ES2130449T3 - Composicion de resina epoxidica. - Google Patents

Composicion de resina epoxidica.

Info

Publication number
ES2130449T3
ES2130449T3 ES94928824T ES94928824T ES2130449T3 ES 2130449 T3 ES2130449 T3 ES 2130449T3 ES 94928824 T ES94928824 T ES 94928824T ES 94928824 T ES94928824 T ES 94928824T ES 2130449 T3 ES2130449 T3 ES 2130449T3
Authority
ES
Spain
Prior art keywords
composition
epoxy resin
polyhydric phenol
epoxidic resin
biphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94928824T
Other languages
English (en)
Inventor
Yasuyuki Murata
Yoshinori Nakanishi
Mitsukazu Ochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHELL INT RESEARCH
Shell Internationale Research Maatschappij BV
Original Assignee
SHELL INT RESEARCH
Shell Internationale Research Maatschappij BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHELL INT RESEARCH, Shell Internationale Research Maatschappij BV filed Critical SHELL INT RESEARCH
Application granted granted Critical
Publication of ES2130449T3 publication Critical patent/ES2130449T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

UNA COMPOSICION DE UNA RESINA EPOXI QUE CONTIENE: (A) UNA RESINA EPOXI TIPO BIFENOL REPRESENTADA POR LA FORMULA GENERAL (I) EN LA QUE R{SUP,1} ES UN ATOMO DE HIDROGENO, UN ATOMO DE HALOGENO, UN GRUPO ALQUILO DE 1 A 10 ATOMOS DE CARBONO, UN GRUPO FENILO SUSTITUIDO O NO SUSTITUIDO, UN GRUPO ARALQUILO SUSTITUIDO O NO SUSTITUIDO O UN GRUPO ALCOXI, EN DONDE CADA R{SUP,1} ES IGUAL O DIFERENTE, Y M ES UN NUMERO QUE TIENE UN VALOR MEDIO DE 0 A 5; Y (B) UN AGENTE POLIHIDRICO DE CURACION DE LA RESINA DE FENOL DERIVADO DE UN COMPUESTO DE FENOL POLIHIDRICO QUE TIENE 2 O MAS GRUPOS HIDROXILO FENOLICOS UNIDOS EN POSICIONES ADYACENTES EN EL ANILLO AROMATICO SIEMPRE Y CUANDO LA RESINA EPOXI NO CONTENGA UN 100 % EN PESO, EN BASE AL PESO DE LA RESINA EPOXI TIPO BIFENOL, DEL COMPUESTO DE LA FORMULA GENERAL (I) EN LA QUE TODOS LOS GRUPOS R{SUP,1} SON HIDROGENO.
ES94928824T 1993-09-24 1994-09-23 Composicion de resina epoxidica. Expired - Lifetime ES2130449T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25896793A JP3428699B2 (ja) 1993-09-24 1993-09-24 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
ES2130449T3 true ES2130449T3 (es) 1999-07-01

Family

ID=17327511

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94928824T Expired - Lifetime ES2130449T3 (es) 1993-09-24 1994-09-23 Composicion de resina epoxidica.

Country Status (12)

Country Link
US (1) US5597876A (es)
EP (1) EP0720630B1 (es)
JP (1) JP3428699B2 (es)
KR (1) KR100327918B1 (es)
CN (1) CN1051326C (es)
AT (1) ATE177767T1 (es)
AU (1) AU7810094A (es)
DE (1) DE69417246T2 (es)
ES (1) ES2130449T3 (es)
MY (1) MY111712A (es)
TW (1) TW354328B (es)
WO (1) WO1995008584A1 (es)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07304846A (ja) * 1994-05-09 1995-11-21 Yuka Shell Epoxy Kk エポキシ樹脂組成物
JPH08259665A (ja) * 1995-03-20 1996-10-08 Dainippon Ink & Chem Inc エポキシ樹脂硬化剤及びその製造方法
US5859153A (en) * 1996-06-21 1999-01-12 Minnesota Mining And Manufacturing Company Novolak compounds useful as adhesion promoters for epoxy resins
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs
ES2367838T3 (es) 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
US6156865A (en) * 1998-11-19 2000-12-05 Nec Corporation Flame retardant thermosetting resin composition
US20050053758A1 (en) * 2001-10-25 2005-03-10 Smith Walter J. Method, apparatus and system for creating a brush seal
US20030151206A1 (en) * 2001-10-25 2003-08-14 Smith Walter J. Method, apparatus and system for creating a brush seal
US20040173969A1 (en) * 2001-10-25 2004-09-09 Smith Walter J. Turbine brush seal
JP2004010762A (ja) 2002-06-07 2004-01-15 Hitachi Ltd エポキシ樹脂，エポキシ樹脂組成物，エポキシ樹脂硬化物及びそれらの製造方法
CN1312190C (zh) * 2002-11-11 2007-04-25 西北工业大学 树脂状酚类固化剂及其制备方法
US7291684B2 (en) 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
MY134219A (en) 2003-03-11 2007-11-30 Sumitomo Bakelite Co Resin composition for encapsulating semiconductor chip and semiconductor device therewith
JP4404051B2 (ja) * 2003-03-25 2010-01-27 住友ベークライト株式会社 半導体封止用樹脂組成物およびこれを用いた半導体装置
CN100523046C (zh) * 2004-03-03 2009-08-05 日立化成工业株式会社 密封用环氧树脂成形材料以及电子器件装置
EP1785441B1 (en) * 2004-09-01 2011-06-08 DIC Corporation Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin
JP4941804B2 (ja) * 2005-03-02 2012-05-30 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂
JP4710379B2 (ja) * 2005-03-30 2011-06-29 住友ベークライト株式会社 エポキシ樹脂組成物および半導体封止用エポキシ樹脂
CN101223207B (zh) * 2005-07-29 2012-02-29 住友电木株式会社 环氧树脂组合物和半导体装置
JP5257725B2 (ja) * 2005-08-03 2013-08-07 Ｄｉｃ株式会社 エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
CN103012702A (zh) 2006-01-25 2013-04-03 日立化成工业株式会社 酚醛树脂及树脂组合物
US8003737B2 (en) 2006-06-16 2011-08-23 Huntsman International Llc Coating system
WO2008059755A1 (en) 2006-11-13 2008-05-22 Nippon Steel Chemical Co., Ltd. Crystalline resin cured product, crystalline resin composite body and method for producing the same
KR101683355B1 (ko) * 2009-09-29 2016-12-06 히타치가세이가부시끼가이샤 다층 수지 시트 및 그 제조 방법, 다층 수지 시트 경화물의 제조 방법, 그리고, 고열전도 수지 시트 적층체 및 그 제조 방법
CN102549068B (zh) * 2009-09-29 2016-05-04 日立化成工业株式会社 树脂组合物、树脂片以及树脂固化物及其制造方法
JP5760997B2 (ja) * 2010-11-30 2015-08-12 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
EP2692759B1 (en) * 2011-03-28 2018-10-31 Hitachi Chemical Company, Ltd. Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device
JP6221634B2 (ja) * 2013-10-30 2017-11-01 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および基板
JP5983590B2 (ja) * 2013-12-13 2016-08-31 株式会社デンソー 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品
TWI733770B (zh) * 2016-04-04 2021-07-21 日商迪愛生股份有限公司 環氧樹脂組成物、硬化性組成物及半導體密封材料
JP7320942B2 (ja) 2018-12-28 2023-08-04 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
CN113557253B (zh) * 2019-03-28 2025-02-07 富士胶片株式会社 组合物、导热材料
KR102259563B1 (ko) * 2019-10-02 2021-06-01 한화솔루션 주식회사 커버레이용 접착제 조성물 및 이를 포함하는 fpcb용 커버레이
JP6992932B2 (ja) * 2019-10-25 2022-02-03 Dic株式会社 多官能フェノール樹脂、多官能エポキシ樹脂、それらを含む硬化性樹脂組成物及びその硬化物
JP7553271B2 (ja) 2020-06-26 2024-09-18 日鉄ケミカル＆マテリアル株式会社 多価ヒドロキシ樹脂、その製造方法、及びそれを含むエポキシ樹脂組成物、並びにエポキシ樹脂硬化物
JP2022011688A (ja) * 2020-06-30 2022-01-17 日鉄ケミカル＆マテリアル株式会社 樹脂組成物及びその硬化物
KR20240140085A (ko) 2022-02-04 2024-09-24 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 에폭시 수지, 에폭시 수지 조성물 및 에폭시 수지 경화물
KR20240151158A (ko) 2022-02-25 2024-10-17 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 에폭시 수지, 다가 히드록시 수지, 에폭시 수지 조성물, 및 에폭시 수지 경화물, 그리고 다가 히드록시 수지의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710651A (en) * 1980-06-23 1982-01-20 Asahi Denka Kogyo Kk Coating material composition
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPH06104712B2 (ja) * 1987-04-08 1994-12-21 東レ株式会社 半導体封止用樹脂組成物
CH672493A5 (es) * 1987-07-23 1989-11-30 Ciba Geigy Ag
JPS6443521A (en) * 1987-08-10 1989-02-15 Toray Industries Epoxy resin
DE69029102T2 (de) * 1989-06-13 1997-03-20 Shell Int Research Epoxyharzzusammensetzung zum Einkapseln
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JP2732122B2 (ja) * 1989-06-13 1998-03-25 油化シエルエポキシ株式会社 エポキシ樹脂及び封止用エポキシ樹脂組成物
JPH082940B2 (ja) * 1990-10-30 1996-01-17 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2837538B2 (ja) * 1990-11-29 1998-12-16 日東電工株式会社 半導体装置
US5334674A (en) * 1991-06-19 1994-08-02 Dai-Ichi Kogyo Seiyaku Co., Ltd. Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions
US5319005A (en) * 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
JP3143721B2 (ja) * 1992-05-07 2001-03-07 ジャパンエポキシレジン株式会社 封止用エポキシ樹脂組成物
JPH1043521A (ja) * 1996-08-02 1998-02-17 Sanyo Electric Co Ltd 浴水循環浄化装置

