdietzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Ams Osram International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ams Osram International GmbH filed Critical Ams Osram International GmbH
Publication of WO2026037601A1 publication Critical patent/WO2026037601A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/95—Circuit arrangements

Definitions

  • the present invention relates to an optoelectronic device.
  • the invention further relates to a method for operating an optoelectronic device.
  • An optoelectronic device can comprise an optoelectronic component structure with one or more optoelectronic components and an electronic semiconductor chip for electrically controlling the component structure.
  • the optoelectronic device can, for example, be used as a light source for a vehicle headlight and, for this purpose, comprise at least one light-emitting semiconductor chip as its optoelectronic component structure. Operation of the device can be controlled by a higher-level control device and can be carried out using operating information tailored to the optoelectronic component structure.
  • an optoelectronic device for use in a vehicle headlight can be divided among several manufacturers. Initially, a primary manufacturer or supplier can provide a starting device comprising the electronic semiconductor chip and the optoelectronic component structure, along with the associated operating information. A subsequent manufacturer can then perform steps such as assembly with further components and integration or uploading the operating information to a storage device. The latter can be quite complex, considering factors such as training and the provision of suitable software and hardware. 2024PF00150 2
  • the object of the present invention is to provide a solution for an improved optoelectronic device.
  • an optoelectronic device comprising an optoelectronic component structure with at least one optoelectronic component and an electronic semiconductor chip for electrically controlling the optoelectronic component structure.
  • the electronic semiconductor chip has an integrated network adapter for establishing an internet connection.
  • the electronic semiconductor chip is further configured to perform data communication with an internet server regarding the operation of the optoelectronic component structure when an internet connection is established.
  • the electronic semiconductor chip serves not only to electrically control and thus supply power to the optoelectronic component structure.
  • the electronic semiconductor chip is also used to establish data communication with an internet server regarding the operation of the optoelectronic component structure. Accordingly, the electronic semiconductor chip has an integrated network adapter for establishing an internet connection.
  • This design simplifies the manufacturing and implementation of the optoelectronic device. This can be advantageous when the process is distributed among multiple manufacturers.
  • the data communication enables updates and software updates, as well as the creation of new configurations. 2024PF00150 3 to provide a history and diagnosis with regard to the operation of the optoelectronic device.
  • the electronic semiconductor chip is designed, among other things, to electrically control the optoelectronic component structure and thus provides it with an electrical supply.
  • the electronic semiconductor chip can have contacts that are electrically connected to mating contacts of the optoelectronic component structure.
  • This electrical connection can be implemented in various ways.
  • An electrically conductive bonding agent for example, solder or electrically conductive adhesive
  • components such as electrical conductor structures can be used.
  • the optoelectronic component structure is mounted on the electronic semiconductor chip.
  • the optoelectronic device can also include other components such as a substrate and/or a housing. The aforementioned conductor structures can be enclosed by the substrate or housing.
  • the internet connection of the electronic semiconductor chip and the data communication conducted via this connection with the internet server can involve at least one other device or communication device, system, and/or network, such as a local network or intranet.
  • the latter could, for example, be the intranet of a manufacturer or production line, a workshop, or even a device containing the optoelectronic device, such as a vehicle or smartphone.
  • a higher-level control device can be involved in the internet connection and data communication, through which the other operations of the optoelectronic device can be controlled.
  • the network adapter integrated into the electronic semiconductor chip can be designed to understand and apply the protocols used. This can include protocols such as the Internet Protocol (IP) or protocols from the TCP/IP protocol family (TCP, Transmission Control Protocol).
  • IP Internet Protocol
  • TCP Transmission Control Protocol
  • the network adapter is a wireless network adapter. This allows part of the internet connection to be implemented wirelessly, or via radio link, and therefore in a simple and uncomplicated way.
  • the wireless network adapter can, for example, be a WLAN adapter (Wireless Local Area Network).
  • Another example is a Bluetooth adapter.
  • the network adapter is a wired network adapter. This allows for an internet connection without a wireless connection, and therefore in a secure and reliable manner.
  • the wired network adapter can, for example, be an Ethernet adapter.
  • the electronic semiconductor chip is designed to receive operating information used for the operation of the optoelectronic component structure during data communication. Using this operating information, the operation of the optoelectronic component structure, or its electrical control, can be carried out reliably and in accordance with relevant specifications.
  • the operating information can be tailored to the optoelectronic component structure and, in this context, constitute calibration information specific to that optoelectronic component structure.
  • the creation of this calibration information can be based on a previously performed calibration on the optoelectronic component structure or device. 2024PF00150 5 guided measurement.
  • the optoelectronic component structure can be operated in such a way that deviations from target specifications are avoided or suppressed as far as possible.
  • the optoelectronic device features a non-volatile memory (NVM) for storing the received operating information.
  • NVM non-volatile memory
  • the non-volatile memory can be, for example, flash memory or EEPROM (Electrically Erasable Programmable Read-Only Memory).
  • Storing the operating information received by the electronic semiconductor chip in the non-volatile memory device can be accomplished with the aid of an additional or intermediate component. This could, for example, be a higher-level control device, as mentioned above. In this way, the electronic semiconductor chip can be implemented with a simple and cost-effective design.
  • an intermediate component can be omitted. This is the case with the following implementation, in which the electronic semiconductor chip is designed to store the operating information in the non-volatile memory device. In this way, fast storage of the operating information is possible.
  • the non-volatile memory is integrated into the electronic semiconductor chip. This further facilitates the rapid storage of operational information without the use of an additional component. 2024PF00150 6
  • the electronic semiconductor chip is designed to electrically control the optoelectronic component structure based on the operating information. In this way, the operation of the optoelectronic device can be achieved with a small number of components.
  • the optoelectronic device includes an additional electronic chip for controlling the electronic semiconductor chip.
  • the control of the electronic semiconductor chip by the additional chip can be based on operating information. This allows for a simple and cost-effective design for the electronic semiconductor chip.
  • Data communication between the electronic semiconductor chip and the internet server can take place via a website or web portal, which can be provided by the internet server.
  • the electronic semiconductor chip can be configured to access the website or web portal using an associated internet address or IP address (Internet Protocol address). This address can be stored within the electronic semiconductor chip.
  • the electronic semiconductor chip is configured to send an associated identifier during data communication.
  • This identifier can also be stored within the electronic semiconductor chip. Based on the identifier transmitted to the internet server, which is assigned to the optoelectronic device or component structure, the device and component structure can be identified. This allows the internet server to reliably transmit operating information, tailored to and used for the operation of the optoelectronic component structure, to the electronic semiconductor chip. 2024PF00150 7
  • the electronic semiconductor chip is designed to acquire operating data during the operation of the optoelectronic component structure and to transmit this data via data communication.
  • the electronic semiconductor chip can incorporate one or more integrated measuring devices for acquiring this operating data.
  • This operating data can be used, for example, for quality assurance or for the further development of the optoelectronic device.
  • This operating information can be specific calibration information tailored to the component structure, as described above.
  • the operating data can include, for example, recorded data or trends of parameters such as electrical current or voltage, temperature, and/or data relating to the usage time of the optoelectronic device. Based on this data, updated operating or calibration information can be generated and transmitted to the electronic semiconductor chip to control the operation of the optoelectronic component structure. In this way, for example, potential aging effects or inhomogeneities in the optoelectronic component structure can be addressed and compensated for.
  • the optoelectronic component structure can be configured for light emission and may include at least one light-emitting component for this purpose.
  • the light-emitting component can be a light-emitting semiconductor chip such as a light-emitting diode chip or a laser diode chip. In this way, the optoelectronic device can function as a lighting device. 2024PF00150 8.
  • the optoelectronic device can also be used, for example, as a light source for a motor vehicle headlight.
  • the optoelectronic component structure comprises a pixelated light-emitting semiconductor chip with separately controllable light-emitting pixels.
  • the light-emitting semiconductor chip and its pixels can be done via the electronic semiconductor chip and controlled by a higher-level control device, different illumination patterns can be flexibly provided.
  • the pixelated light-emitting semiconductor chip can be arranged on the electronic semiconductor chip.
  • the operating information is calibration information relating to the light-emitting pixels.
  • the electrical control and operation of the light-emitting semiconductor chip and its pixels can be carried out in such a way that any operational deviations between the pixels are suppressed or compensated for, thereby producing a homogeneous illuminated image.
  • the calibration information can, for example, relate to the brightness and/or color coordinates of the light-emitting pixels.
  • the optoelectronic component structure can also be configured for light detection, and for this purpose must include at least one light-detecting component. This can be a photodiode or a photodiode chip.
  • the optoelectronic device can be used in various fields.
  • the device can be used for external lighting (i.e., headlights as described above).
  • the optoelectronic device comprises an optoelectronic component structure with at least one optoelectronic component and an electronic semiconductor chip for electrically controlling the optoelectronic component structure.
  • the electronic semiconductor chip has an integrated network adapter for establishing an internet connection. The method includes activating the electronic semiconductor chip to establish an internet connection, such that the electronic semiconductor chip performs data communication with an internet server regarding the operation of the optoelectronic component structure.
  • the proposed method can be used in the manufacture or implementation of the optoelectronic device.
  • This process can be simplified through data communication between the electronic semiconductor chip and the internet server. This is particularly relevant when manufacturing is shared among multiple manufacturers. Furthermore, the data communication can be used to update and analyze the operation of the optoelectronic device.
  • the optoelectronic device can be configured as described above or according to one or more of the embodiments described above. Therefore, features and details mentioned above relating to the optoelectronic device can be applied to the method accordingly. Likewise, features and details described in relation to the method can also apply to the optoelectronic device. 2024PF00150 10
  • the internet connection between the electronic semiconductor chip and the internet server can include at least one other device or communication device, a system and/or network such as a local area network or intranet.
  • a system and/or network such as a local area network or intranet.
  • the latter could, for example, be the intranet of a manufacturer or a production line, a workshop, etc.
  • Activating the electronic semiconductor chip to establish the internet connection can be performed by a control device. This process can be initiated by a user or operator.
  • the control device can be a higher-level control device, as mentioned above, which is also used to control the other operations of the optoelectronic device.
  • the activation of the electronic semiconductor chip occurs after the optoelectronic device has been manufactured.
  • the electronic semiconductor chip receives operating information used for the operation of the optoelectronic component structure. Using this operating information, the optoelectronic component structure can then be operated by electrically controlling it.
  • the manufacturing or implementation of the optoelectronic device distributed across multiple manufacturers as indicated above, can be applied.
  • a primary manufacturer or supplier can provide a starting device comprising the electronic semiconductor chip and the optoelectronic component structure with associated operating information.
  • a subsequent manufacturer can then perform further steps to complete the optoelectronic device. This may include adding at least one additional component (for example, a 2024PF00150 11 non-volatile storage device) or assembly of the output device with at least one other component.
  • the aforementioned activation of the electronic semiconductor chip can take place to initiate the transmission of the operating information from the internet server to the electronic semiconductor chip.
  • the operating information can then be stored.
  • the complex use of software and hardware and the corresponding training required in a conventional procedure for uploading the operating information are therefore not required or are eliminated.
  • the electronic semiconductor chip is activated after the optoelectronic device has been commissioned.
  • the electronic semiconductor chip receives updated operating information during data communication, which is used for the operation of the optoelectronic component structure. Based on this, the further operation of the optoelectronic component structure can be carried out.
  • the aforementioned implementation allows for an update of the optoelectronic device. This can result in improved or optimized operation, for example, in the form of greater efficiency and/or compensation for aging effects previously observed in the optoelectronic component structure.
  • the aforementioned activation of the electronic semiconductor chip can be performed to initiate the transmission of the updated operating information from the internet server to the electronic semiconductor chip. The operating information can then be stored.
  • the operating information can be calibration information specific to the optoelectronic component structure. Based on this, the optoelectronic component structure can be operated in such a way that target specifications are adhered to as closely as possible.
  • the received operating information is stored in a non-volatile memory device of the optoelectronic device. Based on this stored operating information, the operation of the optoelectronic component structure can be reliably carried out. Storing the operating information in the non-volatile memory device can be accomplished with the aid of an additional or intermediate component, such as a higher-level control device, or by the electronic semiconductor chip itself.
  • the non-volatile memory device can be a separate component from the electronic semiconductor chip. It is also possible for the non-volatile memory device to be integrated into the electronic semiconductor chip.
  • the electronic semiconductor chip transmits a corresponding identifier during data communication.
  • This identifier assigned to the optoelectronic device or component structure, enables identification of the device and component structure. Accordingly, the internet server can reliably transmit operating information to the electronic semiconductor chip during data communication, information that is assigned to and tailored to the optoelectronic device. 2024PF00150 13
  • the electronic semiconductor chip transmits operating data from the optoelectronic component structure during data communication.
  • This operating data was acquired by the electronic semiconductor chip during the operation of the optoelectronic component structure.
  • the operating data can be used, for example, for quality assurance or further development of the optoelectronic device.
  • the operating data can be used to generate updated operating or calibration information tailored to the optoelectronic component structure, which can then be transmitted to the electronic semiconductor chip.
  • updated operating or calibration information it may be considered, either additionally or alternatively, to perform a measurement on the optoelectronic device or component structure to provide measurement data and to transmit this measurement data to the internet server.
  • the updated operating or calibration information can then be created taking into account this measurement data and, if necessary, also the operating data acquired by the electronic semiconductor chip and transmitted to the internet server.
  • Figures 1 and 2 show different views of an optoelectronic device used as a light source, comprising an LED chip and an electronic semiconductor chip for electrically controlling the LED chip, wherein the electronic semiconductor chip has an integrated network adapter;
  • Figure 3 shows a representation of a lighting device with an associated control device
  • Figure 4 shows an illustration of an established internet connection using a wireless network adapter
  • Figure 5 shows an illustration of an established internet connection using a wired network adapter
  • Figure 6 shows a representation of another optoelectronic device used as a light source
  • FIGS 7 and 8 show flowcharts of procedures in which data communication with an Internet server takes place
  • Figure 9 shows a block diagram illustrating the manufacture and implementation of a lighting device
  • Figure 10 shows a representation of another lighting device with associated control device
  • Figure 11 shows a representation of another optoelectronic device used as a light source
  • Figure 12 shows a representation of another lighting device with an associated control device
  • Figures 13 and 14 show representations of other optoelectronic devices. 2024PF00150 15
  • FIGS 1 and 2 show a side view and a top view of an optoelectronic device 100 according to one possible embodiment.
  • the optoelectronic device 100 serves as the light source for a lighting device 101 for a vehicle headlight. Accordingly, the designation light source 100 will be used in the following.
  • the light source 100 comprises a light-emitting optoelectronic component structure 110 and an electronic semiconductor chip 120 for electrically controlling and energizing the component structure 110.
  • the electronic semiconductor chip 120 can also be referred to as a driver chip or driver IC (integrated circuit).
  • the optoelectronic component structure 110 comprises a light-emitting optoelectronic semiconductor chip in the form of a monolithically constructed pixelated LED chip 111 (light-emitting diode). 2024PF00150 16
  • the LED chip 111 has a large number of separately controllable light-emitting pixels 112. In contrast to the schematic representation in Figure 2, a much larger number of pixels 112 can be present, for example, in the four- or five-digit range.
  • the pixels 112 can have lateral dimensions in the micrometer range and thus be micro-LEDs.
  • the LED chip 111 is arranged on a front face of the electronic semiconductor chip 120 and is electrically connected to the electronic semiconductor chip 120 at this point.
  • the electronic semiconductor chip 120 has front-facing contacts which are electrically connected to rear-facing contacts of the LED chip 111 using an electrically conductive connecting medium (for example, solder or electrically conductive adhesive) (not shown).
