ATE224579T1 - Multichip-modul drosselspule - Google Patents

Multichip-modul drosselspule

Info

Publication number
ATE224579T1
ATE224579T1 AT95304018T AT95304018T ATE224579T1 AT E224579 T1 ATE224579 T1 AT E224579T1 AT 95304018 T AT95304018 T AT 95304018T AT 95304018 T AT95304018 T AT 95304018T AT E224579 T1 ATE224579 T1 AT E224579T1
Authority
AT
Austria
Prior art keywords
multichip module
throttle coil
metallisation
inductors
module throttle
Prior art date
Application number
AT95304018T
Other languages
English (en)
Inventor
David John Pedder
Original Assignee
Intarsia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intarsia Corp filed Critical Intarsia Corp
Application granted granted Critical
Publication of ATE224579T1 publication Critical patent/ATE224579T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT95304018T 1994-06-30 1995-06-09 Multichip-modul drosselspule ATE224579T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9413145A GB2290913B (en) 1994-06-30 1994-06-30 Multi-chip module inductor structure

Publications (1)

Publication Number Publication Date
ATE224579T1 true ATE224579T1 (de) 2002-10-15

Family

ID=10757574

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95304018T ATE224579T1 (de) 1994-06-30 1995-06-09 Multichip-modul drosselspule

Country Status (6)

Country Link
US (1) US5747870A (de)
EP (1) EP0690460B1 (de)
JP (1) JPH0831646A (de)
AT (1) ATE224579T1 (de)
DE (1) DE69528222T2 (de)
GB (1) GB2290913B (de)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292015B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Trimmable inductor structure
US5936299A (en) * 1997-03-13 1999-08-10 International Business Machines Corporation Substrate contact for integrated spiral inductors
DE19854234C1 (de) * 1998-11-24 2000-06-21 Bosch Gmbh Robert Induktives Bauelement mit planarer Leitungsstruktur und Verfahren zur Herstellung desselben
US6310386B1 (en) * 1998-12-17 2001-10-30 Philips Electronics North America Corp. High performance chip/package inductor integration
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
US6310387B1 (en) * 1999-05-03 2001-10-30 Silicon Wave, Inc. Integrated circuit inductor with high self-resonance frequency
DE19963292A1 (de) 1999-12-27 2001-06-28 Tridonic Bauelemente Elektronisches Vorschaltgerät
US6180445B1 (en) 2000-04-24 2001-01-30 Taiwan Semiconductor Manufacturing Company Method to fabricate high Q inductor by redistribution layer when flip-chip package is employed
US6437653B1 (en) * 2000-09-28 2002-08-20 Sun Microsystems, Inc. Method and apparatus for providing a variable inductor on a semiconductor chip
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
US6932519B2 (en) 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
DE10057606B4 (de) * 2000-11-21 2004-04-29 Vogt Electronic Ag Anordnung zur Verbindung des Ferritkerns eines Planartransformators mit Masse
US6883977B2 (en) 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
KR100416264B1 (ko) 2001-12-06 2004-01-24 삼성전자주식회사 저손실 인덕터소자
US8749054B2 (en) 2010-06-24 2014-06-10 L. Pierre de Rochemont Semiconductor carrier with vertical power FET module
US7754537B2 (en) * 2003-02-25 2010-07-13 Tessera, Inc. Manufacture of mountable capped chips
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
WO2005004195A2 (en) * 2003-07-03 2005-01-13 Shellcase Ltd. Method and apparatus for packaging integrated circuit devices
US7298030B2 (en) * 2003-09-26 2007-11-20 Tessera, Inc. Structure and method of making sealed capped chips
US20050067681A1 (en) * 2003-09-26 2005-03-31 Tessera, Inc. Package having integral lens and wafer-scale fabrication method therefor
US20050139984A1 (en) * 2003-12-19 2005-06-30 Tessera, Inc. Package element and packaged chip having severable electrically conductive ties
US7436281B2 (en) * 2004-07-30 2008-10-14 Texas Instruments Incorporated Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
CN101390253B (zh) 2004-10-01 2013-02-27 L.皮尔·德罗什蒙 陶瓷天线模块及其制造方法
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
WO2007005642A2 (en) 2005-06-30 2007-01-11 Derochemont L Pierre Electrical components and method of manufacture
US8350657B2 (en) * 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US8354294B2 (en) 2006-01-24 2013-01-15 De Rochemont L Pierre Liquid chemical deposition apparatus and process and products therefrom
US7541251B2 (en) * 2006-02-10 2009-06-02 California Micro Devices Wire bond and redistribution layer process
US20080002460A1 (en) * 2006-03-01 2008-01-03 Tessera, Inc. Structure and method of making lidded chips
US20080158840A1 (en) * 2006-12-27 2008-07-03 Inventec Corporation DC power plane structure
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
US8058960B2 (en) * 2007-03-27 2011-11-15 Alpha And Omega Semiconductor Incorporated Chip scale power converter package having an inductor substrate
US7948346B2 (en) * 2008-06-30 2011-05-24 Alpha & Omega Semiconductor, Ltd Planar grooved power inductor structure and method
US7959598B2 (en) 2008-08-20 2011-06-14 Asante Solutions, Inc. Infusion pump systems and methods
US8922347B1 (en) 2009-06-17 2014-12-30 L. Pierre de Rochemont R.F. energy collection circuit for wireless devices
US8952858B2 (en) 2009-06-17 2015-02-10 L. Pierre de Rochemont Frequency-selective dipole antennas
US8552708B2 (en) 2010-06-02 2013-10-08 L. Pierre de Rochemont Monolithic DC/DC power management module with surface FET
US9023493B2 (en) 2010-07-13 2015-05-05 L. Pierre de Rochemont Chemically complex ablative max-phase material and method of manufacture
JP5976648B2 (ja) 2010-08-23 2016-08-24 デ，ロシェモント，エル．，ピエール 共振トランジスタゲートを有するパワーｆｅｔ
WO2012061656A2 (en) 2010-11-03 2012-05-10 De Rochemont L Pierre Semiconductor chip carriers with monolithically integrated quantum dot devices and method of manufacture thereof
US9633772B2 (en) 2013-03-14 2017-04-25 Gentex Corporation Solderable planar magnetic components
US9561324B2 (en) 2013-07-19 2017-02-07 Bigfoot Biomedical, Inc. Infusion pump system and method
EP3374905A1 (de) 2016-01-13 2018-09-19 Bigfoot Biomedical, Inc. Benutzerschnittstelle für diabetesmanagementsystem
EP4588437A3 (de) 2016-01-14 2025-10-01 Insulet Corporation Einstellung der insulinabgaberaten
WO2017123703A2 (en) 2016-01-14 2017-07-20 Bigfoot Biomedical, Inc. Occlusion resolution in medication delivery devices, systems, and methods
US12383166B2 (en) 2016-05-23 2025-08-12 Insulet Corporation Insulin delivery system and methods with risk-based set points
WO2017205819A1 (en) 2016-05-26 2017-11-30 Insulet Corporation Multi-dose drug delivery device
EP3500161A4 (de) 2016-12-12 2020-01-08 Bigfoot Biomedical, Inc. Alarme und warnungen für medikamentenabgabevorrichtungen und zugehörige systeme und verfahren
EP3568862B1 (de) 2017-01-13 2026-03-18 Insulet Corporation System und verfahren zur anpassung der insulinabgabe
US10758675B2 (en) 2017-01-13 2020-09-01 Bigfoot Biomedical, Inc. System and method for adjusting insulin delivery
US10583250B2 (en) 2017-01-13 2020-03-10 Bigfoot Biomedical, Inc. System and method for adjusting insulin delivery
WO2018132765A1 (en) 2017-01-13 2018-07-19 Mazlish Bryan Insulin delivery methods, systems and devices
US10500334B2 (en) 2017-01-13 2019-12-10 Bigfoot Biomedical, Inc. System and method for adjusting insulin delivery
US10610644B2 (en) 2017-01-13 2020-04-07 Bigfoot Biomedical, Inc. Insulin delivery methods, systems and devices
USD874471S1 (en) 2017-06-08 2020-02-04 Insulet Corporation Display screen with a graphical user interface
US10454163B2 (en) * 2017-09-22 2019-10-22 Intel Corporation Ground layer design in a printed circuit board (PCB)
USD928199S1 (en) 2018-04-02 2021-08-17 Bigfoot Biomedical, Inc. Medication delivery device with icons
US12562251B1 (en) 2018-05-09 2026-02-24 Bigfoot Biomedical, Inc. Computing architecture for assuring the provenance of medication therapy related parameters, and related systems, methods and devices
USD920343S1 (en) 2019-01-09 2021-05-25 Bigfoot Biomedical, Inc. Display screen or portion thereof with graphical user interface associated with insulin delivery
US11367557B2 (en) 2019-12-16 2022-06-21 International Business Machines Corporation Semiconductor chip having one or more on-chip metal winding and enclosed by top and bottom chip-external ferromagnetic cores
USD977502S1 (en) 2020-06-09 2023-02-07 Insulet Corporation Display screen with graphical user interface
JP7663693B2 (ja) 2020-12-18 2025-04-16 インスレット コーポレイション 薬物送達デバイスの、スマートウォッチおよび車両用インフォテインメントシステムとの統合
US12514980B2 (en) 2021-06-30 2026-01-06 Insulet Corporation Adjustment of medicament delivery by a medicament delivery device based on menstrual cycle phase
US12521486B2 (en) 2021-07-16 2026-01-13 Insulet Corporation Method for modification of insulin delivery during pregnancy in automatic insulin delivery systems
KR20250129777A (ko) 2023-01-06 2025-08-29 인슐렛 코포레이션 후속 자동 안전 제약 완화를 갖는 자동으로 또는 수동으로 개시되는 음식 볼러스 전달

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614554A (en) * 1968-10-24 1971-10-19 Texas Instruments Inc Miniaturized thin film inductors for use in integrated circuits
US3798059A (en) * 1970-04-20 1974-03-19 Rca Corp Thick film inductor with ferromagnetic core
JPS56150807A (en) * 1980-04-22 1981-11-21 Tdk Corp Coil device
KR890004585B1 (ko) * 1980-09-11 1989-11-16 아사히가세이고교가부시키가이샤 마이크로코일(microcoil)
JPS58134409A (ja) * 1982-02-03 1983-08-10 Mitsubishi Electric Corp 回路素子
JPS6041312A (ja) * 1983-08-16 1985-03-05 Tdk Corp 回路素子
JPS6215850A (ja) * 1985-07-13 1987-01-24 Oki Electric Ind Co Ltd マルチチツプパツケ−ジ基板
JPS62136865A (ja) * 1985-12-11 1987-06-19 Hitachi Ltd モジユ−ル実装構造
JPS6412510A (en) * 1987-07-07 1989-01-17 Matsushita Electric Industrial Co Ltd Lc composite component and manufacture thereof
JPS6491118A (en) * 1987-10-02 1989-04-10 Alps Electric Co Ltd Liquid crystal display element mounting flip chip
JPH023959A (ja) * 1988-06-20 1990-01-09 Mitsubishi Electric Corp モノリシックマイクロ波集積回路
DE69021438T2 (de) * 1989-05-16 1996-01-25 Marconi Gec Ltd Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung.
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
JPH0513240A (ja) * 1991-07-02 1993-01-22 Matsushita Electric Ind Co Ltd チツプ形フエライトビーズコアおよびその製造方法
EP0529503A1 (de) * 1991-08-22 1993-03-03 Hewlett-Packard Company Flip-chip-Vorrichtung mit flexibler Befestigung
JP2867196B2 (ja) * 1992-03-10 1999-03-08 ティーディーケイ株式会社 セラミックインダクタ部品および複合積層部品
JPH06215850A (ja) * 1993-01-13 1994-08-05 Sumitomo Wiring Syst Ltd ロック検知コネクタの検査装置
US5313361A (en) * 1993-03-29 1994-05-17 The Charles Stark Draper Laboratory, Inc. Ceramic substrate
JP3325351B2 (ja) * 1993-08-18 2002-09-17 株式会社東芝 半導体装置
US5416356A (en) * 1993-09-03 1995-05-16 Motorola, Inc. Integrated circuit having passive circuit elements
US5534837A (en) * 1994-07-28 1996-07-09 Rockwell International Orthogonal-field electrically variable magnetic device

Also Published As

Publication number Publication date
GB9413145D0 (en) 1994-08-24
JPH0831646A (ja) 1996-02-02
DE69528222T2 (de) 2003-05-08
GB2290913B (en) 1998-03-11
US5747870A (en) 1998-05-05
GB2290913A (en) 1996-01-10
DE69528222D1 (de) 2002-10-24
EP0690460B1 (de) 2002-09-18
EP0690460A1 (de) 1996-01-03

Similar Documents

Publication Publication Date Title
ATE224579T1 (de) Multichip-modul drosselspule
CA1280475C (en) Transformer structure
US7796006B2 (en) Suspension inductor devices
US6531784B1 (en) Semiconductor package with spacer strips
US5212402A (en) Semiconductor device with integral decoupling capacitor
US11676884B2 (en) Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
US8237534B2 (en) Miniature transformers adapted for use in galvanic isolators and the like
DE69527119D1 (de) Struktur einer abgleichbaren Drosselspule
TW533754B (en) Semiconductor device and semiconductor module
US9852928B2 (en) Semiconductor packages and modules with integrated ferrite material
KR930018769A (ko) 코어 인덕턴스에 의존하는 회로 소자 및 그 제조 방법
US5839184A (en) Method for creating on-package inductors for use with integrated circuits
JPS5731166A (en) Semiconductor device
WO2006074477A2 (en) Integrated packaged device having magnetic components
JPH04367208A (ja) ハイブリッド集積回路プレーナ型変圧器
KR19990029973A (ko) 집적 회로 반도체 칩과 유도 코일을 포함하는단일면 패키지 및 그 제조방법
US8338920B2 (en) Package integrated soft magnetic film for improvement in on-chip inductor performance
JP2002509364A (ja) 小型電源
ATE233428T1 (de) Drosselspuleanordnung
US6159817A (en) Multi-tap thin film inductor
US6525385B2 (en) Semiconductor device with inductance element
US20050167810A1 (en) Stacked semiconductor device
JP2007081146A (ja) インダクタ付半導体装置
JP3195106B2 (ja) 平面型磁気素子の製造方法
KR100249212B1 (ko) 박막인덕터의 구조 및 그 제조방법

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties