ATE203553T1 - Einkomponentenepoxidharz verarbeitungsmaterial - Google Patents

Einkomponentenepoxidharz verarbeitungsmaterial

Info

Publication number: ATE203553T1
Authority: AT; Austria
Prior art keywords: epoxy resin; processing material; resin composition; component epoxy; resin processing
Prior art date: 1996-03-22

Application number

AT97908219T

Other languages

English (en)

Inventor

James Edward Hoge

Teruko Uchimi Miyazaki

Rajan Eadara

Original Assignee

Vantico Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-03-22

Filing date

1997-03-12

Publication date

2001-08-15

1997-03-12 Application filed by Vantico Ag filed Critical Vantico Ag

2001-08-15 Application granted granted Critical

2001-08-15 Publication of ATE203553T1 publication Critical patent/ATE203553T1/de

Links

239000003822 epoxy resin Substances 0.000 title abstract 5
229920000647 polyepoxide Polymers 0.000 title abstract 5
239000000463 material Substances 0.000 title 1
239000000203 mixture Substances 0.000 abstract 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract 1
-1 boron trichloride amine Chemical class 0.000 abstract 1
239000003085 diluting agent Substances 0.000 abstract 1
239000000945 filler Substances 0.000 abstract 1
230000009477 glass transition Effects 0.000 abstract 1
239000000377 silicon dioxide Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/14—Polyepoxides
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/72—Complexes of boron halides
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Engineering & Computer Science (AREA)
Ceramic Engineering (AREA)
Materials Engineering (AREA)
Structural Engineering (AREA)
Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)

AT97908219T 1996-03-22 1997-03-12 Einkomponentenepoxidharz verarbeitungsmaterial ATE203553T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US1397096P	1996-03-22	1996-03-22
PCT/EP1997/001245 WO1997035900A1 (en)	1996-03-22	1997-03-12	One-component epoxy resin tooling material

Publications (1)

Publication Number	Publication Date
ATE203553T1 true ATE203553T1 (de)	2001-08-15

Family

ID=21762787

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT97908219T ATE203553T1 (de)	1996-03-22	1997-03-12	Einkomponentenepoxidharz verarbeitungsmaterial

Country Status (9)

Country	Link
US (1)	US5859096A (de)
EP (1)	EP0888394B1 (de)
JP (1)	JP3906417B2 (de)
AT (1)	ATE203553T1 (de)
AU (1)	AU707263B2 (de)
CA (1)	CA2248730A1 (de)
DE (1)	DE69705826T2 (de)
ES (1)	ES2160928T3 (de)
WO (1)	WO1997035900A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
ATE256164T1 (de) *	1996-09-20	2003-12-15	Vantico Gmbh	Verfahren zum transfer-spritzgiessen von stabilen epoxidharzzusammensetzungen
US6060540A (en) *	1998-02-13	2000-05-09	Landec Corporation	Modeling pastes
US6355196B1 (en) *	1998-03-16	2002-03-12	Vantico Inc.	Process for producing direct tooling mold and method for using the same
US6103784A (en)	1998-08-27	2000-08-15	Henkel Corporation	Corrosion resistant structural foam
US6403222B1 (en)	2000-09-22	2002-06-11	Henkel Corporation	Wax-modified thermosettable compositions
US6451876B1 (en)	2000-10-10	2002-09-17	Henkel Corporation	Two component thermosettable compositions useful for producing structural reinforcing adhesives
CA2471368A1 (en) *	2001-12-21	2003-07-03	Henkel Teroson Gmbh	Expandable epoxy resin-based systems modified with thermoplastic polymers
EP1668057A1 (de) *	2003-09-29	2006-06-14	Siemens Aktiengesellschaft	Harzformulierung, verwendungen dazu und aus der formulierung hergestellter formkörper
US7708858B2 (en)	2004-11-17	2010-05-04	Huntsman Advanced Materials Americas Inc.	Method of making high temperature resistant models or tools
RU2277561C1 (ru) *	2005-04-14	2006-06-10	Открытое акционерное общество "Научно-производственное объединение Стеклопластик"	Полимерная композиция
WO2010121853A1 (en) *	2009-04-24	2010-10-28	Huntsman Advanced Materials (Switzerland) Gmbh	Method of making chemically resistant moulds and tools
CN102596557B (zh) *	2009-09-24	2015-11-25	西格弗里德·贝格哈默	隔热成型件和其制造方法
CN103496887B (zh) *	2013-09-13	2014-12-10	天津大学	一种环氧树脂钨酸锆混凝土及其制备方法
CN104446137B (zh) *	2014-11-03	2016-08-24	武汉二航路桥特种工程有限责任公司	一种利用线性热膨胀系数制备环氧砂浆和混凝土的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3395121A (en) *	1966-09-21	1968-07-30	Stauffer Chemical Co	Curing epoxy resins with boron trichloride-tertiary amine complexes
GB1346768A (en) *	1970-08-11	1974-02-13	Ciba Geigy Uk Ltd	Curable epoxide resin compositions
WO1981001857A1 (en) *	1979-12-26	1981-07-09	Polymer Corp	Chemical resistant coatings
WO1982000651A1 (en) *	1980-08-22	1982-03-04	Housenick J	Epoxy coating powders
US4546067A (en) *	1983-01-26	1985-10-08	Ciba Geigy Corporation	Image production utilizing multifunctional light sensitive compounds
US4528305A (en) *	1984-04-13	1985-07-09	Ciba-Geigy Corporation	Epoxy resin modeling stock
CA1259897A (en) *	1985-04-02	1989-09-26	Madan M. Bagga	Bonding process using curable epoxide resin adhesive
GB8607565D0 (en) *	1986-03-26	1986-04-30	Ciba Geigy Ag	Curable compositions
US4732962A (en) *	1987-02-18	1988-03-22	General Motors Corporation	High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
US4906711A (en) *	1988-07-29	1990-03-06	General Electric Company	Low viscosity epoxy resin compositions
EP0362138B1 (de) *	1988-09-29	1995-07-19	Ciba-Geigy Ag	Epoxidharzgemische
DE4003842C2 (de) *	1989-02-09	1997-06-05	Shinetsu Chemical Co	Epoxidharzmassen zum Einkapseln von Halbleitern, enthaltend kugelförmiges Siliciumdioxid
US5359020A (en) *	1990-05-22	1994-10-25	Ciba-Geigy Corporation	Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers
TW275070B (de) *	1992-12-22	1996-05-01	Ciba Geigy Ag

1997
- 1997-03-12 ES ES97908219T patent/ES2160928T3/es not_active Expired - Lifetime
- 1997-03-12 AT AT97908219T patent/ATE203553T1/de not_active IP Right Cessation
- 1997-03-12 EP EP97908219A patent/EP0888394B1/de not_active Expired - Lifetime
- 1997-03-12 AU AU20264/97A patent/AU707263B2/en not_active Ceased
- 1997-03-12 WO PCT/EP1997/001245 patent/WO1997035900A1/en not_active Ceased
- 1997-03-12 CA CA002248730A patent/CA2248730A1/en not_active Abandoned
- 1997-03-12 JP JP53399097A patent/JP3906417B2/ja not_active Expired - Fee Related
- 1997-03-12 DE DE69705826T patent/DE69705826T2/de not_active Expired - Lifetime
- 1997-03-19 US US08/820,822 patent/US5859096A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JP2000507292A (ja)	2000-06-13
EP0888394A1 (de)	1999-01-07
JP3906417B2 (ja)	2007-04-18
EP0888394B1 (de)	2001-07-25
AU707263B2 (en)	1999-07-08
DE69705826D1 (de)	2001-08-30
DE69705826T2 (de)	2002-04-11
WO1997035900A1 (en)	1997-10-02
ES2160928T3 (es)	2001-11-16
AU2026497A (en)	1997-10-17
CA2248730A1 (en)	1997-10-02
US5859096A (en)	1999-01-12

Legal Events

Date	Code	Title	Description
2002-01-15	UEP	Publication of translation of european patent specification
2005-12-15	REN	Ceased due to non-payment of the annual fee

Publication	Publication Date	Title
ATE203553T1 (de)	2001-08-15	Einkomponentenepoxidharz verarbeitungsmaterial
FI901084A0 (fi)	1990-03-02	Epoksidihartsimuovausmassoja
ATE129274T1 (de)	1995-11-15	Wärmehärtende pulverlackzusammensetzung.
SG63803A1 (en)	1999-03-30	Epoxy-resin composition to seal semiconductors and resin-sealed semiconductor device
AU6486596A (en)	1997-11-26	Bonding fibrous batts with thermosetting fiber-binders of certain epoxy resins
KR950032471A (ko)	1995-12-20	저팽창성 중합체 조성물
US4876298A (en)	1989-10-24	Epoxy resin composition
CA2405643A1 (en)	2003-04-11	Powder coating composition, method for the curing thereof, and articles derived therefrom
KR930000570A (ko)	1993-01-15	분말 코팅 조성물의 제조방법
MY121028A (en)	2005-12-30	Polyfunctional cyanate resin composition and resin-encapsulated type semiconductor device.
ES2100888T3 (es)	1997-07-01	Una matriz epoxidica con tenacidad aumentada con una tolerancia al daño y un rendimiento termico mejorados.
WO2003037985A1 (en)	2003-05-08	Curable epoxy resin compositions and process for production thereof
JPH06279568A (ja)	1994-10-04	エポキシ樹脂組成物及びそれを用いた光半導体装置
JPS63160254A (ja)	1988-07-04	半導体装置
JPS61223024A (ja)	1986-10-03	半導体封止用エポキシ樹脂組成物
DE59009715D1 (de)	1995-11-02	Epoxidharzmischungen.
JPS6475565A (en)	1989-03-22	Thermosetting polymer composition
MX9706096A (es)	1997-11-29	Composicion de resina epoxi capaz de curarse a baja temperatura.
JPS6411355A (en)	1989-01-13	Resin sealed semiconductor device
JPH0291146A (ja)	1990-03-30	ジアリルフタレート樹脂組成物
JPH0245554A (ja)	1990-02-15	半導体封止用樹脂組成物
JPH0468329B2 (de)	1992-11-02
JPH05217704A (ja)	1993-08-27	封止用エポキシ樹脂成形材料
EP0310681A4 (de)	1990-06-26	Zubereitung zum dämpfen von schwingungen.
KR940014611A (ko)	1994-07-19	에폭시 수지조성물 및 이로 밀봉된 수지밀봉형 반도체장치