ATE116792T1 - Chip-zuführungssystem für chipkontaktierer. - Google Patents
Chip-zuführungssystem für chipkontaktierer.Info
- Publication number
- ATE116792T1 ATE116792T1 AT91301752T AT91301752T ATE116792T1 AT E116792 T1 ATE116792 T1 AT E116792T1 AT 91301752 T AT91301752 T AT 91301752T AT 91301752 T AT91301752 T AT 91301752T AT E116792 T1 ATE116792 T1 AT E116792T1
- Authority
- AT
- Austria
- Prior art keywords
- die
- magazine
- chip
- package
- clamp assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7622—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
Landscapes
- Die Bonding (AREA)
- Specific Conveyance Elements (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB909006036A GB9006036D0 (en) | 1990-03-16 | 1990-03-16 | Die presentation system for die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE116792T1 true ATE116792T1 (de) | 1995-01-15 |
Family
ID=10672784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT91301752T ATE116792T1 (de) | 1990-03-16 | 1991-03-04 | Chip-zuführungssystem für chipkontaktierer. |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0447082B1 (de) |
| JP (1) | JPH0774189A (de) |
| AT (1) | ATE116792T1 (de) |
| DE (1) | DE69106410T2 (de) |
| GB (1) | GB9006036D0 (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9803935D0 (en) * | 1998-02-26 | 1998-04-22 | Secr Defence | Liquid crystal polymer devices and materials |
| EP1310986A1 (de) | 2001-11-08 | 2003-05-14 | F & K Delvotec Bondtechnik GmbH | Chipträgerplatten-Wechselmechanismus |
| JP5136100B2 (ja) * | 2008-02-08 | 2013-02-06 | パナソニック株式会社 | チップ供給装置 |
| JP5077254B2 (ja) * | 2009-01-30 | 2012-11-21 | パナソニック株式会社 | パレット自動交換方法 |
| JP5077253B2 (ja) * | 2009-01-30 | 2012-11-21 | パナソニック株式会社 | パレット自動交換装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3894671A (en) * | 1971-01-06 | 1975-07-15 | Kulicke & Soffa Ind Inc | Semiconductor wire bonder |
| JPS6021535A (ja) * | 1983-06-30 | 1985-02-02 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 半導体装置を相互接続する方法 |
| JPS6012799A (ja) * | 1983-07-01 | 1985-01-23 | 三洋電機株式会社 | チップ状電子部品の自動装着装置 |
-
1990
- 1990-03-16 GB GB909006036A patent/GB9006036D0/en active Pending
-
1991
- 1991-03-04 EP EP91301752A patent/EP0447082B1/de not_active Expired - Lifetime
- 1991-03-04 AT AT91301752T patent/ATE116792T1/de active
- 1991-03-04 DE DE69106410T patent/DE69106410T2/de not_active Expired - Fee Related
- 1991-03-13 JP JP4834591A patent/JPH0774189A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE69106410T2 (de) | 1995-08-24 |
| JPH0774189A (ja) | 1995-03-17 |
| EP0447082B1 (de) | 1995-01-04 |
| DE69106410D1 (de) | 1995-02-16 |
| GB9006036D0 (en) | 1990-05-09 |
| EP0447082A1 (de) | 1991-09-18 |
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