ATE177767T1 - Epoxydharzzusammensetzung - Google Patents

Epoxydharzzusammensetzung

Info

Publication number
ATE177767T1
ATE177767T1 AT94928824T AT94928824T ATE177767T1 AT E177767 T1 ATE177767 T1 AT E177767T1 AT 94928824 T AT94928824 T AT 94928824T AT 94928824 T AT94928824 T AT 94928824T AT E177767 T1 ATE177767 T1 AT E177767T1
Authority
AT
Austria
Prior art keywords
epoxy resin
resin composition
polyhydric phenol
biphenol
castings
Prior art date
Application number
AT94928824T
Other languages
English (en)
Inventor
Yasuyuki Murata
Yoshinori Nakanishi
Mitsukazu Ochi
Original Assignee
Shell Int Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Int Research filed Critical Shell Int Research
Application granted granted Critical
Publication of ATE177767T1 publication Critical patent/ATE177767T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT94928824T 1993-09-24 1994-09-23 Epoxydharzzusammensetzung ATE177767T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25896793A JP3428699B2 (ja) 1993-09-24 1993-09-24 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
ATE177767T1 true ATE177767T1 (de) 1999-04-15

Family

ID=17327511

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94928824T ATE177767T1 (de) 1993-09-24 1994-09-23 Epoxydharzzusammensetzung

Country Status (12)

Country Link
US (1) US5597876A (de)
EP (1) EP0720630B1 (de)
JP (1) JP3428699B2 (de)
KR (1) KR100327918B1 (de)
CN (1) CN1051326C (de)
AT (1) ATE177767T1 (de)
AU (1) AU7810094A (de)
DE (1) DE69417246T2 (de)
ES (1) ES2130449T3 (de)
MY (1) MY111712A (de)
TW (1) TW354328B (de)
WO (1) WO1995008584A1 (de)

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JPH07304846A (ja) * 1994-05-09 1995-11-21 Yuka Shell Epoxy Kk エポキシ樹脂組成物
JPH08259665A (ja) * 1995-03-20 1996-10-08 Dainippon Ink & Chem Inc エポキシ樹脂硬化剤及びその製造方法
US5859153A (en) * 1996-06-21 1999-01-12 Minnesota Mining And Manufacturing Company Novolak compounds useful as adhesion promoters for epoxy resins
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
ES2367838T3 (es) 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
US6156865A (en) * 1998-11-19 2000-12-05 Nec Corporation Flame retardant thermosetting resin composition
US20040173969A1 (en) * 2001-10-25 2004-09-09 Smith Walter J. Turbine brush seal
US20050053758A1 (en) * 2001-10-25 2005-03-10 Smith Walter J. Method, apparatus and system for creating a brush seal
US20030151206A1 (en) * 2001-10-25 2003-08-14 Smith Walter J. Method, apparatus and system for creating a brush seal
JP2004010762A (ja) 2002-06-07 2004-01-15 Hitachi Ltd エポキシ樹脂，エポキシ樹脂組成物，エポキシ樹脂硬化物及びそれらの製造方法
CN1312190C (zh) * 2002-11-11 2007-04-25 西北工业大学 树脂状酚类固化剂及其制备方法
KR100697937B1 (ko) * 2003-03-11 2007-03-20 스미토모 베이클라이트 가부시키가이샤 반도체 봉지용 수지 조성물 및 이것을 사용한 반도체장치
US7291684B2 (en) 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
WO2004085511A1 (ja) * 2003-03-25 2004-10-07 Sumitomo Bakelite Co., Ltd. 半導体封止用樹脂組成物およびこれを用いた半導体装置
US7846998B2 (en) * 2004-03-03 2010-12-07 Hitachi Chemical Co., Ltd. Sealant epoxy-resin molding material, and electronic component device
EP1785441B1 (de) 2004-09-01 2011-06-08 DIC Corporation Epoxidharzzusammensetzung, härtungsprodukte davon, material zur verkapselung von halbleitern, neues phenolharz, neues epoxidharz, verfahren zur herstellung von neuem phenolharz und verfahren zur herstellung von neuem epoxidharz
JP4941804B2 (ja) * 2005-03-02 2012-05-30 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂
JP4710379B2 (ja) * 2005-03-30 2011-06-29 住友ベークライト株式会社 エポキシ樹脂組成物および半導体封止用エポキシ樹脂
CN101223207B (zh) * 2005-07-29 2012-02-29 住友电木株式会社 环氧树脂组合物和半导体装置
JP5257725B2 (ja) * 2005-08-03 2013-08-07 Ｄｉｃ株式会社 エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
CN103012702A (zh) 2006-01-25 2013-04-03 日立化成工业株式会社 酚醛树脂及树脂组合物
ATE528333T1 (de) * 2006-06-16 2011-10-15 Huntsman Adv Mat Switzerland Beschichtungssystem
WO2008059755A1 (en) 2006-11-13 2008-05-22 Nippon Steel Chemical Co., Ltd. Crystalline resin cured product, crystalline resin composite body and method for producing the same
US20120251830A1 (en) * 2009-09-29 2012-10-04 Hitachi Chemical Company, Ltd Resin composition, resin sheet, and cured resin material and method for producing the same
JP5573842B2 (ja) * 2009-09-29 2014-08-20 日立化成株式会社 多層樹脂シート及びその製造方法、多層樹脂シート硬化物の製造方法、並びに、高熱伝導樹脂シート積層体及びその製造方法
JP5760997B2 (ja) * 2010-11-30 2015-08-12 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
KR101854948B1 (ko) * 2011-03-28 2018-05-04 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 수지 시트 경화물, 수지 시트 적층체, 수지 시트 적층체 경화물 및 그 제조 방법, 반도체 장치, 그리고 ｌｅｄ 장치
JP6221634B2 (ja) * 2013-10-30 2017-11-01 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および基板
JP5983590B2 (ja) * 2013-12-13 2016-08-31 株式会社デンソー 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品
TWI733770B (zh) * 2016-04-04 2021-07-21 日商迪愛生股份有限公司 環氧樹脂組成物、硬化性組成物及半導體密封材料
JP7320942B2 (ja) 2018-12-28 2023-08-04 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
WO2020195496A1 (ja) * 2019-03-28 2020-10-01 富士フイルム株式会社 組成物、熱伝導材料
KR102259563B1 (ko) * 2019-10-02 2021-06-01 한화솔루션 주식회사 커버레이용 접착제 조성물 및 이를 포함하는 fpcb용 커버레이
US11767424B2 (en) 2019-10-25 2023-09-26 Dic Corporation Polyfunctional phenolic resin, polyfunctional epoxy resin, curable resin composition containing these, and cured product thereof
JP7553271B2 (ja) 2020-06-26 2024-09-18 日鉄ケミカル＆マテリアル株式会社 多価ヒドロキシ樹脂、その製造方法、及びそれを含むエポキシ樹脂組成物、並びにエポキシ樹脂硬化物
JP2022011688A (ja) * 2020-06-30 2022-01-17 日鉄ケミカル＆マテリアル株式会社 樹脂組成物及びその硬化物
KR20240140085A (ko) 2022-02-04 2024-09-24 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 에폭시 수지, 에폭시 수지 조성물 및 에폭시 수지 경화물
KR20240151158A (ko) 2022-02-25 2024-10-17 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 에폭시 수지, 다가 히드록시 수지, 에폭시 수지 조성물, 및 에폭시 수지 경화물, 그리고 다가 히드록시 수지의 제조 방법

