|
JP3012816B2
(ja)
*
|
1996-10-22 |
2000-02-28 |
松下電子工業株式会社 |
樹脂封止型半導体装置およびその製造方法
|
|
US6526326B2
(en)
|
1997-03-31 |
2003-02-25 |
Hitachi, Ltd. |
Fraction defective estimating method and system for estimating an assembly fraction defective of an article
|
|
US6108586A
(en)
*
|
1997-03-31 |
2000-08-22 |
Hitachi, Ltd. |
Fraction defective estimating method, system for carrying out the same and recording medium
|
|
US6494079B1
(en)
|
2001-03-07 |
2002-12-17 |
Symyx Technologies, Inc. |
Method and apparatus for characterizing materials by using a mechanical resonator
|
|
TW360935B
(en)
*
|
1997-11-14 |
1999-06-11 |
Amic Technology Inc |
Variable package structure and process for producing the same
|
|
US6033934A
(en)
*
|
1997-12-09 |
2000-03-07 |
Orient Semiconductor Electronics Ltd. |
Semiconductor chip fabrication method and apparatus therefor
|
|
US6307258B1
(en)
*
|
1998-12-22 |
2001-10-23 |
Silicon Bandwidth, Inc. |
Open-cavity semiconductor die package
|
|
NL1011445C2
(nl)
*
|
1999-03-04 |
2000-09-05 |
Europ Semiconductor Assembly E |
Werkwijze en inrichting voor het inkapselen van chips die gevoelig zijn voor invloeden van buitenaf.
|
|
DE19929026B4
(de)
*
|
1999-06-25 |
2011-02-24 |
Robert Bosch Gmbh |
Verfahren zur Herstellung eines Drucksensors
|
|
JP2001024132A
(ja)
*
|
1999-06-30 |
2001-01-26 |
Texas Instr Inc <Ti> |
半導体デバイス用変形吸収形リードフレーム
|
|
DE19959345C1
(de)
*
|
1999-12-09 |
2001-04-05 |
Micronas Gmbh |
Verfahren zum Einkapseln eines Sensors
|
|
US7026710B2
(en)
|
2000-01-21 |
2006-04-11 |
Texas Instruments Incorporated |
Molded package for micromechanical devices and method of fabrication
|
|
US6489178B2
(en)
*
|
2000-01-26 |
2002-12-03 |
Texas Instruments Incorporated |
Method of fabricating a molded package for micromechanical devices
|
|
SG106050A1
(en)
*
|
2000-03-13 |
2004-09-30 |
Megic Corp |
Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
|
|
AT410727B
(de)
*
|
2000-03-14 |
2003-07-25 |
Austria Mikrosysteme Int |
Verfahren zum unterbringen von sensoren in einem gehäuse
|
|
JP2001267342A
(ja)
*
|
2000-03-22 |
2001-09-28 |
Seiko Instruments Inc |
半導体装置の製造方法
|
|
US6379988B1
(en)
|
2000-05-16 |
2002-04-30 |
Sandia Corporation |
Pre-release plastic packaging of MEMS and IMEMS devices
|
|
US6875640B1
(en)
|
2000-06-08 |
2005-04-05 |
Micron Technology, Inc. |
Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed
|
|
EP1211722B9
(de)
*
|
2000-11-30 |
2005-07-13 |
STMicroelectronics S.r.l. |
Herstellungsverfahren einer elektronischen Packungsanordnung
|
|
EP1211721A1
(de)
*
|
2000-11-30 |
2002-06-05 |
STMicroelectronics S.r.l. |
Verbesserte elektronische Packungsanordnung und Herstellungsverfahren dafür
|
|
US20020079572A1
(en)
|
2000-12-22 |
2002-06-27 |
Khan Reza-Ur Rahman |
Enhanced die-up ball grid array and method for making the same
|
|
EP1220309A1
(de)
|
2000-12-28 |
2002-07-03 |
STMicroelectronics S.r.l. |
Herstellungsverfahren einer elektronischen Packungsanordnung
|
|
EP1246235A1
(de)
*
|
2001-03-26 |
2002-10-02 |
European Semiconductor Assembly (Eurasem) B.V. |
Verfahren zum Einkapseln eines Chips mit empfindlicher Oberfläche
|
|
US6762077B2
(en)
|
2001-05-11 |
2004-07-13 |
Melexis Nv |
Integrated sensor packages and methods of making the same
|
|
US7060216B2
(en)
*
|
2001-05-11 |
2006-06-13 |
Melexis, Nv |
Tire pressure sensors and methods of making the same
|
|
US7302830B2
(en)
|
2001-06-06 |
2007-12-04 |
Symyx Technologies, Inc. |
Flow detectors having mechanical oscillators, and use thereof in flow characterization systems
|
|
US6860731B2
(en)
*
|
2001-07-09 |
2005-03-01 |
Asm Technology Singapore Pte Ltd. |
Mold for encapsulating a semiconductor chip
|
|
NL1019042C2
(nl)
*
|
2001-09-26 |
2003-03-27 |
Europ Semiconductor Assembly E |
Werkwijze voor het inkapselen van een chip en/of ander voorwerp.
|
|
DE10205047B4
(de)
*
|
2002-02-07 |
2006-01-05 |
Hella Kgaa Hueck & Co. |
Sensor, insbesondere zur Messung an oder in Flüssigkeiten sowie Verfahren zur Herstellung desselben
|
|
JP2003243577A
(ja)
*
|
2002-02-18 |
2003-08-29 |
Shinko Electric Ind Co Ltd |
半導体装置及びその製造方法
|
|
US6900508B2
(en)
*
|
2002-04-16 |
2005-05-31 |
Stmicroelectronics, Inc. |
Embedded flat film molding
|
|
US7304362B2
(en)
*
|
2002-05-20 |
2007-12-04 |
Stmicroelectronics, Inc. |
Molded integrated circuit package with exposed active area
|
|
JP4190269B2
(ja)
|
2002-07-09 |
2008-12-03 |
新光電気工業株式会社 |
素子内蔵基板製造方法およびその装置
|
|
US6700190B2
(en)
|
2002-07-26 |
2004-03-02 |
Stmicroelectronics, Inc. |
Integrated circuit device with exposed upper and lower die surfaces
|
|
US6785137B2
(en)
|
2002-07-26 |
2004-08-31 |
Stmicroelectronics, Inc. |
Method and system for removing heat from an active area of an integrated circuit device
|
|
EP1554570A2
(de)
|
2002-10-18 |
2005-07-20 |
Symyx Technologies, Inc. |
Umweltsteuersystemfluidmesssystem und verfahren mit einem sensor mit mechanischem resonator
|
|
US7043969B2
(en)
|
2002-10-18 |
2006-05-16 |
Symyx Technologies, Inc. |
Machine fluid sensor and method
|
|
SG111092A1
(en)
|
2002-11-15 |
2005-05-30 |
St Microelectronics Pte Ltd |
Semiconductor device package and method of manufacture
|
|
US7721590B2
(en)
|
2003-03-21 |
2010-05-25 |
MEAS France |
Resonator sensor assembly
|
|
WO2004086027A2
(en)
|
2003-03-21 |
2004-10-07 |
Symyx Technologies, Inc. |
Mechanical resonator
|
|
GB0307616D0
(en)
*
|
2003-04-02 |
2003-05-07 |
Melexis Nv |
Calorimetric flow meter
|
|
JP4519424B2
(ja)
*
|
2003-06-26 |
2010-08-04 |
ルネサスエレクトロニクス株式会社 |
樹脂モールド型半導体装置
|
|
US6953291B2
(en)
*
|
2003-06-30 |
2005-10-11 |
Finisar Corporation |
Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
|
|
US6934065B2
(en)
*
|
2003-09-18 |
2005-08-23 |
Micron Technology, Inc. |
Microelectronic devices and methods for packaging microelectronic devices
|
|
US7199438B2
(en)
*
|
2003-09-23 |
2007-04-03 |
Advanced Semiconductor Engineering, Inc. |
Overmolded optical package
|
|
DE10351704B4
(de)
*
|
2003-11-03 |
2008-07-31 |
Infineon Technologies Ag |
Optoelektronische Sende- und/oder Empfangsanordnung mit einem opto-elektronischen Wandlermodul
|
|
US7583862B2
(en)
*
|
2003-11-26 |
2009-09-01 |
Aptina Imaging Corporation |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
|
DE102004002163B4
(de)
|
2004-01-15 |
2019-12-24 |
Robert Bosch Gmbh |
Gassensormodul und ein Verfahren zu seiner Herstellung
|
|
US7872686B2
(en)
|
2004-02-20 |
2011-01-18 |
Flextronics International Usa, Inc. |
Integrated lens and chip assembly for a digital camera
|
|
US7796187B2
(en)
|
2004-02-20 |
2010-09-14 |
Flextronics Ap Llc |
Wafer based camera module and method of manufacture
|
|
US7253397B2
(en)
*
|
2004-02-23 |
2007-08-07 |
Micron Technology, Inc. |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
|
DE102004011667B4
(de)
*
|
2004-03-10 |
2006-03-23 |
Technische Fachhochschule Berlin |
Vorrichtung mit einem Halbleiterchip und einem mikrofluidischen System und Verfahren zur Herstellung
|
|
US7253957B2
(en)
*
|
2004-05-13 |
2007-08-07 |
Micron Technology, Inc. |
Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
|
|
US8092734B2
(en)
*
|
2004-05-13 |
2012-01-10 |
Aptina Imaging Corporation |
Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
|
|
DE102004027512A1
(de)
*
|
2004-06-04 |
2005-12-22 |
Robert Bosch Gmbh |
Spektroskopischer Gassensor, insbesondere zum Nachweis mindestens einer Gaskomponente in der Umluft, und Verfahren zur Herstellung eines derartigen spektroskopischen Gassensors
|
|
US20050275750A1
(en)
|
2004-06-09 |
2005-12-15 |
Salman Akram |
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
|
|
US7498647B2
(en)
|
2004-06-10 |
2009-03-03 |
Micron Technology, Inc. |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
|
US7262405B2
(en)
*
|
2004-06-14 |
2007-08-28 |
Micron Technology, Inc. |
Prefabricated housings for microelectronic imagers
|
|
US7199439B2
(en)
*
|
2004-06-14 |
2007-04-03 |
Micron Technology, Inc. |
Microelectronic imagers and methods of packaging microelectronic imagers
|
|
DE102004031317A1
(de)
|
2004-06-29 |
2006-01-19 |
Robert Bosch Gmbh |
Gassensormodul und Verfahren zu seiner Herstellung
|
|
US7294897B2
(en)
*
|
2004-06-29 |
2007-11-13 |
Micron Technology, Inc. |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
|
|
US7232754B2
(en)
*
|
2004-06-29 |
2007-06-19 |
Micron Technology, Inc. |
Microelectronic devices and methods for forming interconnects in microelectronic devices
|
|
DE102004031316B3
(de)
*
|
2004-06-29 |
2005-12-29 |
Robert Bosch Gmbh |
Gassensor-Modul zur spektroskopischen Messung einer Gaskonzentration
|
|
US7416913B2
(en)
*
|
2004-07-16 |
2008-08-26 |
Micron Technology, Inc. |
Methods of manufacturing microelectronic imaging units with discrete standoffs
|
|
US7189954B2
(en)
*
|
2004-07-19 |
2007-03-13 |
Micron Technology, Inc. |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
|
|
US7402453B2
(en)
*
|
2004-07-28 |
2008-07-22 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
|
US20060023107A1
(en)
*
|
2004-08-02 |
2006-02-02 |
Bolken Todd O |
Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers
|
|
US7364934B2
(en)
*
|
2004-08-10 |
2008-04-29 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
|
US7397066B2
(en)
*
|
2004-08-19 |
2008-07-08 |
Micron Technology, Inc. |
Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
|
|
US7223626B2
(en)
*
|
2004-08-19 |
2007-05-29 |
Micron Technology, Inc. |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
|
|
US7115961B2
(en)
*
|
2004-08-24 |
2006-10-03 |
Micron Technology, Inc. |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
|
|
US7429494B2
(en)
*
|
2004-08-24 |
2008-09-30 |
Micron Technology, Inc. |
Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
|
|
US7425499B2
(en)
|
2004-08-24 |
2008-09-16 |
Micron Technology, Inc. |
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
|
|
US7276393B2
(en)
|
2004-08-26 |
2007-10-02 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
|
US20070148807A1
(en)
*
|
2005-08-22 |
2007-06-28 |
Salman Akram |
Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
|
|
US7511262B2
(en)
*
|
2004-08-30 |
2009-03-31 |
Micron Technology, Inc. |
Optical device and assembly for use with imaging dies, and wafer-label imager assembly
|
|
US7646075B2
(en)
*
|
2004-08-31 |
2010-01-12 |
Micron Technology, Inc. |
Microelectronic imagers having front side contacts
|
|
US7300857B2
(en)
|
2004-09-02 |
2007-11-27 |
Micron Technology, Inc. |
Through-wafer interconnects for photoimager and memory wafers
|
|
KR100577430B1
(ko)
|
2004-09-03 |
2006-05-08 |
삼성전자주식회사 |
디스플레이 장치
|
|
US7271482B2
(en)
*
|
2004-12-30 |
2007-09-18 |
Micron Technology, Inc. |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
|
|
US7214919B2
(en)
*
|
2005-02-08 |
2007-05-08 |
Micron Technology, Inc. |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units
|
|
US7303931B2
(en)
*
|
2005-02-10 |
2007-12-04 |
Micron Technology, Inc. |
Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
|
|
US20060177999A1
(en)
*
|
2005-02-10 |
2006-08-10 |
Micron Technology, Inc. |
Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
|
|
US7190039B2
(en)
*
|
2005-02-18 |
2007-03-13 |
Micron Technology, Inc. |
Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
|
|
DE102005010311A1
(de)
*
|
2005-03-03 |
2006-09-14 |
Atmel Germany Gmbh |
Verfahren und Gießform zur Herstellung eines optischen Halbleitermoduls
|
|
DE102005014427B4
(de)
*
|
2005-03-24 |
2008-05-15 |
Infineon Technologies Ag |
Verfahren zum Verkapseln eines Halbleiterbauelements
|
|
JP4233536B2
(ja)
*
|
2005-03-31 |
2009-03-04 |
シャープ株式会社 |
光学装置用モジュール
|
|
US20060290001A1
(en)
*
|
2005-06-28 |
2006-12-28 |
Micron Technology, Inc. |
Interconnect vias and associated methods of formation
|
|
US7795134B2
(en)
*
|
2005-06-28 |
2010-09-14 |
Micron Technology, Inc. |
Conductive interconnect structures and formation methods using supercritical fluids
|
|
US7288757B2
(en)
*
|
2005-09-01 |
2007-10-30 |
Micron Technology, Inc. |
Microelectronic imaging devices and associated methods for attaching transmissive elements
|
|
US7262134B2
(en)
|
2005-09-01 |
2007-08-28 |
Micron Technology, Inc. |
Microfeature workpieces and methods for forming interconnects in microfeature workpieces
|
|
US7622377B2
(en)
|
2005-09-01 |
2009-11-24 |
Micron Technology, Inc. |
Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
|
|
US8302471B2
(en)
|
2005-12-02 |
2012-11-06 |
Melexis Nv |
Calorimetric flow meter having high heat conductivity strips
|
|
TWI313501B
(en)
*
|
2006-03-22 |
2009-08-11 |
Ind Tech Res Inst |
A process for manufacture plastic package of mems devices and the structure for the same
|
|
US7632698B2
(en)
|
2006-05-16 |
2009-12-15 |
Freescale Semiconductor, Inc. |
Integrated circuit encapsulation and method therefor
|
|
JP4794354B2
(ja)
*
|
2006-05-23 |
2011-10-19 |
Okiセミコンダクタ株式会社 |
半導体装置の製造方法
|
|
US8092102B2
(en)
|
2006-05-31 |
2012-01-10 |
Flextronics Ap Llc |
Camera module with premolded lens housing and method of manufacture
|
|
US7468556B2
(en)
*
|
2006-06-19 |
2008-12-23 |
Lv Sensors, Inc. |
Packaging of hybrid integrated circuits
|
|
JP2008066696A
(ja)
*
|
2006-08-10 |
2008-03-21 |
Denso Corp |
半導体製造装置および半導体製造方法
|
|
DE102007001706A1
(de)
*
|
2007-01-11 |
2008-07-17 |
Osram Opto Semiconductors Gmbh |
Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
|
|
TWI341014B
(en)
*
|
2007-05-30 |
2011-04-21 |
Ind Tech Res Inst |
A device structure with preformed ring and method therefor
|
|
ITMI20072099A1
(it)
|
2007-10-30 |
2009-04-30 |
St Microelectronics Srl |
Metodo di fabbricazione di un dispositivo elettronico comprendente dispositivi mems incapsulati per stampaggio
|
|
US8488046B2
(en)
|
2007-12-27 |
2013-07-16 |
Digitaloptics Corporation |
Configurable tele wide module
|
|
DE102008017871B4
(de)
*
|
2008-04-09 |
2014-09-25 |
Hella Kgaa Hueck & Co. |
Drucksensormodul und Verfahren zu seiner Herstellung
|
|
EP2154713B1
(de)
*
|
2008-08-11 |
2013-01-02 |
Sensirion AG |
Verfahren zur Herstellung einer Messvorrichtung mit einer Spannungsverminderungsschicht
|
|
US20100194465A1
(en)
*
|
2009-02-02 |
2010-08-05 |
Ali Salih |
Temperature compensated current source and method therefor
|
|
US8237171B2
(en)
*
|
2010-02-09 |
2012-08-07 |
Microsemi Corporation |
High voltage high package pressure semiconductor package
|
|
US8587107B2
(en)
|
2010-02-09 |
2013-11-19 |
Microsemi Corporation |
Silicon carbide semiconductor
|
|
TWI449162B
(zh)
*
|
2010-05-17 |
2014-08-11 |
勝開科技股份有限公司 |
具有特定焦距之晶圓級影像感測器模組之製造方法
|
|
TWI437700B
(zh)
*
|
2010-05-31 |
2014-05-11 |
勝開科技股份有限公司 |
晶圓級影像感測器構裝結構之製造方法
|
|
US9322600B2
(en)
|
2011-03-17 |
2016-04-26 |
Olive Tree Patents 1 Llc |
Thermosyphon heat recovery
|
|
GB2492120A
(en)
*
|
2011-06-22 |
2012-12-26 |
Melexis Tessenderlo Nv |
Spectrum analyzing sensor with filter glued in cavity of sensing package
|
|
EP2573804A1
(de)
*
|
2011-09-21 |
2013-03-27 |
Nxp B.V. |
Integrierte Schaltung mit Sensor und Verfahren zur Ihrer Herstellung
|
|
CN103579018A
(zh)
*
|
2012-07-18 |
2014-02-12 |
上海裕晶半导体有限公司 |
一种新型光学鼠标控制芯片封装方法
|
|
US9067342B2
(en)
|
2012-09-26 |
2015-06-30 |
Intel Corporation |
Mold chase for integrated circuit package assembly and associated techniques and configurations
|
|
US9366593B2
(en)
*
|
2013-09-27 |
2016-06-14 |
Infineon Technologies Ag |
Pressure sensor package with integrated sealing
|
|
KR20150074427A
(ko)
*
|
2013-12-24 |
2015-07-02 |
삼성전기주식회사 |
센서 패키지 및 이를 구비하는 휴대 단말기
|
|
GB2524235A
(en)
*
|
2014-03-07 |
2015-09-23 |
Melexis Technologies Nv |
Semiconductor device having a transparent window for passing radiation
|
|
US11784103B2
(en)
*
|
2020-12-09 |
2023-10-10 |
Texas Instruments Incorporated |
Covers for semiconductor package components
|
|
US11658083B2
(en)
*
|
2020-12-09 |
2023-05-23 |
Texas Instruments Incorporated |
Film covers for sensor packages
|