ATE151588T1 - Sehr hochleitfähige und sehr feine elektrische schaltungen, verfahren zur herstellung und diese enthaltende anordnungen - Google Patents

Sehr hochleitfähige und sehr feine elektrische schaltungen, verfahren zur herstellung und diese enthaltende anordnungen

Info

Publication number
ATE151588T1
ATE151588T1 AT94922931T AT94922931T ATE151588T1 AT E151588 T1 ATE151588 T1 AT E151588T1 AT 94922931 T AT94922931 T AT 94922931T AT 94922931 T AT94922931 T AT 94922931T AT E151588 T1 ATE151588 T1 AT E151588T1
Authority
AT
Austria
Prior art keywords
groove
conducting
pct
highly conductive
conducting layer
Prior art date
Application number
AT94922931T
Other languages
English (en)
Inventor
Andre Giraud
Jacques Fremaux
Original Assignee
Cogidev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cogidev filed Critical Cogidev
Application granted granted Critical
Publication of ATE151588T1 publication Critical patent/ATE151588T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00Gas-filled discharge tubes with solid cathode
    • H01J17/38Cold-cathode tubes
    • H01J17/48Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H01J17/49Display panels, e.g. with crossed electrodes, e.g. making use of direct current
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/13439Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153Constructional details
    • G02F1/155Electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/84Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Liquid Crystal (AREA)
  • Surface Heating Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Bipolar Transistors (AREA)
  • Logic Circuits (AREA)
AT94922931T 1993-07-19 1994-07-18 Sehr hochleitfähige und sehr feine elektrische schaltungen, verfahren zur herstellung und diese enthaltende anordnungen ATE151588T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9308836A FR2708170B1 (fr) 1993-07-19 1993-07-19 Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant.

Publications (1)

Publication Number Publication Date
ATE151588T1 true ATE151588T1 (de) 1997-04-15

Family

ID=9449364

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94922931T ATE151588T1 (de) 1993-07-19 1994-07-18 Sehr hochleitfähige und sehr feine elektrische schaltungen, verfahren zur herstellung und diese enthaltende anordnungen

Country Status (9)

Country Link
US (1) US5846854A (de)
EP (1) EP0710433B1 (de)
JP (1) JP3644963B2 (de)
KR (1) KR100375875B1 (de)
AT (1) ATE151588T1 (de)
CA (1) CA2167534A1 (de)
DE (1) DE69402553T2 (de)
FR (1) FR2708170B1 (de)
WO (1) WO1995003684A1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08313887A (ja) * 1995-05-12 1996-11-29 Sony Corp プラズマアドレス表示パネル及びその製造方法
US5853446A (en) * 1996-04-16 1998-12-29 Corning Incorporated Method for forming glass rib structures
US6004835A (en) 1997-04-25 1999-12-21 Micron Technology, Inc. Method of forming integrated circuitry, conductive lines, a conductive grid, a conductive network, an electrical interconnection to anode location and an electrical interconnection with a transistor source/drain region
DE19804314A1 (de) * 1998-02-04 1999-08-12 Bayer Ag Elektrochromes Display
US6106352A (en) * 1998-03-18 2000-08-22 Sanyo Electric Co., Ltd. Method for fabrication of organic electroluminescent device
US6106303A (en) * 1998-05-27 2000-08-22 Lear Automotive Dearborn, Inc. Trim panel having grooves with integrally formed electrical circuits
GB2341477B (en) * 1998-09-10 2002-12-24 Sharp Kk Electrode substrate, manufacturing method thereof, and liquid crystal display element
FR2791147B1 (fr) * 1999-03-19 2002-08-30 Saint Gobain Vitrage Dispositif electrochimique du type dispositif electrocommandable a proprietes optiques et/ou energetiques variables
US6905945B1 (en) 1999-04-22 2005-06-14 California Institute Of Technology Microwave bonding of MEMS component
US20060027570A1 (en) * 1999-04-22 2006-02-09 California Institute Of Technology, A Corporation Microwave bonding of MEMS component
AU4651300A (en) * 1999-04-22 2000-11-10 California Institute Of Technology Microwave bonding of mems component
ES2234598T3 (es) * 1999-05-20 2005-07-01 Glaverbel Panel vidriado para automoviles con una capa de recubrimiento de control solar electricamente calefactable.
EP1183913B2 (de) 1999-05-20 2017-03-01 AGC Flat Glass Europe SA Glasscheibe für kraftfahrzeuge miteiner durch sonnenlicht steurnden beschichtung versehen mit einem datenübertragungsfenster
US6305000B1 (en) 1999-06-15 2001-10-16 International Business Machines Corporation Placement of conductive stripes in electronic circuits to satisfy metal density requirements
DE10026976C2 (de) * 2000-05-31 2002-08-01 Schott Glas Kanalplatte aus Glas für Flachbildschirme und Verfahren zu ihrer Herstellung
DE10044425C2 (de) * 2000-09-08 2003-01-09 Siemens Ag Verfahren zur Herstellung einer Leuchstoffschicht
US6864435B2 (en) * 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
EP1271227A1 (de) * 2001-06-26 2003-01-02 Nanomat Limited Elektrochrome Anzeige mit hoher Auflösung und Verfahren zu deren Herstellung
DE10141709A1 (de) * 2001-08-25 2003-03-06 Schott Glas Verfahren und Vorrichtung zum Erzeugen einer Struktur in einem Werkstück
US6591496B2 (en) * 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
US6818155B2 (en) * 2002-01-02 2004-11-16 Intel Corporation Attaching components to a printed circuit card
FR2845778B1 (fr) * 2002-10-09 2004-12-17 Saint Gobain Dispositif electrocommandable du type electroluminescent
US8062734B2 (en) * 2003-04-28 2011-11-22 Eastman Kodak Company Article comprising conductive conduit channels
US20060110580A1 (en) * 2003-04-28 2006-05-25 Aylward Peter T Article comprising conductive conduit channels
EP1651018A4 (de) * 2003-06-04 2009-11-11 Tadahiro Ohmi Substrat und prozess zu seiner herstellung
US7240314B1 (en) 2004-06-04 2007-07-03 Magma Design Automation, Inc. Redundantly tied metal fill for IR-drop and layout density optimization
