ATE210895T1 - Löthöcker-herstellungsverfahren und strukturen mit einer titan-sperrschicht - Google Patents
Löthöcker-herstellungsverfahren und strukturen mit einer titan-sperrschichtInfo
- Publication number
- ATE210895T1 ATE210895T1 AT96923187T AT96923187T ATE210895T1 AT E210895 T1 ATE210895 T1 AT E210895T1 AT 96923187 T AT96923187 T AT 96923187T AT 96923187 T AT96923187 T AT 96923187T AT E210895 T1 ATE210895 T1 AT E210895T1
- Authority
- AT
- Austria
- Prior art keywords
- barrier layer
- layer
- forming
- contact pad
- under bump
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
- H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
- H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01251—Changing the shapes of bumps
- H10W72/01255—Changing the shapes of bumps by using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01251—Changing the shapes of bumps
- H10W72/01257—Changing the shapes of bumps by reflowing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
- H10W72/01951—Changing the shapes of bond pads
- H10W72/01953—Changing the shapes of bond pads by etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/281—Auxiliary members
- H10W72/287—Flow barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/29—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/941—Dispositions of bond pads
- H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
Landscapes
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40719695A | 1995-03-20 | 1995-03-20 | |
| PCT/US1996/003657 WO1996030933A2 (en) | 1995-03-20 | 1996-03-18 | Solder bump fabrication methods and structure including a titanium barrier layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE210895T1 true ATE210895T1 (de) | 2001-12-15 |
Family
ID=23611033
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01110511T ATE271718T1 (de) | 1995-03-20 | 1996-03-18 | Löthöcker-herstellungsverfahren und strukturen mit einer titan-sperrschicht |
| AT96923187T ATE210895T1 (de) | 1995-03-20 | 1996-03-18 | Löthöcker-herstellungsverfahren und strukturen mit einer titan-sperrschicht |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01110511T ATE271718T1 (de) | 1995-03-20 | 1996-03-18 | Löthöcker-herstellungsverfahren und strukturen mit einer titan-sperrschicht |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US5767010A (de) |
| EP (3) | EP1134805B1 (de) |
| JP (1) | JPH11505668A (de) |
| KR (1) | KR100367702B1 (de) |
| CN (1) | CN1096110C (de) |
| AT (2) | ATE271718T1 (de) |
| AU (1) | AU6376796A (de) |
| DE (2) | DE69617928T2 (de) |
| WO (1) | WO1996030933A2 (de) |
Families Citing this family (146)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| US5990564A (en) * | 1997-05-30 | 1999-11-23 | Lucent Technologies Inc. | Flip chip packaging of memory chips |
| JP3080047B2 (ja) * | 1997-11-07 | 2000-08-21 | 日本電気株式会社 | バンプ構造体及びバンプ構造体形成方法 |
| US6875681B1 (en) * | 1997-12-31 | 2005-04-05 | Intel Corporation | Wafer passivation structure and method of fabrication |
| US6642136B1 (en) * | 2001-09-17 | 2003-11-04 | Megic Corporation | Method of making a low fabrication cost, high performance, high reliability chip scale package |
| US5937320A (en) * | 1998-04-08 | 1999-08-10 | International Business Machines Corporation | Barrier layers for electroplated SnPb eutectic solder joints |
| JPH11340265A (ja) * | 1998-05-22 | 1999-12-10 | Sony Corp | 半導体装置及びその製造方法 |
| US6794752B2 (en) * | 1998-06-05 | 2004-09-21 | United Microelectronics Corp. | Bonding pad structure |
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-
1996
- 1996-03-18 EP EP01110511A patent/EP1134805B1/de not_active Expired - Lifetime
- 1996-03-18 KR KR1019970706542A patent/KR100367702B1/ko not_active Expired - Fee Related
- 1996-03-18 AT AT01110511T patent/ATE271718T1/de not_active IP Right Cessation
- 1996-03-18 DE DE69617928T patent/DE69617928T2/de not_active Expired - Fee Related
- 1996-03-18 AU AU63767/96A patent/AU6376796A/en not_active Abandoned
- 1996-03-18 WO PCT/US1996/003657 patent/WO1996030933A2/en not_active Ceased
- 1996-03-18 AT AT96923187T patent/ATE210895T1/de not_active IP Right Cessation
- 1996-03-18 JP JP8529476A patent/JPH11505668A/ja active Pending
- 1996-03-18 DE DE69632969T patent/DE69632969T2/de not_active Expired - Fee Related
- 1996-03-18 EP EP96923187A patent/EP0815593B1/de not_active Expired - Lifetime
- 1996-03-18 EP EP04007632A patent/EP1441388A3/de not_active Withdrawn
- 1996-03-18 CN CN96193314A patent/CN1096110C/zh not_active Expired - Fee Related
- 1996-11-05 US US08/744,122 patent/US5767010A/en not_active Expired - Lifetime
-
1998
- 1998-04-20 US US09/063,422 patent/US6222279B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1441388A3 (de) | 2004-09-22 |
| US5767010A (en) | 1998-06-16 |
| KR100367702B1 (ko) | 2003-04-07 |
| KR19980703139A (ko) | 1998-10-15 |
| AU6376796A (en) | 1996-10-16 |
| WO1996030933A3 (en) | 1996-11-28 |
| HK1036523A1 (en) | 2002-01-04 |
| EP0815593A2 (de) | 1998-01-07 |
| CN1096110C (zh) | 2002-12-11 |
| WO1996030933A2 (en) | 1996-10-03 |
| DE69617928D1 (de) | 2002-01-24 |
| ATE271718T1 (de) | 2004-08-15 |
| EP1441388A2 (de) | 2004-07-28 |
| DE69632969D1 (de) | 2004-08-26 |
| US6222279B1 (en) | 2001-04-24 |
| EP0815593B1 (de) | 2001-12-12 |
| EP1134805B1 (de) | 2004-07-21 |
| EP1134805A3 (de) | 2001-12-12 |
| DE69632969T2 (de) | 2005-07-28 |
| CN1181841A (zh) | 1998-05-13 |
| EP1134805A2 (de) | 2001-09-19 |
| DE69617928T2 (de) | 2002-07-18 |
| JPH11505668A (ja) | 1999-05-21 |
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