ATE349290T1 - Lötverfahren und -vorrichtung zum schnellen kühlen - Google Patents

Lötverfahren und -vorrichtung zum schnellen kühlen

Info

Publication number
ATE349290T1
ATE349290T1 AT02007679T AT02007679T ATE349290T1 AT E349290 T1 ATE349290 T1 AT E349290T1 AT 02007679 T AT02007679 T AT 02007679T AT 02007679 T AT02007679 T AT 02007679T AT E349290 T1 ATE349290 T1 AT E349290T1
Authority
AT
Austria
Prior art keywords
terminal
heat
solder
air
gripper device
Prior art date
Application number
AT02007679T
Other languages
English (en)
Inventor
Larry J Costa
Original Assignee
Larry J Costa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25308003&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE349290(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Larry J Costa filed Critical Larry J Costa
Application granted granted Critical
Publication of ATE349290T1 publication Critical patent/ATE349290T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Die Bonding (AREA)
  • Joining Of Glass To Other Materials (AREA)
AT02007679T 2001-05-07 2002-04-04 Lötverfahren und -vorrichtung zum schnellen kühlen ATE349290T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/850,398 US6550668B2 (en) 2001-05-07 2001-05-07 Method and means for rapid heat-sink soldering

Publications (1)

Publication Number Publication Date
ATE349290T1 true ATE349290T1 (de) 2007-01-15

Family

ID=25308003

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02007679T ATE349290T1 (de) 2001-05-07 2002-04-04 Lötverfahren und -vorrichtung zum schnellen kühlen

Country Status (4)

Country Link
US (2) US6550668B2 (de)
EP (1) EP1256409B1 (de)
AT (1) ATE349290T1 (de)
DE (1) DE60217009T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6550668B2 (en) * 2001-05-07 2003-04-22 Larry J. Costa Method and means for rapid heat-sink soldering
US7259351B2 (en) * 2004-09-07 2007-08-21 Federal-Mogul World Wide, Inc. Heat treating assembly and method
JP2006156446A (ja) * 2004-11-25 2006-06-15 Shinka Jitsugyo Kk 半田付け方法及び装置
US8662374B2 (en) 2010-12-16 2014-03-04 Air Liquide Industrial U.S. Lp Method for reduced cycle times in multi-pass welding while providing an inert atmosphere to the welding zone
US9036354B2 (en) * 2013-01-15 2015-05-19 Flextronics, Ap, Llc Heat sink thermal press for phase change heat sink material
CN115446413B (zh) * 2022-09-20 2023-08-22 六安煜晟电子科技有限公司 一种pcb钻头生产用钎焊装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB141504A (en) * 1919-08-23 1920-04-22 Frank Jacob Wallis Improvements relating to metal soldering, brazing and the like
US2506114A (en) * 1947-07-05 1950-05-02 John M Henry Trigger-type gaseous blowtorch
US3458102A (en) * 1967-08-09 1969-07-29 Kulicke & Soffa Ind Inc Semiconductor wafer pickup and bonding tool
US3640519A (en) * 1969-08-13 1972-02-08 William M Halstead Handling and heat-dissipating device for electrical components
US3632973A (en) * 1970-06-01 1972-01-04 Honeywell Inf Systems Soldering tool for removal and replacement of components having multiple soldered junctions
US3845606A (en) * 1972-11-08 1974-11-05 D Wilson Package sealing in steam atmosphere
US3830681A (en) * 1972-11-08 1974-08-20 Fmc Corp Package sealing in steam atmosphere
US3874443A (en) * 1973-07-16 1975-04-01 Joseph V Bayer Heat dissipator
US4135573A (en) * 1976-10-29 1979-01-23 Sutter Melville B Heat shielding tool
DD135026A1 (de) * 1978-03-16 1979-04-04 Herbert Bartuch Verfahren zum hermetischen verschluss von bauelementegehaeusen der elektronik
US4889277A (en) * 1987-02-05 1989-12-26 Autosplice, Inc. Method and apparatus for surface mounting terminals
US4530456A (en) * 1983-05-04 1985-07-23 Ppg Industries, Inc. Method and apparatus for soldering by means of an industrial robot
JPS60191660A (ja) * 1984-03-09 1985-09-30 Sumitomo Electric Ind Ltd ハンダ付け用治具
US4632294A (en) * 1984-12-20 1986-12-30 International Business Machines Corporation Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
US4962878A (en) * 1987-02-18 1990-10-16 Plato Products, Inc. Desoldering aid
US5004491A (en) * 1990-05-22 1991-04-02 Glasstech, Inc. Glass sheet forming method and apparatus utilizing lower full surface vacuum mold and upper ring mold
US5375757A (en) * 1993-12-17 1994-12-27 Dba Systems, Inc. Fixture for supporting a cable conductor during a soldering operation
US6584670B2 (en) * 2000-02-21 2003-07-01 Larry J. Costa Electrical terminal implementation device
US6550668B2 (en) * 2001-05-07 2003-04-22 Larry J. Costa Method and means for rapid heat-sink soldering

Also Published As

Publication number Publication date
EP1256409B1 (de) 2006-12-27
EP1256409A3 (de) 2004-05-06
DE60217009T2 (de) 2007-07-19
DE60217009D1 (de) 2007-02-08
US20030089761A1 (en) 2003-05-15
EP1256409A2 (de) 2002-11-13
US20020162878A1 (en) 2002-11-07
US6550668B2 (en) 2003-04-22
US6827253B2 (en) 2004-12-07

Similar Documents

Publication Publication Date Title
NO20022132D0 (no) Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse
MY150425A (en) Method and device for heat treatment, especially connection by soldering
MY151676A (en) Substrate support having dynamic temperature control
US8925170B2 (en) Method for removing an electronic component from a substrate
CN105965120A (zh) 一种GaAs微波功放芯片的半自动共晶焊接方法及产品
US20070170227A1 (en) Soldering method
ATE349290T1 (de) Lötverfahren und -vorrichtung zum schnellen kühlen
CN110100357A (zh) 用于将端子焊接在车辆的窗玻璃上的设备及其方法
AU2002334686A1 (en) Improved compositions, methods and devices for high temperature lead-free solder
DK1275462T3 (da) Fremgangsmåde og anordning til lodning af elektriske komponenter på en plastfolie
WO2001059815A3 (en) Method and apparatus for processing a microelectronic workpiece at an elevated temperature
JP3753524B2 (ja) 電子部品の製造方法
JPH09181436A (ja) 半田付け方法及び半田ごて
TW502345B (en) Soldering method for soldering electronic parts and soldering apparatus therefor
AU2003216085A1 (en) Method and apparatus for high heat flux heat transfer
JP2004314138A (ja) 半田付け装置
JPH01183885A (ja) 電子部品のはんだ付け方法
JP2001230541A (ja) プリント配線基板とその熱処理方法と加熱装置
AU2002241425A1 (en) Method for cooling an electrode during an electric melting furnace operation and electrode
JPH10321107A (ja) 温度ヒュ−ズの実装方法及び合金型温度ヒュ−ズ
JPH05235222A (ja) ヒートシンクと半導体素子の接合方法
JPS6021320A (ja) 微小鋼材部品の局部焼入れ方法
JPH0517671B2 (de)
RU2001114164A (ru) Способ соединения пластин в полублоки химического источника тока
JPH08274458A (ja) 電子部品の半田付け方法

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties