ATE345579T1 - Verfahren und system zur reinigung eines wafers nach chemisch- mechanischem polieren oder plasmabehandlung - Google Patents

Verfahren und system zur reinigung eines wafers nach chemisch- mechanischem polieren oder plasmabehandlung

Info

Publication number
ATE345579T1
ATE345579T1 AT00943063T AT00943063T ATE345579T1 AT E345579 T1 ATE345579 T1 AT E345579T1 AT 00943063 T AT00943063 T AT 00943063T AT 00943063 T AT00943063 T AT 00943063T AT E345579 T1 ATE345579 T1 AT E345579T1
Authority
AT
Austria
Prior art keywords
wafer
cleaning
chemical
plasma treatment
mechanical polishing
Prior art date
Application number
AT00943063T
Other languages
English (en)
Inventor
Jeffrey J Farber
Julia S Svirchevski
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE345579T1 publication Critical patent/ATE345579T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT00943063T 1999-06-25 2000-06-23 Verfahren und system zur reinigung eines wafers nach chemisch- mechanischem polieren oder plasmabehandlung ATE345579T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/344,671 US6405399B1 (en) 1999-06-25 1999-06-25 Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing

Publications (1)

Publication Number Publication Date
ATE345579T1 true ATE345579T1 (de) 2006-12-15

Family

ID=23351491

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00943063T ATE345579T1 (de) 1999-06-25 2000-06-23 Verfahren und system zur reinigung eines wafers nach chemisch- mechanischem polieren oder plasmabehandlung

Country Status (8)

Country Link
US (1) US6405399B1 (de)
EP (1) EP1190441B1 (de)
JP (1) JP4667687B2 (de)
KR (1) KR100797421B1 (de)
AT (1) ATE345579T1 (de)
DE (1) DE60031852T2 (de)
TW (1) TW541210B (de)
WO (1) WO2001001458A1 (de)

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CN103913959B (zh) * 2014-03-27 2017-09-26 京东方科技集团股份有限公司 一种光刻胶的剥离装置及剥离方法
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KR20210095047A (ko) 2020-01-22 2021-07-30 주식회사 씨티에스 웨이퍼 건조 모듈 및 이를 포함하는 씨엠피 장치
KR102713031B1 (ko) * 2020-07-02 2024-10-07 창신 메모리 테크놀로지즈 아이엔씨 반도체 구조의 처리 방법 및 형성 방법
CN113889405B (zh) 2020-07-02 2024-07-05 长鑫存储技术有限公司 半导体结构的处理方法及形成方法
CN112371612B (zh) * 2020-10-13 2021-08-24 江苏亚电科技有限公司 一种无篮晶圆清洗方法

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Also Published As

Publication number Publication date
DE60031852D1 (de) 2006-12-28
JP2003503845A (ja) 2003-01-28
DE60031852T2 (de) 2007-09-13
EP1190441A1 (de) 2002-03-27
JP4667687B2 (ja) 2011-04-13
US6405399B1 (en) 2002-06-18
WO2001001458A1 (en) 2001-01-04
KR20020027360A (ko) 2002-04-13
EP1190441B1 (de) 2006-11-15
TW541210B (en) 2003-07-11
KR100797421B1 (ko) 2008-01-23

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