ATE325715T1 - Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement davon hergestellt - Google Patents

Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement davon hergestellt

Info

Publication number
ATE325715T1
ATE325715T1 AT02772699T AT02772699T ATE325715T1 AT E325715 T1 ATE325715 T1 AT E325715T1 AT 02772699 T AT02772699 T AT 02772699T AT 02772699 T AT02772699 T AT 02772699T AT E325715 T1 ATE325715 T1 AT E325715T1
Authority
AT
Austria
Prior art keywords
electronic component
foil
mark
component
components
Prior art date
Application number
AT02772699T
Other languages
English (en)
Inventor
Johan Bosman
De Water Peter W M Van
Roelf A J Groenhuis
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE325715T1 publication Critical patent/ATE325715T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/103—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols alphanumeric information, e.g. words, letters or serial numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/603—Formed on wafers or substrates before dicing and remaining on chips after dicing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Ceramic Capacitors (AREA)
AT02772699T 2001-10-09 2002-10-08 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement davon hergestellt ATE325715T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01203817 2001-10-09

Publications (1)

Publication Number Publication Date
ATE325715T1 true ATE325715T1 (de) 2006-06-15

Family

ID=8181038

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02772699T ATE325715T1 (de) 2001-10-09 2002-10-08 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement davon hergestellt

Country Status (8)

Country Link
EP (1) EP1438198B1 (de)
JP (1) JP2005505145A (de)
KR (1) KR20040039494A (de)
CN (1) CN1302938C (de)
AT (1) ATE325715T1 (de)
DE (1) DE60211364T2 (de)
TW (1) TWI223360B (de)
WO (1) WO2003031193A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4769975B2 (ja) * 2006-03-29 2011-09-07 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
DE102006019118B4 (de) * 2006-04-25 2011-08-18 Epcos Ag, 81669 Bauelement mit optischer Markierung und Verfahren zur Herstellung
JP2010153607A (ja) * 2008-12-25 2010-07-08 Sanyo Electric Co Ltd 半導体装置およびその製造方法
BR112018014160B1 (pt) * 2016-01-18 2022-09-27 Phoenix Contact Gmbh & Co. Kg Processo e dispositivo de marcação para marcação de componentes elétricos

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138084A (en) * 1966-07-22 1968-12-27 Standard Telephones Cables Ltd Method of vapour depositing a material in the form of a pattern
NL8001731A (nl) 1980-03-25 1981-10-16 Philips Nv Werkwijze voor het markeren van een kunststofoppervlak en voorwerp voorzien van een gemarkeerd kunststofoppervlak.
US4743463A (en) * 1986-02-21 1988-05-10 Eastman Kodak Company Method for forming patterns on a substrate or support
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
DE19652253C2 (de) * 1996-12-16 1999-04-29 Kloeckner Moeller Gmbh Laser-Beschriftungsverfahren zur Beschriftung von Bezeichnungsschildern

Also Published As

Publication number Publication date
CN1302938C (zh) 2007-03-07
EP1438198B1 (de) 2006-05-10
EP1438198A1 (de) 2004-07-21
DE60211364D1 (de) 2006-06-14
CN1564754A (zh) 2005-01-12
WO2003031193A1 (en) 2003-04-17
KR20040039494A (ko) 2004-05-10
DE60211364T2 (de) 2007-03-29
JP2005505145A (ja) 2005-02-17
TWI223360B (en) 2004-11-01

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Legal Events

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