ATE33354T1 - Anordnung zum schutz gegen funkenspruehen eines kapillaren teiles das zum schweissen von draehten in einem halbleiterelement dient. - Google Patents

Anordnung zum schutz gegen funkenspruehen eines kapillaren teiles das zum schweissen von draehten in einem halbleiterelement dient.

Info

Publication number
ATE33354T1
ATE33354T1 AT84810001T AT84810001T ATE33354T1 AT E33354 T1 ATE33354 T1 AT E33354T1 AT 84810001 T AT84810001 T AT 84810001T AT 84810001 T AT84810001 T AT 84810001T AT E33354 T1 ATE33354 T1 AT E33354T1
Authority
AT
Austria
Prior art keywords
capillary
arrangement
semiconductor element
protection against
part used
Prior art date
Application number
AT84810001T
Other languages
English (en)
Inventor
Peter Glutz
Kenneth W Ellett
Original Assignee
Aprova General Jewels Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aprova General Jewels Co Ltd filed Critical Aprova General Jewels Co Ltd
Application granted granted Critical
Publication of ATE33354T1 publication Critical patent/ATE33354T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Details Of Resistors (AREA)
  • Emergency Protection Circuit Devices (AREA)
AT84810001T 1983-01-03 1984-01-03 Anordnung zum schutz gegen funkenspruehen eines kapillaren teiles das zum schweissen von draehten in einem halbleiterelement dient. ATE33354T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/455,038 US4513190A (en) 1983-01-03 1983-01-03 Protection of semiconductor wire bonding capillary from spark erosion
EP84810001A EP0116010B1 (de) 1983-01-03 1984-01-03 Anordnung zum Schutz gegen Funkensprühen eines kapillaren Teiles das zum Schweissen von Drähten in einem Halbleiterelement dient

Publications (1)

Publication Number Publication Date
ATE33354T1 true ATE33354T1 (de) 1988-04-15

Family

ID=23807116

Family Applications (1)

Application Number Title Priority Date Filing Date
AT84810001T ATE33354T1 (de) 1983-01-03 1984-01-03 Anordnung zum schutz gegen funkenspruehen eines kapillaren teiles das zum schweissen von draehten in einem halbleiterelement dient.

Country Status (5)

Country Link
US (1) US4513190A (de)
EP (1) EP0116010B1 (de)
JP (1) JPS59135738A (de)
AT (1) ATE33354T1 (de)
DE (1) DE3470290D1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674671A (en) * 1985-11-04 1987-06-23 Olin Corporation Thermosonic palladium lead wire bonding
JPS62158335A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ワイヤボンディング用キャピラリ−
WO1989001384A1 (fr) * 1987-08-17 1989-02-23 Siemens Aktiengesellschaft Agencement d'outillage pour soudage par ultrasons
US4909427A (en) * 1989-05-17 1990-03-20 Plaisted Alan H Bonding wire ball formation
US4947024A (en) * 1989-09-11 1990-08-07 Alcotec Wire Co. Welding apparatus coated with spatter-resistant and electrically conductive film
US5201453A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Linear, direct-drive microelectronic bonding apparatus and method
US5772903A (en) * 1996-09-27 1998-06-30 Hirsch; Gregory Tapered capillary optics
US5931368A (en) 1997-03-28 1999-08-03 Kulicke And Soffa Investments, Inc Long life bonding tool
US6045026A (en) * 1998-02-23 2000-04-04 Micron Technology, Inc. Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems
US6073827A (en) * 1998-08-27 2000-06-13 Kulicke & Soffa Investments, Inc. Wire bonding capillary with a conical surface
US6309891B1 (en) * 1998-09-09 2001-10-30 Incyte Genomics, Inc. Capillary printing systems
US6158647A (en) * 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6957783B1 (en) 1999-01-26 2005-10-25 Dl Technology Llc Dispense tip with vented outlets
US7207498B1 (en) 2000-01-26 2007-04-24 Dl Technology, Llc Fluid dispense tips
US6511301B1 (en) 1999-11-08 2003-01-28 Jeffrey Fugere Fluid pump and cartridge
US6354479B1 (en) * 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US7124927B2 (en) * 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US6651864B2 (en) * 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US7389905B2 (en) * 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US6892959B1 (en) * 2000-01-26 2005-05-17 Dl Technology Llc System and method for control of fluid dispense pump
US6981664B1 (en) 2000-01-26 2006-01-03 Dl Technology Llc Fluid dispense tips
US6523733B2 (en) 2000-04-28 2003-02-25 Kulicke & Soffa Investments Inc. Controlled attenuation capillary
US6497356B2 (en) 2000-04-28 2002-12-24 Kulicke & Soffa Investments, Inc. Controlled attenuation capillary with planar surface
US6321969B1 (en) * 2000-04-28 2001-11-27 Kulicke & Soffa Investments Efficient energy transfer capillary
US6738552B2 (en) 2001-01-22 2004-05-18 Gregory Hirsch Pressed capillary optics
US6729527B2 (en) * 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
JP3621368B2 (ja) * 2001-10-18 2005-02-16 株式会社新川 ワイヤボンディング装置におけるボール形成装置
CA2363409A1 (en) * 2001-11-20 2003-05-20 Microbonds, Inc. A wire bonder for ball bonding insulated wire and method of using same
US6983867B1 (en) 2002-04-29 2006-01-10 Dl Technology Llc Fluid dispense pump with drip prevention mechanism and method for controlling same
US7360675B2 (en) * 2002-11-20 2008-04-22 Microbonds, Inc. Wire bonder for ball bonding insulated wire and method of using same
US7331482B1 (en) 2003-03-28 2008-02-19 Dl Technology, Llc Dispense pump with heated pump housing and heated material reservoir
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US7322507B2 (en) * 2005-01-17 2008-01-29 Amkor Technology, Inc. Transducer assembly, capillary and wire bonding method using the same
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
SG173340A1 (en) * 2006-07-03 2011-08-29 Kulicke & Soffa Ind Inc Bonding tool with improved finish
US8707559B1 (en) 2007-02-20 2014-04-29 Dl Technology, Llc Material dispense tips and methods for manufacturing the same
JP4941268B2 (ja) * 2007-12-17 2012-05-30 富士通株式会社 ワイヤボンディング方法およびワイヤボンディング装置
US7681456B2 (en) * 2008-06-20 2010-03-23 Rosemount Inc. Field device including a capillary tube having a non-cylindrical lumen
US8864055B2 (en) 2009-05-01 2014-10-21 Dl Technology, Llc Material dispense tips and methods for forming the same
CN102013405B (zh) * 2009-09-04 2012-12-05 日月光封装测试(上海)有限公司 芯片打线接合装置的焊针加热构造及其方法
US9725225B1 (en) 2012-02-24 2017-08-08 Dl Technology, Llc Micro-volume dispense pump systems and methods
US9165904B1 (en) * 2014-06-17 2015-10-20 Freescale Semiconductor, Inc. Insulated wire bonding with EFO before second bond
CN107052557B (zh) * 2017-03-28 2019-09-24 潮州三环（集团）股份有限公司 一种具有涂层的焊接陶瓷劈刀
US11746656B1 (en) 2019-05-13 2023-09-05 DL Technology, LLC. Micro-volume dispense pump systems and methods
CN112077484B (zh) * 2019-06-13 2022-08-16 湖南高精特电装备有限公司 一种钛合金锲形键合立针及其制备方法
DE102022001130A1 (de) 2022-03-25 2023-09-28 Jonas Münz Sonotrode sowie Vorrichtung und Verfahren zum Ultraschallschweißen von Stahl

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
JPS5549590B2 (de) * 1972-06-10 1980-12-12
US4315128A (en) * 1978-04-07 1982-02-09 Kulicke And Soffa Industries Inc. Electrically heated bonding tool for the manufacture of semiconductor devices
DE3037735A1 (de) * 1980-10-06 1982-05-13 TS-Electronic Vertriebs-GmbH, 8000 München Kontaktierverfahren und kontaktiermaschine zur durchfuehrung des verfahrens

Also Published As

Publication number Publication date
EP0116010B1 (de) 1988-04-06
EP0116010A2 (de) 1984-08-15
JPS59135738A (ja) 1984-08-04
EP0116010A3 (en) 1986-04-16
US4513190A (en) 1985-04-23
DE3470290D1 (en) 1988-05-11

Similar Documents

Publication Publication Date Title
ATE33354T1 (de) Anordnung zum schutz gegen funkenspruehen eines kapillaren teiles das zum schweissen von draehten in einem halbleiterelement dient.
GB8602740D0 (en) Bonding wires
EP0133118A3 (de) Verfahren und Apparat zum Herstellen von Kugelverbindungen
JPS6126221B2 (de)
FR2388426A1 (fr) Appareil de protection contre les surtensions
KR20100103395A (ko) ３-전극 서지 보호 장치
SE9203234D0 (sv) Anordning foer skydd
KR890000585B1 (ko) 도선 접착법
US3523173A (en) Insulated lead connection
DE59301256D1 (de) Blitzstromtragfähige Anordnung mit zumindest zwei in Reihe geschalteten Funkenstrecken
DE69119093D1 (de) Verfahren und vorrichtung zum einfügen einer elektrisch leitenden flüssigkeit zwischen elektroden in einem stosswellengerät
JPS589566B2 (ja) タソウカトデンアツヨクアツソウチ
GB1494021A (en) Surge diverter
US2883574A (en) Lightning arrester
JPS55150247A (en) Parallel gap electrode and process for welding using the same
JP3066179B2 (ja) シールド型電気化学測定用電極
JPS5596665A (en) Lead component for semiconductor element
JP3973319B2 (ja) ワイヤボンダの電気トーチ
JP3355987B2 (ja) ワイヤボンディング装置
JPS57203939A (en) Gas component detector
SU948582A1 (ru) Инструмент дл микросварки проволочных выводов
JP3023638B2 (ja) Ｔｉｇ溶接用トーチ
JPS5681942A (en) Ball formation in wire bonder
JPS56100459A (en) Electronic component
KR890008357Y1 (ko) 무각도 연속용접용 아크 용접봉

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties