ATE280742T1 - Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung - Google Patents

Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung

Info

Publication number
ATE280742T1
ATE280742T1 AT96917703T AT96917703T ATE280742T1 AT E280742 T1 ATE280742 T1 AT E280742T1 AT 96917703 T AT96917703 T AT 96917703T AT 96917703 T AT96917703 T AT 96917703T AT E280742 T1 ATE280742 T1 AT E280742T1
Authority
AT
Austria
Prior art keywords
production
light
ceramic
green film
ceramic green
Prior art date
Application number
AT96917703T
Other languages
English (en)
Inventor
Tomohiko Ogata
Takaki Masaki
Yuichiro Iguchi
Tuyosi Tanaka
Keiji Iwanaga
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Application granted granted Critical
Publication of ATE280742T1 publication Critical patent/ATE280742T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Materials For Photolithography (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
  • Packages (AREA)
AT96917703T 1996-06-17 1996-06-17 Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung ATE280742T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1996/001658 WO1997048658A1 (fr) 1996-06-17 1996-06-17 Feuille crue de ceramique photosensible, emballage ceramique, et procede de fabrication

Publications (1)

Publication Number Publication Date
ATE280742T1 true ATE280742T1 (de) 2004-11-15

Family

ID=14153421

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96917703T ATE280742T1 (de) 1996-06-17 1996-06-17 Lichtempfendliche keramische grünfolie, keramische packung , verfahren zu deren herstellung sowie verwendung

Country Status (6)

Country Link
US (1) US6159322A (de)
EP (1) EP0845445B1 (de)
KR (1) KR100418834B1 (de)
AT (1) ATE280742T1 (de)
DE (1) DE69633728T2 (de)
WO (1) WO1997048658A1 (de)

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DE69910335T2 (de) * 1998-12-11 2004-07-01 E.I. Du Pont De Nemours And Co., Wilmington Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band
JP3394938B2 (ja) * 1999-03-25 2003-04-07 株式会社村田製作所 感光性導体ペースト
JP3882500B2 (ja) * 2000-03-02 2007-02-14 株式会社村田製作所 厚膜絶縁組成物およびそれを用いたセラミック電子部品、ならびに電子装置
US6417062B1 (en) * 2000-05-01 2002-07-09 General Electric Company Method of forming ruthenium oxide films
US6645424B2 (en) * 2000-06-12 2003-11-11 Guigne International Ltd. Combustion synthesis of glass (Al2O3-CaO-X-Y) ceramic (TiB2) composites
TW526693B (en) * 2000-06-15 2003-04-01 Murata Manufacturing Co Multilayer circuit component and method for manufacturing the same
WO2002001627A1 (en) * 2000-06-26 2002-01-03 Hitachi, Ltd. Semiconductor device and method manufacturing the same
KR100411253B1 (ko) * 2001-05-07 2003-12-18 삼성전기주식회사 다층 세라믹 소자의 제조방법
DE10126958A1 (de) * 2001-06-01 2002-12-05 Philips Corp Intellectual Pty Flüssigkristallbildschirm mit verbesserter Hintergrundbeleuchtung
CN1228178C (zh) * 2002-04-26 2005-11-23 株式会社村田制作所 制备陶瓷复合材料的方法
US20040134875A1 (en) * 2002-11-22 2004-07-15 Kyocera Corporation Circuit-parts sheet and method of producing a multi-layer circuit board
JP3683891B2 (ja) * 2003-01-31 2005-08-17 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
US7641438B2 (en) * 2003-08-14 2010-01-05 Keyes Fibre Corporation Variable-sized molded product tray denesting apparatus
JP2005072539A (ja) * 2003-08-28 2005-03-17 Tdk Corp セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
US20050079450A1 (en) * 2003-08-28 2005-04-14 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
JP4372493B2 (ja) * 2003-08-28 2009-11-25 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
DE602004021085D1 (de) * 2004-03-11 2009-06-25 Corning Inc Keramikzusammensetzung mit einem Silsesquioxanpolymer
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
KR100810524B1 (ko) * 2004-12-20 2008-03-10 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 전자부품 및 그 제조방법
US7655864B2 (en) * 2006-07-13 2010-02-02 E.I Du Pont De Nemours And Company Photosensitive conductive paste for electrode formation and electrode
JP2008085034A (ja) * 2006-09-27 2008-04-10 Kyocera Corp 配線基板
KR100806755B1 (ko) * 2006-12-22 2008-02-27 요업기술원 감광성 저온 동시소성 세라믹 조성물 및 그 제조방법
DE102007063603B4 (de) * 2007-04-25 2009-11-12 Rainer Ronniger Verfahren und Vorrichtung zur Herstellung von keramischen Folien mit UV-LED
CN102944196B (zh) * 2012-11-02 2015-08-19 上海华力微电子有限公司 一种检测半导体圆形接触孔圆度的方法
KR101417445B1 (ko) * 2012-12-03 2014-07-08 송해근 중온 동시 소성용 마그네시아 세라믹 기판 조성물
US20140356637A1 (en) * 2013-05-29 2014-12-04 E I Du Pont De Nemours And Company Method of manufacturing a ceramic electronic component
JP7232280B2 (ja) * 2021-03-25 2023-03-02 株式会社ノリタケカンパニーリミテド 電子部品製造用キットとその利用
CN114933486B (zh) * 2022-04-28 2023-07-28 辽宁大学 一种基于水基浆料的3d打印制备多孔陶瓷块体的方法

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JPH0790539B2 (ja) * 1989-01-20 1995-10-04 日本電気株式会社 グリーンシートのスルーホール形成方法
JP2647947B2 (ja) * 1989-01-30 1997-08-27 日本電気株式会社 感光性グリーンシート
JPH03180092A (ja) * 1989-12-08 1991-08-06 Hitachi Ltd 電子回路装置およびそれに用いる導体ペースト
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US6004705A (en) * 1992-07-07 1999-12-21 Toray Industries, Inc. Photosensitive ceramics green sheet
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Also Published As

Publication number Publication date
DE69633728D1 (de) 2004-12-02
KR100418834B1 (ko) 2004-06-16
EP0845445B1 (de) 2004-10-27
US6159322A (en) 2000-12-12
DE69633728T2 (de) 2005-12-22
KR19990037659A (ko) 1999-05-25
WO1997048658A1 (fr) 1997-12-24
EP0845445A1 (de) 1998-06-03
EP0845445A4 (de) 1999-10-27

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