JP4275644B2 (ja) * 2004-06-23 2009-06-10 シャープ株式会社 アクティブマトリクス基板およびその製造方法、並びに電子装置
JP4351129B2 (ja) * 2004-09-01 2009-10-28 日東電工株式会社 配線回路基板
US7829363B2 (en) * 2006-05-22 2010-11-09 Cardiomems, Inc. Method and apparatus for microjoining dissimilar materials
EP2137456A4 (de) * 2007-03-21 2011-03-16 Ntera Inc Dünne, gedruckte farbanzeige
JP2011513846A (ja) 2008-02-28 2011-04-28 スリーエム イノベイティブ プロパティズ カンパニー タッチスクリーンセンサ
CN103217832B (zh) * 2013-04-24 2015-06-17 京东方科技集团股份有限公司 彩色滤光片、彩色滤光片制作方法和显示装置
KR101656452B1 (ko) * 2013-09-06 2016-09-09 주식회사 잉크테크 전도성 패턴 형성 방법 및 전도성 패턴
JP2015052742A (ja) * 2013-09-09 2015-03-19 パナソニックIpマネジメント株式会社 画像表示装置およびその製造方法
KR102029480B1 (ko) * 2013-09-10 2019-10-07 삼성전기주식회사 인쇄회로기판 제조 방법
JP6530699B2 (ja) * 2015-11-27 2019-06-12 矢崎総業株式会社 車両用パネル及び車両用配線構造
CN109152111B (zh) * 2018-08-30 2021-06-22 厦门市金福冠包装用品有限公司 一种电热膜
US11799183B2 (en) * 2019-07-17 2023-10-24 Xerox Corporation System, apparatus, and method for producing printed electrically conductive lines
CN112770518A (zh) * 2019-10-21 2021-05-07 深南电路股份有限公司 电路板及其制造方法
CN111640881B (zh) * 2020-06-17 2023-05-12 昆山国显光电有限公司 阵列基板及其制备方法
CN116626949B (zh) * 2023-06-05 2025-09-26 中国科学院苏州纳米技术与纳米仿生研究所 高透无色的电致变色对电极及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7317435A (nl) * 1973-12-20 1975-06-24 Philips Nv Gasontladingspaneel.
US4193181A (en) * 1976-12-06 1980-03-18 Texas Instruments Incorporated Method for mounting electrically conductive wires to a substrate
GB2054259A (en) * 1979-06-27 1981-02-11 Modern Controls Inc Gas discharge display device
US4352040A (en) * 1980-07-14 1982-09-28 Burroughs Corporation Display panel with anode and cathode electrodes located in slots of base plate
JPS6013562A (ja) * 1983-07-05 1985-01-24 Matsushita Electric Ind Co Ltd 平行電極構体
JP2568857B2 (ja) * 1987-09-22 1997-01-08 セイコーエプソン株式会社 アクティブマトリックス基板
JPH01167729A (ja) * 1987-12-23 1989-07-03 Hitachi Ltd 液晶表示パネル
JPH0216790A (ja) * 1988-07-04 1990-01-19 Nippon Telegr & Teleph Corp <Ntt> 配線層形成法
JPH0286189A (ja) * 1988-09-22 1990-03-27 Mitsubishi Electric Corp 大電流基板の製造方法
US5076667A (en) * 1990-01-29 1991-12-31 David Sarnoff Research Center, Inc. High speed signal and power supply bussing for liquid crystal displays
JPH0461293A (ja) * 1990-06-29 1992-02-27 Toshiba Corp 回路基板及びその製造方法
JPH0490514A (ja) * 1990-08-02 1992-03-24 Semiconductor Energy Lab Co Ltd 半導体装置
JPH04363092A (ja) * 1991-02-07 1992-12-15 Oki Electric Ind Co Ltd 基板に導電層を形成する方法
JPH04265936A (ja) * 1991-02-20 1992-09-22 Sony Corp 画像表示装置の製造方法
US5317432A (en) * 1991-09-04 1994-05-31 Sony Corporation Liquid crystal display device with a capacitor and a thin film transistor in a trench for each pixel
JP2720655B2 (ja) * 1991-10-02 1998-03-04 日本電気株式会社 薄膜トランジスタ制御型蛍光表示パネル
US5163220A (en) * 1991-10-09 1992-11-17 The Unites States Of America As Represented By The Secretary Of The Army Method of enhancing the electrical conductivity of indium-tin-oxide electrode stripes
JPH05265040A (ja) * 1992-03-18 1993-10-15 Sanyo Electric Co Ltd 液晶表示装置およびその製造方法
JPH05266978A (ja) * 1992-03-18 1993-10-15 Toshiba Corp 端面発光型薄膜エレクトロルミネッセンス素子
JP3173750B2 (ja) * 1993-05-21 2001-06-04 株式会社半導体エネルギー研究所 電気光学装置の作製方法

Also Published As

Publication number Publication date
JPH09504652A (ja) 1997-05-06
EP0710433B1 (de) 1997-04-09
JP3644963B2 (ja) 2005-05-11
KR960704455A (ko) 1996-08-31
FR2708170A1 (fr) 1995-01-27
DE69402553D1 (de) 1997-05-15
DE69402553T2 (de) 1997-11-20
EP0710433A1 (de) 1996-05-08
WO1995003684A1 (fr) 1995-02-02
FR2708170B1 (fr) 1995-09-08
US5846854A (en) 1998-12-08
KR100375875B1 (ko) 2004-09-08
CA2167534A1 (fr) 1995-02-02

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