ATE188574T1 - Verfahren zur herstellung einer integrierten schaltungsanordnung - Google Patents
Verfahren zur herstellung einer integrierten schaltungsanordnungInfo
- Publication number
- ATE188574T1 ATE188574T1 AT95307087T AT95307087T ATE188574T1 AT E188574 T1 ATE188574 T1 AT E188574T1 AT 95307087 T AT95307087 T AT 95307087T AT 95307087 T AT95307087 T AT 95307087T AT E188574 T1 ATE188574 T1 AT E188574T1
- Authority
- AT
- Austria
- Prior art keywords
- indium
- channel region
- producing
- integrated circuit
- circuit arrangement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
- H10D84/0167—Manufacturing their channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P30/00—Ion implantation into wafers, substrates or parts of devices
- H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
- H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
- H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US32092494A | 1994-10-11 | 1994-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE188574T1 true ATE188574T1 (de) | 2000-01-15 |
Family
ID=23248430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT95307087T ATE188574T1 (de) | 1994-10-11 | 1995-10-06 | Verfahren zur herstellung einer integrierten schaltungsanordnung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6331458B1 (de) |
| EP (1) | EP0707345B1 (de) |
| JP (1) | JP4260905B2 (de) |
| KR (1) | KR960015811A (de) |
| AT (1) | ATE188574T1 (de) |
| DE (1) | DE69514307T2 (de) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5821147A (en) * | 1995-12-11 | 1998-10-13 | Lucent Technologies, Inc. | Integrated circuit fabrication |
| WO1999035685A1 (en) * | 1998-01-05 | 1999-07-15 | Advanced Micro Devices, Inc. | Integrated cmos transistor formation |
| US7091093B1 (en) * | 1999-09-17 | 2006-08-15 | Matsushita Electric Industrial Co., Ltd. | Method for fabricating a semiconductor device having a pocket dopant diffused layer |
| JP2001094094A (ja) | 1999-09-21 | 2001-04-06 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP2002076332A (ja) * | 2000-08-24 | 2002-03-15 | Hitachi Ltd | 絶縁ゲート型電界効果トランジスタ及びその製造方法 |
| KR100387536B1 (ko) * | 2000-10-18 | 2003-06-18 | 주식회사 루밴틱스 | 광학 접착제 수지 조성물 및 광학 접착제 수지의 제조방법 |
| KR20020037459A (ko) * | 2000-11-14 | 2002-05-22 | 박성수 | 각종 카드에 인쇄되는 uv향기 잉크의 조성물 |
| US6885078B2 (en) * | 2001-11-09 | 2005-04-26 | Lsi Logic Corporation | Circuit isolation utilizing MeV implantation |
| US7189606B2 (en) * | 2002-06-05 | 2007-03-13 | Micron Technology, Inc. | Method of forming fully-depleted (FD) SOI MOSFET access transistor |
| US6756619B2 (en) | 2002-08-26 | 2004-06-29 | Micron Technology, Inc. | Semiconductor constructions |
| KR100496551B1 (ko) * | 2002-11-20 | 2005-06-22 | 주식회사 하이닉스반도체 | 반도체 소자의 제조 방법 |
| US6734070B1 (en) * | 2003-03-17 | 2004-05-11 | Oki Electric Industry Co., Ltd. | Method of fabricating a semiconductor device with field-effect transistors having shallow source and drain junctions |
| US6949785B2 (en) * | 2004-01-14 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Random access memory (RAM) capacitor in shallow trench isolation with improved electrical isolation to overlying gate electrodes |
| US7071515B2 (en) * | 2003-07-14 | 2006-07-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Narrow width effect improvement with photoresist plug process and STI corner ion implantation |
| JP2006186261A (ja) * | 2004-12-28 | 2006-07-13 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| US7645687B2 (en) * | 2005-01-20 | 2010-01-12 | Chartered Semiconductor Manufacturing, Ltd. | Method to fabricate variable work function gates for FUSI devices |
| KR100779395B1 (ko) * | 2006-08-31 | 2007-11-23 | 동부일렉트로닉스 주식회사 | 반도체소자 및 그 제조방법 |
| TWI418603B (zh) | 2007-03-16 | 2013-12-11 | Mitsubishi Gas Chemical Co | 光穿透型電磁波屏蔽積層體及其製造方法、光穿透型電波吸收體,以及接著劑組成物 |
| US8173503B2 (en) * | 2009-02-23 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fabrication of source/drain extensions with ultra-shallow junctions |
| JP5499780B2 (ja) * | 2010-03-04 | 2014-05-21 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
| KR20130142882A (ko) | 2010-06-01 | 2013-12-30 | 리켄 테크노스 가부시키가이샤 | 도료 및 접착제 조성물, 접착 방법 및 적층체 |
| US10553494B2 (en) * | 2016-11-29 | 2020-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Breakdown resistant semiconductor apparatus and method of making same |
| JP6996858B2 (ja) * | 2017-03-29 | 2022-01-17 | 旭化成エレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| KR102694956B1 (ko) * | 2022-12-28 | 2024-08-14 | 원광대학교산학협력단 | 유기 실란 커플링제를 포함하는 광경화형 점착제 조성물 및 이의 제조 방법 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3883372A (en) * | 1973-07-11 | 1975-05-13 | Westinghouse Electric Corp | Method of making a planar graded channel MOS transistor |
| JPS5952849A (ja) * | 1982-09-20 | 1984-03-27 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS60224271A (ja) | 1984-04-20 | 1985-11-08 | Nec Corp | 半導体装置およびその製造方法 |
| US4746964A (en) | 1986-08-28 | 1988-05-24 | Fairchild Semiconductor Corporation | Modification of properties of p-type dopants with other p-type dopants |
| US4851360A (en) * | 1986-09-29 | 1989-07-25 | Texas Instruments Incorporated | NMOS source/drain doping with both P and As |
| US4835112A (en) | 1988-03-08 | 1989-05-30 | Motorola, Inc. | CMOS salicide process using germanium implantation |
| US5021851A (en) | 1988-05-03 | 1991-06-04 | Texas Instruments Incorporated | NMOS source/drain doping with both P and As |
| US4889819A (en) * | 1988-05-20 | 1989-12-26 | International Business Machines Corporation | Method for fabricating shallow junctions by preamorphizing with dopant of same conductivity as substrate |
| JPH02291150A (ja) * | 1989-04-28 | 1990-11-30 | Hitachi Ltd | 半導体装置 |
| US5134447A (en) | 1989-09-22 | 1992-07-28 | At&T Bell Laboratories | Neutral impurities to increase lifetime of operation of semiconductor devices |
| US5296401A (en) * | 1990-01-11 | 1994-03-22 | Mitsubishi Denki Kabushiki Kaisha | MIS device having p channel MOS device and n channel MOS device with LDD structure and manufacturing method thereof |
| US5320974A (en) * | 1991-07-25 | 1994-06-14 | Matsushita Electric Industrial Co., Ltd. | Method for making semiconductor transistor device by implanting punch through stoppers |
| US5266508A (en) * | 1991-08-26 | 1993-11-30 | Sharp Kabushiki Kaisha | Process for manufacturing semiconductor device |
| US5344790A (en) * | 1993-08-31 | 1994-09-06 | Sgs-Thomson Microelectronics, Inc. | Making integrated circuit transistor having drain junction offset |
-
1995
- 1995-09-22 US US08/532,861 patent/US6331458B1/en not_active Expired - Lifetime
- 1995-10-06 AT AT95307087T patent/ATE188574T1/de active
- 1995-10-06 EP EP95307087A patent/EP0707345B1/de not_active Expired - Lifetime
- 1995-10-06 DE DE69514307T patent/DE69514307T2/de not_active Expired - Lifetime
- 1995-10-09 JP JP26179595A patent/JP4260905B2/ja not_active Expired - Lifetime
- 1995-10-10 KR KR1019950034672A patent/KR960015811A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0707345B1 (de) | 2000-01-05 |
| DE69514307D1 (de) | 2000-02-10 |
| DE69514307T2 (de) | 2000-08-10 |
| EP0707345A1 (de) | 1996-04-17 |
| KR960015811A (ko) | 1996-05-22 |
| US6331458B1 (en) | 2001-12-18 |
| JPH08250730A (ja) | 1996-09-27 |
| JP4260905B2 (ja) | 2009-04-30 |
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