ATE300628T1 - Sputtertargets auf pt-co-basis - Google Patents

Sputtertargets auf pt-co-basis

Info

Publication number
ATE300628T1
ATE300628T1 AT02762011T AT02762011T ATE300628T1 AT E300628 T1 ATE300628 T1 AT E300628T1 AT 02762011 T AT02762011 T AT 02762011T AT 02762011 T AT02762011 T AT 02762011T AT E300628 T1 ATE300628 T1 AT E300628T1
Authority
AT
Austria
Prior art keywords
alloy
sputter target
based sputter
densify
hip
Prior art date
Application number
AT02762011T
Other languages
English (en)
Inventor
Michael Sandlin
Bernd Kunkel
Wenjun Zhang
Philip Corno
Original Assignee
Heraeus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Inc filed Critical Heraeus Inc
Application granted granted Critical
Publication of ATE300628T1 publication Critical patent/ATE300628T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
    • H01F41/183—Sputtering targets therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Thin Magnetic Films (AREA)
AT02762011T 2001-04-11 2002-04-08 Sputtertargets auf pt-co-basis ATE300628T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/832,181 US6797137B2 (en) 2001-04-11 2001-04-11 Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal
PCT/US2002/010909 WO2002083974A1 (en) 2001-04-11 2002-04-08 Pt-co based sputtering targets

Publications (1)

Publication Number Publication Date
ATE300628T1 true ATE300628T1 (de) 2005-08-15

Family

ID=25260918

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02762011T ATE300628T1 (de) 2001-04-11 2002-04-08 Sputtertargets auf pt-co-basis

Country Status (8)

Country Link
US (2) US6797137B2 (de)
EP (2) EP1395689B1 (de)
JP (2) JP3962690B2 (de)
KR (2) KR100668790B1 (de)
CN (2) CN1827843A (de)
AT (1) ATE300628T1 (de)
DE (1) DE60205251T2 (de)
WO (1) WO2002083974A1 (de)

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Also Published As

Publication number Publication date
CN100344789C (zh) 2007-10-24
EP1395689B1 (de) 2005-07-27
CN1827843A (zh) 2006-09-06
US20020170821A1 (en) 2002-11-21
JP3962690B2 (ja) 2007-08-22
KR20050110046A (ko) 2005-11-22
KR20040007493A (ko) 2004-01-24
DE60205251D1 (en) 2005-09-01
JP2006144124A (ja) 2006-06-08
CN1503854A (zh) 2004-06-09
HK1064130A1 (en) 2005-01-21
DE60205251T2 (de) 2006-05-24
EP1595971A1 (de) 2005-11-16
WO2002083974A1 (en) 2002-10-24
EP1395689A1 (de) 2004-03-10
KR100682617B1 (ko) 2007-02-15
US7229588B2 (en) 2007-06-12
KR100668790B1 (ko) 2007-01-16
US20040188249A1 (en) 2004-09-30
JP2004532931A (ja) 2004-10-28
US6797137B2 (en) 2004-09-28

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