ATE324069T1 - Verdrahtungsverfahren und gerät für eine ultraschallsonde - Google Patents

Verdrahtungsverfahren und gerät für eine ultraschallsonde

Info

Publication number
ATE324069T1
ATE324069T1 AT02751558T AT02751558T ATE324069T1 AT E324069 T1 ATE324069 T1 AT E324069T1 AT 02751558 T AT02751558 T AT 02751558T AT 02751558 T AT02751558 T AT 02751558T AT E324069 T1 ATE324069 T1 AT E324069T1
Authority
AT
Austria
Prior art keywords
lands
circuit board
ultrasonic probe
wiring method
flex
Prior art date
Application number
AT02751558T
Other languages
English (en)
Inventor
David G Miller
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE324069T1 publication Critical patent/ATE324069T1/de

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/4461—Features of the scanning mechanism, e.g. for moving the transducer within the housing of the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Gynecology & Obstetrics (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Insulated Conductors (AREA)
AT02751558T 2001-07-31 2002-07-26 Verdrahtungsverfahren und gerät für eine ultraschallsonde ATE324069T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/919,238 US6582371B2 (en) 2001-07-31 2001-07-31 Ultrasound probe wiring method and apparatus

Publications (1)

Publication Number Publication Date
ATE324069T1 true ATE324069T1 (de) 2006-05-15

Family

ID=25441759

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02751558T ATE324069T1 (de) 2001-07-31 2002-07-26 Verdrahtungsverfahren und gerät für eine ultraschallsonde

Country Status (6)

Country Link
US (3) US6582371B2 (de)
EP (1) EP1414350B1 (de)
JP (1) JP4429012B2 (de)
AT (1) ATE324069T1 (de)
DE (1) DE60210980T2 (de)
WO (1) WO2003011141A1 (de)

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US7698909B2 (en) 2002-10-01 2010-04-20 Nellcor Puritan Bennett Llc Headband with tension indicator
WO2004109327A1 (en) * 2003-06-04 2004-12-16 Koninklijke Philips Electronics, N.V. Redundant wire bonds for increasing transducer reliability
JP2006526930A (ja) * 2003-06-05 2006-11-24 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 超音波検査においてコントラスト不透明化を決定及び制御する方法及びシステム
US7047056B2 (en) 2003-06-25 2006-05-16 Nellcor Puritan Bennett Incorporated Hat-based oximeter sensor
US8412297B2 (en) 2003-10-01 2013-04-02 Covidien Lp Forehead sensor placement
US20050085731A1 (en) * 2003-10-21 2005-04-21 Miller David G. Ultrasound transducer finger probe
US7527591B2 (en) * 2003-11-21 2009-05-05 General Electric Company Ultrasound probe distributed beamformer
US7527592B2 (en) * 2003-11-21 2009-05-05 General Electric Company Ultrasound probe sub-aperture processing
US20050113698A1 (en) * 2003-11-21 2005-05-26 Kjell Kristoffersen Ultrasound probe transceiver circuitry
JP4913601B2 (ja) * 2003-11-26 2012-04-11 イマコー・インコーポレーテッド 細いプローブを使用する経食道超音波
US7491172B2 (en) * 2004-01-13 2009-02-17 General Electric Company Connection apparatus and method for controlling an ultrasound probe
JP4575108B2 (ja) * 2004-10-15 2010-11-04 株式会社東芝 超音波プローブ
US20070016056A1 (en) * 2005-07-15 2007-01-18 Scott Kerwin Methods and systems for providing control components in an ultrasound system
US8764664B2 (en) 2005-11-28 2014-07-01 Vizyontech Imaging, Inc. Methods and apparatus for conformable medical data acquisition pad and configurable imaging system
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
WO2007112269A1 (en) * 2006-03-23 2007-10-04 Imacor, Llc Transesophageal ultrasound probe with thin and flexible wiring
JP4980653B2 (ja) * 2006-06-12 2012-07-18 オリンパスメディカルシステムズ株式会社 超音波探触子および超音波探触子を有する超音波内視鏡
US20080130415A1 (en) * 2006-11-07 2008-06-05 General Electric Company Compound flexible circuit and method for electrically connecting a transducer array
US8364220B2 (en) 2008-09-25 2013-01-29 Covidien Lp Medical sensor and technique for using the same
US8257274B2 (en) 2008-09-25 2012-09-04 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US8556850B2 (en) 2008-12-31 2013-10-15 St. Jude Medical, Atrial Fibrillation Division, Inc. Shaft and handle for a catheter with independently-deflectable segments
US8676290B2 (en) 2010-05-11 2014-03-18 St. Jude Medical, Atrial Fibrillation Division, Inc. Multi-directional catheter control handle
US8515515B2 (en) 2009-03-25 2013-08-20 Covidien Lp Medical sensor with compressible light barrier and technique for using the same
US8781548B2 (en) 2009-03-31 2014-07-15 Covidien Lp Medical sensor with flexible components and technique for using the same
US9289154B2 (en) * 2009-08-19 2016-03-22 Insightec Ltd. Techniques for temperature measurement and corrections in long-term magnetic resonance thermometry
US9289147B2 (en) 2010-05-11 2016-03-22 St. Jude Medical, Atrial Fibrillation Division, Inc. Multi-directional flexible wire harness for medical devices
JP5826478B2 (ja) 2010-10-28 2015-12-02 日立アロカメディカル株式会社 組織挿入型超音波プローブ
JP5511627B2 (ja) * 2010-10-28 2014-06-04 日立アロカメディカル株式会社 脊椎手術支援用超音波プローブ及びその製造方法
USD726905S1 (en) 2011-05-11 2015-04-14 St. Jude Medical, Atrial Fibrillation Division, Inc. Control handle for a medical device
US8711570B2 (en) 2011-06-21 2014-04-29 Apple Inc. Flexible circuit routing
US9017262B2 (en) * 2012-01-02 2015-04-28 General Electric Company Systems and methods for connection to a transducer in ultrasound probes
JP2014057136A (ja) * 2012-09-11 2014-03-27 Hitachi Aloka Medical Ltd 超音波探触子
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WO2016198989A1 (en) 2015-06-11 2016-12-15 Koninklijke Philips N.V. Ultrasonic transducer array probe for shear wave imaging
US12510645B2 (en) 2015-06-29 2025-12-30 Koninklijke Philips N.V. Ultrasound system with asymmetric transmit signals
EP3369383A1 (de) * 2017-03-02 2018-09-05 Koninklijke Philips N.V. Ultraschallvorrichtung
JP6791799B2 (ja) * 2017-04-03 2020-11-25 オリンパス株式会社 超音波内視鏡
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Also Published As

Publication number Publication date
DE60210980T2 (de) 2006-12-21
EP1414350B1 (de) 2006-04-26
US7715204B2 (en) 2010-05-11
EP1414350A1 (de) 2004-05-06
US20030153834A1 (en) 2003-08-14
WO2003011141A1 (en) 2003-02-13
US20060036179A1 (en) 2006-02-16
JP4429012B2 (ja) 2010-03-10
US6952870B2 (en) 2005-10-11
JP2005510263A (ja) 2005-04-21
US6582371B2 (en) 2003-06-24
DE60210980D1 (de) 2006-06-01
US20030028105A1 (en) 2003-02-06

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