IL147039A0 - Cmp composition containing silane modified abrasive particles - Google Patents

Cmp composition containing silane modified abrasive particles

Info

Publication number
IL147039A0
IL147039A0 IL14703900A IL14703900A IL147039A0 IL 147039 A0 IL147039 A0 IL 147039A0 IL 14703900 A IL14703900 A IL 14703900A IL 14703900 A IL14703900 A IL 14703900A IL 147039 A0 IL147039 A0 IL 147039A0
Authority
IL
Israel
Prior art keywords
abrasive particles
composition containing
containing silane
cmp composition
silane modified
Prior art date
Application number
IL14703900A
Other languages
English (en)
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of IL147039A0 publication Critical patent/IL147039A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Disintegrating Or Milling (AREA)
IL14703900A 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles IL147039A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07
PCT/US2000/018342 WO2001004226A2 (en) 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles

Publications (1)

Publication Number Publication Date
IL147039A0 true IL147039A0 (en) 2002-08-14

Family

ID=22500954

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14703900A IL147039A0 (en) 1999-07-07 2000-07-05 Cmp composition containing silane modified abrasive particles

Country Status (14)

Country Link
US (2) US6582623B1 (de)
EP (1) EP1200532B1 (de)
JP (2) JP2003520283A (de)
KR (1) KR100590665B1 (de)
CN (1) CN1209429C (de)
AT (1) ATE338100T1 (de)
AU (1) AU5785700A (de)
CA (1) CA2378492A1 (de)
DE (1) DE60030444T2 (de)
HK (1) HK1046151A1 (de)
IL (1) IL147039A0 (de)
MY (1) MY126717A (de)
TW (1) TW538110B (de)
WO (1) WO2001004226A2 (de)

Families Citing this family (115)

* Cited by examiner, † Cited by third party
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CN112680187A (zh) * 2021-01-04 2021-04-20 上海晖研材料科技有限公司 一种表面改性的二氧化硅及含其的磨料组合物
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KR20230055586A (ko) * 2021-10-19 2023-04-26 에스케이하이닉스 주식회사 보론 실리콘 화합물 연마용 cmp 슬러리 조성물과 이를 이용한 cmp 방법 및 반도체 소자의 제조 방법
KR102765056B1 (ko) * 2021-10-21 2025-02-06 한남대학교 산학협력단 화학-기계적 연마 슬러리용 무기산화물 입자의 산화제 기능화를 위한 실란 링커의 제조방법
EP4457054A4 (de) 2021-12-30 2026-01-14 Saint Gobain Abrasives Inc Schleifartikel und verfahren zur formung davon
EP4457055A4 (de) 2021-12-30 2025-12-24 Saint Gobain Abrasives Inc Schleifartikel und verfahren zur formung davon
CA3241421A1 (en) 2021-12-30 2023-07-06 Anthony MARTONE Abrasive articles and methods of forming same
KR20230106938A (ko) * 2022-01-07 2023-07-14 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
TW202523821A (zh) 2023-11-20 2025-06-16 美商慧盛材料美國責任有限公司 用於研磨多晶矽膜的cmp配方及方法
WO2025231281A1 (en) 2024-05-03 2025-11-06 Versum Materials Us, Llc Cmp formulations and methods for polishing ruthenium films

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EP1200532A1 (de) 2002-05-02
CN1209429C (zh) 2005-07-06
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ATE338100T1 (de) 2006-09-15
KR100590665B1 (ko) 2006-06-19
EP1200532B1 (de) 2006-08-30
DE60030444T2 (de) 2006-12-14
AU5785700A (en) 2001-01-30
MY126717A (en) 2006-10-31
US20030209522A1 (en) 2003-11-13
CN1367809A (zh) 2002-09-04
US6582623B1 (en) 2003-06-24
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WO2001004226A3 (en) 2002-10-03
TW538110B (en) 2003-06-21
CA2378492A1 (en) 2001-01-18

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