YU61180A - Method of manufacturing a passivating composition for a semiconductor device - Google Patents
Method of manufacturing a passivating composition for a semiconductor deviceInfo
- Publication number
- YU61180A YU61180A YU00611/80A YU61180A YU61180A YU 61180 A YU61180 A YU 61180A YU 00611/80 A YU00611/80 A YU 00611/80A YU 61180 A YU61180 A YU 61180A YU 61180 A YU61180 A YU 61180A
- Authority
- YU
- Yugoslavia
- Prior art keywords
- manufacturing
- semiconductor device
- passivating composition
- passivating
- composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H10P14/6923—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/694—Inorganic materials composed of nitrides
- H10P14/6943—Inorganic materials composed of nitrides containing silicon
- H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1710079A | 1979-03-05 | 1979-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| YU61180A true YU61180A (en) | 1983-02-28 |
Family
ID=21780714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| YU00611/80A YU61180A (en) | 1979-03-05 | 1980-03-05 | Method of manufacturing a passivating composition for a semiconductor device |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS55121669A (it) |
| DE (1) | DE3007500A1 (it) |
| FR (1) | FR2451103A1 (it) |
| GB (1) | GB2044533B (it) |
| IT (1) | IT1140645B (it) |
| NL (1) | NL8001310A (it) |
| YU (1) | YU61180A (it) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4542037A (en) * | 1980-04-28 | 1985-09-17 | Fairchild Camera And Instrument Corporation | Laser induced flow of glass bonded materials |
| CA1174285A (en) * | 1980-04-28 | 1984-09-11 | Michelangelo Delfino | Laser induced flow of integrated circuit structure materials |
| JPS581878A (ja) * | 1981-06-26 | 1983-01-07 | Fujitsu Ltd | 磁気バブルメモリ素子の製造方法 |
| DE3130666A1 (de) * | 1981-08-03 | 1983-02-17 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen integrieter mos-feldeffekttransistoren mit einer phosphorsilikatglasschicht als zwischenoxidschicht |
| DE3131050A1 (de) * | 1981-08-05 | 1983-02-24 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von integrierten mos-feldeffekttransistoren unter verwendung einer aus phosphorsilikatglas bestehenden obewrflaechenschicht auf dem zwischenoxid zwischen polysiliziumebene und metall-leiterbahnebene |
| DE3133516A1 (de) * | 1981-08-25 | 1983-03-17 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum verrunden des zwischenoxids zwischen polysiliziumebene und metall-leiterbahnebene beim herstellen von integrierten n-kanal-mos-feldeffekttransistoren |
| JPS5898934A (ja) * | 1981-12-08 | 1983-06-13 | Matsushita Electronics Corp | 半導体装置の製造方法 |
| US4686000A (en) * | 1985-04-02 | 1987-08-11 | Heath Barbara A | Self-aligned contact process |
| JPH088246A (ja) * | 1994-06-21 | 1996-01-12 | Nippon Motorola Ltd | 半導体装置の金属配線形成方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3627598A (en) * | 1970-02-05 | 1971-12-14 | Fairchild Camera Instr Co | Nitride passivation of mesa transistors by phosphovapox lifting |
| US3917495A (en) * | 1970-06-01 | 1975-11-04 | Gen Electric | Method of making improved planar devices including oxide-nitride composite layer |
| US3943621A (en) * | 1974-03-25 | 1976-03-16 | General Electric Company | Semiconductor device and method of manufacture therefor |
| US4005240A (en) * | 1975-03-10 | 1977-01-25 | Aeronutronic Ford Corporation | Germanium device passivation |
| US4273805A (en) * | 1978-06-19 | 1981-06-16 | Rca Corporation | Passivating composite for a semiconductor device comprising a silicon nitride (Si1 3N4) layer and phosphosilicate glass (PSG) layer |
-
1980
- 1980-02-19 IT IT20023/80A patent/IT1140645B/it active
- 1980-02-28 DE DE19803007500 patent/DE3007500A1/de not_active Withdrawn
- 1980-02-29 GB GB8007004A patent/GB2044533B/en not_active Expired
- 1980-03-04 JP JP2787680A patent/JPS55121669A/ja active Pending
- 1980-03-04 NL NL8001310A patent/NL8001310A/nl not_active Application Discontinuation
- 1980-03-04 FR FR8004843A patent/FR2451103A1/fr not_active Withdrawn
- 1980-03-05 YU YU00611/80A patent/YU61180A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2451103A1 (fr) | 1980-10-03 |
| NL8001310A (nl) | 1980-09-09 |
| GB2044533B (en) | 1983-12-14 |
| IT8020023A0 (it) | 1980-02-19 |
| IT8020023A1 (it) | 1981-08-19 |
| GB2044533A (en) | 1980-10-15 |
| JPS55121669A (en) | 1980-09-18 |
| DE3007500A1 (de) | 1980-09-18 |
| IT1140645B (it) | 1986-10-01 |
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