JP2000507292A - 一成分のエポキシ樹脂工具材料 - Google Patents
一成分のエポキシ樹脂工具材料Info
- Publication number
- JP2000507292A JP2000507292A JP9533990A JP53399097A JP2000507292A JP 2000507292 A JP2000507292 A JP 2000507292A JP 9533990 A JP9533990 A JP 9533990A JP 53399097 A JP53399097 A JP 53399097A JP 2000507292 A JP2000507292 A JP 2000507292A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- component
- composition according
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/14—Polyepoxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/72—Complexes of boron halides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.(A)エポキシ樹脂またはその混合物; (B)多官能価エポキシ樹脂希釈剤; (C)三塩化ホウ素アミンコンプレックス;および (D)シリカまたはシリケートからなる群から選択される少なくとも1種の充 填剤 からなる、周囲温度で貯蔵安定であり、かつ130℃以上の後硬化高ガラス転移 温度(Tg)および−30ないし125℃の温度範囲にわたる1.7×10-5c m/cm/℃未満の低い熱膨張率(CTE)を保持する硬化性エポキシ樹脂組成 物。 2. 成分(A)のエポキシ樹脂がエポキシフェノールノボラックまたはエポキシ フェノールノボラックの混合物である請求項1記載のエポキシ樹脂組成物。 3. 成分(A)のエポキシ樹脂が少なくとも1種の多官能価エポキシ樹脂からな る請求項1記載のエポキシ樹脂組成物。 4. 成分(B)に係る多官能価エポキシ樹脂希釈剤が2官能価である請求項1記 載のエポキシ樹脂組成物。 5. 2官能価エポキシ樹脂希釈剤がブタンジオールジグリシジルエーテルである 請求項4記載のエポキシ樹脂組成物。 6. 成分(D)の充填剤がシリカ、ケイ酸アルミニウム、ケイ酸カルシウムもし くはケイホウ酸ガラス、またはそれらの混合物である請求項1記載のエポキシ樹 脂組成物。 7. 組成物の全重量を基準として、成分(A)が10−50%の量で存在し;成 分(B)が1−10%の量で存在し;成分(C)が1−7%の量で存在し;そし て成分(D)が30−80%の量で存在する請求項1記載のエポキシ樹脂組成物 。 8. 加工添加剤をさらに含有する請求項1記載のエポキシ樹脂組成物。 9. 140℃以上の後硬化Tgを保持する請求項1記載のエポキシ樹脂組成物。 10.150℃以上の後硬化Tgを保持する請求項9記載のエポキシ樹脂組成物 。 11.−30ないし125℃の温度範囲にわたる1.6×10-5cm/cm/℃ 未満の後硬化CTEを保持する請求項1記載のエポキシ樹脂組成物。 12.(A)エポキシ樹脂またはその混合物; (B)多官能価エポキシ樹脂希釈剤; (C)三塩化ホウ素アミンコンプレックス;および (D)シリカまたはシリケートからなる群から選択される少なくとも1種 の充填剤 の硬化生成物からなる、130℃以上のガラス転移温度(Tg)および−30な いし125℃の温度範囲にわたる1.7×10-5cm/cm/℃未満の熱膨張率 (CTE)を有する硬化されたエポキシ樹脂組成物。 13.成分(A)のエポキシ樹脂がエポキシフェノールノボラックまたはエポキ シフェノールノボラックの混合物である請求項12記載の硬化されたエポキシ樹 脂組成物。 14.成分(A)のエポキシ樹脂が少なくとも1種の多官能価エポキシからなる 請求項12記載の硬化されたエポキシ樹脂組成物。 15.成分(B)の多官能価エポキシ樹脂希釈剤が2官能価である請求項12記 載の硬化されたエポキシ樹脂組成物。 16.2官能価エポキシ樹脂希釈剤がブタンジオールジグリシジルエーテルであ る請求項15記載の硬化されたエポキシ樹脂組成物。 17.成分(D)の充填剤がシリカ、ケイ酸アルミニウム、ケイ酸カルシウムも しくはケイホウ酸ガラス、またはそれらの混合物である請求項12記載の硬化さ れたエポキシ樹脂組成物。 18.組成物の全重量を基準として、成分(A)が10−50%の量で存在し; 成分(B)が1−10%の量で存在し;成分(C)が1−7%の量で存在し;そ して成分(D)が30−80%の量で存在する請求項12記載の硬化されたエポ キシ樹脂組成物。 19.加工添加剤をさらに含有する請求項12記載の硬化されたエポキシ樹脂組 成物。 20.140℃以上のTgを有する請求項12記載の硬化されたエポキシ樹脂組 成物。 21.150℃以上のTgを有する請求項20記載の硬化されたエポキシ樹脂組 成物。 22.−30ないし125℃の温度範囲にわたる1.6×10-5cm/cm/℃ 未満のCTEを有する請求項12記載の硬化された硬化性エポキシ樹脂組成物。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1397096P | 1996-03-22 | 1996-03-22 | |
| US60/013,970 | 1996-03-22 | ||
| PCT/EP1997/001245 WO1997035900A1 (en) | 1996-03-22 | 1997-03-12 | One-component epoxy resin tooling material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000507292A true JP2000507292A (ja) | 2000-06-13 |
| JP3906417B2 JP3906417B2 (ja) | 2007-04-18 |
Family
ID=21762787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53399097A Expired - Fee Related JP3906417B2 (ja) | 1996-03-22 | 1997-03-12 | 一成分エポキシ樹脂工具材料 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5859096A (ja) |
| EP (1) | EP0888394B1 (ja) |
| JP (1) | JP3906417B2 (ja) |
| AT (1) | ATE203553T1 (ja) |
| AU (1) | AU707263B2 (ja) |
| CA (1) | CA2248730A1 (ja) |
| DE (1) | DE69705826T2 (ja) |
| ES (1) | ES2160928T3 (ja) |
| WO (1) | WO1997035900A1 (ja) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2263418A1 (en) * | 1996-09-20 | 1998-03-26 | James Edward Hoge | Resin transfer molding process using stable epoxy resin compositions |
| US6060540A (en) * | 1998-02-13 | 2000-05-09 | Landec Corporation | Modeling pastes |
| US6355196B1 (en) * | 1998-03-16 | 2002-03-12 | Vantico Inc. | Process for producing direct tooling mold and method for using the same |
| US6103784A (en) | 1998-08-27 | 2000-08-15 | Henkel Corporation | Corrosion resistant structural foam |
| US6403222B1 (en) | 2000-09-22 | 2002-06-11 | Henkel Corporation | Wax-modified thermosettable compositions |
| US6451876B1 (en) | 2000-10-10 | 2002-09-17 | Henkel Corporation | Two component thermosettable compositions useful for producing structural reinforcing adhesives |
| AU2002361136A1 (en) * | 2001-12-21 | 2003-07-09 | Henkel Teroson Gmbh | Expandable epoxy resin-based systems modified with thermoplastic polymers |
| EP1668057A1 (de) * | 2003-09-29 | 2006-06-14 | Siemens Aktiengesellschaft | Harzformulierung, verwendungen dazu und aus der formulierung hergestellter formkörper |
| EP1817148B1 (en) | 2004-11-17 | 2015-07-22 | Huntsman Advanced Materials (Switzerland) GmbH | Method of making high temperature resistant models or tools and compositon therefor |
| RU2277561C1 (ru) * | 2005-04-14 | 2006-06-10 | Открытое акционерное общество "Научно-производственное объединение Стеклопластик" | Полимерная композиция |
| WO2010121853A1 (en) * | 2009-04-24 | 2010-10-28 | Huntsman Advanced Materials (Switzerland) Gmbh | Method of making chemically resistant moulds and tools |
| CN102596557B (zh) * | 2009-09-24 | 2015-11-25 | 西格弗里德·贝格哈默 | 隔热成型件和其制造方法 |
| CN103496887B (zh) * | 2013-09-13 | 2014-12-10 | 天津大学 | 一种环氧树脂钨酸锆混凝土及其制备方法 |
| CN104446137B (zh) * | 2014-11-03 | 2016-08-24 | 武汉二航路桥特种工程有限责任公司 | 一种利用线性热膨胀系数制备环氧砂浆和混凝土的方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3395121A (en) * | 1966-09-21 | 1968-07-30 | Stauffer Chemical Co | Curing epoxy resins with boron trichloride-tertiary amine complexes |
| GB1346768A (en) * | 1970-08-11 | 1974-02-13 | Ciba Geigy Uk Ltd | Curable epoxide resin compositions |
| EP0042852A1 (en) * | 1979-12-26 | 1982-01-06 | The Polymer Corporation | Chemical resistant coatings |
| EP0058149A4 (en) * | 1980-08-22 | 1982-12-20 | Polymer Corp | EPOXY COATING POWDER. |
| US4546067A (en) * | 1983-01-26 | 1985-10-08 | Ciba Geigy Corporation | Image production utilizing multifunctional light sensitive compounds |
| US4528305A (en) * | 1984-04-13 | 1985-07-09 | Ciba-Geigy Corporation | Epoxy resin modeling stock |
| EP0197892B1 (de) * | 1985-04-02 | 1989-10-18 | Ciba-Geigy Ag | Härtbare Gemische |
| GB8607565D0 (en) * | 1986-03-26 | 1986-04-30 | Ciba Geigy Ag | Curable compositions |
| US4732962A (en) * | 1987-02-18 | 1988-03-22 | General Motors Corporation | High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst |
| US4906711A (en) * | 1988-07-29 | 1990-03-06 | General Electric Company | Low viscosity epoxy resin compositions |
| DE58909349D1 (de) * | 1988-09-29 | 1995-08-24 | Ciba Geigy Ag | Epoxidharzgemische. |
| DE4003842C2 (de) * | 1989-02-09 | 1997-06-05 | Shinetsu Chemical Co | Epoxidharzmassen zum Einkapseln von Halbleitern, enthaltend kugelförmiges Siliciumdioxid |
| US5359020A (en) * | 1990-05-22 | 1994-10-25 | Ciba-Geigy Corporation | Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers |
| TW275070B (ja) * | 1992-12-22 | 1996-05-01 | Ciba Geigy Ag |
-
1997
- 1997-03-12 EP EP97908219A patent/EP0888394B1/en not_active Expired - Lifetime
- 1997-03-12 JP JP53399097A patent/JP3906417B2/ja not_active Expired - Fee Related
- 1997-03-12 AU AU20264/97A patent/AU707263B2/en not_active Ceased
- 1997-03-12 DE DE69705826T patent/DE69705826T2/de not_active Expired - Lifetime
- 1997-03-12 CA CA002248730A patent/CA2248730A1/en not_active Abandoned
- 1997-03-12 WO PCT/EP1997/001245 patent/WO1997035900A1/en not_active Ceased
- 1997-03-12 AT AT97908219T patent/ATE203553T1/de not_active IP Right Cessation
- 1997-03-12 ES ES97908219T patent/ES2160928T3/es not_active Expired - Lifetime
- 1997-03-19 US US08/820,822 patent/US5859096A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69705826D1 (de) | 2001-08-30 |
| AU707263B2 (en) | 1999-07-08 |
| DE69705826T2 (de) | 2002-04-11 |
| EP0888394B1 (en) | 2001-07-25 |
| JP3906417B2 (ja) | 2007-04-18 |
| WO1997035900A1 (en) | 1997-10-02 |
| CA2248730A1 (en) | 1997-10-02 |
| ES2160928T3 (es) | 2001-11-16 |
| AU2026497A (en) | 1997-10-17 |
| EP0888394A1 (en) | 1999-01-07 |
| US5859096A (en) | 1999-01-12 |
| ATE203553T1 (de) | 2001-08-15 |
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