AT521280A3 - Haltevorrichtung und verfahren zum halten eines substrats - Google Patents

Haltevorrichtung und verfahren zum halten eines substrats Download PDF

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Publication number
AT521280A3
AT521280A3 ATA50420/2019A AT504202019A AT521280A3 AT 521280 A3 AT521280 A3 AT 521280A3 AT 504202019 A AT504202019 A AT 504202019A AT 521280 A3 AT521280 A3 AT 521280A3
Authority
AT
Austria
Prior art keywords
carrier element
base body
substrate
support surface
holding
Prior art date
Application number
ATA50420/2019A
Other languages
English (en)
Other versions
AT521280A2 (de
AT521280B1 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT521280A2 publication Critical patent/AT521280A2/de
Publication of AT521280A3 publication Critical patent/AT521280A3/de
Application granted granted Critical
Publication of AT521280B1 publication Critical patent/AT521280B1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Die Erfindung betrifft eine Haltevorrichtung (100), insbesondere Chuck, für ein Substrat (101), mit einem Grundkörper (103) mit einer Oberseite (105), einem Trägerelement (107), wobei das Trägerelement (107) in einer Aussparung (109) des Grundkörpers (103) so vertikal bewegbar angeordnet ist, dass es zwischen einer vorstehenden Beladestellung und einer zurückgezogenen Spannstellung verstellbar ist, und wobei das Trägerelement (107) eine Auflagefläche (111) zum Auflegen des Substrats (101) umfasst, wobei die Auflagefläche (111) einen geringeren Durchmesser als der Grundkörper (103) aufweist, und einem Hebeelement, welches das Trägerelement (107) in die Beladestellung anhebt, wobei das Trägerelement (107) die Aussparung (109) so abdichtet, dass zwischen dem Grundkörpers (103) und dem Trägerelement (107) ein abgedichteter Hohlraum (113) vorliegt, welcher mit einem Unterdruck beaufschlagbar ist, der der Wirkung des Hebeelements entgegenwirkt, und wobei Abstandshalter (117a, 117b) vorgesehen sind, die die Spannstellung des Trägerelements (107) definieren, in der die Auflagefläche (111) des Trägerelements (107) im Wesentlichen bündig mit der Oberseite (105) des Grundkörpers (103) angeordnet ist.
ATA50420/2019A 2018-05-29 2019-05-10 Haltevorrichtung und verfahren zum halten eines substrats AT521280B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2021006A NL2021006B1 (en) 2018-05-29 2018-05-29 Holding apparatus and method for holding a substrate

Publications (3)

Publication Number Publication Date
AT521280A2 AT521280A2 (de) 2019-12-15
AT521280A3 true AT521280A3 (de) 2021-10-15
AT521280B1 AT521280B1 (de) 2022-03-15

Family

ID=68576375

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50420/2019A AT521280B1 (de) 2018-05-29 2019-05-10 Haltevorrichtung und verfahren zum halten eines substrats

Country Status (8)

Country Link
US (2) US11148258B2 (de)
JP (1) JP7576907B2 (de)
KR (1) KR102732348B1 (de)
CN (1) CN110544664B (de)
AT (1) AT521280B1 (de)
DE (1) DE102019111867A1 (de)
NL (1) NL2021006B1 (de)
TW (1) TWI870350B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102226270B1 (ko) * 2019-04-03 2021-03-09 세메스 주식회사 기판지지 모듈
WO2020236546A1 (en) 2019-05-17 2020-11-26 Boston Scientific Scimed, Inc. Systems and devices for an endoscope tubeless working channel
JP7235884B2 (ja) * 2019-10-08 2023-03-08 株式会社日立ハイテク 試料ステージ及び光学式検査装置
CN112216649B (zh) * 2020-10-14 2023-03-10 中国电子科技集团公司第二十四研究所 一种可固定任意异形晶圆的旋转清洗夹具
CN112967988B (zh) * 2020-11-04 2022-07-29 重庆康佳光电技术研究院有限公司 一种微元件的转移装置及其方法
KR102774299B1 (ko) * 2021-04-12 2025-02-27 에이피시스템 주식회사 기판 트레이 고정장치 및 이를 구비하는 기판처리설비
JP7641187B2 (ja) * 2021-06-23 2025-03-06 株式会社ダイヘン ワーク搬送用ハンド
CN115140412B (zh) * 2022-07-04 2023-05-30 深圳市华星光电半导体显示技术有限公司 承载装置
EP4455064A1 (de) * 2023-04-27 2024-10-30 Grob-Werke GmbH & Co. KG Werkstückträger, transportsystem mit mehreren solcher werkstückträger, sowie verwendung zur vereinzelung von werkstücken, insbesondere bei einer batterieherstellung
CN116741677B (zh) * 2023-08-14 2023-10-27 上海图双精密装备有限公司 用于pin位置检测的装置和方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0312948A (ja) * 1989-06-12 1991-01-21 Nikon Corp 基板ホルダ
JPH05301137A (ja) * 1992-04-27 1993-11-16 Oki Electric Ind Co Ltd 真空チャック
JPH1086086A (ja) * 1996-09-12 1998-04-07 Olympus Optical Co Ltd 基板吸着部材および装置
US20050011460A1 (en) * 2002-02-19 2005-01-20 Olympus Corporation Substrate chucking apparatus
JP2007157867A (ja) * 2005-12-02 2007-06-21 Olympus Corp 基板吸着機構及び基板検査装置
JP2016085439A (ja) * 2014-05-08 2016-05-19 株式会社ブイ・テクノロジー 露光方法及び露光装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161800A (ja) * 1993-12-13 1995-06-23 Kokusai Electric Co Ltd 基板支持装置
KR100207451B1 (ko) * 1995-12-14 1999-07-15 윤종용 반도체 웨이퍼 고정장치
JPH11214486A (ja) * 1998-01-27 1999-08-06 Komatsu Ltd 基板処理装置
JP4332409B2 (ja) * 2003-10-31 2009-09-16 キヤノン株式会社 基板保持機構およびそれを用いた露光装置並びにデバイス製造方法
WO2011101450A1 (en) * 2010-02-19 2011-08-25 Mapper Lithography Ip B.V. Substrate support structure, clamp preparation unit, and lithography system
JP2012119464A (ja) * 2010-11-30 2012-06-21 Fuji Electric Co Ltd ウエハ保持装置およびウエハ保持方法
JP2012146783A (ja) 2011-01-11 2012-08-02 Murata Mfg Co Ltd 基板吸着装置
KR101414830B1 (ko) * 2011-11-30 2014-07-03 다이닛뽕스크린 세이조오 가부시키가이샤 얼라이먼트 방법, 전사 방법 및 전사장치
JP5756008B2 (ja) 2011-12-26 2015-07-29 株式会社フジクラ はんだ付け部の外観検査装置
GB2502303A (en) * 2012-05-22 2013-11-27 Applied Microengineering Ltd Method of handling a substrate using a pressure variance
US20130312907A1 (en) * 2012-05-23 2013-11-28 Lg Display Co., Ltd. Substrate-bonding apparatus for display device and method for manufacturing bonded substrate
JP6457334B2 (ja) 2015-05-13 2019-01-23 株式会社ディスコ 切削装置
CN106129218B (zh) * 2016-06-27 2019-02-05 纳晶科技股份有限公司 一种透光载体和电致发光器件的封装装置
JP7140626B2 (ja) * 2018-10-10 2022-09-21 株式会社ディスコ リングフレームの保持機構

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0312948A (ja) * 1989-06-12 1991-01-21 Nikon Corp 基板ホルダ
JPH05301137A (ja) * 1992-04-27 1993-11-16 Oki Electric Ind Co Ltd 真空チャック
JPH1086086A (ja) * 1996-09-12 1998-04-07 Olympus Optical Co Ltd 基板吸着部材および装置
US20050011460A1 (en) * 2002-02-19 2005-01-20 Olympus Corporation Substrate chucking apparatus
JP2007157867A (ja) * 2005-12-02 2007-06-21 Olympus Corp 基板吸着機構及び基板検査装置
JP2016085439A (ja) * 2014-05-08 2016-05-19 株式会社ブイ・テクノロジー 露光方法及び露光装置

Also Published As

Publication number Publication date
KR20190135929A (ko) 2019-12-09
US20210394340A1 (en) 2021-12-23
US20190366517A1 (en) 2019-12-05
CN110544664A (zh) 2019-12-06
TW202004977A (zh) 2020-01-16
AT521280A2 (de) 2019-12-15
JP7576907B2 (ja) 2024-11-01
US11148258B2 (en) 2021-10-19
US11504825B2 (en) 2022-11-22
AT521280B1 (de) 2022-03-15
JP2019208020A (ja) 2019-12-05
DE102019111867A1 (de) 2019-12-05
CN110544664B (zh) 2024-10-11
TWI870350B (zh) 2025-01-21
KR102732348B1 (ko) 2024-11-20
NL2021006B1 (en) 2019-12-04

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