Also Published As

Publication number Publication date
KR100327918B1 (ko) 2002-07-06
JP3428699B2 (ja) 2003-07-22
EP0720630A1 (en) 1996-07-10
WO1995008584A1 (en) 1995-03-30
TW354328B (en) 1999-03-11
DE69417246T2 (de) 1999-09-02
EP0720630B1 (en) 1999-03-17
ATE177767T1 (de) 1999-04-15
CN1051326C (zh) 2000-04-12
JPH0790052A (ja) 1995-04-04
US5597876A (en) 1997-01-28
DE69417246D1 (de) 1999-04-22
AU7810094A (en) 1995-04-10
CN1134713A (zh) 1996-10-30
MY111712A (en) 2000-11-30

Similar Documents

Publication Publication Date Title
ATE177767T1 (de) Epoxydharzzusammensetzung
MX9606181A (es) Composiciones curables.
EP0225174A3 (en) Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix
EP0324405A3 (en) Modified advanced epoxy resins
AR021895A1 (es) Empleo de composiciones con resinas epoxidicas resistentes a los golpes, tales composiciones para ser utilizadas como adhesivos y procedimiento parael pegado de materiales
ES8802532A1 (es) Un procedimiento para fabricar un material compuesto termoestable a base de una matriz de resina epoxidica reticulada.
NO983859L (no) Beleggingssammensetninger inneholdende en bicyclo- eller spiro-ortoesterfunksjonell forbindelse
FI960115A0 (fi) Epoksihartsien ja epoksoitujen polydieenien yhteensopivia seoksia
MY104947A (en) Modified advanced epoxy resins
ES2091281T3 (es) Composiciones de resina epoxidica modificadas con caucho.
MY146603A (en) Expoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel expoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin
EP0266306A3 (en) Curing agent composition for epoxy resins
EP0258900A3 (en) Thermosetting resin composition
NO964349D0 (no) Epoksyderte lav-viskositets gummi-seiggjöringsmodifiserende midler for epoksyharpikser
ATE123502T1 (de) Härtbare epoxydharzzusammensetzungen.
MY130575A (en) Epoxy resin composition
CA2154074A1 (en) Urethane modified epoxy resin compositions
JPS51129498A (en) Thermosetting resin composition
MY131397A (en) Solvent system
ES2054227T5 (es) Composicion de resina basada en una resina de poliester, una resina aminica y una resina epoxidica.
EP0394965A3 (en) Resin composition for laminate
JPS5734122A (en) Thermosetting resin composition
BR9204496A (pt) Resinas sinteticas
EP0264705A3 (en) Blends of relatively low molecular weight epoxy resins and relatively high molecular weight epoxy or phenoxy resins and cured products therefrom
EP0469786A3 (en) High surface area magnesia as hardener for phenolic resins

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 720630

Country of ref document: ES