ATE209831T1 - Verfahren und system zum randabschluss von parallelen leitenden oberflächen in einer elektrischen verbindungsvorrichtung - Google Patents

Verfahren und system zum randabschluss von parallelen leitenden oberflächen in einer elektrischen verbindungsvorrichtung

Info

Publication number
ATE209831T1
ATE209831T1 AT99923182T AT99923182T ATE209831T1 AT E209831 T1 ATE209831 T1 AT E209831T1 AT 99923182 T AT99923182 T AT 99923182T AT 99923182 T AT99923182 T AT 99923182T AT E209831 T1 ATE209831 T1 AT E209831T1
Authority
AT
Austria
Prior art keywords
electrical
grid
impedance
periphery
electrical resistance
Prior art date
Application number
AT99923182T
Other languages
English (en)
Inventor
Istvan Novak
Wai-Yeung Yip
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/081,372 external-priority patent/US6104258A/en
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Application granted granted Critical
Publication of ATE209831T1 publication Critical patent/ATE209831T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT99923182T 1998-05-19 1999-05-18 Verfahren und system zum randabschluss von parallelen leitenden oberflächen in einer elektrischen verbindungsvorrichtung ATE209831T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/081,372 US6104258A (en) 1998-05-19 1998-05-19 System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus
US09/246,654 US6215373B1 (en) 1998-05-19 1999-02-08 Method for edge termination of parallel conductive planes including estimating the characteristic impedance of the structure
PCT/US1999/010937 WO1999060699A1 (en) 1998-05-19 1999-05-18 System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus

Publications (1)

Publication Number Publication Date
ATE209831T1 true ATE209831T1 (de) 2001-12-15

Family

ID=26765513

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99923182T ATE209831T1 (de) 1998-05-19 1999-05-18 Verfahren und system zum randabschluss von parallelen leitenden oberflächen in einer elektrischen verbindungsvorrichtung

Country Status (7)

Country Link
US (1) US6215373B1 (de)
EP (1) EP1078452B1 (de)
JP (1) JP2003517740A (de)
AT (1) ATE209831T1 (de)
AU (1) AU4000999A (de)
DE (1) DE69900505T2 (de)
WO (1) WO1999060699A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
JP3501674B2 (ja) * 1999-04-21 2004-03-02 日本電気株式会社 プリント回路基板特性評価装置、プリント回路基板特性評価方法、及び記憶媒体
US6441313B1 (en) * 1999-11-23 2002-08-27 Sun Microsystems, Inc. Printed circuit board employing lossy power distribution network to reduce power plane resonances
US6775122B1 (en) * 1999-12-28 2004-08-10 Intel Corporation Circuit board with added impedance
US6509640B1 (en) * 2000-09-29 2003-01-21 Intel Corporation Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction
US6525622B1 (en) * 2000-11-17 2003-02-25 Sun Microsystems, Inc. Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conducts of an electrical power distribution structure
US6901343B2 (en) * 2001-01-10 2005-05-31 Matsushita Electric Industrial Co., Ltd. Multilayer board in which wiring of signal line that requires tamper-resistance is covered by component or foil, design apparatus, method, and program for the multilayer board, and medium recording the program
US6704669B2 (en) * 2001-04-25 2004-03-09 International Business Machines Corporation Method for determining voltage, current, and/or power distributions in a resistive structure using a rectangular grid algorithm modified for non-rectangular holes and contacts
US6727780B2 (en) 2001-10-24 2004-04-27 Sun Microsystems, Inc. Adding electrical resistance in series with bypass capacitors using annular resistors
US6608257B1 (en) 2001-12-12 2003-08-19 Sun Microsystems, Inc. Direct plane attachment for capacitors
DE10305520A1 (de) * 2003-02-11 2004-08-19 Robert Bosch Gmbh Vorrichtung und Verfahren zur Dämpfung von Hohlraumresonanzen in einer mehrschichtigen Trägereinrichtung
US7010768B2 (en) * 2003-06-17 2006-03-07 International Business Machines Corporation Transmission line bounding models
US6963204B2 (en) * 2004-04-06 2005-11-08 International Business Machines Corporation Method to include delta-I noise on chip using lossy transmission line representation for the power mesh
US7376408B2 (en) * 2004-08-10 2008-05-20 Sony Ericsson Mobile Communications Ab Reduction of near field electro-magnetic scattering using high impedance metallization terminations
CN1764346B (zh) * 2004-10-19 2012-05-30 辉达公司 一种可以降低一印刷电路板的电源阻抗的方法
JP2008537843A (ja) 2005-03-01 2008-09-25 エックストゥーワイ アテニュエイターズ，エルエルシー 内部で重なり合った調整器
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
US20070003088A1 (en) * 2005-06-27 2007-01-04 Nokia Corporation Hearing aid compatible mobile phone and method
US20070152771A1 (en) * 2006-01-05 2007-07-05 Lei Shan Apparatus and method of via-stub resonance extinction
EP1991996A1 (de) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energiekonditionierungsstrukturen
US20070279882A1 (en) * 2006-06-06 2007-12-06 Samtec, Inc. Power distribution system for integrated circuits
US7886431B2 (en) * 2006-06-06 2011-02-15 Teraspeed Consulting Group Llc Power distribution system for integrated circuits
US7773390B2 (en) * 2006-06-06 2010-08-10 Teraspeed Consulting Group Llc Power distribution system for integrated circuits
US20080068818A1 (en) * 2006-09-19 2008-03-20 Jinwoo Choi Method and apparatus for providing ultra-wide band noise isolation in printed circuit boards
US8059423B2 (en) * 2007-02-06 2011-11-15 Sanmina-Sci Corporation Enhanced localized distributive capacitance for circuit boards
JP5229945B2 (ja) * 2008-09-09 2013-07-03 太陽誘電株式会社 フィルタ、デュープレクサ、および通信装置
US8923528B2 (en) 2010-08-30 2014-12-30 Microsoft Corporation Hearing aid-compatible apparatus for wireless communication devices
US8952503B2 (en) 2013-01-29 2015-02-10 International Business Machines Corporation Organic module EMI shielding structures and methods
US20140326489A1 (en) * 2013-05-03 2014-11-06 Dell Products L.P. Systems and methods for decreasing stub resonance of plating for circuit boards
CN104854792B (zh) * 2013-10-17 2018-11-06 株式会社村田制作所 高频电路
US20160183386A1 (en) * 2014-12-19 2016-06-23 Qualcomm Incorporated Techniques for controlling equivalent series resistance of a capacitor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4371746A (en) 1978-01-05 1983-02-01 Peptek, Incorporated Edge terminations for impedance planes
JPS60134440A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
US5114912A (en) 1991-05-13 1992-05-19 The United States Of America As Represented By The Secretary Of Commerce Two-dimensional, Josephson-array, voltage-tunable, high-frequency oscillator
US5266036A (en) 1992-06-02 1993-11-30 Hewlett-Packard Company Reduction of radio frequency emissions through terminating geometrically induced transmission lines in computer products
US5708400A (en) 1996-10-30 1998-01-13 Hewlett-Packard Company AC coupled termination of a printed circuit board power plane in its characteristic impedance
US5818315A (en) * 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane

Also Published As

Publication number Publication date
DE69900505T2 (de) 2002-07-18
DE69900505D1 (de) 2002-01-10
EP1078452B1 (de) 2001-11-28
JP2003517740A (ja) 2003-05-27
WO1999060699A1 (en) 1999-11-25
AU4000999A (en) 1999-12-06
EP1078452A1 (de) 2001-02-28
US6215373B1 (en) 2001-04-10

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