AT519840A5 - Vorrichtung und Verfahren zum Lösen eines ersten Substrats - Google Patents

Vorrichtung und Verfahren zum Lösen eines ersten Substrats

Info

Publication number
AT519840A5
AT519840A5 ATA9486/2014A AT94862014A AT519840A5 AT 519840 A5 AT519840 A5 AT 519840A5 AT 94862014 A AT94862014 A AT 94862014A AT 519840 A5 AT519840 A5 AT 519840A5
Authority
AT
Austria
Prior art keywords
wafer
releasing
release direction
carrier wafer
carrier
Prior art date
Application number
ATA9486/2014A
Other languages
English (en)
Other versions
AT519840B1 (de
Inventor
Fehkührer Andreas
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of AT519840A5 publication Critical patent/AT519840A5/de
Application granted granted Critical
Publication of AT519840B1 publication Critical patent/AT519840B1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P56/00—Debonding of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)

Abstract

Die vorliegende Erfindung betrifft eine Vorrichtung zum Lösen eines Trägerwafers (8) von einem Produktwafer (6) in einer Löserichtung (L) mit mindestens zwei quer zur Löserichtung (L) und in einer Radialrichtung (R) zum Trägerwafer (8) geführten Klemmelementen (1, 1', 1", 1'''), die vorzugsweise an die Außenkontur des Trägerwafers angepasst sind, zur Klemmung des Trägerwafers (8) quer zur Löserichtung (L), wobei die Klemmelemente (1, 1', 1", 1"') elastische Konturaufnahmeelemente (3, 3') zur Aufnahme und Fixierung einer jeden Waferkante aufweisen sowie einer Substrathalterung (11, 11') zum Halten des Produktwafers (6) und Mitteln zum Lösen des Trägerwafers (8) vom Produktwafer (6) durch Bewegung der Substrathalterung (11, 11') entgegen der Löserichtung (L). Weiterhin betrifft die vorliegende Erfindung ein korrespondierendes Verfahren zum Lösen der Wafer voneinander.
ATA9486/2014A 2014-01-28 2014-01-28 Vorrichtung und Verfahren zum Lösen eines ersten Substrats AT519840B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/051611 WO2015113591A1 (de) 2014-01-28 2014-01-28 Vorrichtung und verfahren zum lösen eines ersten substrats

Publications (2)

Publication Number Publication Date
AT519840A5 true AT519840A5 (de) 2018-10-15
AT519840B1 AT519840B1 (de) 2019-04-15

Family

ID=50029034

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA9486/2014A AT519840B1 (de) 2014-01-28 2014-01-28 Vorrichtung und Verfahren zum Lösen eines ersten Substrats

Country Status (7)

Country Link
US (1) US9922862B2 (de)
JP (1) JP6389528B2 (de)
KR (1) KR102211334B1 (de)
AT (1) AT519840B1 (de)
DE (1) DE112014005278B4 (de)
TW (1) TWI643256B (de)
WO (1) WO2015113591A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3140850B1 (de) * 2014-05-09 2019-10-16 Ev Group E. Thallner GmbH Verfahren und vorrichtung zur plasmabehandlung von substraten
KR101950157B1 (ko) * 2015-08-11 2019-02-19 도오꾜오까고오교 가부시끼가이샤 지지체 분리 장치 및 지지체 분리 방법
US10155369B2 (en) * 2016-11-29 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer debonding system and method
US10272661B2 (en) 2017-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. Pad removal device and method
US11335588B2 (en) * 2019-06-18 2022-05-17 Ebara Corporation Substrate holding apparatus and substrate processing apparatus
JP7430074B2 (ja) * 2020-02-20 2024-02-09 株式会社荏原製作所 基板保持装置
JP7339905B2 (ja) * 2020-03-13 2023-09-06 キオクシア株式会社 貼合装置および貼合方法
KR102895321B1 (ko) * 2020-11-05 2025-12-05 삼성디스플레이 주식회사 필름 박리 장치 및 필름 박리 방법
JP7266344B1 (ja) 2022-10-11 2023-04-28 不二越機械工業株式会社 剥離装置及び剥離方法
WO2024240350A1 (de) 2023-05-25 2024-11-28 Ev Group E. Thallner Gmbh Verfahren zum auftrennen eines gesamtsubstrats in ein erstes substrat und ein zweites substrat sowie vorrichtung für ein solches verfahren

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090166930A1 (en) * 2007-12-27 2009-07-02 Tdk Corporation Peeling apparatus, peeling method, and method of manufacturing information recording medium
JP2011146457A (ja) * 2010-01-13 2011-07-28 Tokyo Ohka Kogyo Co Ltd 分離方法及び分離装置
US20110308739A1 (en) * 2010-06-21 2011-12-22 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US20140020847A1 (en) * 2011-04-11 2014-01-23 Ev Group E. Thallner Gmbh Bendable carrier mount, device and method for releasing a carrier substrate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3834026A (en) * 1973-03-26 1974-09-10 M Klein Crown remover
US20070145231A1 (en) 2005-12-21 2007-06-28 Chunghwa Picture Tubes, Ltd Substrate buffer clamp
US20090062869A1 (en) * 2007-08-28 2009-03-05 Perception Raisonnement Action En Medecine Minimally invasive bone fixation clamp for navigated surgeries
JP4209456B1 (ja) 2008-02-22 2009-01-14 三菱重工業株式会社 積層接合装置用治具
JP2010010207A (ja) * 2008-06-24 2010-01-14 Tokyo Ohka Kogyo Co Ltd 剥離装置および剥離方法
KR101695289B1 (ko) 2010-04-30 2017-01-16 엘지디스플레이 주식회사 평판 표시 소자의 제조 장치 및 방법
US8845859B2 (en) * 2011-03-15 2014-09-30 Sunedison Semiconductor Limited (Uen201334164H) Systems and methods for cleaving a bonded wafer pair
US8657994B2 (en) 2011-04-01 2014-02-25 Alta Devices, Inc. System and method for improved epitaxial lift off
CN104025277A (zh) * 2011-10-31 2014-09-03 Memc电子材料有限公司 用于劈裂键合晶片结构的夹持装置和劈裂方法
US9806054B2 (en) 2011-12-22 2017-10-31 Ev Group E. Thallner Gmbh Flexible substrate holder, device and method for detaching a first substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090166930A1 (en) * 2007-12-27 2009-07-02 Tdk Corporation Peeling apparatus, peeling method, and method of manufacturing information recording medium
JP2011146457A (ja) * 2010-01-13 2011-07-28 Tokyo Ohka Kogyo Co Ltd 分離方法及び分離装置
US20110308739A1 (en) * 2010-06-21 2011-12-22 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
US20140020847A1 (en) * 2011-04-11 2014-01-23 Ev Group E. Thallner Gmbh Bendable carrier mount, device and method for releasing a carrier substrate

Also Published As

Publication number Publication date
US20160329235A1 (en) 2016-11-10
US9922862B2 (en) 2018-03-20
AT519840B1 (de) 2019-04-15
JP6389528B2 (ja) 2018-09-12
WO2015113591A1 (de) 2015-08-06
DE112014005278A5 (de) 2016-10-13
JP2017505996A (ja) 2017-02-23
KR102211334B1 (ko) 2021-02-03
TW201533791A (zh) 2015-09-01
TWI643256B (zh) 2018-12-01
DE112014005278B4 (de) 2021-09-16
KR20160111392A (ko) 2016-09-26

Similar Documents

Publication Publication Date Title
EP3465238A4 (de) System und verfahren für burn-in-test eines halbleiters
DE112019000675A5 (de) Vorrichtung und Verfahren zum Umformen von Drahtenden in Umfangsrichtung
EP4290563A3 (de) Aufnahmeeinrichtung zur halterung von wafern
BR112017010406A2 (pt) processo de realização de teste de alta produtividade de cromatografia líquida de alta eficiência
EP4552893A3 (de) Verfahren und vorrichtungen zur dateneinspiegelung
FR3020099B1 (fr) Agrafe de fixation d'un panneau sur un support, procede de mise en oeuvre et equipement automobile
EP3989149C0 (de) Verfahren und vorrichtung zur ausführung eines intelligenten kontraktes
EP3566039A4 (de) Vorrichtung, verfahren und zugehöriges system zum testen einer strassenbelagmaterialprobe
EP3592493A4 (de) Vorrichtung und verfahren zum reparieren von leitblechbolzen
DE112019002707A5 (de) Vorrichtung zum anbinden eines herzunterstützungssystems an eine einführeinrichtung und verfahren zu deren herstellung
EP4017694C0 (de) Verfahren und vorrichtung zum herstellen eines bauteils aus einem faserverbundwerkstoff
DE112018002180A5 (de) Verfahren und Vorrichtung zum Anlegen mehrerer gesponnener Fäden
DE112018005428A5 (de) Verfahren und Vorrichtung zur Vereinzelung und Ablage von Körnern, insbesondere von Saatkörnern
AT521734A3 (de) Randentlackungssystem und Verfahren zur Behandlung eines Substrats
DE112014005278A5 (de) Vorrichtung und Verfahren zum Lösen eines ersten Substrats
EP3683717A4 (de) Verfahren, gerät und vorrichtung zum zählen von passagierströmen
EP3349931C0 (de) Spanneinrichtung zum fixieren eines werkzeugs in einer werkzeugmaschine, sowie verfahren zur herstellung der spanneinrichtung
EP3613346C0 (de) Vorrichtung und verfahren für eine mammographieanlage
AT517050A3 (de) Heizkanaleinheit, Verfahren zum Herstellen einer Heizkanaleinheit und Umbuganlage
EP3643095A4 (de) Verfahren zur durchführung eines rlau verfahrens und vorrichtung damit
EP3610275C0 (de) Wafer-sondenkarte, analysevorrichtung damit und verfahren zur herstellung der wafer-sondenkarte
EP3531817A4 (de) Substratinspektionsvorrichtung und substratinspektionsverfahren damit
AT517639A5 (de) Vorrichtung und Verfahren zum Bonden
EP3547824A4 (de) Verfahren und vorrichtung zur pasteurisierung eines substrats für die pilzzucht
EP3570567A4 (de) Verfahren und vorrichtung zum betrieb von instanzressourcen