  • an electrically conductive connecting medium for example, solder or electrically conductive adhesive
  • the electronic semiconductor chip 120 can selectively energize individual, several, or all pixels 112 of the LED chip 111 and thereby electrically control them to emit light. During illumination, light radiation can be emitted from the LED chip 111 in a direction away from the electronic semiconductor chip 120 (not shown).
  • the electronic semiconductor chip 120 also includes electronic circuit components (not shown) for electrical control and other functions.
  • FIG. 1 and 2 Further components of the light source 100 shown in Figures 1 and 2 are a carrier 130 and a surrounding housing frame 135.
  • the electronic semiconductor chip 120 and the housing frame 135 are arranged on a front side of the carrier 130, and the housing frame 135 surrounds the electronic semiconductor chip 120 with the LED chip 111 located on it.
  • the housing frame 135 can be a molded body made of a plastic material.
  • the carrier 130 can be in the form of a printed circuit board (PCB). Other designs are also possible, for example, in the form of a ceramic carrier.
  • the carrier 130 has electrical conductor structures (not shown) with front and rear contacts, where- 2024PF00150 17 where the front contacts of the carrier 130 are electrically connected via bond wires 139 to (further) front contacts not shown of the electronic semiconductor chip 120. In this way, the electronic semiconductor chip 120 can be electrically supplied via the carrier 130, and electrical control signals for controlling the lighting operation can be supplied to the electronic semiconductor chip 120 via the carrier 130.
  • the light source 100 may also include other components not shown.
  • the LED chip 111 may have a conversion layer for radiation conversion, for example, produced by spraying, which is arranged on a semiconductor body of the LED chip 111.
  • the conversion layer allows a portion of the primary light radiation generated during illumination to be converted into secondary light radiation.
  • the primary and secondary light radiation can be blue and yellow, respectively, so that overall white light radiation can be emitted by the light source 100.
  • Another possible component is a reflective potting material, which may be present in an area between the electronic semiconductor chip 120 and the housing frame 135, as well as on the front edge of the electronic semiconductor chip 120, and in which the bond wires 139 may be embedded.
  • the light source 100 is characterized by the fact that the electronic semiconductor chip 120, which is used for the electrical control of the optoelectronic component structure 110, or in this case the LED chip 111, and thus serves as the electrical power supply or current source for the component structure 110, has an integrated network adapter 121 via which the electronic semiconductor chip 120 can establish an internet connection.
  • the electronic semiconductor chip 120 therefore not only serves for the electrical control and thus the electrical supply of the LED chip 111.
  • the electronic semiconductor chip 120 is also used to establish data communication with an internet server. 2024PF00150 18
  • the light source 100 is intended for use in a vehicle headlight.
  • Figure 3 shows a side view of another optoelectronic device 101 according to a possible embodiment, which includes the light source 100 described above.
  • a simplified representation of the light source 100 has been chosen for clarity, in which components such as the housing frame 135 and the bond wires 139 have been omitted.
  • the optoelectronic device 101 serves as the lighting device of a headlight (not shown) and is accordingly referred to below as the lighting device 101.
  • the lighting device 101 in addition to the light source 100, has a carrier plate 140 on the front of which the light source 100 and, to the side of it, further components of the lighting device 101, i.e., an electronic add-on chip 145 and a non-volatile memory device 150 (NVM), are arranged.
  • the carrier plate 140 can be a printed circuit board (PCB).
  • the carrier plate 140 has electrical conductor structures (not shown) with front-facing contacts, which are electrically connected to mating contacts of the light source 100, the add-on chip 145, and the memory device 150 (not shown).
  • the front contacts of the carrier plate 140 can be connected to the rear contacts of the carrier 130 of the light source 100 using an electrically conductive connecting medium (for example, solder or electrically conductive adhesive), so that an electrical connection exists between the conductor structures of the carrier 130 and the carrier plate 140.
  • a corresponding electrical connection can exist with respect to the electronic add-on chip 145 and the non-volatile storage device 150.
  • the electronic add-on chip 145 can be an AS IC chip (Applicable- 2024PF00150 19 tion-Specific Integrated Circuit).
  • the non-volatile memory device 150 can be or include an EEPROM (Electrically Erasable Programmable Read-Only Memory). Alternatively, the memory device 150 can be or include a flash memory.
  • a higher-level control device 160 is assigned to the lighting device 101, via which the operation of the lighting device 101 can be controlled.
  • the control device 160 can be implemented in the form of a microcontroller or may include a microcontroller.
  • the control device 160 is electrically connected to the lighting device 101 or to conductor structures of the carrier plate 140 in a suitable manner.
  • the control device 160 can transmit corresponding commands in the form of electrical control signals to the electronic auxiliary chip 145 via the carrier plate 140 or its conductor structures.
  • the auxiliary chip 145 can then transmit corresponding commands or electrical control signals to the electronic semiconductor chip 120 of the light source 100, also via the carrier plate 140 or its conductor structures and via the carrier 130 of the light source 100, for controlling the light source 100.
  • the electronic semiconductor chip 120 can perform a corresponding electrical control of the LED chip 111 of the light source 100, and corresponding light patterns can be generated via the respective energized and thus light-emitting pixels 112 of the LED chip 111 (not shown).
  • the operation of the light source 100, or rather its electronic semiconductor chip 120, is controlled by the additional chip 145 using operating information stored in the memory device 150.
  • This is specific calibration information tailored to the light source 100 and its optoelectronic component structure 110, or LED chip 111.
  • the calibration information which can also be referred to as configuration information, can be in the form of a file and is based on a 2024PF00150 20 measurements may have been taken in advance on the light source 100 or the LED chip 111. In this way, the light source 100 and the LED chip 111 can be operated in such a way that target specifications are adhered to as closely as possible.
  • the calibration information can refer to brightness and/or color coordinates of the pixels 112 of the LED chip 111, so that the lighting operation can be carried out with high brightness or color homogeneity, and thus homogeneous lighting images can be generated.
  • the additional electronic chip 145 which is electrically connected to the non-volatile memory device 150 via the carrier plate 140 or its conductor structures, can access the memory device 150.
  • the data can be provided or... Integrating the operating information into the lighting device 101, an internet connection that can be established via the electronic semiconductor chip 120 of the light source 100 is used.
  • the execution of internet access which the electronic semiconductor chip 120 can perform via its network adapter 121, takes place in a manufactured state of the lighting device 101 in which the light source 100 is enclosed by the lighting device 101.
  • network adapter 121 different configurations for the network adapter 121 are possible.
  • Figure 4 shows one possible variant in which the network adapter 121 of the electronic semiconductor chip 120 of the light source 100 is wireless and can therefore communicate via radio link.
  • Figure 4 further illustrates an internet connection between the network adapter 121 and an internet server 180, via which data communication between the network adapter 121 and the internet server 180 concerning the operation of the LED chip 111 of the light source 100 can take place.
  • the network adapter 121 is connected wirelessly to a wireless communication device 170, which in turn is connected to the internet 190. 2024PF00150 21
  • Internet server 180 is also connected to, or rather, is part of, Internet 190.
  • Data communication between network adapter 121 and Internet server 180 thus involves radio communication between network adapter 121 and wireless communication device 170, as well as data exchange between communication device 170 and Internet server 180 via Internet 190.
  • at least one additional component, system, and/or network may be involved in the connection between network adapter 121 and Internet server 180.
  • network adapter 121 is, for example, a WLAN adapter (Wireless Local Area Network).
  • communication device 170 can be a WLAN communication device or a WLAN router, or it can include such a device.
  • network adapter 121 can have a different design, for example, in the form of a Bluetooth adapter.
  • communication device 170 can be a Bluetooth communication device, or it can include such a device.
  • Figure 5 illustrates an alternative variant in which the network adapter 121 of the electronic semiconductor chip 120 of the light source 100 is wired.
  • Figure 5 also shows an internet connection between the network adapter 121 and an internet server 180, via which data communication can take place between the network adapter 121 and the internet server 180 regarding the operation of the LED chip 111 of the light source 100.
  • the network adapter 121 is connected via a wired connection to a communication device 171, which in turn is connected to the internet 190.
  • the internet server 180 is also connected to the internet 190, or is part of the internet 190.
  • the data- 2024PF00150 22 Communication between the network adapter 121 and the internet server 180 thus includes data exchange between the network adapter 121 and the communication device 171 as well as data exchange between the communication device 171 and the internet server 180 via the internet 190.
  • the network adapter 121 can be an Ethernet adapter
  • the communication device 171 can be an Ethernet communication device.
  • connection between the network adapter 121 and the communication device 171 can be implemented as follows.
  • the network adapter 121 can be connected via internal conductors of the electronic semiconductor chip 120 to rear contacts of the electronic semiconductor chip 120, which in turn are connected, as described above, to front contacts and thus conductor structures of the carrier 130 of the light source 100.
  • the lighting device 101 see Figure 3
  • the communication device 171 can be connected to conductor structures of the carrier plate 140, so that the connection between the network adapter 121 and the communication device 171 can be established partly via the carrier 130 and the carrier plate 140.
  • connection between the network adapter 121 and the internet server 180 can be implemented with the involvement of at least one other component, system, and/or network, such as an intranet.
  • the higher-level control device 160 (see Figure 3) can also be included, either by connecting the control device 160 to and upstream of the communication device 171, or by integrating the communication device 171 into the control device 160 (not shown). 2024PF00150 23
  • the network adapter 121 of the electronic semiconductor chip 120 is designed to access the internet and to perform data communication with the internet server 180, and to understand and apply the corresponding protocols.
  • IP Internet Protocol
  • TCP Transmission Control Protocol
  • Other possible protocols are, for example, a WLAN or Bluetooth protocol (as shown in Figure 4) and an Ethernet protocol (as shown in Figure 5).
  • the internet connection and data communication between the electronic semiconductor chip 120 and the internet server 180, as shown in Figures 4 and 5, is based on a website or web portal provided by the internet server 180.
  • the electronic semiconductor chip 120 is configured to access the website or web portal using its associated internet address or IP address (Internet Protocol address). This address is stored in the electronic semiconductor chip 120.
  • IP address Internet Protocol address
  • the electronic semiconductor chip 120 of the light source 100 can, in addition to components such as circuit structures, the network adapter 121, etc., include further components.
  • Figure 6 shows a possible embodiment in which the electronic semiconductor chip 120 of the light source 100 has an integrated measuring device 125.
  • the measuring device 125 serves to acquire operating data during the operation of the light source 100 or of its LED chip 111.
  • the operating data which can be stored in the electronic semiconductor chip 120 of the light source 100, can also be the subject of data communication with the internet server 180.
  • the operating data can include, for example, recorded data or histories of the LED chip's operation. 2024PF00150 24
  • the electronic semiconductor chip 120 is designed to record several of the aforementioned operating data and accordingly has several measuring devices 125.
  • Step 201 the lighting device 101 comprising the light source 100 is first manufactured.
  • Step 201 includes providing or manufacturing the light source 100 and providing associated operating information used for the operation of the light source 100 or its LED chip 111.
  • the operating information is specific calibration information relating to the LED chip 111 and its light-emitting pixels 112.
  • the calibration information can be in the form of a calibration file and can be generated by performing a measurement on the light source 100 or the LED chip 111.
  • a sorting process called binning of the light source 100 generated together with other light sources can also be carried out.
  • the calibration information can also be referred to as BIN information or BIN file.
  • further components are added or assembled to manufacture the lighting device 101. With reference to the embodiment shown in Figure 3, these further components include the carrier plate 140, the additional electronic chip 145, and the non-volatile memory device 150.
  • step 201 may include the integration or implementation of the lighting device 101 in an end product such as a vehicle headlight or vehicle.
  • a connection to the higher-level control device 160 can also be established. 2024PF00150 25
  • the electronic semiconductor chip 120 of the light source 100 is activated to establish an internet connection, so that the electronic semiconductor chip 120 performs data communication 210 with an internet server 180 regarding the operation of the optoelectronic component structure 110, or in this case, the LED chip 111.
  • the internet connection can be implemented using a local network or intranet, in this case, an intranet of a manufacturer or production line.
  • Activation can be carried out by a suitable control device after initiation by a user or operator.
  • the control device can be the higher-level control device 160.
  • the relevant control device can be controlled, among other things, via the carrier 140 and its conductor structures, and optionally with the additional assistance of...
  • the electronic add-on chip 145 sends an activation command to the electronic semiconductor chip 120 of the light source 100.
  • data communication 210 takes place on the basis of a website or web portal, which is provided by the internet server 180.
  • the electronic semiconductor chip 120 accesses the relevant website or web portal using an associated internet address, which is stored in the electronic semiconductor chip 120.
  • the electronic semiconductor chip 120 also transmits an associated identifier or identification information (ID) to the internet server 180, as shown in Figure 7 by an arrow 211.
  • ID is also stored in the electronic semiconductor chip 120. It is possible that the aforementioned internet address and the identifier are stored in a ROM (Read-Only Memory) or a comparable storage medium. 2024PF00150 26 ren, only readable memory of the electronic semiconductor chip 120 are stored.
  • the Internet server 180 can identify the light source 100 or the LED chip 111. Subsequently, or based on this, the Internet server 180 transmits the specific calibration information (BIN information or BIN file) belonging to the light source 100 or the LED chip 111, as shown in Figure 7 by arrow 212.
  • the calibration information received by the electronic semiconductor chip 120 of the light source 100 is further stored in the non-volatile memory device 150 of the lighting device 101 (see Figure 3). It is possible for the electronic semiconductor chip 120 itself (i.e., in this case via the carrier plate 140 and its conductor structures) to access the memory device 150 and store the calibration information there. Alternatively, the calibration information received by the electronic semiconductor chip 120 can be stored via another or intermediate component. This could be the higher-level control device 160, which is appropriately connected to the light source 100 for this purpose, or the additional electronic chip 145. The storage of the calibration information can be attributed to step 202 shown in Figure 7.
  • the lighting device 101 is put into operation.
  • the calibration information received during data communication between the electronic semiconductor chip 120 of the light source 100 and the internet server 180 is used so that the lighting operation can be carried out according to the target specifications.
  • Step 180 can occur not only once, but also multiple times.
  • Figure 8 shows another flowchart, which is an extension of the flowchart in Figure 7.
  • Step 201 includes providing the light source 100 along with the associated calibration information and manufacturing the lighting device 101 (and, if applicable, its implementation).
  • Step 202 includes the initial activation of the electronic semiconductor chip 120 to establish an internet connection, so that the electronic semiconductor chip 120 performs initial data communication 210 with the internet server 180.
  • calibration information belonging to the light source 100 or the LED chip 111 is transmitted. This is an initial or original calibration information. This is stored in the non-volatile memory device 150.
  • the lighting device 101 is put into operation. This operation is carried out using the calibration information. In Figure 8, the commissioning of the lighting device 101 is not shown in a separate step.
  • the electronic semiconductor chip 120 of the light source 100 is activated again to establish an internet connection, so that the electronic semiconductor chip 120 performs further data communication 210 with the internet server 180 concerning the operation of the optoelectronic component structure 110, or in this case, the LED chip 111.
  • activation can be carried out by a suitable control device (for example, the control device 160) after initiation by a user or operator.
  • the electronic semiconductor chip 120 again calls the internet server using the internet address. 2024PF00150 28 internet page or web portal, which is provided by the internet server 180.
  • the electronic semiconductor chip 120 transmits the associated identifier (ID) to the internet server 180 (arrow 211).
  • the internet server 180 sends calibration information (BIN information or BIN file, arrow 213) belonging to the light source 100 or the LED chip 111 to the electronic semiconductor chip 120.
  • This is updated calibration information that can be used to recalibrate the light source 100 or the LED chip 111, which replaces the first or original calibration information, and which is furthermore stored in the non-volatile memory device 150 of the lighting device 101 (see Figure 3).
  • this process can be carried out by the electronic semiconductor chip 120 itself or via an intermediate component (for example, the control device 160 or the electronic add-on chip 145).
