ATE151588T1 - Sehr hochleitfähige und sehr feine elektrische schaltungen, verfahren zur herstellung und diese enthaltende anordnungen - Google Patents
Sehr hochleitfähige und sehr feine elektrische schaltungen, verfahren zur herstellung und diese enthaltende anordnungenInfo
- Publication number
- ATE151588T1 ATE151588T1 AT94922931T AT94922931T ATE151588T1 AT E151588 T1 ATE151588 T1 AT E151588T1 AT 94922931 T AT94922931 T AT 94922931T AT 94922931 T AT94922931 T AT 94922931T AT E151588 T1 ATE151588 T1 AT E151588T1
- Authority
- AT
- Austria
- Prior art keywords
- groove
- conducting
- pct
- highly conductive
- conducting layer
- Prior art date
Links
- 239000000463 material Substances 0.000 abstract 3
- 239000002243 precursor Substances 0.000 abstract 3
- 238000011282 treatment Methods 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/38—Cold-cathode tubes
- H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
- H01J17/49—Display panels, e.g. with crossed electrodes, e.g. making use of direct current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on an electrochromic effect
- G02F1/153—Constructional details
- G02F1/155—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Liquid Crystal (AREA)
- Surface Heating Bodies (AREA)
- Electroluminescent Light Sources (AREA)
- Bipolar Transistors (AREA)
- Logic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9308836A FR2708170B1 (fr) | 1993-07-19 | 1993-07-19 | Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE151588T1 true ATE151588T1 (de) | 1997-04-15 |
Family
ID=9449364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT94922931T ATE151588T1 (de) | 1993-07-19 | 1994-07-18 | Sehr hochleitfähige und sehr feine elektrische schaltungen, verfahren zur herstellung und diese enthaltende anordnungen |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5846854A (de) |
| EP (1) | EP0710433B1 (de) |
| JP (1) | JP3644963B2 (de) |
| KR (1) | KR100375875B1 (de) |
| AT (1) | ATE151588T1 (de) |
| CA (1) | CA2167534A1 (de) |
| DE (1) | DE69402553T2 (de) |
| FR (1) | FR2708170B1 (de) |
| WO (1) | WO1995003684A1 (de) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08313887A (ja) * | 1995-05-12 | 1996-11-29 | Sony Corp | プラズマアドレス表示パネル及びその製造方法 |
| US5853446A (en) * | 1996-04-16 | 1998-12-29 | Corning Incorporated | Method for forming glass rib structures |
| US6004835A (en) | 1997-04-25 | 1999-12-21 | Micron Technology, Inc. | Method of forming integrated circuitry, conductive lines, a conductive grid, a conductive network, an electrical interconnection to anode location and an electrical interconnection with a transistor source/drain region |
| DE19804314A1 (de) * | 1998-02-04 | 1999-08-12 | Bayer Ag | Elektrochromes Display |
| US6106352A (en) * | 1998-03-18 | 2000-08-22 | Sanyo Electric Co., Ltd. | Method for fabrication of organic electroluminescent device |
| US6106303A (en) * | 1998-05-27 | 2000-08-22 | Lear Automotive Dearborn, Inc. | Trim panel having grooves with integrally formed electrical circuits |
| GB2341477B (en) * | 1998-09-10 | 2002-12-24 | Sharp Kk | Electrode substrate, manufacturing method thereof, and liquid crystal display element |
| FR2791147B1 (fr) * | 1999-03-19 | 2002-08-30 | Saint Gobain Vitrage | Dispositif electrochimique du type dispositif electrocommandable a proprietes optiques et/ou energetiques variables |
| US6905945B1 (en) | 1999-04-22 | 2005-06-14 | California Institute Of Technology | Microwave bonding of MEMS component |
| US20060027570A1 (en) * | 1999-04-22 | 2006-02-09 | California Institute Of Technology, A Corporation | Microwave bonding of MEMS component |
| AU4651300A (en) * | 1999-04-22 | 2000-11-10 | California Institute Of Technology | Microwave bonding of mems component |
| ES2234598T3 (es) * | 1999-05-20 | 2005-07-01 | Glaverbel | Panel vidriado para automoviles con una capa de recubrimiento de control solar electricamente calefactable. |
| EP1183913B2 (de) | 1999-05-20 | 2017-03-01 | AGC Flat Glass Europe SA | Glasscheibe für kraftfahrzeuge miteiner durch sonnenlicht steurnden beschichtung versehen mit einem datenübertragungsfenster |
| US6305000B1 (en) | 1999-06-15 | 2001-10-16 | International Business Machines Corporation | Placement of conductive stripes in electronic circuits to satisfy metal density requirements |
| DE10026976C2 (de) * | 2000-05-31 | 2002-08-01 | Schott Glas | Kanalplatte aus Glas für Flachbildschirme und Verfahren zu ihrer Herstellung |
| DE10044425C2 (de) * | 2000-09-08 | 2003-01-09 | Siemens Ag | Verfahren zur Herstellung einer Leuchstoffschicht |
| US6864435B2 (en) * | 2001-04-25 | 2005-03-08 | Alien Technology Corporation | Electrical contacts for flexible displays |
| EP1271227A1 (de) * | 2001-06-26 | 2003-01-02 | Nanomat Limited | Elektrochrome Anzeige mit hoher Auflösung und Verfahren zu deren Herstellung |
| DE10141709A1 (de) * | 2001-08-25 | 2003-03-06 | Schott Glas | Verfahren und Vorrichtung zum Erzeugen einer Struktur in einem Werkstück |
| US6591496B2 (en) * | 2001-08-28 | 2003-07-15 | 3M Innovative Properties Company | Method for making embedded electrical traces |
| US6818155B2 (en) * | 2002-01-02 | 2004-11-16 | Intel Corporation | Attaching components to a printed circuit card |
| FR2845778B1 (fr) * | 2002-10-09 | 2004-12-17 | Saint Gobain | Dispositif electrocommandable du type electroluminescent |
| US8062734B2 (en) * | 2003-04-28 | 2011-11-22 | Eastman Kodak Company | Article comprising conductive conduit channels |
| US20060110580A1 (en) * | 2003-04-28 | 2006-05-25 | Aylward Peter T | Article comprising conductive conduit channels |
| EP1651018A4 (de) * | 2003-06-04 | 2009-11-11 | Tadahiro Ohmi | Substrat und prozess zu seiner herstellung |
| US7240314B1 (en) | 2004-06-04 | 2007-07-03 | Magma Design Automation, Inc. | Redundantly tied metal fill for IR-drop and layout density optimization |
| JP4275644B2 (ja) * | 2004-06-23 | 2009-06-10 | シャープ株式会社 | アクティブマトリクス基板およびその製造方法、並びに電子装置 |
| JP4351129B2 (ja) * | 2004-09-01 | 2009-10-28 | 日東電工株式会社 | 配線回路基板 |
| US7829363B2 (en) * | 2006-05-22 | 2010-11-09 | Cardiomems, Inc. | Method and apparatus for microjoining dissimilar materials |
| EP2137456A4 (de) * | 2007-03-21 | 2011-03-16 | Ntera Inc | Dünne, gedruckte farbanzeige |
| JP2011513846A (ja) | 2008-02-28 | 2011-04-28 | スリーエム イノベイティブ プロパティズ カンパニー | タッチスクリーンセンサ |
| CN103217832B (zh) * | 2013-04-24 | 2015-06-17 | 京东方科技集团股份有限公司 | 彩色滤光片、彩色滤光片制作方法和显示装置 |
| KR101656452B1 (ko) * | 2013-09-06 | 2016-09-09 | 주식회사 잉크테크 | 전도성 패턴 형성 방법 및 전도성 패턴 |
| JP2015052742A (ja) * | 2013-09-09 | 2015-03-19 | パナソニックIpマネジメント株式会社 | 画像表示装置およびその製造方法 |
| KR102029480B1 (ko) * | 2013-09-10 | 2019-10-07 | 삼성전기주식회사 | 인쇄회로기판 제조 방법 |
| JP6530699B2 (ja) * | 2015-11-27 | 2019-06-12 | 矢崎総業株式会社 | 車両用パネル及び車両用配線構造 |
| CN109152111B (zh) * | 2018-08-30 | 2021-06-22 | 厦门市金福冠包装用品有限公司 | 一种电热膜 |
| US11799183B2 (en) * | 2019-07-17 | 2023-10-24 | Xerox Corporation | System, apparatus, and method for producing printed electrically conductive lines |
| CN112770518A (zh) * | 2019-10-21 | 2021-05-07 | 深南电路股份有限公司 | 电路板及其制造方法 |
| CN111640881B (zh) * | 2020-06-17 | 2023-05-12 | 昆山国显光电有限公司 | 阵列基板及其制备方法 |
| CN116626949B (zh) * | 2023-06-05 | 2025-09-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | 高透无色的电致变色对电极及其制备方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7317435A (nl) * | 1973-12-20 | 1975-06-24 | Philips Nv | Gasontladingspaneel. |
| US4193181A (en) * | 1976-12-06 | 1980-03-18 | Texas Instruments Incorporated | Method for mounting electrically conductive wires to a substrate |
| GB2054259A (en) * | 1979-06-27 | 1981-02-11 | Modern Controls Inc | Gas discharge display device |
| US4352040A (en) * | 1980-07-14 | 1982-09-28 | Burroughs Corporation | Display panel with anode and cathode electrodes located in slots of base plate |
| JPS6013562A (ja) * | 1983-07-05 | 1985-01-24 | Matsushita Electric Ind Co Ltd | 平行電極構体 |
| JP2568857B2 (ja) * | 1987-09-22 | 1997-01-08 | セイコーエプソン株式会社 | アクティブマトリックス基板 |
| JPH01167729A (ja) * | 1987-12-23 | 1989-07-03 | Hitachi Ltd | 液晶表示パネル |
| JPH0216790A (ja) * | 1988-07-04 | 1990-01-19 | Nippon Telegr & Teleph Corp <Ntt> | 配線層形成法 |
| JPH0286189A (ja) * | 1988-09-22 | 1990-03-27 | Mitsubishi Electric Corp | 大電流基板の製造方法 |
| US5076667A (en) * | 1990-01-29 | 1991-12-31 | David Sarnoff Research Center, Inc. | High speed signal and power supply bussing for liquid crystal displays |
| JPH0461293A (ja) * | 1990-06-29 | 1992-02-27 | Toshiba Corp | 回路基板及びその製造方法 |
| JPH0490514A (ja) * | 1990-08-02 | 1992-03-24 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JPH04363092A (ja) * | 1991-02-07 | 1992-12-15 | Oki Electric Ind Co Ltd | 基板に導電層を形成する方法 |
| JPH04265936A (ja) * | 1991-02-20 | 1992-09-22 | Sony Corp | 画像表示装置の製造方法 |
| US5317432A (en) * | 1991-09-04 | 1994-05-31 | Sony Corporation | Liquid crystal display device with a capacitor and a thin film transistor in a trench for each pixel |
| JP2720655B2 (ja) * | 1991-10-02 | 1998-03-04 | 日本電気株式会社 | 薄膜トランジスタ制御型蛍光表示パネル |
| US5163220A (en) * | 1991-10-09 | 1992-11-17 | The Unites States Of America As Represented By The Secretary Of The Army | Method of enhancing the electrical conductivity of indium-tin-oxide electrode stripes |
| JPH05265040A (ja) * | 1992-03-18 | 1993-10-15 | Sanyo Electric Co Ltd | 液晶表示装置およびその製造方法 |
| JPH05266978A (ja) * | 1992-03-18 | 1993-10-15 | Toshiba Corp | 端面発光型薄膜エレクトロルミネッセンス素子 |
| JP3173750B2 (ja) * | 1993-05-21 | 2001-06-04 | 株式会社半導体エネルギー研究所 | 電気光学装置の作製方法 |
-
1993
- 1993-07-19 FR FR9308836A patent/FR2708170B1/fr not_active Expired - Fee Related
-
1994
- 1994-07-18 KR KR1019960700278A patent/KR100375875B1/ko not_active Expired - Fee Related
- 1994-07-18 CA CA002167534A patent/CA2167534A1/fr not_active Abandoned
- 1994-07-18 DE DE69402553T patent/DE69402553T2/de not_active Expired - Fee Related
- 1994-07-18 EP EP94922931A patent/EP0710433B1/de not_active Expired - Lifetime
- 1994-07-18 JP JP50496995A patent/JP3644963B2/ja not_active Expired - Fee Related
- 1994-07-18 WO PCT/FR1994/000893 patent/WO1995003684A1/fr not_active Ceased
- 1994-07-18 AT AT94922931T patent/ATE151588T1/de not_active IP Right Cessation
- 1994-07-18 US US08/581,620 patent/US5846854A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09504652A (ja) | 1997-05-06 |
| EP0710433B1 (de) | 1997-04-09 |
| JP3644963B2 (ja) | 2005-05-11 |
| KR960704455A (ko) | 1996-08-31 |
| FR2708170A1 (fr) | 1995-01-27 |
| DE69402553D1 (de) | 1997-05-15 |
| DE69402553T2 (de) | 1997-11-20 |
| EP0710433A1 (de) | 1996-05-08 |
| WO1995003684A1 (fr) | 1995-02-02 |
| FR2708170B1 (fr) | 1995-09-08 |
| US5846854A (en) | 1998-12-08 |
| KR100375875B1 (ko) | 2004-09-08 |
| CA2167534A1 (fr) | 1995-02-02 |
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