ATE296529T1 - Vorrichtung zur herstellung einer schichtung von elektronisch interaktivem material - Google Patents

Vorrichtung zur herstellung einer schichtung von elektronisch interaktivem material

Info

Publication number
ATE296529T1
ATE296529T1 AT02806390T AT02806390T ATE296529T1 AT E296529 T1 ATE296529 T1 AT E296529T1 AT 02806390 T AT02806390 T AT 02806390T AT 02806390 T AT02806390 T AT 02806390T AT E296529 T1 ATE296529 T1 AT E296529T1
Authority
AT
Austria
Prior art keywords
interactive material
electronically
support
layer
computer
Prior art date
Application number
AT02806390T
Other languages
English (en)
Inventor
Cesare Fumo
Jozef Vodopivec
Original Assignee
New System Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New System Srl filed Critical New System Srl
Application granted granted Critical
Publication of ATE296529T1 publication Critical patent/ATE296529T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Ropes Or Cables (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Laminated Bodies (AREA)
AT02806390T 2001-12-27 2002-12-11 Vorrichtung zur herstellung einer schichtung von elektronisch interaktivem material ATE296529T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT2001UD000220A ITUD20010220A1 (it) 2001-12-27 2001-12-27 Sistema per la realizzazione di una stratificazione di materiale elettronicamente interattivo
PCT/IT2002/000780 WO2003061357A1 (en) 2001-12-27 2002-12-11 System to form a layering of electronically-interactive material

Publications (1)

Publication Number Publication Date
ATE296529T1 true ATE296529T1 (de) 2005-06-15

Family

ID=11460673

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02806390T ATE296529T1 (de) 2001-12-27 2002-12-11 Vorrichtung zur herstellung einer schichtung von elektronisch interaktivem material

Country Status (9)

Country Link
US (2) US7757628B2 (de)
EP (1) EP1459609B1 (de)
AT (1) ATE296529T1 (de)
CA (1) CA2471759A1 (de)
DE (1) DE60204360T2 (de)
ES (1) ES2243804T3 (de)
IT (1) ITUD20010220A1 (de)
SI (1) SI1459609T1 (de)
WO (1) WO2003061357A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1026013C2 (nl) * 2004-04-23 2005-10-25 Otb Group Bv Werkwijze en inrichting voor het nauwkeurig aanbrengen van structuren op een substraat.
US20090095176A1 (en) * 2007-10-11 2009-04-16 Printar Ltd. Method and apparatus for PCB finishing processes
ITVI20120276A1 (it) 2012-10-19 2014-04-20 New System Srl Dispositivo di compensazione per una testa di stampa e gruppo di stampa comprendente tale dispositivo di compensazione
WO2020165897A1 (en) 2019-02-14 2020-08-20 Orbotech Ltd A method and apparatus for preparing a pcb product having highly dense conductors

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661304A (en) * 1970-08-03 1972-05-09 Mead Corp Pressure impulse apparatus for initiating formation of fluid drops
US4403229A (en) * 1981-10-30 1983-09-06 International Business Machines Corporation Maintenance system to prime and to exclude air from ink jet heads
JPH02229489A (ja) * 1989-03-02 1990-09-12 Juki Corp 厚膜回路形成装置
JPH0467696A (ja) * 1990-07-07 1992-03-03 Juki Corp 直接描画装置
JP3149439B2 (ja) * 1990-12-26 2001-03-26 松下電器産業株式会社 厚膜回路の形成装置および形成方法
JPH05329423A (ja) * 1992-06-01 1993-12-14 Matsushita Electric Ind Co Ltd 塗布装置
US6224180B1 (en) * 1997-02-21 2001-05-01 Gerald Pham-Van-Diep High speed jet soldering system
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
DE19807202A1 (de) * 1998-02-20 1999-08-26 Zeiss Carl Jena Gmbh Verfahren und Anordnung zum Kontaktieren von elektronischen Bauelementen
DE19817530C2 (de) * 1998-04-09 2002-10-24 Bundesrep Deutschland Verfahren zur Herstellung von Dünnschichtstrukturen
JP3576862B2 (ja) * 1998-04-28 2004-10-13 キヤノン株式会社 インク、画像形成方法及び光重合開始剤
DE19842379A1 (de) 1998-09-16 2000-05-11 Tron Elektronik Gmbh F Verfahren zum zweidimensional-gerasterten Herstellen von Schichtstrukturen auf Schaltungsplatinen
US6190727B1 (en) * 1998-10-30 2001-02-20 Georgia-Pacific Corporation Liquid coating spray applicator and method providing automatic spread rate control
JP2001044601A (ja) * 1999-07-30 2001-02-16 Brother Ind Ltd プリント基板の配線パターン形成装置
JP2001246299A (ja) * 2000-03-07 2001-09-11 Toshiba Corp ぺースト塗布方法および実装装置
JP3805266B2 (ja) * 2002-02-27 2006-08-02 Ｕｈｔ株式会社 セラミック積層体の製造装置
JPWO2002090117A1 (ja) * 2001-05-09 2004-08-19 松下電器産業株式会社 インクジェット装置、インクジェットインキ及びそれを用いた電子部品の製造方法
JP2006218846A (ja) * 2004-07-23 2006-08-24 Seiko Epson Corp 液体回収容器および液体噴射装置

Also Published As

Publication number Publication date
DE60204360D1 (de) 2005-06-30
EP1459609B1 (de) 2005-05-25
EP1459609A1 (de) 2004-09-22
SI1459609T1 (en) 2005-10-31
US8196544B2 (en) 2012-06-12
US20100247791A1 (en) 2010-09-30
US7757628B2 (en) 2010-07-20
ITUD20010220A1 (it) 2003-06-27
WO2003061357A1 (en) 2003-07-24
ES2243804T3 (es) 2005-12-01
CA2471759A1 (en) 2003-07-24
DE60204360T2 (de) 2006-02-02
US20050118787A1 (en) 2005-06-02

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