ATE349049T1 - Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren - Google Patents

Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren

Info

Publication number
ATE349049T1
ATE349049T1 AT03778441T AT03778441T ATE349049T1 AT E349049 T1 ATE349049 T1 AT E349049T1 AT 03778441 T AT03778441 T AT 03778441T AT 03778441 T AT03778441 T AT 03778441T AT E349049 T1 ATE349049 T1 AT E349049T1
Authority
AT
Austria
Prior art keywords
component
production method
chip card
microcircuit
appearance component
Prior art date
Application number
AT03778441T
Other languages
English (en)
Inventor
Francois Launay
Jacques Venambre
Original Assignee
Oberthur Card Syst Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Syst Sa filed Critical Oberthur Card Syst Sa
Application granted granted Critical
Publication of ATE349049T1 publication Critical patent/ATE349049T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Ceramic Capacitors (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
AT03778441T 2002-10-28 2003-10-23 Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren ATE349049T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0213465A FR2846446B1 (fr) 2002-10-28 2002-10-28 Carte a puce comportant un composant debouchant et un procede de fabrication

Publications (1)

Publication Number Publication Date
ATE349049T1 true ATE349049T1 (de) 2007-01-15

Family

ID=32088335

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03778441T ATE349049T1 (de) 2002-10-28 2003-10-23 Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren

Country Status (12)

Country Link
US (1) US9792541B2 (de)
EP (1) EP1556832B1 (de)
JP (1) JP4287378B2 (de)
CN (1) CN100424722C (de)
AT (1) ATE349049T1 (de)
AU (1) AU2003285440A1 (de)
CA (1) CA2503688C (de)
DE (1) DE60310599T2 (de)
ES (1) ES2276132T3 (de)
FR (1) FR2846446B1 (de)
MX (1) MXPA05004469A (de)
WO (1) WO2004040507A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371225B2 (en) 2005-07-20 2013-02-12 Multiclip Co. Ltd. Device, method, and apparatus for lifting a railway rail

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2997535B1 (fr) 2012-10-30 2016-07-08 Oberthur Technologies Procede de fabrication d'une carte a puce a plusieurs composants et carte ainsi obtenue
CN105164703A (zh) * 2013-03-14 2015-12-16 X卡控股有限公司 用于显示一次性密码的信息携带卡及制作该信息携带卡的方法
US10789524B2 (en) 2013-09-08 2020-09-29 Amatech Group Limited Smartcard with a booster antenna and a wireless connection between modules
US11410010B2 (en) 2014-08-21 2022-08-09 Amatech Group Limiied Smartcard with a coupling frame and a wireless connection between modules
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce
FR3115904B1 (fr) * 2020-10-30 2023-11-17 Linxens Holding Procédé de fabrication d’un module de carte à puce avec composant électronique soudé
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61157990A (ja) * 1984-12-29 1986-07-17 Kyodo Printing Co Ltd Ｉｃカ−ド
EP0234954A3 (en) * 1986-02-28 1988-04-27 Intellicard International, Inc. Magnetic card with identification code
JPH0437596A (ja) * 1990-06-01 1992-02-07 Toshiba Corp 配線基板装置
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
DE19805282A1 (de) * 1998-02-10 1999-08-19 Siemens Ag Flächiger Träger mit einer Anzeigeeinrichtung
FR2776796B1 (fr) * 1998-03-31 2000-12-01 Gemplus Card Int Procede de fabrication de cartes a puce
US6239976B1 (en) * 1998-11-24 2001-05-29 Comsense Technologies, Ltd. Reinforced micromodule
FR2789505B1 (fr) * 1999-02-08 2001-03-09 Gemplus Card Int Procede de fabrication de support de memorisation portable de type carte a puce

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371225B2 (en) 2005-07-20 2013-02-12 Multiclip Co. Ltd. Device, method, and apparatus for lifting a railway rail

Also Published As

Publication number Publication date
EP1556832B1 (de) 2006-12-20
WO2004040507A8 (fr) 2005-05-19
CA2503688A1 (fr) 2004-05-13
EP1556832A2 (de) 2005-07-27
US20060237542A1 (en) 2006-10-26
WO2004040507A1 (fr) 2004-05-13
AU2003285440A1 (en) 2004-05-25
ES2276132T3 (es) 2007-06-16
DE60310599D1 (de) 2007-02-01
FR2846446B1 (fr) 2005-02-18
JP2006504193A (ja) 2006-02-02
CN1708770A (zh) 2005-12-14
DE60310599T2 (de) 2007-10-25
JP4287378B2 (ja) 2009-07-01
MXPA05004469A (es) 2005-11-23
CA2503688C (fr) 2011-06-28
FR2846446A1 (fr) 2004-04-30
CN100424722C (zh) 2008-10-08
US9792541B2 (en) 2017-10-17

Similar Documents

Publication Publication Date Title
SE9701612D0 (sv) Smartcard and method for its manufacture
BR9807357A (pt) Método de fabricação de cartão sem contato com antena bobinada
FR2617666B1 (fr) Carte a microcircuits electroniques et son procede de fabrication
ATE229204T1 (de) Verfahren zur herstellung von kontaktlosen karten
DOS2002000432S (es) Tarjeta de credito con borde redondeado
DK1399880T3 (da) Kontaktlöst chipkort med en antennebærer og en chipbærer i fibröst materiale
FR2805067B1 (fr) Jeton a puce electronique et procedes de fabrication d'un tel jeton
EP1237280A3 (de) Programmierbares Gatterfeld mit erhöhter Leistung
AU5376999A (en) Method for making a contactless chip card
ATE349049T1 (de) Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren
DE50310815D1 (de) Kontaktiervorrichtung für eine Chipkarte, insbesondere für eine SIM-Karte
TW200634651A (en) RFID tag in a printed circuit board
DE50305281D1 (de) Datenträger mit transponderspule
WO2003054790A8 (fr) Carte a puce a module de surface etendue
MY122247A (en) Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame.
AU1652700A (en) Method for embedding an ic component into a foamed layer of a chip card
ATE254316T1 (de) Vorrichtung und herstellungsverfahren mit zumindest einem chip auf einem träger
EP0681741A4 (de) Gehäuse für einen elektronischen chipträger und herstellungsverfahren.
FR2794265B1 (fr) Procede de fabrication de cartes a puce a contact avec dielectrique bas cout
FR2816107B1 (fr) Module de circuit integre sur film et son procede de fabrication
WO2004070495A3 (fr) Objet portable a puce
FR2845182B1 (fr) Lecteur de carte a puce a boitier transparent
WO2004006172A3 (de) Tragbarer datenträger mit einer polymerbasierten integrierten schaltung
DE60045905D1 (de) Kartenleser für IC- und /oder SIM-Karte mit veschiedener Dicke
ATE237847T1 (de) Verfahren zur herstellung eines moduls für chipkarten

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties