ATE321624T1 - Verfahren zum brechen eines spr den substrats - Google Patents

Verfahren zum brechen eines spr den substrats

Info

Publication number
ATE321624T1
ATE321624T1 AT03792540T AT03792540T ATE321624T1 AT E321624 T1 ATE321624 T1 AT E321624T1 AT 03792540 T AT03792540 T AT 03792540T AT 03792540 T AT03792540 T AT 03792540T AT E321624 T1 ATE321624 T1 AT E321624T1
Authority
AT
Austria
Prior art keywords
substrate
breaking
heated
line
heated spots
Prior art date
Application number
AT03792540T
Other languages
English (en)
Inventor
Rudolf H Brzesowsky
Abraham R Balkenende
Agthoven Raymond G A Van
Petrus H M Timmermans
Nicolaas P Willard
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=31896921&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE321624(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE321624T1 publication Critical patent/ATE321624T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/095—Tubes, rods or hollow products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laser Beam Processing (AREA)
AT03792540T 2002-08-21 2003-07-18 Verfahren zum brechen eines spr den substrats ATE321624T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02078453 2002-08-21

Publications (1)

Publication Number Publication Date
ATE321624T1 true ATE321624T1 (de) 2006-04-15

Family

ID=31896921

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03792540T ATE321624T1 (de) 2002-08-21 2003-07-18 Verfahren zum brechen eines spr den substrats

Country Status (10)

Country Link
US (1) US7838795B2 (de)
EP (1) EP1534463B1 (de)
JP (1) JP2005536428A (de)
KR (1) KR101016157B1 (de)
CN (1) CN1675021A (de)
AT (1) ATE321624T1 (de)
AU (1) AU2003247104A1 (de)
DE (1) DE60304365T2 (de)
TW (1) TWI341758B (de)
WO (1) WO2004018144A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005024563B9 (de) * 2005-05-28 2006-12-14 Schott Ag Verfahren zum Trennen von Glas und Verwendung einer dafür geeigneten Flüssigkeit
JP5011048B2 (ja) * 2007-09-27 2012-08-29 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
US8011207B2 (en) * 2007-11-20 2011-09-06 Corning Incorporated Laser scoring of glass sheets at high speeds and with low residual stress
WO2009084398A1 (ja) * 2007-12-27 2009-07-09 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板のクラック形成方法
CN101513692B (zh) * 2008-02-21 2011-09-07 富士迈半导体精密工业（上海）有限公司 激光切割脆性材料的方法及装置
KR101229325B1 (ko) * 2008-05-30 2013-02-04 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저 가공 장치 및 레이저 가공 방법
KR101258403B1 (ko) * 2011-12-09 2013-04-30 로체 시스템즈(주) 강화유리 기판 절단방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634243A (en) * 1969-01-09 1972-01-11 Cincinnati Milling Machine Co Method of removing suspended matter from cutting fluids and cutting oils by addition of cationic surfactants
US3833502A (en) * 1973-04-30 1974-09-03 Nalco Chemical Co Method for improving the adherence of metalworking coolants to metal surfaces
US4897153A (en) * 1989-04-24 1990-01-30 General Electric Company Method of processing siloxane-polyimides for electronic packaging applications
US5565363A (en) * 1991-10-21 1996-10-15 Wako Pure Chemical Industries, Ltd. Reagent composition for measuring ionic strength or specific gravity of aqueous solution samples
JPH07157792A (ja) * 1993-11-01 1995-06-20 Xerox Corp 水性ベース切削油剤
KR960042126A (ko) * 1995-05-31 1996-12-21 엄길용 액정기판 절단방법
KR970008386A (ko) * 1995-07-07 1997-02-24 하라 세이지 기판의 할단(割斷)방법 및 그 할단장치
US6350123B1 (en) * 1995-08-31 2002-02-26 Biolase Technology, Inc. Fluid conditioning system
GB2332223B (en) * 1997-12-13 2000-01-19 Sofitech Nv Viscoelastic surfactant based gelling composition for wellbore service fluids
US6252197B1 (en) * 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
JP2000233936A (ja) * 1999-02-10 2000-08-29 Mitsuboshi Diamond Kogyo Kk ガラス切断装置
ATE371006T1 (de) * 1999-07-22 2007-09-15 Johnson Diversey Inc Schmiermittelzusammensetzung zum schmieren einer transportanlage
EP1305381A4 (de) * 2000-07-28 2007-07-18 Corning Inc Hochleistungs-schneidöle für glasige, kristalline oder aggregierte werkstoffe
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치
KR100676249B1 (ko) 2001-05-23 2007-01-30 삼성전자주식회사 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치
US7253017B1 (en) * 2002-06-22 2007-08-07 Nanosolar, Inc. Molding technique for fabrication of optoelectronic devices
US7291782B2 (en) * 2002-06-22 2007-11-06 Nanosolar, Inc. Optoelectronic device and fabrication method

Also Published As

Publication number Publication date
CN1675021A (zh) 2005-09-28
AU2003247104A1 (en) 2004-03-11
EP1534463B1 (de) 2006-03-29
JP2005536428A (ja) 2005-12-02
DE60304365T2 (de) 2006-12-07
TWI341758B (en) 2011-05-11
US20050263503A1 (en) 2005-12-01
DE60304365D1 (de) 2006-05-18
TW200404634A (en) 2004-04-01
KR101016157B1 (ko) 2011-02-17
KR20050059074A (ko) 2005-06-17
US7838795B2 (en) 2010-11-23
WO2004018144A1 (en) 2004-03-04
EP1534463A1 (de) 2005-06-01

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