  • the updated calibration information can be used to provide optimized operation of the light source 100 and the lighting device 101. This could include, for example, achieving greater efficiency and/or compensating for aging effects previously observed on the LED chip 111, such as burn-in effects.
  • the updated calibration information may be generated based on a measurement performed on the light source 100.
  • the configuration of the electronic semiconductor chip 120 can be used with one or more integrated measuring devices 125 to acquire operating data of the LED chip 111.
  • the electronic semiconductor chip 120 can transmit this operating data to the internet server 180 as part of data communication 210 with the internet server 180.
  • the updated calibration information can be obtained using the The operating data transmitted by 2024PF00150 29 is created and then transmitted by the Internet server 180 to the electronic semiconductor chip 120 (arrow 213).
  • the creation of the updated calibration information can be performed by the Internet server 180.
  • measurement data obtained externally by measuring the light source 100 or the lighting device 101 can be transmitted to the internet server 180, as indicated by arrow 215 in Figure 8.
  • the updated calibration information can then be generated by the internet server 180 taking into account this measurement data (and, if applicable, the operating data transmitted by the electronic semiconductor chip 120) and subsequently transmitted to the electronic semiconductor chip 120 (arrow 213).
  • the light source 100 and the lighting device 101 are used in a vehicle headlight. Calibration or recalibration can be performed in connection with a workshop visit, for example, as part of a service appointment or to replace a defective or accident-damaged headlight and subsequently calibrate it.
  • a light pattern of the LED chip 111 can be recorded using a special measuring device or a smartphone with a suitable application, and the corresponding measurement data can be transmitted to the internet server 180 (arrow 215).
  • a new calibration information or BIN file can then be created and sent to the electronic semiconductor chip 120 (arrow 213).
  • the internet connection between the electronic semiconductor chip 120 and the internet server 180 can be established via the workshop's intranet.
  • Data such as luminance data can also be collected using cameras integrated into the vehicle. 2024PF00150 30
  • the relevant measurement data can be recorded in a suitable measurement environment (for example, a darkened room with a screen). Furthermore, it is possible to record measurement data relating to luminance or light color over time during the operation of the lighting device 101 using the vehicle cameras and then transmit this data to the internet server 180 during a workshop visit (arrow 215). This can be used to detect relatively large deviations from the target values.
  • a suitable measurement environment for example, a darkened room with a screen.
  • step 203 can then be performed at least one more time to provide a further update regarding the operation of the lighting device 101.
  • the manufacture and implementation of the lighting device 101 can be divided among different manufacturers.
  • the data communication with an internet server 180 described above offers a simplification in this context. This is clearly illustrated by the block diagram in Figure 9.
  • an initial manufacturer or supplier 221 provides the light source 100 and associated (initial) calibration information 230.
  • a subsequent manufacturer 222 assembles the light source 100 with further components, thereby manufacturing the lighting device 101. This can then be implemented in an end product such as a vehicle.
  • the initial manufacturer 221 also makes the calibration information 230 available for download on a web portal 240 provided by an internet server 180.
  • Initial internet access 250 to the web portal 240, and thus data communication with the internet server 180 can be established within the framework of... after the manufacture of the lighting device 101 by the manufacturer 222 of the lighting device 101.
  • the initial calibration information 230 provided by the original manufacturer 221 (2024PF00150 31) for the electronic semiconductor chip 120 can be transferred and integrated or stored in the lighting device 101. No complex use of corresponding software or hardware is required on the part of the manufacturer 222. Furthermore, after implementation or commissioning of the lighting device 101, another internet access 251 to the web portal 240 can be made to provide an update for the operation of the lighting device 101. In this process, updated calibration information for the electronic semiconductor chip 120 can be transferred and integrated or stored in the lighting device 101.
  • Figure 10 shows a side view of a further embodiment of the lighting device 101, with a representation of the control device 160 associated with the lighting device 101.
  • the lighting device 101 of Figure 10 does not have an additional electronic chip 145.
  • the embodiment of Figure 10 can be understood as the integration of the additional chip 145 into the electronic semiconductor chip 120 of the light source 100.
  • the electronic semiconductor chip 120 can be an AS IC chip.
  • the control device 160 can send commands in the form of electrical control signals to the light source 100 via the carrier plate 140 and the carrier 130 or conductor structures thereof.
  • 2024PF00150 32 transmits to the electronic semiconductor chip 120, which can then electrically control the LED chip 111 of the light source 100 accordingly.
  • the electronic semiconductor chip 120 can perform the electrical control of the LED chip 111 using the operating or calibration information stored in the non-volatile memory device 150.
  • the electronic semiconductor chip 120 is electrically connected to the memory device 150 via the carrier 130 and the carrier plate 140 or conductor structures thereof, so that the electronic semiconductor chip 120 can access the memory device 150.
  • the electronic semiconductor chip 120 of the light source 100 shown in Figure 10 also has the integrated network adapter 121. This allows the electronic semiconductor chip 120 to perform internet access, as described above, for the purpose of data communication with an internet server 180.
  • Figure 12 shows a side view of the lighting device 101 with the light source 100 from Figure 11, including a representation of the associated control device 160.
  • the non-volatile memory device 150 used to store the operating or calibration information is integrated into the electronic semiconductor chip 120 of the light source 100.
  • the lighting device 101 shown in Figure 12 has the light source 100 arranged on the carrier plate 140, and no further non-volatile memory device to the side of the light source 100.
  • the electronic semiconductor chip 120 can control the LED chip 111 based on the operating or calibration information stored in its own non-volatile memory device 150. Electrically control calibration information.
  • the relevant information can be transmitted, as described above, via data communication with an internet server (180) from the electronic device. 2024PF00150 33
  • semiconductor chip 120 received by semiconductor chip 120, and subsequently stored by semiconductor chip 120 in the non-volatile memory device 150.
  • the optoelectronic component structure 110 comprises several or three optoelectronic components 115.
  • the device 100 also has a carrier 131, on the front of which the components 115 and the electronic semiconductor chip 120 used for electrically controlling the components 115 are arranged side by side.
  • the carrier 131 has electrical conductor structures with front-side contacts, which are electrically connected to contacts of the electronic semiconductor chip 120 and the optoelectronic components 115 (not shown).
  • the electronic semiconductor chip 120 is electrically connected to the components 115, and the electronic semiconductor chip 120 can electrically control and energize the components 115.
  • the optoelectronic components 115 can be light-emitting semiconductor chips 115 .
  • the optoelectronic device 100 shown in Figure 13 can, for example, be an RGB component.
  • the semiconductor chips 115 can be LED chips and configured to generate different light radiations, i.e., red, green, and blue light radiation.
  • the LED chips can also be micro-LEDs. The same applies to the following variant.
  • the semiconductor chips 115 can be LED chips. 2024PF00150 34 and designed to produce red, green and infrared light radiation.
  • the device 100 of Figure 13 can also comprise not only light-emitting semiconductor chips 115 in the form of LED chips. It is also possible that at least one or all of the semiconductor chips 115 are implemented in the form of laser diode chips. These can be edge emitters or surface emitters (VCSELs, Vertical-Cavity Surface-Emitting Lasers).
  • At least one optoelectronic component 115 is a detector or a light-detecting component 115 or a light-detecting semiconductor chip 115. This can be a photodiode or a photodiode chip. In this way, the device 100 can be used, for example, for monitoring vital parameters. Configurations with only light-detecting components 115 or semiconductor chips 115 are also possible.
  • Figure 14 shows a top view of another optoelectronic device 100.
  • the optoelectronic component structure 110 comprises several matrix-like arranged LED chips 117.
  • the device 100 also has a carrier 132 on which the LED chips 117 and the electronic semiconductor chip 120 used for electrically controlling the LED chips 117 are arranged side by side.
  • the carrier 131 has electrical conductor structures with contacts which are electrically connected to contacts of the electronic semiconductor chip 120 and the LED chips 117 (not shown). This electrically connects the electronic semiconductor chip 120 to the LED chips 117, and allows the electronic semiconductor chip 120 to electrically control and energize the LED chips 117.
  • the LED chips 117 can be used to generate different colored light radiation, i.e., a red, green, and blue light radiation.
  • the optoelectro- 2024PF00150 35 Niche device 100 for example, a display device.
  • the carrier 132 can be transparent and, if necessary, implemented as a film. This allows the optoelectronic device 100 to be used, for example, as a transparent lighting device.
  • the electronic semiconductor chip 120 also has the structure described above with the integrated network adapter 121, so that the electronic semiconductor chip 120 can establish internet access for the purpose of data communication with an internet server 180.
  • operating or calibration information associated with the optoelectronic component structure 110 can be transmitted to the electronic semiconductor chip 120 in the manner described above, based on which the component structure 110 can be operated.
  • the operating information can be stored in a non-volatile memory device 150, which is implemented as a separate component of a device comprising the respective optoelectronic device 100, or can be integrated into the electronic semiconductor chip 120 itself.
  • Activation of the electronic semiconductor chip 120 to establish the internet connection can be performed by a control device.
  • the control device can also be used to control the remaining operation of the respective optoelectronic device 100 (not shown in each case).
  • the optoelectronic component structure 110 shown in Figure 13 can be replaced with different numbers of optoelectronic components 115. 2024PF00150 36 finally only a light-emitting or light-detecting component 115 , be realized .
  • the electronic semiconductor chip 120 shown in Figures 10, 11, 12, 13 and 14, as shown in Figure 6, can have at least one integrated measuring device 125 for acquiring operating data.
  • the operating data can be transmitted to an internet server 180 during data communication.
  • the relevant optoelectronic device 100 can be provided pre-configured, i.e., in a state in which initial operating or calibration information is already stored in the memory device 150.
  • an inter-process can be performed by the electronic semiconductor chip 120 to transmit updated operating or calibration information to the electronic semiconductor chip 120, as described above, and/or to transmit recorded operating data to an internet server 180.

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Abstract

L'invention concerne un dispositif optoélectronique comprenant une structure de composant optoélectronique avec au moins un composant optoélectronique, et comprenant une puce semi-conductrice électronique pour commander électriquement la structure de composant optoélectronique. La puce semi-conductrice électronique comprend un adaptateur de réseau intégré pour établir une connexion Internet. Lorsque la connexion Internet est établie, la puce semi-conductrice électronique est configurée pour effectuer une communication de données avec un serveur Internet concernant le fonctionnement de la structure de composant optoélectronique. L'invention concerne également un procédé pour faire fonctionner un dispositif optoélectronique.
PCT/EP2025/071065 2024-08-12 2025-07-22 Dispositif optoélectronique et procédé de fonctionnement de dispositif optoélectronique Pending WO2026037601A1 (fr)

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