ATE339313T1 - Piezoelektrische struktur, flüssigkeitsstrahlkopf und verfahren zur herstellung - Google Patents

Piezoelektrische struktur, flüssigkeitsstrahlkopf und verfahren zur herstellung

Info

Publication number
ATE339313T1
ATE339313T1 AT02002903T AT02002903T ATE339313T1 AT E339313 T1 ATE339313 T1 AT E339313T1 AT 02002903 T AT02002903 T AT 02002903T AT 02002903 T AT02002903 T AT 02002903T AT E339313 T1 ATE339313 T1 AT E339313T1
Authority
AT
Austria
Prior art keywords
production
jet head
liquid jet
monocrystal
piezoelectric structure
Prior art date
Application number
AT02002903T
Other languages
English (en)
Inventor
Akira Unno
Takao Yonehara
Tetsuro Fukui
Takanori Matsuda
Kiyotaka Wasa
Original Assignee
Canon Kk
Kiyotaka Wasa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk, Kiyotaka Wasa filed Critical Canon Kk
Application granted granted Critical
Publication of ATE339313T1 publication Critical patent/ATE339313T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
AT02002903T 2001-02-09 2002-02-08 Piezoelektrische struktur, flüssigkeitsstrahlkopf und verfahren zur herstellung ATE339313T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001033823A JP3833070B2 (ja) 2001-02-09 2001-02-09 液体噴射ヘッドおよび製造方法

Publications (1)

Publication Number Publication Date
ATE339313T1 true ATE339313T1 (de) 2006-10-15

Family

ID=18897515

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02002903T ATE339313T1 (de) 2001-02-09 2002-02-08 Piezoelektrische struktur, flüssigkeitsstrahlkopf und verfahren zur herstellung

Country Status (7)

Country Link
US (2) US7053526B2 (de)
EP (1) EP1231061B1 (de)
JP (1) JP3833070B2 (de)
KR (1) KR100715406B1 (de)
CN (1) CN1181977C (de)
AT (1) ATE339313T1 (de)
DE (1) DE60214612T2 (de)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004001338A (ja) 2001-12-27 2004-01-08 Seiko Epson Corp 液体噴射ヘッド、及び、その製造方法
JP4100202B2 (ja) * 2002-03-18 2008-06-11 セイコーエプソン株式会社 圧電アクチュエータ、及び、液体噴射ヘッド
JP4100953B2 (ja) * 2002-04-18 2008-06-11 キヤノン株式会社 Ｓｉ基板上に単結晶酸化物導電体を有する積層体及びそれを用いたアクチュエーター及びインクジェットヘッドとその製造方法
JP4086535B2 (ja) * 2002-04-18 2008-05-14 キヤノン株式会社 アクチュエータ及びインクジェットヘッドの製造方法
JP4708667B2 (ja) 2002-08-08 2011-06-22 キヤノン株式会社 アクチュエータおよび液体噴射ヘッド
JP2007243200A (ja) * 2002-11-11 2007-09-20 Seiko Epson Corp 圧電体デバイス、液体吐出ヘッド、強誘電体デバイス及び電子機器並びにこれらの製造方法
JP2004179642A (ja) * 2002-11-11 2004-06-24 Seiko Epson Corp 圧電体デバイス、液体吐出ヘッド、強誘電体デバイス及び電子機器並びにこれらの製造方法
JP3821231B2 (ja) 2003-01-27 2006-09-13 セイコーエプソン株式会社 液体噴射ヘッドの駆動方法及び液体噴射装置
US7144101B2 (en) * 2003-01-31 2006-12-05 Canon Kabushiki Kaisha Piezoelectric element
US7215067B2 (en) * 2003-02-07 2007-05-08 Canon Kabushiki Kaisha Ferroelectric thin film element, piezoelectric actuator and liquid discharge head
US7059711B2 (en) * 2003-02-07 2006-06-13 Canon Kabushiki Kaisha Dielectric film structure, piezoelectric actuator using dielectric element film structure and ink jet head
JP2004255585A (ja) 2003-02-24 2004-09-16 Riso Kagaku Corp 画像形成装置
US7193756B2 (en) * 2003-11-26 2007-03-20 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, method for fabricating the same, inkjet head, method for fabricating the same, and inkjet recording apparatus
JP4717344B2 (ja) * 2003-12-10 2011-07-06 キヤノン株式会社 誘電体薄膜素子、圧電アクチュエータおよび液体吐出ヘッド
TWI243496B (en) * 2003-12-15 2005-11-11 Canon Kk Piezoelectric film element, method of manufacturing the same, and liquid discharge head
US7262544B2 (en) * 2004-01-09 2007-08-28 Canon Kabushiki Kaisha Dielectric element, piezoelectric element, ink jet head and method for producing the same head
JP4192794B2 (ja) 2004-01-26 2008-12-10 セイコーエプソン株式会社 圧電素子、圧電アクチュエーター、インクジェット式記録ヘッド、インクジェットプリンター、表面弾性波素子、周波数フィルタ、発振器、電子回路、薄膜圧電共振器、及び電子機器
US7453188B2 (en) 2004-02-27 2008-11-18 Canon Kabushiki Kaisha Dielectric element, piezoelectric element, ink jet head and ink jet recording apparatus and manufacturing method of same
JP2005244133A (ja) 2004-02-27 2005-09-08 Canon Inc 誘電体素子、圧電素子、インクジェットヘッド及びインクジェット記録装置、並びにこれらの製造方法
JP4737375B2 (ja) * 2004-03-11 2011-07-27 セイコーエプソン株式会社 アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法並びに液体噴射装置の製造方法
JP3875240B2 (ja) 2004-03-31 2007-01-31 株式会社東芝 電子部品の製造方法
CN100568568C (zh) * 2004-04-23 2009-12-09 新加坡科技研究局 微机电装置
US7497962B2 (en) 2004-08-06 2009-03-03 Canon Kabushiki Kaisha Method of manufacturing liquid discharge head and method of manufacturing substrate for liquid discharge head
US7235917B2 (en) * 2004-08-10 2007-06-26 Canon Kabushiki Kaisha Piezoelectric member element and liquid discharge head comprising element thereof
JP2006069151A (ja) * 2004-09-06 2006-03-16 Canon Inc 圧電膜型アクチュエータの製造方法及び液体噴射ヘッド
JP2006069152A (ja) * 2004-09-06 2006-03-16 Canon Inc インクジェットヘッド及びその製造方法
WO2006083635A2 (en) * 2005-01-28 2006-08-10 Satake Usa, Inc. Multiport ejector for use with sorter
US7449816B2 (en) * 2005-03-25 2008-11-11 Brother Kogyo Kabushiki Kaisha Piezoelectric actuator, liquid transporting apparatus, and method for producing piezoelectric actuator and method for producing liquid transporting apparatus
US7521845B2 (en) * 2005-08-23 2009-04-21 Canon Kabushiki Kaisha Piezoelectric substance, piezoelectric element, liquid discharge head using piezoelectric element, and liquid discharge apparatus
US7998362B2 (en) * 2005-08-23 2011-08-16 Canon Kabushiki Kaisha Piezoelectric substance, piezoelectric element, liquid discharge head using piezoelectric element, liquid discharge apparatus, and production method of piezoelectric element
US20070046153A1 (en) * 2005-08-23 2007-03-01 Canon Kabushiki Kaisha Piezoelectric substrate, piezoelectric element, liquid discharge head and liquid discharge apparatus
WO2007023985A1 (ja) 2005-08-23 2007-03-01 Canon Kabushiki Kaisha 圧電体素子、それを用いた液体吐出ヘッド、および液体吐出装置
US8142678B2 (en) * 2005-08-23 2012-03-27 Canon Kabushiki Kaisha Perovskite type oxide material, piezoelectric element, liquid discharge head and liquid discharge apparatus using the same, and method of producing perovskite type oxide material
US7591543B2 (en) * 2005-08-23 2009-09-22 Canon Kabushiki Kaisha Piezoelectric member, piezoelectric member element, liquid discharge head in use thereof, liquid discharge apparatus and method of manufacturing piezoelectric member
US7528532B2 (en) * 2005-08-23 2009-05-05 Canon Kabushiki Kaisha Piezoelectric substance and manufacturing method thereof, piezoelectric element and liquid discharge head using such piezoelectric element and liquid discharge apparatus
US7528530B2 (en) 2005-08-23 2009-05-05 Canon Kabushiki Kaisha Piezoelectric substance, piezoelectric substance element, liquid discharge head, liquid discharge device and method for producing piezoelectric substance
US7759845B2 (en) * 2006-03-10 2010-07-20 Canon Kabushiki Kaisha Piezoelectric substance element, liquid discharge head utilizing the same and optical element
JP5188076B2 (ja) * 2006-04-03 2013-04-24 キヤノン株式会社 圧電素子及びその製造方法、電子デバイス、インクジェット装置
US7984977B2 (en) * 2006-07-14 2011-07-26 Canon Kabushiki Kaisha Piezoelectric element, manufacturing method for piezoelectric body, and liquid jet head
CN101641806B (zh) * 2007-03-30 2011-11-30 佳能株式会社 外延膜、压电元件、铁电元件、它们的制造方法以及液体排出头
JP5242238B2 (ja) * 2007-05-30 2013-07-24 オセ−テクノロジーズ・ベー・ヴエー 圧電インクジェットデバイスの製作方法
JP5448320B2 (ja) * 2007-10-04 2014-03-19 キヤノン株式会社 圧電アクチュエータ及びそれを用いた液体吐出ヘッド
JP5382905B2 (ja) * 2008-03-10 2014-01-08 富士フイルム株式会社 圧電素子の製造方法及び液体吐出ヘッドの製造方法
JP4618344B2 (ja) * 2008-07-29 2011-01-26 コニカミノルタビジネステクノロジーズ株式会社 認証装置、認証システム、認証方法、認証プログラムおよび記録媒体
WO2011145453A1 (ja) * 2010-05-17 2011-11-24 株式会社村田製作所 圧電アクチュエータ及び駆動装置
CN102959752B (zh) * 2010-08-12 2015-09-02 株式会社村田制作所 压电薄膜元件的制造方法、压电薄膜元件以及压电薄膜元件用部件
CN102834943B (zh) * 2011-03-25 2015-09-09 日本碍子株式会社 层叠体及其制造方法
CN102794989A (zh) * 2011-05-27 2012-11-28 研能科技股份有限公司 压电式喷墨头结构
CN103496257B (zh) * 2013-09-11 2016-01-20 佛山市南海金刚新材料有限公司 喷墨打印头及喷墨打印机
JP6467156B2 (ja) * 2014-07-18 2019-02-06 株式会社東芝 インクジェットヘッド及びインクジェット記録装置
CN105375812A (zh) 2014-08-13 2016-03-02 精工爱普生株式会社 压电驱动装置及其驱动方法、机器人及其驱动方法
JP2016040984A (ja) * 2014-08-13 2016-03-24 セイコーエプソン株式会社 圧電駆動装置及びその駆動方法、ロボット及びその駆動方法
JP6910631B2 (ja) * 2016-11-15 2021-07-28 アドバンストマテリアルテクノロジーズ株式会社 膜構造体及びその製造方法
JP6907710B2 (ja) * 2017-05-29 2021-07-21 セイコーエプソン株式会社 圧電デバイス、液体吐出ヘッド、液体吐出装置
CN110128169B (zh) * 2019-05-10 2021-05-18 济南大学 采用钙离子掺杂的SiO2膜对压电陶瓷表面进行改性的方法及其应用
CN111081864B (zh) * 2020-01-02 2021-05-07 大连理工大学 一种(100)择优取向的pmn-pzt/pzt异质结构薄膜的制备方法
CN112062564B (zh) * 2020-09-17 2022-05-17 广西大学 一种pmn-psn超高击穿电场薄膜材料的制备方法
JP7689316B2 (ja) * 2021-03-04 2025-06-06 パナソニックＩｐマネジメント株式会社 インクジェットヘッド

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE65004T1 (de) * 1983-09-29 1991-07-15 Siemens Ag Wandlerplatte fuer piezoelektrische wandler und vorrichtung zu deren herstellung.
US4783821A (en) * 1987-11-25 1988-11-08 The Regents Of The University Of California IC processed piezoelectric microphone
JPH02219654A (ja) * 1989-02-20 1990-09-03 Ricoh Co Ltd インクジェットヘッド及びその製造方法
US5160870A (en) * 1990-06-25 1992-11-03 Carson Paul L Ultrasonic image sensing array and method
US5534900A (en) * 1990-09-21 1996-07-09 Seiko Epson Corporation Ink-jet recording apparatus
JP3379106B2 (ja) * 1992-04-23 2003-02-17 セイコーエプソン株式会社 液体噴射ヘッド
EP0698490B1 (de) * 1994-08-25 1999-06-16 Seiko Epson Corporation Flüssigkeitsstrahlkopf
JP3381473B2 (ja) * 1994-08-25 2003-02-24 セイコーエプソン株式会社 液体噴射ヘッド
US5933167A (en) * 1995-04-03 1999-08-03 Seiko Epson Corporation Printer head for ink jet recording
JP3327149B2 (ja) * 1995-12-20 2002-09-24 セイコーエプソン株式会社 圧電体薄膜素子及びこれを用いたインクジェット式記録ヘッド
JP3601239B2 (ja) * 1996-04-05 2004-12-15 セイコーエプソン株式会社 インクジェット式記録ヘッド及びそれを用いたインクジェット式記録装置
JPH1044406A (ja) * 1996-08-01 1998-02-17 Ricoh Co Ltd インクジェットヘッド及びその製造方法
US5804907A (en) 1997-01-28 1998-09-08 The Penn State Research Foundation High strain actuator using ferroelectric single crystal
JP3832075B2 (ja) * 1997-03-25 2006-10-11 セイコーエプソン株式会社 インクジェット式記録ヘッド、その製造方法および圧電体素子
JP3666177B2 (ja) 1997-04-14 2005-06-29 松下電器産業株式会社 インクジェット記録装置
JP3619036B2 (ja) * 1997-12-05 2005-02-09 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JPH11348285A (ja) 1998-06-10 1999-12-21 Matsushita Electric Ind Co Ltd インクジェット記録装置とその製造方法
DE19859914A1 (de) * 1998-07-22 2000-02-03 Samsung Electro Mech Verfahren zum Herstellen eines Aktuators für einen Tintenstrahldruckkopf
JP3517876B2 (ja) * 1998-10-14 2004-04-12 セイコーエプソン株式会社 強誘電体薄膜素子の製造方法、インクジェット式記録ヘッド及びインクジェットプリンタ
KR100464307B1 (ko) * 1998-10-16 2005-02-28 삼성전자주식회사 압전효과를이용한잉크젯프린터헤드및그제조방법
JP3339569B2 (ja) * 1999-03-26 2002-10-28 富士ゼロックス株式会社 インクジェット記録ヘッド
JP2000357826A (ja) * 1999-04-13 2000-12-26 Seiko Epson Corp 圧電体素子の製造方法、圧電体素子、インクジェット式記録ヘッドおよびプリンタ
JP3796394B2 (ja) 2000-06-21 2006-07-12 キヤノン株式会社 圧電素子の製造方法および液体噴射記録ヘッドの製造方法
JP3754897B2 (ja) 2001-02-09 2006-03-15 キヤノン株式会社 半導体装置用基板およびｓｏｉ基板の製造方法

Also Published As

Publication number Publication date
US20060028100A1 (en) 2006-02-09
DE60214612T2 (de) 2007-09-27
KR100715406B1 (ko) 2007-05-08
JP2002234156A (ja) 2002-08-20
EP1231061A1 (de) 2002-08-14
JP3833070B2 (ja) 2006-10-11
CN1380187A (zh) 2002-11-20
US7053526B2 (en) 2006-05-30
US7069631B2 (en) 2006-07-04
DE60214612D1 (de) 2006-10-26
KR20020066226A (ko) 2002-08-14
US20020140320A1 (en) 2002-10-03
EP1231061B1 (de) 2006-09-13
CN1181977C (zh) 2004-12-29

Similar Documents

Publication Publication Date Title
ATE339313T1 (de) Piezoelektrische struktur, flüssigkeitsstrahlkopf und verfahren zur herstellung
EP1275618A4 (de) Keramischer film und verfahren zu seiner herstellung, sowie halbleitervorrichtung und piezoelektrisches element
TWI249063B (en) Display device and manufacturing method thereof
EP1505663A4 (de) Piezoelektrisches stellglied und flüssigkeits-jet-kopf
EP1435653A3 (de) Halbleiteranordnung hergestellt durch ein Transferverfahren
ATE219292T1 (de) Verfahren für die kontrollierte strukturierung und entfernung einer dünnschicht
EP1726050A4 (de) Piezoelektrischer dünnfilm, verfahren zur herstellung eines piezoelektrischen dünnfilms, piezoelektrisches element und inkjet-aufzeichnungskopf
WO2005037558A8 (en) Print head with thin membrane
ATE498913T1 (de) Piezoelektrisches verbundelement und dessen herstellungsverfahren
JP4086535B2 (ja) アクチュエータ及びインクジェットヘッドの製造方法
CA2351199A1 (en) Structure of piezoelectric element and liquid discharge recording head, and method of manufacture therefor
EP1544927A3 (de) Piezoelektrisches Element, dessen Herstellungsverfahren, sowie Tintenstrahlkopf, Tintenstrahlaufzeichnungsgerät und Winkelgeschwindigkeitssensor mit demselben
GB2396962B (en) Mask for sequential lateral solidification and and crystallization method using thereof
ATE337191T1 (de) Doppelbrechende markierung
ATE407010T1 (de) Träger, tintenstrahldruckkopf mit träger, und herstellungsverfaren von tintenstrahldruckkopf mit träger
WO2005054955A3 (en) Lithographic apparatus and device manufacturing method
WO2002095799A3 (en) Thin films and production methods thereof
TW200520273A (en) Piezoelectric film element, method of manufacturing the same, and liquid discharge head
TW200606507A (en) Variable mask device for crystallizing silicon layer and method for crystallizing using the same
FR2862769B1 (fr) Substrat inferieur, dispositif d'affichage a cristal liquide a mode ips et son procede de fabrication
DE69926566D1 (de) Drehgeschwindigkeitssensor und sein Herstellungsverfahren
Russel et al. How can surface-crystallized glass-ceramics be piezoelectric?
ATE360055T1 (de) Trocknungsverfahren und lösungsmittel für cholesterische flüssigkristalle
BRPI0412278A (pt) método para fabricar um recurso de alinhamento para uma tinta óptica, elemento oftálmico e elemento óptico
DE502004008498D1 (de) Piezoelektrisches keramikmaterial, vielschichtbauelement und verfahren zur herstellung des keramikmaterials

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties