ATE177767T1 - Epoxydharzzusammensetzung - Google Patents

Epoxydharzzusammensetzung

Info

Publication number: ATE177767T1
Authority: AT; Austria
Prior art keywords: epoxy resin; resin composition; polyhydric phenol; biphenol; castings
Prior art date: 1993-09-24

Application number

AT94928824T

Other languages

English (en)

Inventor

Yasuyuki Murata

Yoshinori Nakanishi

Mitsukazu Ochi

Original Assignee

Shell Int Research

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-09-24

Filing date

1994-09-23

Publication date

1999-04-15

1994-09-23 Application filed by Shell Int Research filed Critical Shell Int Research

1999-04-15 Application granted granted Critical

1999-04-15 Publication of ATE177767T1 publication Critical patent/ATE177767T1/de

Links

239000003822 epoxy resin Substances 0.000 title abstract 3
229920000647 polyepoxide Polymers 0.000 title abstract 3
239000000203 mixture Substances 0.000 title abstract 2
-1 phenol compound Chemical class 0.000 abstract 2
239000000853 adhesive Substances 0.000 abstract 1
230000001070 adhesive effect Effects 0.000 abstract 1
125000003118 aryl group Chemical group 0.000 abstract 1
238000005266 casting Methods 0.000 abstract 1
239000003795 chemical substances by application Substances 0.000 abstract 1
125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
238000000465 moulding Methods 0.000 abstract 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
239000005011 phenolic resin Substances 0.000 abstract 1
239000003566 sealing material Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Epoxy Resins (AREA)
Compositions Of Macromolecular Compounds (AREA)

AT94928824T 1993-09-24 1994-09-23 Epoxydharzzusammensetzung ATE177767T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP25896793A JP3428699B2 (ja)	1993-09-24	1993-09-24	エポキシ樹脂組成物

Publications (1)

Publication Number	Publication Date
ATE177767T1 true ATE177767T1 (de)	1999-04-15

Family

ID=17327511

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT94928824T ATE177767T1 (de)	1993-09-24	1994-09-23	Epoxydharzzusammensetzung

Country Status (12)

Country	Link
US (1)	US5597876A (de)
EP (1)	EP0720630B1 (de)
JP (1)	JP3428699B2 (de)
KR (1)	KR100327918B1 (de)
CN (1)	CN1051326C (de)
AT (1)	ATE177767T1 (de)
AU (1)	AU7810094A (de)
DE (1)	DE69417246T2 (de)
ES (1)	ES2130449T3 (de)
MY (1)	MY111712A (de)
TW (1)	TW354328B (de)
WO (1)	WO1995008584A1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
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JPH07304846A (ja) *	1994-05-09	1995-11-21	Yuka Shell Epoxy Kk	エポキシ樹脂組成物
JPH08259665A (ja) *	1995-03-20	1996-10-08	Dainippon Ink & Chem Inc	エポキシ樹脂硬化剤及びその製造方法
US5859153A (en) *	1996-06-21	1999-01-12	Minnesota Mining And Manufacturing Company	Novolak compounds useful as adhesion promoters for epoxy resins
ES2367838T3 (es)	1998-09-10	2011-11-10	JX Nippon Mining & Metals Corp.	Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
US6117536A (en) *	1998-09-10	2000-09-12	Ga-Tek Inc.	Adhesion promoting layer for use with epoxy prepregs
US6132589A (en) *	1998-09-10	2000-10-17	Ga-Tek Inc.	Treated copper foil and process for making treated copper foil
US6156865A (en) *	1998-11-19	2000-12-05	Nec Corporation	Flame retardant thermosetting resin composition
US20030151206A1 (en) *	2001-10-25	2003-08-14	Smith Walter J.	Method, apparatus and system for creating a brush seal
US20040173969A1 (en) *	2001-10-25	2004-09-09	Smith Walter J.	Turbine brush seal
US20050053758A1 (en) *	2001-10-25	2005-03-10	Smith Walter J.	Method, apparatus and system for creating a brush seal
JP2004010762A (ja)	2002-06-07	2004-01-15	Hitachi Ltd	エポキシ樹脂，エポキシ樹脂組成物，エポキシ樹脂硬化物及びそれらの製造方法
CN1312190C (zh) *	2002-11-11	2007-04-25	西北工业大学	树脂状酚类固化剂及其制备方法
US7291684B2 (en)	2003-03-11	2007-11-06	Sumitomo Bakelite Co., Ltd.	Resin composition for encapsulating semiconductor chip and semiconductor device therewith
KR100697937B1 (ko) *	2003-03-11	2007-03-20	스미토모 베이클라이트 가부시키가이샤	반도체 봉지용 수지 조성물 및 이것을 사용한 반도체장치
KR100697938B1 (ko) *	2003-03-25	2007-03-20	스미토모 베이클라이트 가부시키가이샤	반도체 봉지용 수지 조성물 및 이것을 사용한 반도체장치
US7846998B2 (en) *	2004-03-03	2010-12-07	Hitachi Chemical Co., Ltd.	Sealant epoxy-resin molding material, and electronic component device
CN101027336B (zh)	2004-09-01	2010-12-08	大日本油墨化学工业株式会社	环氧树脂组合物、其固化物、半导体封装材料、新型酚醛树脂、新型环氧树脂、新型酚醛树脂的制造方法及新型环氧树脂的制造方法
JP4941804B2 (ja) *	2005-03-02	2012-05-30	Ｄｉｃ株式会社	エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂
JP4710379B2 (ja) *	2005-03-30	2011-06-29	住友ベークライト株式会社	エポキシ樹脂組成物および半導体封止用エポキシ樹脂
KR100997606B1 (ko) *	2005-07-29	2010-11-30	스미토모 베이클라이트 가부시키가이샤	에폭시 수지 조성물 및 반도체장치
JP5257725B2 (ja) *	2005-08-03	2013-08-07	Ｄｉｃ株式会社	エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
US8642714B2 (en)	2006-01-25	2014-02-04	Hitachi Chemical Company, Ltd.	Phenol resin and resin composition
KR101386027B1 (ko) *	2006-06-16	2014-04-24	훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하	코팅 시스템
CN101611069B (zh)	2006-11-13	2012-05-30	新日铁化学株式会社	结晶性树脂固化物、结晶性树脂复合体及其制造方法
US20120251830A1 (en) *	2009-09-29	2012-10-04	Hitachi Chemical Company, Ltd	Resin composition, resin sheet, and cured resin material and method for producing the same
KR101597390B1 (ko) *	2009-09-29	2016-02-24	히타치가세이가부시끼가이샤	다층 수지 시트 및 그 제조 방법, 다층 수지 시트 경화물의 제조 방법, 그리고, 고열전도 수지 시트 적층체 및 그 제조 방법
JP5760997B2 (ja) *	2010-11-30	2015-08-12	三菱化学株式会社	エポキシ樹脂、エポキシ樹脂組成物及び硬化物
KR101854948B1 (ko) *	2011-03-28	2018-05-04	히타치가세이가부시끼가이샤	수지 조성물, 수지 시트, 수지 시트 경화물, 수지 시트 적층체, 수지 시트 적층체 경화물 및 그 제조 방법, 반도체 장치, 그리고 ｌｅｄ 장치
JP6221634B2 (ja) *	2013-10-30	2017-11-01	Tdk株式会社	樹脂組成物、樹脂シート、樹脂硬化物および基板
JP5983590B2 (ja) *	2013-12-13	2016-08-31	株式会社デンソー	硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品
TWI733770B (zh) *	2016-04-04	2021-07-21	日商迪愛生股份有限公司	環氧樹脂組成物、硬化性組成物及半導體密封材料
JP7320942B2 (ja)	2018-12-28	2023-08-04	日鉄ケミカル＆マテリアル株式会社	エポキシ樹脂、エポキシ樹脂組成物及び硬化物
EP3950755B1 (de) *	2019-03-28	2025-12-03	FUJIFILM Corporation	Zusammensetzung und wärmeleitendes material
KR102259563B1 (ko) *	2019-10-02	2021-06-01	한화솔루션 주식회사	커버레이용 접착제 조성물 및 이를 포함하는 fpcb용 커버레이
JP6992932B2 (ja) *	2019-10-25	2022-02-03	Dic株式会社	多官能フェノール樹脂、多官能エポキシ樹脂、それらを含む硬化性樹脂組成物及びその硬化物
JP7553271B2 (ja) *	2020-06-26	2024-09-18	日鉄ケミカル＆マテリアル株式会社	多価ヒドロキシ樹脂、その製造方法、及びそれを含むエポキシ樹脂組成物、並びにエポキシ樹脂硬化物
JP2022011688A (ja) *	2020-06-30	2022-01-17	日鉄ケミカル＆マテリアル株式会社	樹脂組成物及びその硬化物
JPWO2023149493A1 (de)	2022-02-04	2023-08-10
CN118591574A (zh)	2022-02-25	2024-09-03	日铁化学材料株式会社	环氧树脂、多元羟基树脂、环氧树脂组合物及环氧树脂硬化物以及多元羟基树脂的制造方法

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JPS5710651A (en) *	1980-06-23	1982-01-20	Asahi Denka Kogyo Kk	Coating material composition
JPS62167318A (ja) *	1986-01-20	1987-07-23	Teijin Ltd	エポキシ樹脂の硬化方法
JPH06104712B2 (ja) *	1987-04-08	1994-12-21	東レ株式会社	半導体封止用樹脂組成物
CH672493A5 (de) *	1987-07-23	1989-11-30	Ciba Geigy Ag
JPS6443521A (en) *	1987-08-10	1989-02-15	Toray Industries	Epoxy resin
JP2732122B2 (ja) *	1989-06-13	1998-03-25	油化シエルエポキシ株式会社	エポキシ樹脂及び封止用エポキシ樹脂組成物
JPH0314818A (ja) *	1989-06-13	1991-01-23	Yuka Shell Epoxy Kk	半導体封止用エポキシ樹脂組成物
EP0403022B1 (de) *	1989-06-13	1996-11-13	Shell Internationale Researchmaatschappij B.V.	Epoxyharzzusammensetzung zum Einkapseln
JPH082940B2 (ja) *	1990-10-30	1996-01-17	信越化学工業株式会社	エポキシ樹脂組成物及び半導体装置
JP2837538B2 (ja) *	1990-11-29	1998-12-16	日東電工株式会社	半導体装置
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JPH1043521A (ja) *	1996-08-02	1998-02-17	Sanyo Electric Co Ltd	浴水循環浄化装置

1993
- 1993-09-24 JP JP25896793A patent/JP3428699B2/ja not_active Expired - Fee Related
1994
- 1994-09-21 MY MYPI94002505A patent/MY111712A/en unknown
- 1994-09-23 EP EP94928824A patent/EP0720630B1/de not_active Expired - Lifetime
- 1994-09-23 CN CN94194075A patent/CN1051326C/zh not_active Expired - Lifetime
- 1994-09-23 KR KR1019960701556A patent/KR100327918B1/ko not_active Expired - Fee Related
- 1994-09-23 WO PCT/EP1994/003215 patent/WO1995008584A1/en not_active Ceased
- 1994-09-23 AU AU78100/94A patent/AU7810094A/en not_active Abandoned
- 1994-09-23 ES ES94928824T patent/ES2130449T3/es not_active Expired - Lifetime
- 1994-09-23 AT AT94928824T patent/ATE177767T1/de not_active IP Right Cessation
- 1994-09-23 DE DE69417246T patent/DE69417246T2/de not_active Expired - Fee Related
- 1994-09-26 TW TW083108907A patent/TW354328B/zh active
1996
- 1996-04-01 US US08/625,839 patent/US5597876A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JP3428699B2 (ja)	2003-07-22
MY111712A (en)	2000-11-30
JPH0790052A (ja)	1995-04-04
WO1995008584A1 (en)	1995-03-30
EP0720630B1 (de)	1999-03-17
CN1051326C (zh)	2000-04-12
EP0720630A1 (de)	1996-07-10
US5597876A (en)	1997-01-28
AU7810094A (en)	1995-04-10
ES2130449T3 (es)	1999-07-01
DE69417246T2 (de)	1999-09-02
TW354328B (en)	1999-03-11
KR100327918B1 (ko)	2002-07-06
CN1134713A (zh)	1996-10-30
DE69417246D1 (de)	1999-04-22

Legal Events

Date	Code	Title	Description
1999-10-15	UEP	Publication of translation of european patent specification
2002-06-15	REN	Ceased due to non-payment of the annual fee

Publication	Publication Date	Title
DE69417246D1 (de)	1999-04-22	Epoxydharzzusammensetzung
EP0324405A3 (de)	1991-03-06	Modifizierte und kettenverlängerte Epoxydharze
ES8800291A1 (es)	1987-10-16	Un procedimiento para preparar un producto preimpregnado
EP0225174A3 (de)	1989-04-12	Thermohärtbare Harzzusammensetzung und ein Verbundstoff, der dieses gehärtete Harz als Bindemittel enthält
MY104947A (en)	1994-07-30	Modified advanced epoxy resins
MX9606181A (es)	1998-06-30	Composiciones curables.
MY146603A (en)	2012-08-30	Expoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel expoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin
EP0266306A3 (en)	1989-05-24	Curing agent composition for epoxy resins
FI960115A0 (fi)	1996-01-10	Epoksihartsien ja epoksoitujen polydieenien yhteensopivia seoksia
ATE156850T1 (de)	1997-08-15	Zusammensetzung aromatischer polycarbonate
BR9507780A (pt)	1997-08-19	Combinaçoes de poliéster/policarbonato com propriedades realçadas
ES2091281T3 (es)	1996-11-01	Composiciones de resina epoxidica modificadas con caucho.
EP0133281A3 (de)	1988-11-30	Härtbare faserverstärkte Epoxyharzzubereitung
EP1020456A4 (de)	2003-03-05	Mehrwertige phenole, epoxyharze, epoxyharz-zuammensetzungen und ihre vernetzten produkte
MY130575A (en)	2007-06-29	Epoxy resin composition
AU585849B2 (en)	1989-06-29	Curable epoxy resin compositions
MY105987A (en)	1995-02-28	Curing agent for epoxy resin.
DK1150837T3 (da)	2005-06-06	Sammensætning og fremgangsmåde til fremme af hæftning af termoplastiske elastomerer til metaloverflader
JPS51129498A (en)	1976-11-11	Thermosetting resin composition
MY119145A (en)	2005-04-30	Heat resistant resin composition and adhesive sheet using the same
EP0342027A3 (de)	1991-01-09	Zusammensetzungen aus Epoxiden und aromatischen Polysiloxanen
EP0394965A3 (de)	1991-12-18	Harzzusammensetzung für Laminate
JPS5734122A (en)	1982-02-24	Thermosetting resin composition
DE69213902D1 (de)	1996-10-24	Epoxydharzzusammensetzung
BR9204496A (pt)	1993-06-01	Resinas sinteticas