NL1003315C2 - Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling. - Google Patents

Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling. Download PDF

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Publication number
NL1003315C2
NL1003315C2 NL1003315A NL1003315A NL1003315C2 NL 1003315 C2 NL1003315 C2 NL 1003315C2 NL 1003315 A NL1003315 A NL 1003315A NL 1003315 A NL1003315 A NL 1003315A NL 1003315 C2 NL1003315 C2 NL 1003315C2
Authority
NL
Netherlands
Prior art keywords
face
semiconductor circuit
injection mold
conductor circuit
semi
Prior art date
Application number
NL1003315A
Other languages
English (en)
Dutch (nl)
Inventor
Peter Jacobus Kaldenberg
Original Assignee
Europ Semiconductor Assembly E
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europ Semiconductor Assembly E filed Critical Europ Semiconductor Assembly E
Priority to NL1003315A priority Critical patent/NL1003315C2/nl
Priority to DE69737248T priority patent/DE69737248T2/de
Priority to EP97201750A priority patent/EP0813236B1/de
Priority to US08/871,960 priority patent/US5897338A/en
Priority to AT97201750T priority patent/ATE352100T1/de
Priority to JP9167866A priority patent/JPH1070146A/ja
Application granted granted Critical
Publication of NL1003315C2 publication Critical patent/NL1003315C2/nl

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
NL1003315A 1996-06-11 1996-06-11 Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling. NL1003315C2 (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL1003315A NL1003315C2 (nl) 1996-06-11 1996-06-11 Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.
DE69737248T DE69737248T2 (de) 1996-06-11 1997-06-10 Verfahren zum Einkapseln einer integrierten Halbleiterschaltung
EP97201750A EP0813236B1 (de) 1996-06-11 1997-06-10 Verfahren zum Einkapseln einer integrierten Halbleiterschaltung
US08/871,960 US5897338A (en) 1996-06-11 1997-06-10 Method for encapsulating an integrated semi-conductor circuit
AT97201750T ATE352100T1 (de) 1996-06-11 1997-06-10 Verfahren zum einkapseln einer integrierten halbleiterschaltung
JP9167866A JPH1070146A (ja) 1996-06-11 1997-06-11 集積半導体回路のカプセル封じ方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1003315 1996-06-11
NL1003315A NL1003315C2 (nl) 1996-06-11 1996-06-11 Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.

Publications (1)

Publication Number Publication Date
NL1003315C2 true NL1003315C2 (nl) 1997-12-17

Family

ID=19762999

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1003315A NL1003315C2 (nl) 1996-06-11 1996-06-11 Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling.

Country Status (6)

Country Link
US (1) US5897338A (de)
EP (1) EP0813236B1 (de)
JP (1) JPH1070146A (de)
AT (1) ATE352100T1 (de)
DE (1) DE69737248T2 (de)
NL (1) NL1003315C2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1246235A1 (de) * 2001-03-26 2002-10-02 European Semiconductor Assembly (Eurasem) B.V. Verfahren zum Einkapseln eines Chips mit empfindlicher Oberfläche
NL1019042C2 (nl) * 2001-09-26 2003-03-27 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een chip en/of ander voorwerp.

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Cited By (6)

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EP1246235A1 (de) * 2001-03-26 2002-10-02 European Semiconductor Assembly (Eurasem) B.V. Verfahren zum Einkapseln eines Chips mit empfindlicher Oberfläche
WO2002078077A1 (en) * 2001-03-26 2002-10-03 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating a chip having a sensitive surface
US7312106B2 (en) 2001-03-26 2007-12-25 Elmos Advanced Packaging B.V. Method for encapsulating a chip having a sensitive surface
NL1019042C2 (nl) * 2001-09-26 2003-03-27 Europ Semiconductor Assembly E Werkwijze voor het inkapselen van een chip en/of ander voorwerp.
WO2003028086A1 (en) * 2001-09-26 2003-04-03 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating a chip and/or other article
US7205175B2 (en) 2001-09-26 2007-04-17 Elmos Advanced Packaging B.V. Method for encapsulating a chip and/or other article

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EP0813236B1 (de) 2007-01-17
ATE352100T1 (de) 2007-02-15
DE69737248T2 (de) 2007-05-24
DE69737248D1 (de) 2007-03-08
US5897338A (en) 1999-04-27
JPH1070146A (ja) 1998-03-10
EP0813236A1 (de) 1997-12-17

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