ATE363454T1 - Verfahren zur herstellung einer durch mikromaterialbearbeitung hergestellten geschichteten vorrichtung - Google Patents

Verfahren zur herstellung einer durch mikromaterialbearbeitung hergestellten geschichteten vorrichtung

Info

Publication number
ATE363454T1
ATE363454T1 AT04726696T AT04726696T ATE363454T1 AT E363454 T1 ATE363454 T1 AT E363454T1 AT 04726696 T AT04726696 T AT 04726696T AT 04726696 T AT04726696 T AT 04726696T AT E363454 T1 ATE363454 T1 AT E363454T1
Authority
AT
Austria
Prior art keywords
producing
substrate
micromaterial
machining
membrane layer
Prior art date
Application number
AT04726696T
Other languages
English (en)
Inventor
Edwin Jager
Magnus Krogh
Original Assignee
Micromuscle Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micromuscle Ab filed Critical Micromuscle Ab
Application granted granted Critical
Publication of ATE363454T1 publication Critical patent/ATE363454T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/008—Manufacture of substrate-free structures separating the processed structure from a mother substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/724—Devices having flexible or movable element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)
  • Disintegrating Or Milling (AREA)
  • Catalysts (AREA)
  • Glass Compositions (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT04726696T 2003-04-17 2004-04-08 Verfahren zur herstellung einer durch mikromaterialbearbeitung hergestellten geschichteten vorrichtung ATE363454T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0301144A SE526192C2 (sv) 2003-04-17 2003-04-17 Metod för att framställa en anordning

Publications (1)

Publication Number Publication Date
ATE363454T1 true ATE363454T1 (de) 2007-06-15

Family

ID=20291064

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04726696T ATE363454T1 (de) 2003-04-17 2004-04-08 Verfahren zur herstellung einer durch mikromaterialbearbeitung hergestellten geschichteten vorrichtung

Country Status (8)

Country Link
US (1) US7322100B2 (de)
EP (1) EP1620356B1 (de)
JP (1) JP2006523540A (de)
AT (1) ATE363454T1 (de)
DE (1) DE602004006742T2 (de)
ES (1) ES2287719T3 (de)
SE (1) SE526192C2 (de)
WO (1) WO2004092050A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004037128A1 (de) * 2004-07-30 2006-03-23 Robert Bosch Gmbh Laserbearbeitung von mikromechanischen Strukturen
DE102006017549A1 (de) * 2006-04-13 2007-10-18 Imi Intelligent Medical Implants Ag Verfahren zur Herstellung von Implantatstrukturen zur Kontaktierung oder Elektrostimulation von lebenden Gewebezellen oder Nerven
US9242073B2 (en) 2006-08-18 2016-01-26 Boston Scientific Scimed, Inc. Electrically actuated annelid
DE102012224284A1 (de) 2012-12-21 2014-06-26 Heraeus Precious Metals Gmbh & Co. Kg Dünne Metallmembran mit Träger
US11615979B2 (en) * 2019-12-18 2023-03-28 Disco Corporation Method of processing wafer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749460A (ja) * 1993-08-06 1995-02-21 Nippondenso Co Ltd 可変焦点ミラーおよびその製造方法
SE513975C2 (sv) * 1994-08-19 2000-12-04 Telia Ab Repeterare och metod för DECT-system
SE9500849D0 (sv) * 1995-03-10 1995-03-10 Pharmacia Ab Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods
JPH09293913A (ja) * 1996-04-25 1997-11-11 Casio Comput Co Ltd 機能性高分子素子
JPH11121900A (ja) 1997-10-15 1999-04-30 Sumitomo Electric Ind Ltd 回路基板の製造方法
JPH11288863A (ja) * 1998-04-01 1999-10-19 Mitsubishi Electric Corp Ｘ線マスクおよびその製造方法
JP3857526B2 (ja) * 1999-03-31 2006-12-13 シーメンス アクチエンゲゼルシヤフト 無支持の微細構造体または肉薄の扁平部分またはダイアフラムを製造する方法および該方法により製造された無支持の微細構造体の使用法
CN1427749A (zh) * 2000-04-17 2003-07-02 宾夕法尼亚州研究基金会 淀积的薄膜以及它们在分离层和牺牲层应用中的使用

Also Published As

Publication number Publication date
JP2006523540A (ja) 2006-10-19
DE602004006742D1 (de) 2007-07-12
EP1620356A1 (de) 2006-02-01
ES2287719T3 (es) 2007-12-16
EP1620356B1 (de) 2007-05-30
US7322100B2 (en) 2008-01-29
SE526192C2 (sv) 2005-07-26
DE602004006742T2 (de) 2008-01-31
SE0301144D0 (sv) 2003-04-17
SE0301144L (sv) 2004-10-18
WO2004092050A1 (en) 2004-10-28
US20070050969A1 (en) 2007-03-08

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties