ATE258846T1 - Verfahren zur herstellung von eingebetteten elektronischen bauteilen - Google Patents

Verfahren zur herstellung von eingebetteten elektronischen bauteilen

Info

Publication number
ATE258846T1
ATE258846T1 AT00927946T AT00927946T ATE258846T1 AT E258846 T1 ATE258846 T1 AT E258846T1 AT 00927946 T AT00927946 T AT 00927946T AT 00927946 T AT00927946 T AT 00927946T AT E258846 T1 ATE258846 T1 AT E258846T1
Authority
AT
Austria
Prior art keywords
electronic components
electrically conducting
adhesive film
conducting support
support
Prior art date
Application number
AT00927946T
Other languages
English (en)
Inventor
Johannes Bernardus Pet Janssen
Vrught Johannes Bernardus De
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19769109&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE258846(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Application granted granted Critical
Publication of ATE258846T1 publication Critical patent/ATE258846T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Reverberation, Karaoke And Other Acoustics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
AT00927946T 1999-04-29 2000-05-01 Verfahren zur herstellung von eingebetteten elektronischen bauteilen ATE258846T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1011929A NL1011929C2 (nl) 1999-04-29 1999-04-29 Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen.
PCT/NL2000/000280 WO2000066340A1 (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronical components

Publications (1)

Publication Number Publication Date
ATE258846T1 true ATE258846T1 (de) 2004-02-15

Family

ID=19769109

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00927946T ATE258846T1 (de) 1999-04-29 2000-05-01 Verfahren zur herstellung von eingebetteten elektronischen bauteilen

Country Status (10)

Country Link
US (2) US6613607B2 (de)
EP (2) EP1175290B1 (de)
JP (2) JP2002543604A (de)
KR (1) KR100701720B1 (de)
AT (1) ATE258846T1 (de)
AU (1) AU4624900A (de)
DE (1) DE60008093T2 (de)
NL (1) NL1011929C2 (de)
SG (1) SG121813A1 (de)
WO (1) WO2000066340A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10012880A1 (de) * 2000-03-16 2001-09-27 Infineon Technologies Ag Verfahren und Vorrichtung zur Herstellung einer Halbleiterchip-Umhüllung
US6908791B2 (en) * 2002-04-29 2005-06-21 Texas Instruments Incorporated MEMS device wafer-level package
NL1020594C2 (nl) * 2002-05-14 2003-11-17 Fico Bv Werkwijze voor het met behulp van een folielaag omhullen van een elektronische component.
TW560026B (en) * 2002-08-27 2003-11-01 Uni Tek System Inc Singulation method of the array-type work piece to be singulated having metal layer singulation street, and the array-type work piece to be singulated applying the method
US7759775B2 (en) * 2004-07-20 2010-07-20 Alpha And Omega Semiconductor Incorporated High current semiconductor power device SOIC package
US7394150B2 (en) * 2004-11-23 2008-07-01 Siliconix Incorporated Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
US7238551B2 (en) * 2004-11-23 2007-07-03 Siliconix Incorporated Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
US20070130759A1 (en) * 2005-06-15 2007-06-14 Gem Services, Inc. Semiconductor device package leadframe formed from multiple metal layers
GB0516625D0 (en) * 2005-08-15 2005-09-21 Eurocut Ltd Orthopaedic surgical instrument
JP4782522B2 (ja) * 2005-09-27 2011-09-28 ソニーケミカル＆インフォメーションデバイス株式会社 光機能素子パッケージ及びその製造方法
US7608482B1 (en) * 2006-12-21 2009-10-27 National Semiconductor Corporation Integrated circuit package with molded insulation
JP2008258411A (ja) * 2007-04-05 2008-10-23 Rohm Co Ltd 半導体装置および半導体装置の製造方法
JP5285289B2 (ja) * 2008-02-06 2013-09-11 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置およびその製造方法
EP2154713B1 (de) * 2008-08-11 2013-01-02 Sensirion AG Verfahren zur Herstellung einer Messvorrichtung mit einer Spannungsverminderungsschicht
US8829685B2 (en) * 2009-03-31 2014-09-09 Semiconductor Components Industries, Llc Circuit device having funnel shaped lead and method for manufacturing the same
TWI453831B (zh) 2010-09-09 2014-09-21 台灣捷康綜合有限公司 半導體封裝結構及其製造方法
KR101247561B1 (ko) 2011-08-18 2013-03-25 주식회사 해성엔지니어링 스트립용 테이핑장치
JP6146732B2 (ja) * 2013-01-18 2017-06-14 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
US9966330B2 (en) 2013-03-14 2018-05-08 Vishay-Siliconix Stack die package
US9589929B2 (en) 2013-03-14 2017-03-07 Vishay-Siliconix Method for fabricating stack die package
JP6180646B1 (ja) * 2016-02-25 2017-08-16 三菱電機株式会社 半導体パッケージ、及びモジュール
WO2021030316A1 (en) 2019-08-13 2021-02-18 Dow Silicones Corporation Method for making elastomeric articles

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635754A (en) * 1966-01-21 1972-01-18 Johnson & Johnson Adhesive product
US3754070A (en) 1970-08-03 1973-08-21 Motorola Inc Flash free molding
US4980016A (en) * 1985-08-07 1990-12-25 Canon Kabushiki Kaisha Process for producing electric circuit board
JPH02153354A (ja) * 1988-12-05 1990-06-13 Oki Electric Ind Co Ltd 導電性付与材料及びその使用方法並びにこれを用いた薄膜形成材料
JPH04287351A (ja) * 1991-03-15 1992-10-12 Toowa Kk 電子部品のリード加工方法及び装置
US5218759A (en) * 1991-03-18 1993-06-15 Motorola, Inc. Method of making a transfer molded semiconductor device
JP2708343B2 (ja) * 1993-01-28 1998-02-04 ローム株式会社 半導体装置の製造方法およびリードフレーム
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
JP3541491B2 (ja) * 1994-06-22 2004-07-14 セイコーエプソン株式会社 電子部品
JP3257904B2 (ja) * 1994-08-11 2002-02-18 新光電気工業株式会社 リードフレームとその製造方法
JPH08172153A (ja) * 1994-12-20 1996-07-02 Sony Corp 半導体装置のリード加工方法及びリード加工用金型
US5977613A (en) * 1996-03-07 1999-11-02 Matsushita Electronics Corporation Electronic component, method for making the same, and lead frame and mold assembly for use therein
US6001671A (en) * 1996-04-18 1999-12-14 Tessera, Inc. Methods for manufacturing a semiconductor package having a sacrificial layer
KR100206910B1 (ko) * 1996-06-14 1999-07-01 구본준 반도체 패키지의 디플래쉬 방법
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JPH10209190A (ja) * 1997-01-21 1998-08-07 Fujitsu Ltd 半導体装置の製造方法及び半導体装置
WO1998035382A1 (fr) * 1997-02-10 1998-08-13 Matsushita Electronics Corporation Dispositif a semiconducteur scelle par resine et procede de fabrication
KR100214555B1 (ko) * 1997-02-14 1999-08-02 구본준 반도체 패키지의 제조방법
FR2764111A1 (fr) * 1997-06-03 1998-12-04 Sgs Thomson Microelectronics Procede de fabrication de boitiers semi-conducteurs comprenant un circuit integre
JP2971834B2 (ja) * 1997-06-27 1999-11-08 松下電子工業株式会社 樹脂封止型半導体装置の製造方法
JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
US6028354A (en) * 1997-10-14 2000-02-22 Amkor Technology, Inc. Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package
US6187654B1 (en) * 1998-03-13 2001-02-13 Intercon Tools, Inc. Techniques for maintaining alignment of cut dies during substrate dicing
US6130473A (en) * 1998-04-02 2000-10-10 National Semiconductor Corporation Lead frame chip scale package
JP3862411B2 (ja) * 1998-05-12 2006-12-27 三菱電機株式会社 半導体装置の製造方法及びその構造
US6294100B1 (en) * 1998-06-10 2001-09-25 Asat Ltd Exposed die leadless plastic chip carrier
JP2000208540A (ja) * 1998-08-25 2000-07-28 Texas Instr Inc <Ti> 薄型半導体チップスケ―ル・パッケ―ジを密封する方法

Also Published As

Publication number Publication date
US20020064926A1 (en) 2002-05-30
JP2004349728A (ja) 2004-12-09
KR100701720B1 (ko) 2007-03-29
US6613607B2 (en) 2003-09-02
SG121813A1 (en) 2006-05-26
HK1044737A1 (en) 2002-11-01
EP1175290A1 (de) 2002-01-30
DE60008093T2 (de) 2004-09-09
AU4624900A (en) 2000-11-17
EP1338397A2 (de) 2003-08-27
JP2002543604A (ja) 2002-12-17
US20040005737A1 (en) 2004-01-08
EP1338397A3 (de) 2004-03-24
WO2000066340A1 (en) 2000-11-09
NL1011929C2 (nl) 2000-10-31
EP1175290B1 (de) 2004-02-04
KR20020000883A (ko) 2002-01-05
JP3744927B2 (ja) 2006-02-15
US6921682B2 (en) 2005-07-26
DE60008093D1 (de) 2004-03-11

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