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPS5710651A (en) * 1980-06-23 1982-01-20 Asahi Denka Kogyo Kk Coating material composition
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPH06104712B2 (ja) * 1987-04-08 1994-12-21 東レ株式会社 半導体封止用樹脂組成物
CH672493A5 (de) * 1987-07-23 1989-11-30 Ciba Geigy Ag
JPS6443521A (en) * 1987-08-10 1989-02-15 Toray Industries Epoxy resin
JP2732122B2 (ja) * 1989-06-13 1998-03-25 油化シエルエポキシ株式会社 エポキシ樹脂及び封止用エポキシ樹脂組成物
EP0403022B1 (de) * 1989-06-13 1996-11-13 Shell Internationale Researchmaatschappij B.V. Epoxyharzzusammensetzung zum Einkapseln
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JPH082940B2 (ja) * 1990-10-30 1996-01-17 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2837538B2 (ja) * 1990-11-29 1998-12-16 日東電工株式会社 半導体装置
US5334674A (en) * 1991-06-19 1994-08-02 Dai-Ichi Kogyo Seiyaku Co., Ltd. Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions
US5319005A (en) * 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
JP3143721B2 (ja) * 1992-05-07 2001-03-07 ジャパンエポキシレジン株式会社 封止用エポキシ樹脂組成物
JPH1043521A (ja) * 1996-08-02 1998-02-17 Sanyo Electric Co Ltd 浴水循環浄化装置

Also Published As

Publication number Publication date
CN1134713A (zh) 1996-10-30
WO1995008584A1 (en) 1995-03-30
AU7810094A (en) 1995-04-10
KR100327918B1 (ko) 2002-07-06
EP0720630A1 (de) 1996-07-10
US5597876A (en) 1997-01-28
DE69417246D1 (de) 1999-04-22
JPH0790052A (ja) 1995-04-04
ES2130449T3 (es) 1999-07-01
CN1051326C (zh) 2000-04-12
JP3428699B2 (ja) 2003-07-22
DE69417246T2 (de) 1999-09-02
TW354328B (en) 1999-03-11
MY111712A (en) 2000-11-30
EP0720630B1 (de) 1999-03-17

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee