ATE284083T1 - Anisotropisches leitfähiges verbindungsblatt, herstellungsverfahren dafür und produkt davon - Google Patents

Anisotropisches leitfähiges verbindungsblatt, herstellungsverfahren dafür und produkt davon

Info

Publication number
ATE284083T1
ATE284083T1 AT01122859T AT01122859T ATE284083T1 AT E284083 T1 ATE284083 T1 AT E284083T1 AT 01122859 T AT01122859 T AT 01122859T AT 01122859 T AT01122859 T AT 01122859T AT E284083 T1 ATE284083 T1 AT E284083T1
Authority
AT
Austria
Prior art keywords
layer
conductive particles
lubricant
production process
thickness
Prior art date
Application number
AT01122859T
Other languages
English (en)
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Naoshi Yasudo
Daisuke Yamada
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Application granted granted Critical
Publication of ATE284083T1 publication Critical patent/ATE284083T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Laminated Bodies (AREA)
AT01122859T 2000-09-25 2001-09-24 Anisotropisches leitfähiges verbindungsblatt, herstellungsverfahren dafür und produkt davon ATE284083T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000289804 2000-09-25

Publications (1)

Publication Number Publication Date
ATE284083T1 true ATE284083T1 (de) 2004-12-15

Family

ID=18773137

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01122859T ATE284083T1 (de) 2000-09-25 2001-09-24 Anisotropisches leitfähiges verbindungsblatt, herstellungsverfahren dafür und produkt davon

Country Status (7)

Country Link
US (1) US6720787B2 (de)
EP (1) EP1195860B1 (de)
KR (1) KR100509526B1 (de)
CN (1) CN1296717C (de)
AT (1) ATE284083T1 (de)
DE (1) DE60107519T2 (de)
TW (1) TW515890B (de)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462568B1 (en) * 2000-08-31 2002-10-08 Micron Technology, Inc. Conductive polymer contact system and test method for semiconductor components
AU2002221060A1 (en) * 2000-12-08 2002-06-18 Jsr Corporation Anisotropic conductive sheet and wafer inspection device
KR100577947B1 (ko) * 2001-02-09 2006-05-10 제이에스알 가부시끼가이샤 이방 도전성 커넥터 및 그 제조 방법 및 프로우브 부재
JP3573120B2 (ja) * 2001-08-31 2004-10-06 Ｊｓｒ株式会社 異方導電性コネクターおよびその製造方法並びにその応用製品
ATE538373T1 (de) * 2002-03-06 2012-01-15 Polymer Aging Concepts Inc Elektrisches überwachungsverfahren für polymere
JPWO2003079495A1 (ja) * 2002-03-20 2005-07-21 日本圧着端子製造株式会社 柔軟性良導電層及びそれを用いた異方導電シート
JP2003322665A (ja) * 2002-05-01 2003-11-14 Jsr Corp 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法
FR2842023B1 (fr) * 2002-07-05 2005-09-30 Commissariat Energie Atomique Procede de fabrication de film conducteur anisotrope a inserts conducteurs pointus
ATE367650T1 (de) * 2002-08-09 2007-08-15 Jsr Corp Prüfverbinder mit anisotroper leitfähigkeit
EP1544625B1 (de) * 2002-08-27 2006-12-27 JSR Corporation Anisotrope leitfähige folie und impedanzmesssonde
TWI292196B (en) * 2002-09-30 2008-01-01 Via Tech Inc Flip chip test structure
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
WO2004077904A1 (ja) * 2003-01-17 2004-09-10 Jsr Corporation 回路基板の検査装置および回路基板の検査方法
ATE515078T1 (de) * 2003-01-17 2011-07-15 Jsr Corp Anisotroper leitfähiger verbinder und herstellungsverfahren dafür und untersuchungseinheit für eine schaltungseinrichtung
CN100359659C (zh) * 2003-02-18 2008-01-02 Jsr株式会社 各向异性导电连接器、探测部件和晶片检测设备以及晶片检测方法
WO2004086062A1 (ja) * 2003-03-26 2004-10-07 Jsr Corporation 電気抵抗測定用コネクター、電気抵抗測定用コネクター装置およびその製造方法並びに回路基板の電気抵抗測定装置および測定方法
US7311531B2 (en) * 2003-03-26 2007-12-25 Jsr Corporation Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
JP3753145B2 (ja) * 2003-04-21 2006-03-08 Ｊｓｒ株式会社 異方導電性シートおよびその製造方法、アダプター装置およびその製造方法並びに回路装置の電気的検査装置
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
CN1806178A (zh) * 2003-06-09 2006-07-19 Jsr株式会社 各向异性导电性连接器以及晶片检测装置
CA2441447A1 (en) * 2003-09-18 2005-03-18 Ibm Canada Limited - Ibm Canada Limitee Method and apparatus for electrical commoning of circuits
JP3714344B2 (ja) * 2003-10-14 2005-11-09 Ｊｓｒ株式会社 回路基板検査装置
CN100413151C (zh) * 2003-11-17 2008-08-20 Jsr株式会社 各向异性导电性片以及其制造方法和其应用制品
WO2005060719A2 (en) * 2003-12-18 2005-07-07 Lecroy Corporation Resistive probe tips
CN1894589A (zh) * 2003-12-18 2007-01-10 Jsr株式会社 各向异性导电性连接器和电路装置的检查方法
US20060177971A1 (en) * 2004-01-13 2006-08-10 Jsr Corporation Anisotropically conductive connector, production process thereof and application product thereof
JP3705288B2 (ja) * 2004-02-24 2005-10-12 Ｊｓｒ株式会社 回路基板検査用アダプターおよび回路基板検査装置
JP2005259475A (ja) * 2004-03-10 2005-09-22 Jst Mfg Co Ltd 異方導電性シート
JPWO2006009070A1 (ja) * 2004-07-15 2008-05-01 Jsr株式会社 中継基板および回路基板側コネクタ
KR101030360B1 (ko) * 2004-07-15 2011-04-20 제이에스알 가부시끼가이샤 이방 도전성 커넥터 장치 및 회로 장치의 검사 장치
US7300397B2 (en) * 2004-07-29 2007-11-27 C2C Cure, Inc. Endoscope electronics assembly
TWI254798B (en) * 2004-10-28 2006-05-11 Advanced Semiconductor Eng Substrate testing apparatus with full contact configuration
FI20055261A0 (fi) * 2005-05-27 2005-05-27 Midas Studios Avoin Yhtioe Akustisten muuttajien kokoonpano, järjestelmä ja menetelmä akustisten signaalien vastaanottamista tai toistamista varten
JP4767147B2 (ja) * 2005-11-16 2011-09-07 パナソニック株式会社 検査装置および検査方法
TWI403723B (zh) * 2005-12-21 2013-08-01 Jsr股份有限公司 Manufacturing method of foreign - shaped conductive connector
JP2007207530A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 異方性導電膜及びこれを用いたｘ線平面検出器、赤外線平面検出器及び表示装置
DE102006059429A1 (de) * 2006-12-15 2008-06-26 Atg Luther & Maelzer Gmbh Modul für eine Prüfvorrichtung zum Testen von Leiterplatten
DE102008018932A1 (de) * 2007-04-17 2008-11-20 C2Cure Inc., Wilmington Bildgebende Systeme und Verfahren, insbesondere zur Verwendung mit einem bei offener Chirurgie verwendeten Instrument
US7759951B2 (en) * 2007-05-29 2010-07-20 Touchdown Technologies, Inc. Semiconductor testing device with elastomer interposer
US20090002002A1 (en) * 2007-06-30 2009-01-01 Wen-Bi Hsu Electrical Testing System
KR100886712B1 (ko) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
US7786600B2 (en) * 2008-06-30 2010-08-31 Hynix Semiconductor Inc. Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire
CN101661078A (zh) * 2008-08-26 2010-03-03 鸿富锦精密工业（深圳）有限公司 电路板及电路板测试装置
KR101278131B1 (ko) * 2009-04-28 2013-07-05 가부시키가이샤 어드밴티스트 배선 기판 유닛 및 시험 장치
US8870579B1 (en) * 2011-01-14 2014-10-28 Paricon Technologies Corporation Thermally and electrically enhanced elastomeric conductive materials
US9176167B1 (en) * 2011-08-21 2015-11-03 Bruker Nano Inc. Probe and method of manufacture for semiconductor wafer characterization
US9442133B1 (en) * 2011-08-21 2016-09-13 Bruker Nano Inc. Edge electrode for characterization of semiconductor wafers
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법
US20130319759A1 (en) * 2012-05-31 2013-12-05 General Electric Company Fine-pitch flexible wiring
US20140167805A1 (en) * 2012-08-29 2014-06-19 Michael K. Dell Reduced footprint test socket system
KR20160093145A (ko) * 2015-01-28 2016-08-08 고려대학교 산학협력단 브래드 보드, 브래드 보드용 점퍼선 및 교육용 키트
US10356902B2 (en) 2015-12-26 2019-07-16 Intel Corporation Board to board interconnect
KR101959536B1 (ko) * 2016-04-05 2019-03-18 주식회사 아이에스시 이종의 입자가 혼합된 도전성 입자를 포함하는 이방도전성 시트
WO2018030438A1 (ja) * 2016-08-08 2018-02-15 積水化学工業株式会社 導通検査装置用部材及び導通検査装置
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
EP3552217A4 (de) * 2016-12-07 2020-07-22 Wafer LLC Mechanismus zur verlustarmen elektrischen übertragung und antenne mit verwendung davon
CN111987548B (zh) * 2019-05-21 2021-09-21 新韩精密电子有限公司 各向异性导电片
CN110767348A (zh) * 2019-11-12 2020-02-07 业成科技（成都）有限公司 异方性导电膜及其制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209481A (en) * 1976-04-19 1980-06-24 Toray Industries, Inc. Process for producing an anisotropically electroconductive sheet
JPS587001B2 (ja) 1976-06-25 1983-02-08 ジェイエスアール株式会社 耐久性のよい感圧抵抗体およびその製造方法
JP3079605B2 (ja) 1991-02-28 2000-08-21 ジェイエスアール株式会社 導電性エラストマー形成用組成物
US5574382A (en) * 1991-09-17 1996-11-12 Japan Synthetic Rubber Co., Ltd. Inspection electrode unit for printed wiring board
US5313840A (en) * 1992-10-30 1994-05-24 At&T Bell Laboratories Tactile shear sensor using anisotropically conductive material
JPH0997643A (ja) * 1995-09-29 1997-04-08 Shin Etsu Polymer Co Ltd 低抵抗コネクタと、その製造方法
JP3233195B2 (ja) * 1996-07-02 2001-11-26 信越ポリマー株式会社 半導体素子検査用ソケット
JP3179503B2 (ja) * 1996-08-08 2001-06-25 日東電工株式会社 異方導電性フィルムおよびその製造方法
FR2766618B1 (fr) * 1997-07-22 2000-12-01 Commissariat Energie Atomique Procede de fabrication d'un film conducteur anisotrope a inserts conducteurs
JP3283226B2 (ja) * 1997-12-26 2002-05-20 ポリマテック株式会社 ホルダーの製造法
JP2000241485A (ja) * 1999-02-24 2000-09-08 Jsr Corp 回路基板の電気抵抗測定装置および方法

Also Published As

Publication number Publication date
KR100509526B1 (ko) 2005-08-23
EP1195860A1 (de) 2002-04-10
EP1195860B1 (de) 2004-12-01
DE60107519D1 (de) 2005-01-05
CN1296717C (zh) 2007-01-24
KR20020024540A (ko) 2002-03-30
CN1349101A (zh) 2002-05-15
DE60107519T2 (de) 2005-12-15
US6720787B2 (en) 2004-04-13
TW515890B (en) 2003-01-01
US20020060583A1 (en) 2002-05-23

Similar Documents

Publication Publication Date Title
ATE284083T1 (de) Anisotropisches leitfähiges verbindungsblatt, herstellungsverfahren dafür und produkt davon
BR9706947A (pt) Material tendo uma substância protegida por espaçadores deformáveis e processo de produção
TW200500298A (en) Methods and apparatus for patterned deposition of nanostructure-containing materials by self-assembly and related articles
EA200600165A1 (ru) Способ и устройство для получения рисунка в покрытии, содержащем частицы магнитного материала, за счет воздействия магнитного поля
BRPI0507209A (pt) processo e dispositivo que permitem medir a viscosidade de uma cultura de microorganismos
ES2307254T8 (es) Procedimiento para restaurar las propiedades funcionales de un sensor electroquímico
PT1218533E (pt) Biossensor e sua utilizacao para indicacao do estado de um produto
BRPI0410641A (pt) processo para revestimento de substratos com material baseado em carbono
EP1089132A3 (de) Leitendeselement, Arbeitseinheit und Bilderzeugungsgerät
WO2002003142A3 (en) Electric microcontact printing method and apparatus
TW348076B (en) Method and apparatus for coating a substrate
TW200609671A (en) Imprint lithography apparatus and method employing an effective pressure
AU2414695A (en) Methods of capturing species from liquids and assay procedures
EP0723208A3 (de) Kontaktaufladungselement, Verfahren zu seiner Herstellung und damit versehendes elektrographisches Gerät
FI921323A0 (fi) Anordning foer framstaellning av boejliga behaollare.
CA2485313A1 (en) Improved high speed embossing and adhesive printing process
BR0110449A (pt) Aparelho e método de vedação aperfeiçoados para calha de corrida quente
ATE502224T1 (de) Hydrostatisches gaslager, hydrostatische gaslagervorrichtung zum gebrauchen in vakuum- umgebung, und einrichtung zur wiedergewinnung von gas für die hydrostatische gaslagervorrichtung
Sun et al. Using self-polymerized dopamine to modify the antifouling property of oligo (ethylene glycol) self-assembled monolayers and its application in cell patterning
CA2359385A1 (en) Photo definable polyimide film used as an embossing surface
ATE399063T1 (de) Vorrichtung und verfahren zum auftragen von beschichtungsmaterial
PL1965758T3 (pl) Preparaty zawierające białka do transportu / recyklingu strukturalnie zmienionych lipidów oraz ich zastosowania
MY129674A (en) Method for magnetic transfer
DE50205953D1 (de) Elektrisch leitfähige teilchen, insbesondere zum einbringen in flüssige medien und verfahren zur deren herstellung
ATE118281T1 (de) Bilderzeugungsverfahren und -gerät.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties